TWI713576B - Mask holding device, exposure apparatus, manufacturing method of flat panel display, device manufacturing method, holding method of mask, and exposure method - Google Patents

Abstract

The photomask stage device (14) for holding the photomask (M) of the present invention is provided with a support block (50) for supporting the photomask (M) from below, and a support block (50) for holding the photomask (50) supported by the support block (50). The holding surface of the face of the mask (M) that is bent by its own weight and the holding face is movable along the face of the deflected mask (M) to hold the adsorption pad (46) of the holding face of the mask, And the suction port (46b) for sucking the flexible mask (M) to the holding surface.

Description

Mask holding device, exposure device, manufacturing method of flat panel display, device manufacturing method, mask holding method, and exposure method

The present invention relates to an object holding device, an exposure device, a manufacturing method of a flat panel display, a device manufacturing method, an object holding method, and an exposure method, and more specifically, it relates to an object holding device and method for holding an object, including the aforementioned object holding device The exposure device, the exposure method including the aforementioned object holding method, the flat panel display using the aforementioned exposure device or method, or the manufacturing method of the device.

Previously, in the lithography process for manufacturing electronic components (microcomponents) such as liquid crystal display components and semiconductor components (collective circuits, etc.), one side of the mask or reticle (hereinafter, collectively referred to as "mask") and glass Plates or wafers, etc. (hereinafter, collectively referred to as "substrates") move synchronously in a predetermined scanning direction, and the pattern formed on the mask is transferred on the substrate using energy beams. A step & scan exposure device ( The so-called scanning stepper (also known as scanning machine)) and so on.

This type of exposure apparatus has a photomask stage device capable of holding a photomask and moving the photomask at a predetermined speed and accuracy in the scanning direction (for example, refer to Patent Document 1).

Here, in order to avoid interference with the light path of the energy beam, the general mask stage device is constructed to hold (or support) the vicinity of the end of the mask M (the area where the mask pattern is not formed), so the mask Will flex due to its own weight. Although the deflection of this type of photomask can be optically compensated to ensure exposure accuracy, when the deflection shape of the photomask is unstable, there is a problem that it is difficult to perform optical compensation.

Advanced technical literature

[Patent Document 1] JP 2011-85671 A

The present invention is completed under the above circumstances. The first aspect is to provide an object holding device for holding an object, which is provided with: a support portion for supporting the object from below; and a holding portion for holding the object supported by the support portion. The holding surface of the surface of the object that is deflected by its own weight makes the holding surface movable along the surface of the deflected object to hold the object with the holding surface; and the suction part sucks the deflected object To the retaining surface.

A second aspect is to provide an exposure apparatus, which includes an object holding device, and an exposure action of exposing an exposure object with an energy beam through the object held by the object holding device is formed on the basis of a pattern of the object This is a pattern forming device for the object to be exposed.

A third aspect provides a method of manufacturing a flat panel display, which includes an operation of exposing the object to be exposed using an exposure device, and an operation of developing the object to be exposed after exposure.

A fourth aspect provides a device manufacturing method, which includes: using an exposure device to make The operation of exposing the exposure object and the operation of developing the exposure object after exposure.

A fifth aspect provides an object holding method that uses an object holding device with a supporting portion and a holding surface to hold an object, which includes: using the supporting portion to support the object from below; making the holding supported by the supporting portion, The holding surface of the surface of the object that is deflected by the weight of the object is movable along the surface of the deflected object; and the operation of adsorbing the deflected object to the holding surface.

A sixth aspect provides an exposure method, including: the object holding method described above, and an exposure action of exposing an exposure object with an energy beam through the object held by the object holding method to form a pattern possessed by the object For the movement of the exposure object.

A seventh aspect provides a method for manufacturing a flat panel display, which includes an operation of exposing the object to be exposed using an exposure method, and an operation of developing the object to be exposed after exposure.

An eighth aspect provides a device manufacturing method, which includes an operation of exposing the object to be exposed using an exposure method, and an operation of developing the object to be exposed after exposure.

