TWI433965B - 用於電解處理板狀產品之裝置及方法 - Google Patents
用於電解處理板狀產品之裝置及方法 Download PDFInfo
- Publication number
- TWI433965B TWI433965B TW097120909A TW97120909A TWI433965B TW I433965 B TWI433965 B TW I433965B TW 097120909 A TW097120909 A TW 097120909A TW 97120909 A TW97120909 A TW 97120909A TW I433965 B TWI433965 B TW I433965B
- Authority
- TW
- Taiwan
- Prior art keywords
- product
- flow
- treatment
- electrolytically treating
- plate
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 40
- 238000012545 processing Methods 0.000 claims description 54
- 230000008569 process Effects 0.000 claims description 7
- 230000010355 oscillation Effects 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 5
- 238000012935 Averaging Methods 0.000 claims description 3
- 239000000047 product Substances 0.000 description 109
- 239000003795 chemical substances by application Substances 0.000 description 36
- 239000007788 liquid Substances 0.000 description 31
- 229910052751 metal Inorganic materials 0.000 description 15
- 239000002184 metal Substances 0.000 description 15
- 230000000694 effects Effects 0.000 description 9
- 238000007747 plating Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000007921 spray Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000007743 anodising Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005238 degreasing Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000000866 electrolytic etching Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0736—Methods for applying liquids, e.g. spraying
- H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1509—Horizontally held PCB
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrolytic Production Of Metals (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Coating Apparatus (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007026633A DE102007026633B4 (de) | 2007-06-06 | 2007-06-06 | Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200918689A TW200918689A (en) | 2009-05-01 |
| TWI433965B true TWI433965B (zh) | 2014-04-11 |
Family
ID=39712035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW097120909A TWI433965B (zh) | 2007-06-06 | 2008-06-05 | 用於電解處理板狀產品之裝置及方法 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US8545687B2 (enExample) |
| EP (1) | EP2176450B9 (enExample) |
| JP (2) | JP2010530029A (enExample) |
| KR (2) | KR101641475B1 (enExample) |
| CN (1) | CN101730760B (enExample) |
| AT (1) | ATE519872T1 (enExample) |
| BR (1) | BRPI0812259A2 (enExample) |
| DE (1) | DE102007026633B4 (enExample) |
| PL (1) | PL2176450T3 (enExample) |
| TW (1) | TWI433965B (enExample) |
| WO (1) | WO2008148578A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BRPI0812195B1 (pt) * | 2007-06-05 | 2018-11-21 | Nestec Sa | cápsula de uso único para preparação de um líquido alimentício por centrifugação |
| WO2008148834A1 (en) | 2007-06-05 | 2008-12-11 | Nestec S.A. | Capsule and method for preparing a food liquid by centrifugation |
| EP2316310B1 (en) * | 2007-06-05 | 2012-05-16 | Nestec S.A. | System and method for preparing a food liquid from a food substance contained in a receptacle by centrifugation |
| AU2008258738B2 (en) * | 2007-06-05 | 2015-05-14 | Société des Produits Nestlé S.A. | Method for preparing a beverage or liquid food and system using brewing centrifugal force |
| US8431175B2 (en) * | 2007-06-05 | 2013-04-30 | Nestec S.A. | Method for preparing a beverage or food liquid and system using brewing centrifugal force |
| HUE027580T2 (en) | 2008-09-02 | 2016-10-28 | Nestec Sa | A method for preparing a food liquid stored in a capsule by centrifugation and a composition according to such a process |
| WO2010026053A1 (en) * | 2008-09-02 | 2010-03-11 | Nestec S.A. | Controlled beverage production device using centrifugal forces |
| AU2009326071B2 (en) | 2008-12-09 | 2016-01-14 | Société des Produits Nestlé S.A. | Liquid food preparation system for preparing a liquid food by centrifugation |
| JP5375596B2 (ja) * | 2009-02-19 | 2013-12-25 | 株式会社デンソー | 噴流式めっき方法および装置 |
