JP6199010B2 - プローブカード - Google Patents
プローブカード Download PDFInfo
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- JP6199010B2 JP6199010B2 JP2012124813A JP2012124813A JP6199010B2 JP 6199010 B2 JP6199010 B2 JP 6199010B2 JP 2012124813 A JP2012124813 A JP 2012124813A JP 2012124813 A JP2012124813 A JP 2012124813A JP 6199010 B2 JP6199010 B2 JP 6199010B2
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- Prior art date
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- 238000010586 diagram Methods 0.000 description 14
- 238000012360 testing method Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
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- 229920005989 resin Polymers 0.000 description 3
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- 230000002411 adverse Effects 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Images
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
Description
Claims (2)
- 検査装置が有する接触ピンが接触する複数の接触部が配設された基板表面である第1の板面、及び前記第1の板面と反対側の基板底面である第2の板面を有する基板であって、前記第1の板面と前記第2の板面との間の基板内部に配設されたグランド層を含む基板と、
前記検査装置によって検査される対象の被検査部に接触するためのプローブ針と、
前記第2の板面に配設されて、前記プローブ針の中間部分が固定された固定部と、
中心導体と外側導体とを有し、前記中心導体の一端が前記プローブ針と接続されて、前記中心導体の他端が前記接触部に直接接続された同軸線と、
前記第2の板面において前記基板を支持するための支持部が配置される領域のうち、前記同軸線が配置される領域の前記第2の板面に設けられた溝部であって、前記同軸線を複数本配置するための凹加工が施された溝底面を有する溝部と、
前記基板の前記第2の板面の前記溝部の前記溝底面から、前記基板の第1の板面側の前記複数の接触部の内で互いに隣接する接触部の間へ貫通した状態の貫通孔部であって、前記接触部に直接接続される前記中心導体を有する前記同軸線を通すための貫通孔部と、
を備え、
前記基板の前記第1の板面において、前記貫通孔部を通った後の状態の前記同軸線は、前記中心導体の他端が前記接触部に接続され、
前記基板内部に配設されていた前記グランド層のうち、前記第1の板面の側から前記接触部を平面視したときに前記接触部と重なる領域である接触部直下領域の部分の前記グランド層が削除されている、プローブカード。 - 請求項1に記載のプローブカードにおいて、
前記基板は、前記接触部直下領域においてグランド層が削除された領域の面積が前記接触部直下領域の面積以上である、プローブカード。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012124813A JP6199010B2 (ja) | 2012-05-31 | 2012-05-31 | プローブカード |
TW102112637A TWI572865B (zh) | 2012-05-31 | 2013-04-10 | 探針卡 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012124813A JP6199010B2 (ja) | 2012-05-31 | 2012-05-31 | プローブカード |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013250145A JP2013250145A (ja) | 2013-12-12 |
JP6199010B2 true JP6199010B2 (ja) | 2017-09-20 |
Family
ID=49848975
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012124813A Active JP6199010B2 (ja) | 2012-05-31 | 2012-05-31 | プローブカード |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6199010B2 (ja) |
TW (1) | TWI572865B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111913019A (zh) * | 2017-09-15 | 2020-11-10 | 中华精测科技股份有限公司 | 探针卡装置的圆形探针 |
KR101895012B1 (ko) * | 2017-10-12 | 2018-09-05 | 심민섭 | 삽입형 고주파수 신호 전송커넥터 및 상기 삽입형 고주파수 신호 전송커넥터를 사용하는 프로브카드 |
TWI640790B (zh) * | 2018-02-26 | 2018-11-11 | 新加坡商美亞國際電子有限公司 | 測試用電路板及其操作方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3911361A (en) * | 1974-06-28 | 1975-10-07 | Ibm | Coaxial array space transformer |
JPS60139276U (ja) * | 1984-02-24 | 1985-09-14 | 日本電子材料株式会社 | プロ−ブカ−ド |
JPS6156981A (ja) * | 1984-08-27 | 1986-03-22 | Nec Corp | 半導体検査装置 |
JPS6449236A (en) * | 1987-08-20 | 1989-02-23 | Tokyo Electron Ltd | Prober |
JPH11248748A (ja) * | 1998-03-05 | 1999-09-17 | Advantest Corp | プローブカード |
US7595651B2 (en) * | 2007-02-13 | 2009-09-29 | Mpi Corporation | Cantilever-type probe card for high frequency application |
JP2008205282A (ja) * | 2007-02-21 | 2008-09-04 | Toshiba Corp | プローブカード |
JP2008226880A (ja) * | 2007-03-08 | 2008-09-25 | Micronics Japan Co Ltd | 回路基板およびこれを用いた電気的接続装置 |
JP2008232883A (ja) * | 2007-03-22 | 2008-10-02 | Yokogawa Electric Corp | 半導体検査装置 |
-
2012
- 2012-05-31 JP JP2012124813A patent/JP6199010B2/ja active Active
-
2013
- 2013-04-10 TW TW102112637A patent/TWI572865B/zh active
Also Published As
Publication number | Publication date |
---|---|
TWI572865B (zh) | 2017-03-01 |
JP2013250145A (ja) | 2013-12-12 |
TW201350861A (zh) | 2013-12-16 |
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