10: Liquid crystal exposure device

12: Lighting system

14, 114, 114A, 214: Mask stage device

16: Projection optical system

16a: Projection system module

20: substrate stage device

30, 130, 230: carrier body

32, 232: opening

40: Supporting device

40A~40E: Supporting device

42: Base

44, 44C, 44D ₁ , 44D ₂ : Leaf spring

46: Adsorption pad

46a: Slot

46b: suction mouth

46c: opening

48: Bolt

48a: Gasket

50: Support block

52: Support rod

56: Cylindrical leaf spring

60, 60A: supporting device

62, 62A: Adsorption pad

64: leaf spring

68: Support pad

68a: sphere

68b: Bolt

80: holding device

82: pressing member

84: Actuator

88: Datum member

90: Supporting device

92, 142, 142A: base

94: Adsorption pad

IL: Illumination light

M: Mask

P: substrate

PL: Outer membrane

S: Support position

Fig. 1 is a diagram schematically showing the structure of the liquid crystal exposure apparatus of the first embodiment.

FIG. 2 is a plan view of a mask stage device included in the liquid crystal exposure device of FIG. 1. FIG.

Fig. 3(a) is an enlarged view of part 3A of Fig. 2, and Fig. 3(b) is a cross-sectional view taken along line 3B-3B of Fig. 3(a).

Figures 4(a) to 4(c) are diagrams for explaining the loading operation of the photomask on the photomask stage device (part 1~part 3).

Fig. 5(a) is a diagram showing the supporting device of the photomask of the comparative example, Fig. 5(b) is a diagram showing the supporting device of the photomask of the first embodiment, and Fig. 5(c) is shown in the comparative example and the first embodiment. 1 Graph showing the relationship between the suction pressure of the mask and the amount of displacement in the embodiment.

6(a) and 6(b) are diagrams showing a first modification of the mask stage device of the first embodiment (a cross-sectional view and a plan view, respectively).

Fig. 7 is a diagram showing a second modification of the mask stage device of the first embodiment.

Fig. 8 is a diagram showing a third modification of the mask stage device of the first embodiment.

Fig. 9 is a diagram showing a fourth modification of the photomask stage device of the first embodiment.

Fig. 10 is a diagram showing a fifth modification of the mask stage device of the first embodiment.

11(a) and 11(b) are diagrams (1 and 2) for explaining the structure and operation of the mask stage device of the second embodiment.

Fig. 12 is a diagram showing a modification of the mask stage device of the second embodiment.

Fig. 13 is a plan view of the mask stage device of the third embodiment.

"First Embodiment"

Hereinafter, the first embodiment will be described using FIGS. 1 to 5(c).

FIG. 1 schematically shows the structure of the liquid crystal exposure apparatus 10 of the first embodiment. The liquid crystal exposure device 10 is, for example, a step and scan method in which a rectangular (square) glass substrate P (hereinafter, simply referred to as substrate P) used in a liquid crystal display device (flat panel display) or the like is used as an exposure object The projection exposure device, also known as the scanner.

The liquid crystal exposure device 10 has an illumination system 12, a photomask stage device 14 for holding a photomask M formed with patterns such as circuit patterns, a projection optical system 16, and a holding surface (in Fig. 1 It is the substrate stage device 20 of the substrate P coated with a resist (sensor), and the control system and the like thereof. Hereinafter, it is assumed that the scanning direction of the light mask M and the substrate P relative to the projection optical system 16 is the X axis direction, the direction orthogonal to the X axis in the horizontal plane is the Y axis direction, and the direction orthogonal to the X axis and the Y axis. The description is given for the Z-axis direction. In addition, the description will be made assuming that the rotation directions around the X axis, Y axis, and Z axis are the θ x, θ y, and θ z directions, respectively.

The lighting system 12 has the same configuration as the lighting system disclosed in the specification of US Patent No. 5,729,331, for example. That is, the illuminating system 12 makes light emitted from a light source not shown (such as a mercury lamp) pass through a mirror, a beam splitter, a shutter, a wavelength selective filter, various lenses, etc., not shown, respectively. The exposure illumination light (illumination light) IL irradiates the mask M. The illumination light IL uses, for example, i-line (wavelength 365nm), g-line (wavelength 436nm), h-line (wavelength 405nm), etc. (or the aforementioned i-line, g-line, and h-line combined light). The optical axis AX of the illumination light IL irradiated on the mask M from the illumination system 12 is substantially parallel to the Z axis.

