EP2021874A1 - Chucks for reticles and other planar bodies - Google Patents
Chucks for reticles and other planar bodiesInfo
- Publication number
- EP2021874A1 EP2021874A1 EP07744174A EP07744174A EP2021874A1 EP 2021874 A1 EP2021874 A1 EP 2021874A1 EP 07744174 A EP07744174 A EP 07744174A EP 07744174 A EP07744174 A EP 07744174A EP 2021874 A1 EP2021874 A1 EP 2021874A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- chuck
- pins
- reticle
- membrane
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70783—Handling stress or warp of chucks, masks or workpieces, e.g. to compensate for imaging errors or considerations related to warpage of masks or workpieces due to their own weight
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- microlithography is a key imaging technology used in the manufacture of semiconductor micro-devices, displays, and other products having fine structure that can be fabricated by processes that include microlithographic imprinting. More specifically, the disclosure pertains to devices for holding a reticle or other planar body.
- the pattern to be projected onto the surface of an exposure-sensitive substrate is defined by a "reticle,” sometimes called a "mask.”
- a reticle In the microlithography system the reticle is mounted on a stage that is capable of undergoing fine and highly accurate movements as required during the lithographic exposure. While mounted on the reticle stage, the reticle is illuminated by a radiation beam (e.g. , a beam of deep-ultraviolet or vacuum-ultraviolet light). As the beam propagates downstream from the reticle, the beam carries an aerial image of the illuminated pattern.
- a radiation beam e.g. , a beam of deep-ultraviolet or vacuum-ultraviolet light
- This downstream beam passes through a projection-optical system that conditions and shapes the patterned beam as required to form a focused image of the pattern on the surface of an exposure-sensitive lithographic substrate (e.g., a resist-coated semiconductor wafer).
- an exposure-sensitive lithographic substrate e.g., a resist-coated semiconductor wafer.
- the substrate also is mounted on a respective movable stage called a
- substrate stage or wafer stage.
- the reticle stage For holding the reticle (usually horizontally) during the making of lithographic exposures, the reticle stage is equipped with a "reticle chuck" mounted to a moving surface of the reticle stage.
- the reticle chuck holds the reticle in a suitable manner for imaging while avoiding damage to the delicate reticle. For example, some reticle chucks hold the reticle by applying a vacuum force to the reticle. Other reticle chucks hold the reticle by electrostatic or Lorentz-force attraction.
- the reticle chuck is usually configured to hold (to "chuck") the reticle around the periphery (or at least along two opposing sides) of the reticle, thereby leaving the patterned regions of the reticle unsupported. Due to the mass of the reticle, the unsupported middle region of the reticle tends to sag due to gravity. The sag deforms the reticle and can degrade the imaging performance of the microlithography system if not corrected or compensated for in some manner.
- Image quality encompasses any of various parameters such as image resolution, fidelity, sharpness, contrast, and the like.
- “Overlay” pertains to the accuracy and precision with which a current image is placed relative to a target location for the image. For example, proper overlay requires that the image be in registration with a previously formed, underlying structure on the substrate.
- the deformed shape of a chucked reticle has a direct impact on overlay and image quality. If reticle sag is inevitable, then the ideal deformed shape is at most second-order (parabolic) about the scanning axis (y-axis).
- Making appropriate adjustments to downstream optics ⁇ e.g. , the projection-optical system) can compensate for this kind of reticle deformation, but each reticle usually deforms differently from another reticle, and it is impractical to adjust the downstream optics each time a different reticle is chucked.
- reticle slip is a non-repeatable change in the relative position between the reticle and interferometers that are used for determining reticle position. This change directly affects overlay accuracy.
- each compliant member has a strip-like configuration that extends lengthwise along the respective side region of the reticle and along the respective side region of the reticle stage.
- One lateral side region of the compliant member is mounted to the respective side region of the reticle stage and the other lateral side region of the compliant member extends in a cantilever manner from the respective edge region of the reticle stage.
- Extending along the full length of the cantilevered side region of each compliant member and projecting upward are short walls that encircle and define a respective "vacuum space.”
- the walls and vacuum space collectively define respective reticle "chucks.”
- the corresponding under-side of the reticle actually rests on the top edges ("lands") of the walls that collectively serve as respective "chuck surfaces.” Evacuating the vacuum space holds the reticle on the chuck surfaces.
- the compliant members exhibit compliance in the z-direction and yield somewhat to the shape of the reticle, they nevertheless have high stiffness in the x-y directions, as do the walls.
- At least three pins extend between the underside of the chucks and the top surface of the reticle stage (i.e., two pins beneath one chuck and one pin beneath the other chuck).
- one or more "pins" can be located in the vacuum spaces to provide additional support for the chucked regions of the reticle; these configurations are called “pin chucks.”
