TWI431705B - Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device - Google Patents

Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device Download PDF

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Publication number
TWI431705B
TWI431705B TW097110056A TW97110056A TWI431705B TW I431705 B TWI431705 B TW I431705B TW 097110056 A TW097110056 A TW 097110056A TW 97110056 A TW97110056 A TW 97110056A TW I431705 B TWI431705 B TW I431705B
Authority
TW
Taiwan
Prior art keywords
probes
needle end
end position
contact
contact body
Prior art date
Application number
TW097110056A
Other languages
English (en)
Chinese (zh)
Other versions
TW200845261A (en
Inventor
山田浩史
鈴木勝
Original Assignee
東京威力科創股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 東京威力科創股份有限公司 filed Critical 東京威力科創股份有限公司
Publication of TW200845261A publication Critical patent/TW200845261A/zh
Application granted granted Critical
Publication of TWI431705B publication Critical patent/TWI431705B/zh

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
TW097110056A 2007-03-23 2008-03-21 Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device TWI431705B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007077923A JP4950719B2 (ja) 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置

Publications (2)

Publication Number Publication Date
TW200845261A TW200845261A (en) 2008-11-16
TWI431705B true TWI431705B (zh) 2014-03-21

Family

ID=39774048

Family Applications (1)

Application Number Title Priority Date Filing Date
TW097110056A TWI431705B (zh) 2007-03-23 2008-03-21 Method for detecting the position of the needle end of the probe, the alignment method, the needle end position detecting device, and the probe device

Country Status (5)

Country Link
US (1) US7839156B2 (https=)
JP (1) JP4950719B2 (https=)
KR (1) KR100945328B1 (https=)
CN (1) CN101285865B (https=)
TW (1) TWI431705B (https=)

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* Cited by examiner, † Cited by third party
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TWI908218B (zh) * 2024-07-29 2025-12-11 欣銓科技股份有限公司 針測行程最佳化的晶圓測試裝置及其方法

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JP5260119B2 (ja) * 2008-04-02 2013-08-14 東京エレクトロン株式会社 アライメント方法
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ITVI20110343A1 (it) * 2011-12-30 2013-07-01 St Microelectronics Srl Sistema e adattatore per testare chips con circuiti integrati in un package
JP5993649B2 (ja) * 2012-07-31 2016-09-14 東京エレクトロン株式会社 プローブカードへの基板当接装置、基板当接装置を備えた基板検査装置、及びプローブカードへの基板当接方法
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JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
US9347979B2 (en) * 2013-10-01 2016-05-24 Infineon Technologies Ag Touchdown monitoring for individual dies of a semiconductor wafer
TWI498565B (zh) * 2013-12-11 2015-09-01 Mpi Corp 探針點測系統、探針高度調整方法與探針位置監測方法
KR101934880B1 (ko) * 2014-05-15 2019-01-03 삼성전자주식회사 탐침 장치 및 그 운용 방법
TWI528041B (zh) * 2015-04-30 2016-04-01 The method of adjusting the displacement distance of the probe according to the horizontal position of the plurality of points to be measured
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JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
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JP6501726B2 (ja) * 2016-04-19 2019-04-17 三菱電機株式会社 プローブ位置検査装置および半導体評価装置ならびにプローブ位置検査方法
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
KR102799834B1 (ko) * 2017-01-11 2025-04-28 (주)테크윙 테스트핸들러용 가압장치
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6869123B2 (ja) 2017-06-23 2021-05-12 東京エレクトロン株式会社 プローブ装置及び針跡転写方法
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) * 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
CN108828425B (zh) * 2018-07-16 2024-08-27 苏州肯美特设备集成股份有限公司 一种半导体测试装置
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI908218B (zh) * 2024-07-29 2025-12-11 欣銓科技股份有限公司 針測行程最佳化的晶圓測試裝置及其方法

Also Published As

Publication number Publication date
US20080231300A1 (en) 2008-09-25
KR20080086816A (ko) 2008-09-26
CN101285865B (zh) 2011-07-20
TW200845261A (en) 2008-11-16
CN101285865A (zh) 2008-10-15
KR100945328B1 (ko) 2010-03-08
JP4950719B2 (ja) 2012-06-13
US7839156B2 (en) 2010-11-23
JP2008243860A (ja) 2008-10-09

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