The mask stage device 14 has a stage body 30 for holding a light-transmitting type mask M. The stage main body 30 is composed of a plate-shaped member arranged substantially parallel to the XY plane, and an opening 32 into which the mask M is inserted is formed in the center. The stage main body 30 is driven in the X-axis direction (scanning direction) with a predetermined long stroke relative to the illumination system 12 (illumination light IL) through a mask stage driving system including a linear motor, and is micro-driven in the Y-axis direction And the θ z direction. The position information in the horizontal plane of the stage body 30 is obtained by, for example, a photomask stage position measurement system (not shown) including a laser interferometer system (or an encoder system). The holding structure of the carrier body 30 to the mask M will be described later.

The projection optical system 16 is arranged below the mask stage device 14. The projection optical system 16 is similar to the projection optical system disclosed in the specification of US Patent No. 6,552,775, etc. The so-called multi-lens type projection optical system of the same configuration includes, for example, a plurality of optical systems (projection system modules 16a) that form both sides of the erect image telecentrically.

In the liquid crystal exposure device 10, when the illuminating light IL from the illuminating system 12 illuminates the mask M located in the predetermined illumination area, the illuminating light IL passing through the mask M passes through the projection optical system 16 in the illuminated area The projection image of the pattern of the mask M (the image of the partial pattern) is formed in the exposure area on the substrate P. Then, the mask M is moved in the scanning direction relative to the illumination area (illumination light IL), and the substrate P is moved in the scanning direction relative to the exposure area (illumination light IL), so that one shot area on the substrate P is performed. For scanning exposure, the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the irradiation area. Here, the illumination area on the mask M and the exposure area on the substrate P (illumination light irradiation area) are optically conjugated to each other by the projection optical system 16.

The substrate stage device 20 is a part that accurately positions the substrate P with respect to the projection optical system 16 (illumination light IL). The substrate stage device 20 has a holding member (also referred to as a substrate holder, etc.) that holds the substrate P, and the holding member (that is, the substrate P) is placed along a horizontal plane (X-axis direction and Y-axis direction) with a predetermined long stroke A drive system that drives and slightly drives in the direction of 6 degrees of freedom. The position information of the 6-degree-of-freedom direction of the holding member (ie, the substrate P) is obtained by, for example, a substrate stage position measurement system (not shown) including a laser interferometer system (or an encoder system).

Next, the support and holding structure of the photomask M by the stage body 30 of the photomask stage device 14 will be described.

As shown in FIG. 2, the photomask stage device 14 has a plurality of support devices 40 (for example, six in this embodiment). For example, each of the 6 support devices 40 has a support from below Support block 50 of light-bearing cover M. In addition, for example, each of the six supporting devices 40 has an adsorption pad 46 that adsorbs and holds the mask M. That is, the mask M is supported by the support block 50 in six different parts, for example, and is sucked and held by the suction pad 46 in six different parts, for example.

For example, three of the six support devices 40 are arranged to protrude from the wall surface on the +Y side into the opening 32 in the wall surface forming the (predetermined) opening 32, and the remaining three are arranged from − The wall surface on the Y side protrudes into the opening 32. The three support devices 40 on the +Y side and the three support devices 40 on the -Y side are respectively arranged at predetermined intervals in the X-axis direction.

Here, on the lower surface (pattern surface) of the mask M, near the ends of each of the four sides, there are formed areas where patterns are not formed (hereinafter referred to as "blank areas"). In addition, the pattern-formed area under the mask M (the area inside the mask M with a blank area) is provided with an outer film (pellicle, not shown) for pattern protection. For example, among the 6 support devices 40, 3 on the +Y side support and hold the blank area (area that does not interfere with the outer film) formed near the +Y side end of the mask M from below, and the -Y side Three of them support and hold the blank area near the -Y side end of the mask M from below.

Next, the structure of the support device 40 will be described. For example, the structure of the six supporting devices 40 is substantially the same, so only one of them will be described. As shown in FIG. 3(a) and FIG. 3(b), the support device 40 has a base 42, a leaf spring 44, an adsorption pad 46, a support block 50, and the like.

The base 42 is composed of a rectangular flat member in a plan view, and one end (the end on the -Y side in FIGS. 3(a) and 3(b)) is fixed to the lower surface of the carrier body 30. The other end of the base 42 (the end on the +Y side in FIGS. 3(a) and 3(b)) protrudes from the stage body 30 into the opening 32. The base 42 has a stepped portion formed in the middle part of the Y-axis direction, and the area on the other end side is formed slightly larger than the area on the one end side (a range that does not affect the rigidity of the base 42 itself Degree) thin.