- the reticle still exhibits an unacceptable amount of slip relative to the chuck surfaces.
- An embodiment of the device comprises a stage and a body chuck.
- the stage has a movable support surface.
- the device includes a first membrane including a proximal region and a distal region.
- the proximal region is coupled to the support surface.
- the distal region extends from the support surface and is coupled to the body chuck such that the first membrane at least partially supports the body chuck.
- the body chuck comprises a surface and multiple pins.
- the surface is situated at the distal region of the first membrane.
- the pins extend relative to the surface and are arrayed on the surface to contact and support a respective portion of the body relative to the surface.
- the pins are arrayed so that, during movements of the body chuck imparted by corresponding movement of the support surface, slippage of the body relative to the pins due to forces caused by the movement is substantially uniform at each pin.
- the stage has first and second support surfaces spaced apart from each other (but that desirably move in a synchronous manner).
- the body chuck comprises a first chuck portion and a second chuck portion, and the first membrane comprises a first membrane portion mounted to and extending from the first support surface and a second membrane portion mounted to and extending from the second support surface.
- the first chuck portion is mounted to a distal region of the first membrane portion, and the second chuck portion is mounted to a distal region of the second membrane portion.
- the body chuck can comprise at least one vacuum chuck, such as for a reticle.
- the body chuck can comprise walls extending from the surface. The walls desirably define, in cooperation with the surface and a portion of the body contacting the body chuck, a vacuum cavity.
- the walls have respective lands, and the pins have respective top surfaces.
- the top surfaces (and optionally at least one of the lands) collectively define a chuck surface that contacts and at least partially supports the body whenever the body is being held by the device.
- the top surfaces of the pins (and optionally at least one of the lands) contact an under-surface of the body.
- the walls can be integral with the surface. At least one of the walls can be made of a different material than the surface and mounted to the surface.
- the pins can be arranged to extend in at least one longitudinal column in a scanning direction of the body chuck as moved by the support surface.
- the pins can be arranged in multiple longitudinal columns.
- the pins can have substantially identical respective stiffness or variable stiffness.
- the device can include a second membrane that can comprise the surface from which the pins extend.
- the second membrane can have a substantially uniform thickness or have a variable thickness.
- the second membrane can be made of a material such as, but not limited to, invar, ZERODUR ® .
- the pins can be integral with, and made of the same material as, the second membrane. In embodiments including a second membrane, at least one of the walls can be made of the same material as the second membrane.
- An embodiment of such a device comprises a stage comprising first and second movable support surfaces.
- the device also comprises a reticle chuck mounted to the support surfaces.
- the reticle chuck comprises first and second chuck portions.
- Each chuck portion comprises a respective first membrane having a respective first region and a respective second region.
- the first regions are mounted to the respective first and second support surfaces such that the second regions extend toward each other from the first and second support surfaces.
- the first and second chuck portions are mounted to the respective second regions.
- Each chuck portion comprises a respective surface (which can be of a second membrane mounted to the first membrane or part of the first membrane) and respective walls and free-standing pins extending from the surface.
- the surface and respective walls collectively define a respective vacuum cavity whenever a respective region of a reticle is situated on the chuck portion.
- the walls provide respective lands that can be contacting or non-contacting lands, wherein a contacting land contacts the under-surface of the reticle and a non-contacting land does not.
- At least the pins (and optionally at least one land) contact and support the respective region of the reticle.
- the pins are configured and arranged so that, during a movement of the reticle chuck by the stage, slippage of the reticle relative to the pins (and any contacting lands) due to shear forces caused by the movement occurs with substantial uniformity at each pin and contacting land.
- tops of the pins (and any contacting lands) in each chuck portion collectively define respective chuck surfaces situated in a plane and configured to hold respective portions of the reticle.
- FIG. IA is a plan view of a first representative embodiment of a kinematic reticle chuck, as an exemplary device for holding and moving a planar body.
- FIG. IB is an elevational section along the line B-B in FIG. IA.
- FIG. 2 depicts a second-order deformation of the reticle as chucked, exhibiting a parabolic profile about the scanning axis (y-axis).
- FIG. 3 A is a schematic elevational view of a portion of a kinematic reticle chuck according to a fourth representative embodiment, in which the pins are not all the same length.
- FIG. 3B is a schematic elevational view of a portion of an alternative configuration of the kinematic reticle chuck shown in FIG. 3 A.
- reticle is used to denote a pattern-defining object (pattern master) used in microlithography and related techniques.
- pattern master Another term frequently used in microlithography to denote the pattern master is “mask,” and it will be understood that "reticle” as used herein encompasses masks and other pattern masters used in microlithography.
