JP2010530029A - 板状製品の電気的処理用装置及び方法 - Google Patents

板状製品の電気的処理用装置及び方法 Download PDF

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Publication number
JP2010530029A
JP2010530029A JP2010510699A JP2010510699A JP2010530029A JP 2010530029 A JP2010530029 A JP 2010530029A JP 2010510699 A JP2010510699 A JP 2010510699A JP 2010510699 A JP2010510699 A JP 2010510699A JP 2010530029 A JP2010530029 A JP 2010530029A
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product
treatment
flow
flow device
processing
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Pending
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JP2010510699A
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English (en)
Japanese (ja)
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JP2010530029A5 (enExample
Inventor
ラインハルト シュナイダー
ヘンリー クンツェ
フェルディナント ヴィーナー
Original Assignee
アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
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Application filed by アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング filed Critical アトーテヒ ドイッチュラント ゲゼルシャフト ミット ベシュレンクテル ハフツング
Publication of JP2010530029A publication Critical patent/JP2010530029A/ja
Publication of JP2010530029A5 publication Critical patent/JP2010530029A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/10—Agitating of electrolytes; Moving of racks
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/04—Electroplating with moving electrodes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Coating Apparatus (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2010510699A 2007-06-06 2008-06-03 板状製品の電気的処理用装置及び方法 Pending JP2010530029A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102007026633A DE102007026633B4 (de) 2007-06-06 2007-06-06 Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware
PCT/EP2008/004616 WO2008148578A1 (en) 2007-06-06 2008-06-03 Apparatus and method for the electrolytic treatment of a plate-shaped product

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013123570A Division JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Publications (2)

Publication Number Publication Date
JP2010530029A true JP2010530029A (ja) 2010-09-02
JP2010530029A5 JP2010530029A5 (enExample) 2011-01-27

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010510699A Pending JP2010530029A (ja) 2007-06-06 2008-06-03 板状製品の電気的処理用装置及び方法
JP2013123570A Expired - Fee Related JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Family Applications After (1)

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JP2013123570A Expired - Fee Related JP5597751B2 (ja) 2007-06-06 2013-06-12 板状製品の電気分解処理用装置及び方法

Country Status (11)

Country Link
US (1) US8545687B2 (enExample)
EP (1) EP2176450B9 (enExample)
JP (2) JP2010530029A (enExample)
KR (2) KR101641475B1 (enExample)
CN (1) CN101730760B (enExample)
AT (1) ATE519872T1 (enExample)
BR (1) BRPI0812259A2 (enExample)
DE (1) DE102007026633B4 (enExample)
PL (1) PL2176450T3 (enExample)
TW (1) TWI433965B (enExample)
WO (1) WO2008148578A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (ja) * 2009-02-19 2010-09-30 Denso Corp 噴流式めっき方法および装置
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
WO2019058860A1 (ja) * 2017-09-20 2019-03-28 上村工業株式会社 表面処理装置および表面処理方法
JP2024504514A (ja) * 2021-01-19 2024-01-31 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BRPI0812195B1 (pt) * 2007-06-05 2018-11-21 Nestec Sa cápsula de uso único para preparação de um líquido alimentício por centrifugação
WO2008148834A1 (en) 2007-06-05 2008-12-11 Nestec S.A. Capsule and method for preparing a food liquid by centrifugation
EP2316310B1 (en) * 2007-06-05 2012-05-16 Nestec S.A. System and method for preparing a food liquid from a food substance contained in a receptacle by centrifugation
AU2008258738B2 (en) * 2007-06-05 2015-05-14 Société des Produits Nestlé S.A. Method for preparing a beverage or liquid food and system using brewing centrifugal force
US8431175B2 (en) * 2007-06-05 2013-04-30 Nestec S.A. Method for preparing a beverage or food liquid and system using brewing centrifugal force
HUE027580T2 (en) 2008-09-02 2016-10-28 Nestec Sa A method for preparing a food liquid stored in a capsule by centrifugation and a composition according to such a process
WO2010026053A1 (en) * 2008-09-02 2010-03-11 Nestec S.A. Controlled beverage production device using centrifugal forces
AU2009326071B2 (en) 2008-12-09 2016-01-14 Société des Produits Nestlé S.A. Liquid food preparation system for preparing a liquid food by centrifugation
ES2423294T3 (es) * 2009-08-19 2013-09-19 Nestec S.A. Cápsula para la preparación de un extracto de café provista de una estructura que facilita la perforación por inyección de agua
JP5722895B2 (ja) 2009-08-28 2015-05-27 ネステク ソシエテ アノニム 遠心法による飲料調製用カプセルシステム
US8658232B2 (en) * 2009-08-28 2014-02-25 Nestec S.A. Capsule system for the preparation of beverages by centrifugation
DE102010033256A1 (de) 2010-07-29 2012-02-02 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Methode zur Erzeugung gezielter Strömungs- und Stromdichtemuster bei der chemischen und elektrolytischen Oberflächenbehandlung
EP2518187A1 (en) 2011-04-26 2012-10-31 Atotech Deutschland GmbH Aqueous acidic bath for electrolytic deposition of copper
US20140083842A1 (en) * 2012-09-25 2014-03-27 Almex Pe Inc. Serial plating system
EP2746432A1 (en) * 2012-12-20 2014-06-25 Atotech Deutschland GmbH Device for vertical galvanic metal deposition on a substrate
ITMI20130466A1 (it) * 2013-03-27 2014-09-28 Qualital Servizi S R L Sistema di pretrattamento alla verniciatura dell'alluminio mediante una tecnica innovativa di ossidazione anodica.
EP2813601A1 (en) 2013-06-14 2014-12-17 ATOTECH Deutschland GmbH Device for moving a substrate holder during a vertical gal-vanic metal deposition, and a method for vertical galvanic metal deposition using such a device
ES2772808T3 (es) * 2014-03-11 2020-07-08 Qualital Servizi S R L Instalación y procedimiento para el tratamiento de anodización de productos fabricados de aluminio o aleaciones del mismo
CN105063709B (zh) * 2015-09-18 2018-02-23 安捷利电子科技（苏州）有限公司 印刷电路板用电镀装置
EP3176288A1 (en) * 2015-12-03 2017-06-07 ATOTECH Deutschland GmbH Method for galvanic metal deposition
EP3470553A4 (en) * 2016-06-09 2019-08-21 JFE Steel Corporation METHOD FOR PRODUCING A GALVANIZED STEEL PLATE AND MANUFACTURING DEVICE THEREFOR
PT3287550T (pt) 2016-08-23 2019-05-30 Atotech Deutschland Gmbh Dispositivo para deposição galvânica vertical de metal num substrato
CN113943966A (zh) * 2020-07-16 2022-01-18 南通深南电路有限公司 一种电路板的电镀装置和电镀方法
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀系统
CN117964183B (zh) * 2024-04-02 2024-06-07 生态环境部华南环境科学研究所(生态环境部生态环境应急研究所) 一种苯胺类事故废水应急处置方法及一体化装置