A support block 50 is fixed on the upper surface near the other end of the base 42. The support block 50 is composed of a rectangular member with a YZ cross-section extending in the X-axis direction. In the present embodiment, although the support block 50 is formed of a metal material such as stainless steel, it is not limited to this, and it may be formed of, for example, a ceramic with less accuracy change. In addition, since the support block 50 directly contacts the bottom surface of the photomask M, the same glass as the photomask M can also be used. In addition, in this embodiment, although the support block 50 and the base 42 are different members, they may be formed integrally.

The leaf spring 44 is formed of an elastic plate material (for example, a steel plate). The leaf spring 44 is arranged so as to be substantially parallel to the XY plane and has elasticity in the Z axis and the θ x direction. On the other hand, it has a predetermined rigidity in the direction parallel to the XY plane (especially the X axis direction). One end of the leaf spring 44 is fixed to the area on the upper side of the base 42 on the one end side (thicker side) of the stepped portion through a shim 48a and fixed with a bolt 48. The other end of the leaf spring 44 (hereinafter referred to as the "front end") protrudes from the area on the top of the base 42 on the front end side (the thinner side) of the stepped portion, and between the upper surface of the base 42 and the lower surface of the leaf spring 44 Form a predetermined gap. Furthermore, although the support device 40 of this embodiment has, for example, two leaf springs 44 separated in the X-axis direction, the number of leaf springs 44 is not particularly limited.

The suction pad 46 is composed of a flat member extending in the X-axis direction (see FIG. 3(a)), and is fixed to the front end side area of the leaf spring 44, that is, the upper surface of the free end side. The support block 50 is arranged on the center side of the mask M (the +Y side in FIG. 3(b)) relative to the suction pad 46. A groove 46a extending in the X-axis direction is formed on the upper surface (suction surface) of the suction pad 46, and a suction port 46b is formed in the center of the bottom surface of the groove 46a. The suction port 46b communicates with an external connection opening 46c opened on the side surface of the suction pad 46 (not shown in FIG. 3(a). See FIG. 3(b)). Absorbing pad The groove 46a of 46 supplies vacuum suction from the outside through the opening 46c and the suction port 46b. In addition, the height position of the upper surface (suction surface) of the suction pad 46 is set to a position higher than the upper end surface of the support block 50 (+Z side). In FIG. 3(b), for ease of understanding, the mask M is shown in a more flexed state (inclined).

Next, the operation of the support device 40 when the photomask M is loaded on the photomask stage device 14 will be described using FIGS. 4(a) to 4(c).

As shown in FIG. 4(a), when the photomask M is lowered and driven by a photomask loader (refer to the arrow in FIG. 4(a)), the bottom of the photomask M will first contact the suction pad 46. At this time, the suction pad 46 does not perform vacuum suction. Therefore, the suction pad 46 does not restrict the mask M, and the front end portion of the leaf spring 44 is bent downward due to the weight of the mask M. In addition, since the leaf spring 44 is fixed to the free end side with the suction pad 46, even in the state where the mask M is not supported, the tip portion may be slightly deformed such as drooping, but it is not limited to this.

Next, as shown in FIG. 4(b), the lower surface of the mask M contacts the support block 50. Accordingly, in the Z-axis direction, the supporting position of the mask M by the mask stage device 14 (the position indicated by the circle S in FIG. 4(b)) is determined mechanically. Here, since the support block 50 extends in the X-axis direction, the support block 50 and the mask M are in line contact. Since the mask M is supported from below by a plurality of support blocks 50 near the ends on the +Y side and -Y side (refer to FIG. 2), the center part in the Y axis direction protrudes in the -Z direction due to its own weight. Deflection into a convex shape.