| ES2423294T3 (es) * | 2009-08-19 | 2013-09-19 | Nestec S.A. | Cápsula para la preparación de un extracto de café provista de una estructura que facilita la perforación por inyección de agua |
| JP5722895B2 (ja) | 2009-08-28 | 2015-05-27 | ネステク ソシエテ アノニム | 遠心法による飲料調製用カプセルシステム |
| US8658232B2 (en) * | 2009-08-28 | 2014-02-25 | Nestec S.A. | Capsule system for the preparation of beverages by centrifugation |
| DE102010033256A1 (de) | 2010-07-29 | 2012-02-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung |
| WO2012073501A1 (ja) * | 2010-12-01 | 2012-06-07 | マルイ鍍金工業株式会社 | 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法 |
| EP2518187A1 (en) | 2011-04-26 | 2012-10-31 | Atotech Deutschland GmbH | Aqueous acidic bath for electrolytic deposition of copper |
| US20140083842A1 (en) * | 2012-09-25 | 2014-03-27 | Almex Pe Inc. | Serial plating system |
| EP2746432A1 (en) * | 2012-12-20 | 2014-06-25 | Atotech Deutschland GmbH | Device for vertical galvanic metal deposition on a substrate |
| ITMI20130466A1 (it) * | 2013-03-27 | 2014-09-28 | Qualital Servizi S R L | Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica. |
| EP2813601A1 (en) | 2013-06-14 | 2014-12-17 | ATOTECH Deutschland GmbH | Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device |
| ES2772808T3 (es) * | 2014-03-11 | 2020-07-08 | Qualital Servizi S R L | Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo |
| CN105063709B (zh) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | 印刷电路板用电镀装置 |
| EP3176288A1 (en) * | 2015-12-03 | 2017-06-07 | ATOTECH Deutschland GmbH | Method for galvanic metal deposition |
| EP3470553A4 (en) * | 2016-06-09 | 2019-08-21 | JFE Steel Corporation | METHOD FOR PRODUCING A GALVANIZED STEEL PLATE AND MANUFACTURING DEVICE THEREFOR |
| PT3287550T (pt) | 2016-08-23 | 2019-05-30 | Atotech Deutschland Gmbh | Dispositivo para deposição galvânica vertical de metal num substrato |
| JP6995544B2 (ja) * | 2017-09-20 | 2022-01-14 | 上村工業株式会社 | 表面処理装置および表面処理方法 |
| CN113943966A (zh) * | 2020-07-16 | 2022-01-18 | 南通深南电路有限公司 | 一种电路板的电镀装置和电镀方法 |
| CN112899743B (zh) * | 2021-01-19 | 2021-09-21 | 鑫巨(深圳)半导体科技有限公司 | 一种电镀装置及电镀方法 |
| CN114808057B (zh) * | 2021-01-29 | 2024-06-21 | 泰科电子(上海)有限公司 | 电镀装置和电镀系统 |
| CN117964183B (zh) * | 2024-04-02 | 2024-06-07 | 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) | 一种苯胺类事故废水应急处置方法及一体化装置 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US3963588A (en) * | 1975-04-21 | 1976-06-15 | United States Steel Corporation | Coalescent-jet apparatus and method for high current density preferential electroplating |
| US4043891A (en) * | 1976-01-14 | 1977-08-23 | Bell Telephone Laboratories, Incorporated | Electrolytic cell with bipolar electrodes |
| JPS5836079B2 (ja) * | 1980-12-02 | 1983-08-06 | 日鉱エンジニアリング株式会社 | 金属表面処理装置 |
| JPS57210989A (en) * | 1981-02-10 | 1982-12-24 | Hiroshige Sawa | Electroplating method |
| CA1190514A (en) | 1981-06-25 | 1985-07-16 | George R. Scanlon | High speed plating of flat planar workpieces |
| US4622917A (en) * | 1982-09-27 | 1986-11-18 | Etd Technology, Inc. | Apparatus and method for electroless plating |
| US4443304A (en) * | 1982-10-01 | 1984-04-17 | Micro-Plate, Inc. | Plating system and method |
| JPS59181873U (ja) * | 1983-05-21 | 1984-12-04 | 株式会社 中央製作所 | 板状被表面処理物のメツキ処理装置 |
| DE3804070C3 (de) | 1988-02-10 | 1994-02-24 | Siemens Nixdorf Inf Syst | Galvanisieranlage für Leiterplatten |
| JPH07113159B2 (ja) | 1988-08-29 | 1995-12-06 | 日本電装株式会社 | めっき装置 |
| JPH0826480B2 (ja) * | 1989-03-28 | 1996-03-13 | 日本エレクトロプレイテイング・エンジニヤース株式会社 | メッキ装置及びメッキ金属の補給方法 |
| DE4133561C2 (de) * | 1991-10-10 | 1994-02-03 | Reinhard Kissler Gmbh | Verfahren und Vorrichtung zum Galvanisieren von Waren |
| DE4322378A1 (de) * | 1993-07-06 | 1995-01-12 | Hans Henig | Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage |
| US5421987A (en) * | 1993-08-30 | 1995-06-06 | Tzanavaras; George | Precision high rate electroplating cell and method |
