KR101641475B1 - 판상 제품의 전해 처리를 위한 장치 및 방법 - Google Patents

판상 제품의 전해 처리를 위한 장치 및 방법 Download PDF

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Publication number
KR101641475B1
KR101641475B1 KR1020157013377A KR20157013377A KR101641475B1 KR 101641475 B1 KR101641475 B1 KR 101641475B1 KR 1020157013377 A KR1020157013377 A KR 1020157013377A KR 20157013377 A KR20157013377 A KR 20157013377A KR 101641475 B1 KR101641475 B1 KR 101641475B1
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KR
South Korea
Prior art keywords
product
nozzle
flow
treatment
counter electrode
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
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KR1020157013377A
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English (en)
Korean (ko)
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KR20150071031A (ko
Inventor
라인하르트 슈나이더
헨리 쿤체
페르디난트 비에너
Original Assignee
아토테크더치랜드게엠베하
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Publication of KR20150071031A publication Critical patent/KR20150071031A/ko
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Publication of KR101641475B1 publication Critical patent/KR101641475B1/ko
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1020157013377A 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법 Expired - Fee Related KR101641475B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
DE102007026633.4 2007-06-06
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020097025444A Division KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Publications (2)

Publication Number Publication Date
KR20150071031A KR20150071031A (ko) 2015-06-25
KR101641475B1 true KR101641475B1 (ko) 2016-07-20

Family

ID=39712035

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020157013377A Expired - Fee Related KR101641475B1 (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법
KR1020097025444A Ceased KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020097025444A Ceased KR20100019481A (ko) 2007-06-06 2008-06-03 판상 제품의 전해 처리를 위한 장치 및 방법

Country Status (11)

Country Link
US (1) US8545687B2 (enExample)
EP (1) EP2176450B9 (enExample)
JP (2) JP2010530029A (enExample)
KR (2) KR101641475B1 (enExample)
CN (1) CN101730760B (enExample)
AT (1) ATE519872T1 (enExample)
BR (1) BRPI0812259A2 (enExample)
DE (1) DE102007026633B4 (enExample)
PL (1) PL2176450T3 (enExample)
TW (1) TWI433965B (enExample)
WO (1) WO2008148578A1 (enExample)

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WO2008148834A1 (en) 2007-06-05 2008-12-11 Nestec S.A. Capsule and method for preparing a food liquid by centrifugation
EP2316310B1 (en) * 2007-06-05 2012-05-16 Nestec S.A. System and method for preparing a food liquid from a food substance contained in a receptacle by centrifugation
AU2008258738B2 (en) * 2007-06-05 2015-05-14 Société des Produits Nestlé S.A. Method for preparing a beverage or liquid food and system using brewing centrifugal force
US8431175B2 (en) * 2007-06-05 2013-04-30 Nestec S.A. Method for preparing a beverage or food liquid and system using brewing centrifugal force
HUE027580T2 (en) 2008-09-02 2016-10-28 Nestec Sa A method for preparing a food liquid stored in a capsule by centrifugation and a composition according to such a process
WO2010026053A1 (en) * 2008-09-02 2010-03-11 Nestec S.A. Controlled beverage production device using centrifugal forces
AU2009326071B2 (en) 2008-12-09 2016-01-14 Société des Produits Nestlé S.A. Liquid food preparation system for preparing a liquid food by centrifugation
JP5375596B2 (ja) * 2009-02-19 2013-12-25 株式会社デンソー 噴流式めっき方法および装置
ES2423294T3 (es) * 2009-08-19 2013-09-19 Nestec S.A. Cápsula para la preparación de un extracto de café provista de una estructura que facilita la perforación por inyección de agua
JP5722895B2 (ja) 2009-08-28 2015-05-27 ネステク ソシエテ アノニム 遠心法による飲料調製用カプセルシステム
US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
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EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
EP3470553A4 (en) * 2016-06-09 2019-08-21 JFE Steel Corporation METHOD FOR PRODUCING A GALVANIZED STEEL PLATE AND MANUFACTURING DEVICE THEREFOR
PT3287550T (pt) 2016-08-23 2019-05-30 Atotech Deutschland Gmbh Dispositivo para deposição galvânica vertical de metal num substrato
JP6995544B2 (ja) * 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN112899743B (zh) * 2021-01-19 2021-09-21 鑫巨(深圳)半导体科技有限公司 一种电镀装置及电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

Citations (1)

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Also Published As

Publication number Publication date
TWI433965B (zh) 2014-04-11
EP2176450A1 (en) 2010-04-21
DE102007026633B4 (de) 2009-04-02
WO2008148578A1 (en) 2008-12-11
KR20100019481A (ko) 2010-02-18
US8545687B2 (en) 2013-10-01
CN101730760B (zh) 2011-09-28
JP2010530029A (ja) 2010-09-02
CN101730760A (zh) 2010-06-09
EP2176450B1 (en) 2011-08-10
PL2176450T3 (pl) 2011-12-30
JP5597751B2 (ja) 2014-10-01
TW200918689A (en) 2009-05-01
US20100176004A1 (en) 2010-07-15
JP2013224492A (ja) 2013-10-31
BRPI0812259A2 (pt) 2014-12-23
ATE519872T1 (de) 2011-08-15
EP2176450B9 (en) 2012-02-01
DE102007026633A1 (de) 2008-12-11
KR20150071031A (ko) 2015-06-25

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