- FIG. IA is a plan view of the x-y plane, wherein the y-direction is the scanning direction. Shown are left and right portions 14a, 14b of the reticle stage 12, each presenting a respective support surface 17a, 17b. The portions 14a, 14b extend parallel to each other in the y-direction and oppose each other in the x-direction. Attached to the support surfaces 17a, 17b are respective flexible members (each termed a "first membrane” herein) 16a, 16b.
- first membrane first membrane
- Each first membrane 16a, 16b has a first lateral region 18a, 18b attached to the respective support surface 17a, 17b of the reticle stage 12, and a second lateral region 20a, 20b extending in a cantilever manner from the respective portion 14a, 14b.
- the first lateral regions 18a, 18b are respective "proximal” regions (relative to the support surfaces 17a, 17b, respectively) of the first membranes 16a, 16b
- the second lateral regions 20a, 20b are respective "distal” regions (relative to the support surfaces 17a, 17b, respectively) of the first membranes 16a, 16b.
- each second lateral region 20a, 20b Mounted to the upward-facing surface of each second lateral region 20a, 20b is a respective vacuum chuck 22a, 22b.
- the vacuum chucks 22a, 22b support a reticle 25.
- a respective spacer 24a, 24b serving to elevate the vacuum chucks (in the z-direction) slightly from the upper surfaces of the respective second lateral regions.
- the vacuum chuck 22a is mounted to the upper surface of the spacer 24a.
- the vacuum chuck 22a comprises a base (also called a "second membrane” or “web”) 28 from which walls 30, 32 project in the z-direction.
- the walls 30, 32 have respective upper surfaces 34, 36, called “lands.” (Although the figure shows all the lands at a uniform height above the surface of the second membrane 28, this is not intended to be limiting. " The lands 34, 36 of this embodiment all have substantially the same height above the second membrane 28 and collectively define a "chuck surface,” extending in the x-y direction, on which the reticle is placed (FIG. IB).
- the reticle 25, second membrane 28, and walls 30, 32 collectively define a vacuum cavity 33 that is evacuated through a port 46 that extends through the second membrane 28. Reducing the pressure in the vacuum cavity 33 urges the reticle against the lands 34, 36.
- This embodiment solves a key problem that is experienced by conventional reticle chucks, namely the problem of slippage due to unequal shear forces at each point of contact of the vacuum chucks with the reticle.
- the slippage point (magnitude of shear stress) is substantially the same at each such point of contact of the reticle with the vacuum chucks.
- Exemplary materials from which to fabricate the first membranes 16a, 16b and second membranes 28, 28b are invar, and ZERODUR ® (a brand of glass ceramic from Schott AQ Germany). For less demanding applications, any of several metals alternatively could be used. Particularly desirable materials have extremely low coefficients of thermal expansion, and the foregoing list is similar to a list of candidate materials for fabricating reticles.
- the reticle chucks can be made of any of these materials, and can be made of the same material as the first membranes or of a different material.
- the walls 30, 32 and lands 34, 36 need not be made of the same material as the second membrane 28.
- the walls 30, 32 in this embodiment have respective lands 34, 36 that are all in the same x-y plane (as the tops of the pins), which is achieved in this embodiment by configuring all the walls 30, 32 with identical height relative to the upper surface of the second membrane 28. But, having all the lands in the same x-y plane in this embodiment is not intended to be limiting. In alternative embodiments, such as described later below, at least one of the walls (e.g., the outboard wall) is shorter than other of the walls (e.g., the inboard wall), thereby placing the land of the shorter wall below the x-y plane of the pin tops and leaving a gap between the land and the underside of the reticle.
- the walls 30, 32 in this embodiment are continuous with each other, but this is not intended to be limiting.
- Vacuum chucks having at least one shorter wall or a wall with at least one gap along its length form "leaky" seals for the vacuum cavity 33.
- the first lateral regions 18a, 18b of the first membranes 16a, 16b can be attached to their respective support surfaces 17a, 17b of the reticle stage by any of various suitable means. Exemplary means includes adhesive means.
- each vacuum chuck 22a, 22b comprised multiple columns of free-standing pins 44 (two columns are shown).
- a reticle placed on a reticle chuck according to this embodiment likely will experience gravity-induced sag, which is largely inevitable with an object supported in this manner. See FIG. 2, which depicts an ideal deformed-reticle shape.
- the "ideal" deformed shape is one that is, at most, second-order about the scanning axis (y-axis).
- two important measures of performance of a microlithography system are overlay and imaging.
- the deformed shape of a chucked reticle has a direct impact on overlay and imaging.
- this embodiment achieves this goal.
- this embodiment of a reticle chuck kinematically supports the reticle so that differing reticle flatness does not affect the deformed shape when the reticle is chucked.
- this embodiment holds the reticle securely even as the reticle stage undergoes repeated accelerations and decelerations in the y-direction. Thus, overlay errors are minimized.