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794593A (en) * 1980-12-02 1982-06-12 Nikko Eng Kk Surface treating device for metal
JPS57210989A (en) * 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
JPH0261089A (ja) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd めっき装置
JPH02254200A (ja) * 1989-03-28 1990-10-12 Electroplating Eng Of Japan Co メッキ装置及びメッキ金属の補給方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法
JPH10275811A (ja) * 1997-03-31 1998-10-13 Shinko Electric Ind Co Ltd バンプの形成方法およびめっき装置
JP2000239899A (ja) * 1999-02-25 2000-09-05 Nau Chemical:Kk めっき装置
JP2002226993A (ja) * 2001-02-01 2002-08-14 Asuka Engineering:Kk プリント基板の銅めっき方法およびめっき装置
JP2005520930A (ja) * 2001-12-24 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ウェハ表面を電気メッキするための装置および方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3963588A (en) * 1975-04-21 1976-06-15 United States Steel Corporation Coalescent-jet apparatus and method for high current density preferential electroplating
US4043891A (en) * 1976-01-14 1977-08-23 Bell Telephone Laboratories, Incorporated Electrolytic cell with bipolar electrodes
CA1190514A (en) 1981-06-25 1985-07-16 George R. Scanlon High speed plating of flat planar workpieces
US4622917A (en) * 1982-09-27 1986-11-18 Etd Technology, Inc. Apparatus and method for electroless plating
US4443304A (en) * 1982-10-01 1984-04-17 Micro-Plate, Inc. Plating system and method
DE3804070C3 (de) 1988-02-10 1994-02-24 Siemens Nixdorf Inf Syst Galvanisieranlage für Leiterplatten
DE4133561C2 (de) * 1991-10-10 1994-02-03 Reinhard Kissler Gmbh Verfahren und Vorrichtung zum Galvanisieren von Waren
DE4322378A1 (de) * 1993-07-06 1995-01-12 Hans Henig Verfahren und Einrichtung zur Oberflächenbehandlung vornehmlich plattenförmiger Werkstücke in horizontaler Betriebslage
US5421987A (en) * 1993-08-30 1995-06-06 Tzanavaras; George Precision high rate electroplating cell and method
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen
US5865984A (en) * 1997-06-30 1999-02-02 International Business Machines Corporation Electrochemical etching apparatus and method for spirally etching a workpiece
US6103096A (en) * 1997-11-12 2000-08-15 International Business Machines Corporation Apparatus and method for the electrochemical etching of a wafer
KR100474746B1 (ko) 1998-02-12 2005-03-08 에이씨엠 리서치, 인코포레이티드 도금 장치 및 방법
JPH11288893A (ja) * 1998-04-03 1999-10-19 Nec Corp 半導体製造装置及び半導体装置の製造方法
US6132586A (en) * 1998-06-11 2000-10-17 Integrated Process Equipment Corporation Method and apparatus for non-contact metal plating of semiconductor wafers using a bipolar electrode assembly
US6610190B2 (en) * 2000-11-03 2003-08-26 Nutool, Inc. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6984302B2 (en) * 1998-12-30 2006-01-10 Intel Corporation Electroplating cell based upon rotational plating solution flow
US6989084B2 (en) * 2001-11-02 2006-01-24 Rockwell Scientific Licensing, Llc Semiconductor wafer plating cell assembly
JP4330380B2 (ja) * 2003-05-29 2009-09-16 株式会社荏原製作所 めっき装置及びめっき方法
WO2004081261A2 (en) * 2003-03-11 2004-09-23 Ebara Corporation Plating apparatus
US20040182715A1 (en) * 2003-03-20 2004-09-23 Jeffrey Bogart Process and apparatus for air bubble removal during electrochemical processing
JP4624738B2 (ja) 2003-08-21 2011-02-02 株式会社荏原製作所 めっき装置
EP1903129A1 (en) * 2003-11-20 2008-03-26 Process Automation International Limited A liquid delivery system for an electroplating apparatus, an electroplating apparatus with such a liquid delivery system, and a method of operating an electroplating apparatus

