TWI429018B - 用於微影裝置的剪切層夾盤 - Google Patents

用於微影裝置的剪切層夾盤 Download PDF

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Publication number
TWI429018B
TWI429018B TW098111528A TW98111528A TWI429018B TW I429018 B TWI429018 B TW I429018B TW 098111528 A TW098111528 A TW 098111528A TW 98111528 A TW98111528 A TW 98111528A TW I429018 B TWI429018 B TW I429018B
Authority
TW
Taiwan
Prior art keywords
chuck
platform
array
stress
elongated elements
Prior art date
Application number
TW098111528A
Other languages
English (en)
Chinese (zh)
Other versions
TW201001613A (en
Inventor
山米爾Ａ 納非耶
馬克 艾迪 威廉斯
賈斯汀 馬修 凡迪萊姆
Original Assignee
Asml控股公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asml控股公司 filed Critical Asml控股公司
Publication of TW201001613A publication Critical patent/TW201001613A/zh
Application granted granted Critical
Publication of TWI429018B publication Critical patent/TWI429018B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H10P76/2042—Photolithographic processes using lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/34—Accessory or component

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098111528A 2008-04-10 2009-04-07 用於微影裝置的剪切層夾盤 TWI429018B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7105908P 2008-04-10 2008-04-10

Publications (2)

Publication Number Publication Date
TW201001613A TW201001613A (en) 2010-01-01
TWI429018B true TWI429018B (zh) 2014-03-01

Family

ID=40752516

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098111528A TWI429018B (zh) 2008-04-10 2009-04-07 用於微影裝置的剪切層夾盤

Country Status (7)

Country Link
US (3) US20110013164A1 (cg-RX-API-DMAC10.html)
JP (1) JP5372136B2 (cg-RX-API-DMAC10.html)
KR (1) KR101602367B1 (cg-RX-API-DMAC10.html)
CN (1) CN101990652B (cg-RX-API-DMAC10.html)
NL (1) NL1036735A1 (cg-RX-API-DMAC10.html)
TW (1) TWI429018B (cg-RX-API-DMAC10.html)
WO (1) WO2009124732A1 (cg-RX-API-DMAC10.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.
US9366973B2 (en) 2011-02-18 2016-06-14 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
EP2753980B1 (en) 2011-09-09 2019-11-20 ASML Netherlands B.V. Support structure for wafer table
KR20170016547A (ko) 2015-08-03 2017-02-14 삼성전자주식회사 척 테이블 및 그를 포함하는 기판 제조 장치
US11040705B2 (en) 2016-05-19 2021-06-22 Pylon Manufacturing Corp. Windshield wiper connector
US10761435B2 (en) 2017-02-10 2020-09-01 Asml Holding N.V. Reticle clamping device
CN113826045A (zh) 2019-04-30 2021-12-21 Asml荷兰有限公司 用于在本体上提供耐磨材料的方法、以及复合体
US11650512B2 (en) * 2021-06-25 2023-05-16 Taiwan Semiconductor Manufacturing Company, Ltd. Reticle cleaning device and method of use
WO2025242380A1 (en) * 2024-05-20 2025-11-27 Asml Netherlands B.V. Split chuck
WO2026073658A1 (en) * 2024-10-01 2026-04-09 Asml Netherlands B.V. Methods and systems for determining reticle deformation

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JPS6335989U (cg-RX-API-DMAC10.html) * 1986-08-25 1988-03-08
US5401973A (en) 1992-12-04 1995-03-28 Atomic Energy Of Canada Limited Industrial material processing electron linear accelerator
WO2001060125A1 (en) * 2000-02-07 2001-08-16 Tdk Corporation Composite substrate, thin-film light-emitting device comprising the same, and method for producing the same
JP2003007602A (ja) * 2001-06-26 2003-01-10 Nikon Corp 計測装置及び計測方法、露光装置及び露光方法
JP2002050560A (ja) 2000-08-02 2002-02-15 Nikon Corp ステージ装置、計測装置及び計測方法、露光装置及び露光方法
JP2002134599A (ja) * 2000-10-24 2002-05-10 Ngk Insulators Ltd 静電吸着装置
US6513796B2 (en) * 2001-02-23 2003-02-04 International Business Machines Corporation Wafer chuck having a removable insert
JP2002299228A (ja) 2001-04-03 2002-10-11 Nikon Corp レチクル、それを用いた露光装置及び露光方法
JP4103385B2 (ja) * 2001-12-27 2008-06-18 住友金属工業株式会社 真空チャック
JP2003332411A (ja) * 2002-05-17 2003-11-21 Nikon Corp 基板保持装置及び露光装置
JP4204964B2 (ja) * 2002-12-23 2009-01-07 エーエスエムエル ネザーランズ ビー．ブイ． リソグラフィ装置
EP1434100A2 (en) * 2002-12-23 2004-06-30 ASML Netherlands B.V. Lithographic apparatus
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US7119884B2 (en) * 2003-12-24 2006-10-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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JP4298547B2 (ja) 2004-03-01 2009-07-22 キヤノン株式会社 位置決め装置およびそれを用いた露光装置
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JP4708876B2 (ja) * 2005-06-21 2011-06-22 キヤノン株式会社 液浸露光装置
US7372549B2 (en) 2005-06-24 2008-05-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
US7564536B2 (en) * 2005-11-08 2009-07-21 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
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NL1036735A1 (nl) 2008-04-10 2009-10-13 Asml Holding Nv Shear-layer chuck for lithographic apparatus.

Also Published As

Publication number Publication date
JP2011520245A (ja) 2011-07-14
CN101990652B (zh) 2012-10-10
KR20100133473A (ko) 2010-12-21
US20140233009A1 (en) 2014-08-21
US8976336B2 (en) 2015-03-10
NL1036735A1 (nl) 2009-10-13
JP5372136B2 (ja) 2013-12-18
TW201001613A (en) 2010-01-01
US8786832B2 (en) 2014-07-22
WO2009124732A1 (en) 2009-10-15
KR101602367B1 (ko) 2016-03-11
CN101990652A (zh) 2011-03-23
US20140016110A1 (en) 2014-01-16
US20110013164A1 (en) 2011-01-20

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