Furthermore, after the mask M is supported by the support block 50, as shown in FIG. 4(c), the suction pad 46 sucks and holds the mask M. At this time, in the supporting device 40, since the supporting block 50 supports (constrained in the -Z direction) the mask M in advance, the mask M will not move in the -Z direction due to the suction force from the suction pad 46. At this time, the suction pad 46 makes the suction surface along due to the action of the leaf spring 44 The bottom surface of the photomask M is displaced, and the suction force acts vertically (refer to the arrow in Figure 4(c)) under the photomask M. In addition, as long as the mask M can be constrained in the XY plane, the suction force of the suction pad 46 can be relatively small, and the moment acting around the supporting position S of the mask M is so small that it can be ignored. That is, the suction pad 46 restrains (fixes) the mask M relative to the stage body 30 in a manner that does not affect the deflection caused by the weight of the mask M.

At this time, as described above, the mask M will be deflected due to its own weight, but the amount of deflection varies depending on the position in the Y-axis direction. The deflection amount at the center of the mask M in the Y-axis direction is greater than Near both ends in the Y-axis direction. Therefore, the distance between the pattern surface of the mask M and the upper surface (exposure surface) of the substrate P (refer to FIG. 1) (the distance from the pattern surface of the mask M to the imaging surface) may be different (uneven).

On the other hand, in the liquid crystal exposure apparatus 10 of this embodiment, the projection optical system 16 (refer FIG. 1 respectively) is used to compensate for the above-mentioned unevenness. That is, as shown in FIG. 1, the projection optical system 16 is a so-called multi-lens (multi lens) optical system, and includes a plurality of (for example, 5 in FIG. 1) projection system modules 16a arranged in a zigzag shape. The plurality of projection system modules 16a are independently equipped with a focus position adjustment mechanism, an image shift mechanism, a magnification adjustment mechanism, and the like. Therefore, even if the mask M is deflected due to its own weight as described above (even if the distance between the mask M and the substrate P is uneven), the projection system modules 16a can be independently controlled to adjust the imaging according to the amount of deflection. Conditions to ensure the desired exposure accuracy. In addition, the number of projection system modules 16a is just an example, and can be changed as appropriate.

Next, by comparing with a comparative example, the function and effect of the mask stage device 14 of this embodiment will be described. Fig. 5(a) shows the supporting device 90 of the photomask stage device of the comparative example. The arrangement of the support device 90 on the stage body 30 (refer to FIG. 2) is the same as the support of this embodiment The device 40 is the same.

In contrast to the supporting device 40 of this embodiment shown in FIG. 5(b), the suction pad 46 is cantilevered by the leaf spring 44, and the supporting device 90 of the comparative example shown in FIG. 5(a) is attached to the base The adsorption pad 94 is directly fixed on top of 92. That is, with respect to the suction pad 46 of this embodiment (refer to FIG. 5(b)), the suction surface can be displaced (moved to the Z axis and the θ x direction) according to the lower surface of the mask M, and the suction pad 94 ( Referring to Fig. 5(a)), the position of the suction surface is fixed approximately parallel to the XY plane. Therefore, in the supporting device 90, the suction pad 94 that sucks and holds the mask M also has the function of supporting the supporting member of the mask M at the supporting position S. In addition, the support device 90 of the comparative example aims to correct the plane of the mask M (reducing the absolute value of deflection) by the suction pressure from the suction pad 94 so that the lower surface of the mask M is parallel to the horizontal plane. In contrast, the support device 40 of the present embodiment shown in FIG. 5(b) is configured to allow the deflection of the mask M due to its own weight (the deflection of the mask M is optically compensated).

Here, as shown in the graph of Fig. 5(c), in the support device 90 of the comparative example, it can be seen that the free deflection of the mask M is due to the change of the suction pressure (negative pressure) (due to the dead weight acting on the mask M). The amount of deflection caused is large (the amount of deflection is sensitive to changes in negative pressure). That is, in the support device 90 of the comparative example, when the suction pressure from the suction pad 94 changes, the deflection amount (deflection shape) of the mask M is unstable. At this time, since the distance between the mask M and the substrate P (refer to FIG. 1) is unstable, it becomes difficult to compensate for the deflection of the mask M using a multi-lens optical system. The aforementioned change in the adsorption pressure is easily generated due to the decrease in the parallelism between the adsorption surface of the adsorption pad 94 and the lower surface of the mask M (a tiny gap of micrometer units is generated).