| US5597469A (en) * | 1995-02-13 | 1997-01-28 | International Business Machines Corporation | Process for selective application of solder to circuit packages |
| JP3438387B2 (ja) * | 1995-03-16 | 2003-08-18 | 株式会社デンソー | めっき装置およびめっき方法 |
| JP3352352B2 (ja) | 1997-03-31 | 2002-12-03 | 新光電気工業株式会社 | めっき装置、めっき方法およびバンプの形成方法 |
| DE19717512C3 (de) * | 1997-04-25 | 2003-06-18 | Atotech Deutschland Gmbh | Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen |
| US5865984A (en) * | 1997-06-30 | 1999-02-02 | International Business Machines Corporation | Electrochemical etching apparatus and method for spirally etching a workpiece |
| US6103096A (en) * | 1997-11-12 | 2000-08-15 | International Business Machines Corporation | Apparatus and method for the electrochemical etching of a wafer |
| KR100474746B1 (ko) | 1998-02-12 | 2005-03-08 | 에이씨엠 리서치, 인코포레이티드 | 도금 장치 및 방법 |
| JPH11288893A (ja) * | 1998-04-03 | 1999-10-19 | Nec Corp | 半導体製造装置及び半導体装置の製造方法 |
| US6132586A (en) * | 1998-06-11 | 2000-10-17 | Integrated Process Equipment Corporation | Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly |
| US6610190B2 (en) * | 2000-11-03 | 2003-08-26 | Nutool, Inc. | Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate |
| US6984302B2 (en) * | 1998-12-30 | 2006-01-10 | Intel Corporation | Electroplating cell based upon rotational plating solution flow |
| JP4175528B2 (ja) * | 1999-02-25 | 2008-11-05 | 株式会社ナウケミカル | めっき装置 |
| JP3352081B2 (ja) | 2001-02-01 | 2002-12-03 | 株式会社アスカエンジニアリング | プリント基板の銅めっき装置 |
| US6989084B2 (en) * | 2001-11-02 | 2006-01-24 | Rockwell Scientific Licensing, Llc | Semiconductor wafer plating cell assembly |
| JP2005520930A (ja) * | 2001-12-24 | 2005-07-14 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | ウェハ表面を電気メッキするための装置および方法 |
| JP4330380B2 (ja) * | 2003-05-29 | 2009-09-16 | 株式会社荏原製作所 | めっき装置及びめっき方法 |
| WO2004081261A2 (en) * | 2003-03-11 | 2004-09-23 | Ebara Corporation | Plating apparatus |
| US20040182715A1 (en) * | 2003-03-20 | 2004-09-23 | Jeffrey Bogart | Process and apparatus for air bubble removal during electrochemical processing |
| JP4624738B2 (ja) | 2003-08-21 | 2011-02-02 | 株式会社荏原製作所 | めっき装置 |
| EP1903129A1 (en) * | 2003-11-20 | 2008-03-26 | Process Automation International Limited | A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus |
-
2007
- 2007-06-06 DE DE102007026633A patent/DE102007026633B4/de not_active Expired - Fee Related
-
2008
- 2008-06-03 KR KR1020157013377A patent/KR101641475B1/ko not_active Expired - Fee Related
- 2008-06-03 BR BRPI0812259-8A2A patent/BRPI0812259A2/pt not_active IP Right Cessation
- 2008-06-03 PL PL08759143T patent/PL2176450T3/pl unknown
- 2008-06-03 US US12/602,703 patent/US8545687B2/en not_active Expired - Fee Related
- 2008-06-03 JP JP2010510699A patent/JP2010530029A/ja active Pending
- 2008-06-03 WO PCT/EP2008/004616 patent/WO2008148578A1/en not_active Ceased
- 2008-06-03 EP EP08759143A patent/EP2176450B9/en not_active Not-in-force
- 2008-06-03 AT AT08759143T patent/ATE519872T1/de active
- 2008-06-03 CN CN200880018855XA patent/CN101730760B/zh active Active
- 2008-06-03 KR KR1020097025444A patent/KR20100019481A/ko not_active Ceased
- 2008-06-05 TW TW097120909A patent/TWI433965B/zh active
-
2013
- 2013-06-12 JP JP2013123570A patent/JP5597751B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| EP2176450A1 (en) | 2010-04-21 |
| DE102007026633B4 (de) | 2009-04-02 |
| WO2008148578A1 (en) | 2008-12-11 |
| KR20100019481A (ko) | 2010-02-18 |
| US8545687B2 (en) | 2013-10-01 |
| CN101730760B (zh) | 2011-09-28 |
| JP2010530029A (ja) | 2010-09-02 |
| CN101730760A (zh) | 2010-06-09 |
| EP2176450B1 (en) | 2011-08-10 |
| PL2176450T3 (pl) | 2011-12-30 |
| KR101641475B1 (ko) | 2016-07-20 |
| JP5597751B2 (ja) | 2014-10-01 |
| TW200918689A (en) | 2009-05-01 |
| US20100176004A1 (en) | 2010-07-15 |
| JP2013224492A (ja) | 2013-10-31 |
| BRPI0812259A2 (pt) | 2014-12-23 |
| ATE519872T1 (de) | 2011-08-15 |
| EP2176450B9 (en) | 2012-02-01 |
| DE102007026633A1 (de) | 2008-12-11 |
| KR20150071031A (ko) | 2015-06-25 |
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