TWI430411B - 堆式防護結構 - Google Patents

堆式防護結構 Download PDF

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Publication number
TWI430411B
TWI430411B TW096106763A TW96106763A TWI430411B TW I430411 B TWI430411 B TW I430411B TW 096106763 A TW096106763 A TW 096106763A TW 96106763 A TW96106763 A TW 96106763A TW I430411 B TWI430411 B TW I430411B
Authority
TW
Taiwan
Prior art keywords
signal
outer contour
layer
shape
substrate
Prior art date
Application number
TW096106763A
Other languages
English (en)
Chinese (zh)
Other versions
TW200739858A (en
Inventor
Benjamin N Eldridge
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Formfactor Inc filed Critical Formfactor Inc
Publication of TW200739858A publication Critical patent/TW200739858A/zh
Application granted granted Critical
Publication of TWI430411B publication Critical patent/TWI430411B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
TW096106763A 2006-03-06 2007-02-27 堆式防護結構 TWI430411B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/308,094 US7956633B2 (en) 2006-03-06 2006-03-06 Stacked guard structures

Publications (2)

Publication Number Publication Date
TW200739858A TW200739858A (en) 2007-10-16
TWI430411B true TWI430411B (zh) 2014-03-11

Family

ID=38470927

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096106763A TWI430411B (zh) 2006-03-06 2007-02-27 堆式防護結構

Country Status (7)

Country Link
US (1) US7956633B2 (enExample)
EP (1) EP1996954A2 (enExample)
JP (1) JP5189995B2 (enExample)
KR (1) KR20080100458A (enExample)
CN (1) CN101395486A (enExample)
TW (1) TWI430411B (enExample)
WO (1) WO2007102998A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7724004B2 (en) * 2005-12-21 2010-05-25 Formfactor, Inc. Probing apparatus with guarded signal traces
US8130005B2 (en) * 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference
US8362797B2 (en) * 2009-08-25 2013-01-29 Advanced Inquiry Systems, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed therebetween
US9176186B2 (en) 2009-08-25 2015-11-03 Translarity, Inc. Maintaining a wafer/wafer translator pair in an attached state free of a gasket disposed
TW201122493A (en) * 2009-12-24 2011-07-01 Premtek Int Inc Microprobe structure and method of making the same
ITMI20120453A1 (it) * 2012-03-22 2013-09-23 Technoprobe Spa Struttura di connessione di tipo ibrido
KR20140110443A (ko) * 2013-03-08 2014-09-17 삼성전자주식회사 프로브 카드
US9911563B2 (en) * 2013-07-31 2018-03-06 Analog Devices Global MEMS switch device and method of fabrication
JP6548849B1 (ja) * 2018-08-27 2019-07-24 三菱電機株式会社 光モジュール

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4189825A (en) * 1975-06-04 1980-02-26 Raytheon Company Integrated test and assembly device
JPS6032401A (ja) * 1983-08-03 1985-02-19 Nec Corp 帯域濾波器
JPS617101U (ja) * 1984-06-18 1986-01-17 ティーディーケイ株式会社 ストリツプライン型フイルタ
JPS61114601A (ja) * 1984-11-08 1986-06-02 Matsushita Electric Ind Co Ltd フイルタ装置
US5103557A (en) * 1988-05-16 1992-04-14 Leedy Glenn J Making and testing an integrated circuit using high density probe points
DE69416200T2 (de) * 1993-06-16 1999-06-02 Nitto Denko Corp., Ibaraki, Osaka Sondenkonstruktion
US5416429A (en) * 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
US5621333A (en) * 1995-05-19 1997-04-15 Microconnect, Inc. Contact device for making connection to an electronic circuit device
US6034533A (en) 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6292003B1 (en) * 1998-07-01 2001-09-18 Xilinx, Inc. Apparatus and method for testing chip scale package integrated circuits
US6215320B1 (en) * 1998-10-23 2001-04-10 Teradyne, Inc. High density printed circuit board
US6268015B1 (en) * 1998-12-02 2001-07-31 Formfactor Method of making and using lithographic contact springs
US6351133B1 (en) * 1999-03-31 2002-02-26 Adoamtest Corp. Packaging and interconnection of contact structure
JP2000307312A (ja) * 1999-04-15 2000-11-02 Nec Corp 回路特性の調整方法
JP2001007525A (ja) * 1999-06-24 2001-01-12 Kyocera Corp 多層配線基板
JP3710652B2 (ja) * 1999-08-03 2005-10-26 三菱電機株式会社 ストリップライン給電装置
DE10023736A1 (de) * 2000-05-15 2001-11-22 Harting Elektrooptische Bauteile Gmbh & Co Kg Leiterplatte sowie Verfahren zur Herstellung einer Leiterplatte
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
JP3487283B2 (ja) * 2000-10-31 2004-01-13 三菱電機株式会社 差動ストリップ線路垂直変換器および光モジュール
US6657130B2 (en) * 2001-09-20 2003-12-02 International Business Machines Corporation Electrical and physical design integration method and apparatus for providing interconnections on first level ceramic chip carrier packages
TW565529B (en) * 2002-01-24 2003-12-11 Scs Hightech Inc Probe card and method for testing the proceed function or speed of electronic devices
US7724004B2 (en) 2005-12-21 2010-05-25 Formfactor, Inc. Probing apparatus with guarded signal traces
US8130005B2 (en) 2006-12-14 2012-03-06 Formfactor, Inc. Electrical guard structures for protecting a signal trace from electrical interference

Also Published As

Publication number Publication date
US7956633B2 (en) 2011-06-07
KR20080100458A (ko) 2008-11-18
US20070205780A1 (en) 2007-09-06
WO2007102998A3 (en) 2008-04-10
TW200739858A (en) 2007-10-16
JP2009529238A (ja) 2009-08-13
JP5189995B2 (ja) 2013-04-24
WO2007102998A2 (en) 2007-09-13
EP1996954A2 (en) 2008-12-03
CN101395486A (zh) 2009-03-25

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MM4A Annulment or lapse of patent due to non-payment of fees