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5794593A (en) * 1980-12-02 1982-06-12 Nikko Eng Kk Surface treating device for metal
JPS57210989A (en) * 1981-02-10 1982-12-24 Hiroshige Sawa Electroplating method
JPS59181873U (ja) * 1983-05-21 1984-12-04 株式会社　中央製作所 板状被表面処理物のメツキ処理装置
JPH0261089A (ja) * 1988-08-29 1990-03-01 Nippon Denso Co Ltd めっき装置
JPH02254200A (ja) * 1989-03-28 1990-10-12 Electroplating Eng Of Japan Co メッキ装置及びメッキ金属の補給方法
JPH08253892A (ja) * 1995-03-16 1996-10-01 Nippondenso Co Ltd めっき装置およびめっき方法
JPH10275811A (ja) * 1997-03-31 1998-10-13 Shinko Electric Ind Co Ltd バンプの形成方法およびめっき装置
JP2000239899A (ja) * 1999-02-25 2000-09-05 Nau Chemical:Kk めっき装置
JP2002226993A (ja) * 2001-02-01 2002-08-14 Asuka Engineering:Kk プリント基板の銅めっき方法およびめっき装置
JP2005520930A (ja) * 2001-12-24 2005-07-14 コーニンクレッカ　フィリップス　エレクトロニクス　エヌ　ヴィ ウェハ表面を電気メッキするための装置および方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010216006A (ja) * 2009-02-19 2010-09-30 Denso Corp 噴流式めっき方法および装置
WO2012073501A1 (ja) * 2010-12-01 2012-06-07 マルイ鍍金工業株式会社 電解液、電解ケース、電解研磨システムおよび、それらを用いた電解研磨方法
WO2019058860A1 (ja) * 2017-09-20 2019-03-28 上村工業株式会社 表面処理装置および表面処理方法
JP2019056137A (ja) * 2017-09-20 2019-04-11 上村工業株式会社 表面処理装置および表面処理方法
KR20200056409A (ko) * 2017-09-20 2020-05-22 우에무라 고교 가부시키가이샤 표면 처리 장치 및 표면 처리 방법
JP6995544B2 (ja) 2017-09-20 2022-01-14 上村工業株式会社 表面処理装置および表面処理方法
KR102401901B1 (ko) * 2017-09-20 2022-05-24 우에무라 고교 가부시키가이샤 표면 처리 장치 및 표면 처리 방법
US11389818B2 (en) 2017-09-20 2022-07-19 C. Uyemura & Co., Ltd. Surface treatment apparatus and surface treatment method
JP2024504514A (ja) * 2021-01-19 2024-01-31 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法
JP7672742B2 (ja) 2021-01-19 2025-05-08 ▲シン▼巨（深▲せん▼）半導体科技有限公司 電気めっき装置及び電気めっき方法

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Publication number Publication date
TWI433965B (zh) 2014-04-11
EP2176450A1 (en) 2010-04-21
DE102007026633B4 (de) 2009-04-02
WO2008148578A1 (en) 2008-12-11
KR20100019481A (ko) 2010-02-18
US8545687B2 (en) 2013-10-01
CN101730760B (zh) 2011-09-28
CN101730760A (zh) 2010-06-09
EP2176450B1 (en) 2011-08-10
PL2176450T3 (pl) 2011-12-30
KR101641475B1 (ko) 2016-07-20
JP5597751B2 (ja) 2014-10-01
TW200918689A (en) 2009-05-01
US20100176004A1 (en) 2010-07-15
JP2013224492A (ja) 2013-10-31
BRPI0812259A2 (pt) 2014-12-23
ATE519872T1 (de) 2011-08-15
EP2176450B9 (en) 2012-02-01
DE102007026633A1 (de) 2008-12-11
KR20150071031A (ko) 2015-06-25

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