ATE519872T1 - Vorrichtung und verfahren zum elektrolytischen behandeln einer plattenförmigen ware - Google Patents

Vorrichtung und verfahren zum elektrolytischen behandeln einer plattenförmigen ware

Info

Publication number
ATE519872T1
ATE519872T1 AT08759143T AT08759143T ATE519872T1 AT E519872 T1 ATE519872 T1 AT E519872T1 AT 08759143 T AT08759143 T AT 08759143T AT 08759143 T AT08759143 T AT 08759143T AT E519872 T1 ATE519872 T1 AT E519872T1
Authority
AT
Austria
Prior art keywords
product
treatment
plate
shaped product
electrolytically treating
Prior art date
Application number
AT08759143T
Other languages
German (de)
English (en)
Inventor
Reinhard Schneider
Henry Kunze
Ferdinand Wiener
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Application granted granted Critical
Publication of ATE519872T1 publication Critical patent/ATE519872T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
AT08759143T 2007-06-06 2008-06-03 Vorrichtung und verfahren zum elektrolytischen behandeln einer plattenförmigen ware ATE519872T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Publications (1)

Publication Number Publication Date
ATE519872T1 true ATE519872T1 (de) 2011-08-15

Family

ID=39712035

Family Applications (1)

Application Number Title Priority Date Filing Date
AT08759143T ATE519872T1 (de) 2007-06-06 2008-06-03 Vorrichtung und verfahren zum elektrolytischen behandeln einer plattenförmigen ware

Country Status (11)

Country Link
US (1) US8545687B2 (enExample)
EP (1) EP2176450B9 (enExample)
JP (2) JP2010530029A (enExample)
KR (2) KR101641475B1 (enExample)
CN (1) CN101730760B (enExample)
AT (1) ATE519872T1 (enExample)
BR (1) BRPI0812259A2 (enExample)
DE (1) DE102007026633B4 (enExample)
PL (1) PL2176450T3 (enExample)
TW (1) TWI433965B (enExample)
WO (1) WO2008148578A1 (enExample)

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PT3287550T (pt) 2016-08-23 2019-05-30 Atotech Deutschland Gmbh Dispositivo para deposição galvânica vertical de metal num substrato
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

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Also Published As

Publication number Publication date
TWI433965B (zh) 2014-04-11
EP2176450A1 (en) 2010-04-21
DE102007026633B4 (de) 2009-04-02
WO2008148578A1 (en) 2008-12-11
KR20100019481A (ko) 2010-02-18
US8545687B2 (en) 2013-10-01
CN101730760B (zh) 2011-09-28
JP2010530029A (ja) 2010-09-02
CN101730760A (zh) 2010-06-09
EP2176450B1 (en) 2011-08-10
PL2176450T3 (pl) 2011-12-30
KR101641475B1 (ko) 2016-07-20
JP5597751B2 (ja) 2014-10-01
TW200918689A (en) 2009-05-01
US20100176004A1 (en) 2010-07-15
JP2013224492A (ja) 2013-10-31
BRPI0812259A2 (pt) 2014-12-23
EP2176450B9 (en) 2012-02-01
DE102007026633A1 (de) 2008-12-11
KR20150071031A (ko) 2015-06-25

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