- Various embodiments are configured so that the ratios of shear stresses to normal contact stresses are substantially equal at all points of contact of the reticle with the vacuum chucks. It alternatively is possible to distribute the shear stresses between the reticle and vacuum chucks so as to have the stresses vary from point to point in a desired manner.
- the instant embodiment is directed to achieving this variability by controllably varying the shear/bending stiffness of the pins. For example, changing the size (length) of the pins can produce corresponding changes in their shear/bending stiffness. Examples are shown in FIGS. 3 A and 3B. In FIG. 3 A a portion of the reticle 25, the reticle-stage portion 14, and the first membrane 16a are shown, along with a vacuum chuck 120.
- the vacuum chuck 120 comprises shorter distal walls 122, taller proximal walls 124, and free-standing pins 126a, 126b, 126c extending upward from the surface of a stepped second membrane (web) 128.
- the second membrane 128 can be simply an extension of the first membrane 16a.
- the pins 126a, 126b, 126c vary in height from 0.25 to 2.5 mm.
- the reticle 25 rests not only on the tops of the pins 126a, 126b, 126c but also on lands 130a, 130b defined by the walls 122, 124, respectively.
- the lands 130a, 130b effectively enclose the region beneath the chucked portion of the reticle 25 to define a vacuum cavity 132.
- FIG. 3B depicts an alternative configuration in which the walls 142, 144 of a vacuum chuck 140 are shorter than the free-standing pins 146a, 146b, 146c.
- the walls 142, 144 provide lands 148a, 148b that effectively provide a vacuum "seal" to the under-surface of the reticle 25 to define a vacuum cavity 150.
- the base 152 is stepped to accommodate the different lengths of pins 146a- 146c. Note also the variations in web thickness.
- This representative embodiment can allow higher reticle acceleration, without reticle slip, by distributing the shear stresses between the reticle and the reticle chuck in a predetermined manner.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80186606P | 2006-05-19 | 2006-05-19 | |
PCT/JP2007/060740 WO2007136123A1 (en) | 2006-05-19 | 2007-05-21 | Chucks for reticles and other planar bodies |
Publications (1)
Publication Number | Publication Date |
---|---|
EP2021874A1 true EP2021874A1 (en) | 2009-02-11 |
Family
ID=38457950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP07744174A Withdrawn EP2021874A1 (en) | 2006-05-19 | 2007-05-21 | Chucks for reticles and other planar bodies |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2021874A1 (en) |
JP (1) | JP2009537966A (en) |
KR (1) | KR20090018916A (en) |
TW (1) | TW200807171A (en) |
WO (1) | WO2007136123A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070268476A1 (en) * | 2006-05-19 | 2007-11-22 | Nikon Corporation | Kinematic chucks for reticles and other planar bodies |
NL1036735A1 (en) * | 2008-04-10 | 2009-10-13 | Asml Holding Nv | Shear-layer chuck for lithographic apparatus. |
NL2020281A (en) | 2017-02-10 | 2018-08-22 | Asml Holding Nv | Reticle clamping device |
CN112415856B (en) * | 2019-08-23 | 2022-04-22 | 上海微电子装备(集团)股份有限公司 | Flexible adsorption device and photoetching equipment |
JP7342613B2 (en) * | 2019-10-25 | 2023-09-12 | オムロン株式会社 | Deterioration determination device, deterioration determination method, and control program |
JP2023178028A (en) | 2022-06-03 | 2023-12-14 | キヤノン株式会社 | Exposure device, method for controlling exposure device, and article manufacturing method |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5532903A (en) * | 1995-05-03 | 1996-07-02 | International Business Machines Corporation | Membrane electrostatic chuck |
TW504605B (en) * | 1999-12-03 | 2002-10-01 | Asm Lithography Bv | Lithographic projection apparatus, method of manufacturing a device using the same, the device and mask |
TWI254841B (en) * | 2002-12-23 | 2006-05-11 | Asml Netherlands Bv | Lithographic apparatus |
-
2007
- 2007-05-21 EP EP07744174A patent/EP2021874A1/en not_active Withdrawn
- 2007-05-21 JP JP2008553564A patent/JP2009537966A/en active Pending
- 2007-05-21 TW TW096118102A patent/TW200807171A/en unknown
- 2007-05-21 WO PCT/JP2007/060740 patent/WO2007136123A1/en active Application Filing
- 2007-05-21 KR KR1020087028197A patent/KR20090018916A/en not_active Application Discontinuation
Non-Patent Citations (1)
Title |
---|
See references of WO2007136123A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR20090018916A (en) | 2009-02-24 |
TW200807171A (en) | 2008-02-01 |
WO2007136123A1 (en) | 2007-11-29 |
JP2009537966A (en) | 2009-10-29 |
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