DE102008045260B8 - Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern - Google Patents

Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern Download PDF

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Publication number
DE102008045260B8
DE102008045260B8 DE102008045260A DE102008045260A DE102008045260B8 DE 102008045260 B8 DE102008045260 B8 DE 102008045260B8 DE 102008045260 A DE102008045260 A DE 102008045260A DE 102008045260 A DE102008045260 A DE 102008045260A DE 102008045260 B8 DE102008045260 B8 DE 102008045260B8
Authority
DE
Germany
Prior art keywords
process chambers
electroplating substrates
electroplating
substrates
chambers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102008045260A
Other languages
English (en)
Other versions
DE102008045260B3 (de
Inventor
Mathias Gutekunst
Peter Reustle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RENA Technologies GmbH
Original Assignee
Rena GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rena GmbH filed Critical Rena GmbH
Priority to DE102008045260A priority Critical patent/DE102008045260B8/de
Priority to EP09777348A priority patent/EP2331733A2/de
Priority to PCT/EP2009/005301 priority patent/WO2010022825A2/de
Application granted granted Critical
Publication of DE102008045260B3 publication Critical patent/DE102008045260B3/de
Publication of DE102008045260B8 publication Critical patent/DE102008045260B8/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/002—Cell separation, e.g. membranes, diaphragms
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/008—Current shielding devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
DE102008045260A 2008-09-01 2008-09-01 Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern Active DE102008045260B8 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102008045260A DE102008045260B8 (de) 2008-09-01 2008-09-01 Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern
EP09777348A EP2331733A2 (de) 2008-09-01 2009-07-21 Vorrichtung und verfahren zum galvanisieren von substraten in prozesskammern
PCT/EP2009/005301 WO2010022825A2 (de) 2008-09-01 2009-07-21 Vorrichtung und verfahren zum galvanisieren von substraten in prozesskammern

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008045260A DE102008045260B8 (de) 2008-09-01 2008-09-01 Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern

Publications (2)

Publication Number Publication Date
DE102008045260B3 DE102008045260B3 (de) 2009-09-10
DE102008045260B8 true DE102008045260B8 (de) 2010-02-11

Family

ID=40936605

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008045260A Active DE102008045260B8 (de) 2008-09-01 2008-09-01 Vorrichtung und Verfahren zum Galvanisieren von Substraten in Prozesskammern

Country Status (3)

Country Link
EP (1) EP2331733A2 (de)
DE (1) DE102008045260B8 (de)
WO (1) WO2010022825A2 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102383168B (zh) * 2011-08-22 2015-03-04 无锡鼎亚电子材料有限公司 压轮式导电槽
DE102017116934B4 (de) * 2017-07-26 2022-01-20 Balver Zinn Josef Jost GmbH & Co. KG Löslicher Anodenkörper

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5391285A (en) * 1994-02-25 1995-02-21 Motorola, Inc. Adjustable plating cell for uniform bump plating of semiconductor wafers
US6132587A (en) * 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
US20010000891A1 (en) * 1997-04-28 2001-05-10 Katsuya Kosaki Method of plating semiconductor wafer and plated semiconductor wafer
KR20010090533A (ko) * 2000-03-24 2001-10-18 조셉 제이. 스위니 금속층의 균일한 증착을 위한 천공 양극
JP2002097595A (ja) * 2000-09-25 2002-04-02 Hitachi Ltd 半導体装置の製造方法
JP2002115096A (ja) * 2000-10-10 2002-04-19 Applied Materials Inc めっき装置
DE102007020449A1 (de) * 2006-12-13 2008-06-19 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur einseitigen nasschemischen und elektrolytischen Behandlung von Gut

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6402923B1 (en) * 2000-03-27 2002-06-11 Novellus Systems Inc Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping element
US6695957B1 (en) * 1999-06-04 2004-02-24 Mykrolis Corporation Simultaneous electrical and fluid connection for anode
US20030188975A1 (en) * 2002-04-05 2003-10-09 Nielsen Thomas D. Copper anode for semiconductor interconnects
JP2006193822A (ja) * 2004-12-16 2006-07-27 Sharp Corp めっき装置、めっき方法、半導体装置、及び半導体装置の製造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5000827A (en) * 1990-01-02 1991-03-19 Motorola, Inc. Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
US5391285A (en) * 1994-02-25 1995-02-21 Motorola, Inc. Adjustable plating cell for uniform bump plating of semiconductor wafers
US20010000891A1 (en) * 1997-04-28 2001-05-10 Katsuya Kosaki Method of plating semiconductor wafer and plated semiconductor wafer
US6132587A (en) * 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
KR20010090533A (ko) * 2000-03-24 2001-10-18 조셉 제이. 스위니 금속층의 균일한 증착을 위한 천공 양극
JP2002097595A (ja) * 2000-09-25 2002-04-02 Hitachi Ltd 半導体装置の製造方法
JP2002115096A (ja) * 2000-10-10 2002-04-19 Applied Materials Inc めっき装置
DE102007020449A1 (de) * 2006-12-13 2008-06-19 Rena Sondermaschinen Gmbh Vorrichtung und Verfahren zur einseitigen nasschemischen und elektrolytischen Behandlung von Gut

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
KR 1020010090533 A

Also Published As

Publication number Publication date
WO2010022825A3 (de) 2010-05-14
EP2331733A2 (de) 2011-06-15
WO2010022825A2 (de) 2010-03-04
DE102008045260B3 (de) 2009-09-10

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Legal Events

Date Code Title Description
8396 Reprint of erroneous front page
8363 Opposition against the patent
R031 Decision of examining division/federal patent court maintaining patent unamended now final

Effective date: 20120530

R081 Change of applicant/patentee

Owner name: RENA TECHNOLOGIES GMBH, DE

Free format text: FORMER OWNER: RENA GMBH, 78148 GUETENBACH, DE

R082 Change of representative

Representative=s name: JOACHIM STUERKEN PATENTANWALTSGESELLSCHAFT MBH, DE

R082 Change of representative