KR100945328B1 - 프로브의 침끝위치의 검출 방법, 얼라이먼트 방법,침끝위치 검출 장치 및 프로브 장치 - Google Patents

프로브의 침끝위치의 검출 방법, 얼라이먼트 방법,침끝위치 검출 장치 및 프로브 장치 Download PDF

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KR100945328B1
KR100945328B1 KR1020080022752A KR20080022752A KR100945328B1 KR 100945328 B1 KR100945328 B1 KR 100945328B1 KR 1020080022752 A KR1020080022752 A KR 1020080022752A KR 20080022752 A KR20080022752 A KR 20080022752A KR 100945328 B1 KR100945328 B1 KR 100945328B1
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probes
needle tip
contact
tip position
contact body
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KR20080086816A (ko
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히로시 야마다
마사루 스즈키
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도쿄엘렉트론가부시키가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020080022752A 2007-03-23 2008-03-12 프로브의 침끝위치의 검출 방법, 얼라이먼트 방법,침끝위치 검출 장치 및 프로브 장치 Active KR100945328B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-00077923 2007-03-23
JP2007077923A JP4950719B2 (ja) 2007-03-23 2007-03-23 プローブの針先位置の検出方法、アライメント方法、針先位置検出装置及びプローブ装置

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KR20080086816A KR20080086816A (ko) 2008-09-26
KR100945328B1 true KR100945328B1 (ko) 2010-03-08

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US (1) US7839156B2 (https=)
JP (1) JP4950719B2 (https=)
KR (1) KR100945328B1 (https=)
CN (1) CN101285865B (https=)
TW (1) TWI431705B (https=)

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ITVI20110343A1 (it) * 2011-12-30 2013-07-01 St Microelectronics Srl Sistema e adattatore per testare chips con circuiti integrati in un package
JP5993649B2 (ja) * 2012-07-31 2016-09-14 東京エレクトロン株式会社 プローブカードへの基板当接装置、基板当接装置を備えた基板検査装置、及びプローブカードへの基板当接方法
JP5918682B2 (ja) * 2012-10-09 2016-05-18 東京エレクトロン株式会社 プローブカード取り付け方法
CN103091521B (zh) * 2013-01-08 2015-07-15 上海交通大学 一种探针和引脚自动对准的方法及其探针台测试系统
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JP5819880B2 (ja) * 2013-05-08 2015-11-24 本田技研工業株式会社 平行度調整装置および平行度調整方法
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TWI528041B (zh) * 2015-04-30 2016-04-01 The method of adjusting the displacement distance of the probe according to the horizontal position of the plurality of points to be measured
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CN105097598B (zh) * 2015-08-14 2018-06-26 武汉新芯集成电路制造有限公司 一种晶圆探针卡自动检测装置
JP6406221B2 (ja) * 2015-11-17 2018-10-17 三菱電機株式会社 半導体装置の評価装置及び評価方法
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JP6501726B2 (ja) * 2016-04-19 2019-04-17 三菱電機株式会社 プローブ位置検査装置および半導体評価装置ならびにプローブ位置検査方法
US11262384B2 (en) 2016-12-23 2022-03-01 Intel Corporation Fine pitch probe card methods and systems
KR102799834B1 (ko) * 2017-01-11 2025-04-28 (주)테크윙 테스트핸들러용 가압장치
KR102755729B1 (ko) * 2017-01-26 2025-01-17 주식회사 탑 엔지니어링 프로브 장치
JP6869123B2 (ja) 2017-06-23 2021-05-12 東京エレクトロン株式会社 プローブ装置及び針跡転写方法
US11268983B2 (en) 2017-06-30 2022-03-08 Intel Corporation Chevron interconnect for very fine pitch probing
US10775414B2 (en) * 2017-09-29 2020-09-15 Intel Corporation Low-profile gimbal platform for high-resolution in situ co-planarity adjustment
US11061068B2 (en) 2017-12-05 2021-07-13 Intel Corporation Multi-member test probe structure
US11204555B2 (en) 2017-12-28 2021-12-21 Intel Corporation Method and apparatus to develop lithographically defined high aspect ratio interconnects
US11073538B2 (en) 2018-01-03 2021-07-27 Intel Corporation Electrical testing apparatus with lateral movement of a probe support substrate
US10488438B2 (en) 2018-01-05 2019-11-26 Intel Corporation High density and fine pitch interconnect structures in an electric test apparatus
JP2019160937A (ja) * 2018-03-09 2019-09-19 東京エレクトロン株式会社 位置補正方法、検査装置及びプローブカード
CN108828425B (zh) * 2018-07-16 2024-08-27 苏州肯美特设备集成股份有限公司 一种半导体测试装置
US11543454B2 (en) 2018-09-25 2023-01-03 Intel Corporation Double-beam test probe
US10935573B2 (en) 2018-09-28 2021-03-02 Intel Corporation Slip-plane MEMS probe for high-density and fine pitch interconnects
JP7474678B2 (ja) * 2020-10-28 2024-04-25 東京エレクトロン株式会社 載置台、検査装置及び検査方法
CN114639520B (zh) * 2020-12-15 2025-07-15 泰科电子(上海)有限公司 检测机构、导线定位装置及导线加工设备
CN115047309A (zh) * 2022-04-28 2022-09-13 广州市艾佛光通科技有限公司 一种探针台自动聚焦和压针方法
TWI908218B (zh) * 2024-07-29 2025-12-11 欣銓科技股份有限公司 針測行程最佳化的晶圓測試裝置及其方法

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Publication number Publication date
US20080231300A1 (en) 2008-09-25
KR20080086816A (ko) 2008-09-26
CN101285865B (zh) 2011-07-20
TW200845261A (en) 2008-11-16
CN101285865A (zh) 2008-10-15
JP4950719B2 (ja) 2012-06-13
US7839156B2 (en) 2010-11-23
JP2008243860A (ja) 2008-10-09
TWI431705B (zh) 2014-03-21

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