On the other hand, in the supporting device 40 of the present embodiment shown in FIG. 5(b), the supporting block 50 having the function of supporting the photomask M and the suction having the function of adsorbing and holding the photomask M The pad 46 is separated. The adsorption pad 46 adsorbs and holds the photomask M previously supported by the support block 50, and the adsorption surface of the adsorption pad 46 can be displaced along (adjacent to) the lower surface of the photomask M. From this, it can be seen from the graph of FIG. 5(c) that in the support device 40 of this embodiment, even if the suction pressure changes, the amount of displacement from the free deflection of the mask M changes less. Therefore, even if the suction pressure of the mask M by the suction pad 46 fluctuates, the change in the amount of deflection of the mask M is small, and the distance between the mask M and the substrate P (see FIG. 1) is stable. Accordingly, as described above, the deflection of the mask M can be easily compensated by using the multi-lens optical system, and the exposure accuracy can be improved.

In addition, in the support device 90 of the comparative example, although the base 92 can be inclined in advance in consideration of the amount of free deflection of the mask M, the position of the support position S of the adsorption pad 94 on the mask M is also affected by the freedom of the mask M. The amount of deflection varies, so it is difficult to stabilize the amount of deflection of the mask M.

According to the photomask stage device 14 of the first embodiment described above, even when the photomask M is reloaded (including loading between different exposure devices) on the photomask stage device 14, The reproducibility of the deflection amount (deflection shape) of the mask M can be improved. Therefore, the multi-lens type projection optical system 16 can be used to reliably compensate for the deflection of the mask M and improve the exposure accuracy.

In addition, the structure of the support device 40 of the photomask M in the first embodiment described above is only an example, and it can of course be modified appropriately. For example, the supporting member mounted on the front end of the base 42 and supporting the lower surface of the mask M is not limited to the member (support block 50) with a rectangular cross section as in the first embodiment described above. For example, Figure 6 (a) and Figure 6 (b) The support rod 52 of the support device 40A of the mask M in the first modification shown in) is composed of a member with a circular cross section. In addition, the length of the supporting member (including the supporting block 50) can be longer than the length of the X-axis direction of the mask M like the supporting rod 52 shown in FIG. 6(b). For example, it can be erected and supported on three bases 42棒52. In addition, the support rod 52 As in the above-mentioned first embodiment, the base 42 of each support device 40A can be individually provided. In the support device 40A of this modification, the straightness of the contact portion of the mask M and the support rod 52 in line contact can be easily made higher than the support block 50 by processing. In addition, as long as the mask M can be brought into line contact with the support rod 52, the cross section of the support rod 52 is not particularly limited, and may be, for example, a semicircular shape.

In addition, like the support device 40B of the second modification shown in FIG. 7, a compression coil spring 54 may be inserted between the lower surface of the leaf spring 44 and the upper surface of the base 42 to force the gravity direction upward (the suction pad The force 46 pressing against the mask M) acts on the adsorption pad 46. In this case, the suction surface of the suction pad 46 can be reliably brought into contact with the bottom surface of the mask M (a situation where a gap is formed between the suction pad 46 and the mask M is suppressed). In addition, the vibration of the suction pad 46 can also be suppressed. Moreover, the upward force of the compression coil spring 54 in the direction of gravity imparted to the suction pad 46 is preferably a magnitude (strength) that does not affect the amount of deflection of the mask M due to its own weight. Furthermore, instead of the compression coil spring 54, another spring member such as a leaf spring or an elastic body formed of a rubber-based or synthetic resin-based material may be inserted between the leaf spring 44 and the base 42.

In addition, like the support device 40C of the third modification shown in FIG. 8, a bent portion may be formed in the middle portion of the leaf spring 44C in the longitudinal direction. In this case, as in the second modification (see FIG. 7) described above, the suction pad 46 can be pressed against the mask M.

Also, like the support device 40D of the fourth modification shown in FIG. 9, the suction pad 46 can be mounted on the base 42 through two types of leaf springs 44D ₁ and 44D _{2 with} different thicknesses (spring constants). Similarly to the second modification (see FIG. 7) described above, the suction pad 46 is pressed against the mask M.

Also, like the support device 40E of the fifth modification shown in FIG. 10, the leaf spring 44 of the support device 40 of the above-mentioned first embodiment (see FIG. 3(b) respectively) may be replaced, and the A cylindrical leaf spring 56 is arranged between the attached pad 46 and the base 42, and only the cylindrical leaf spring 56 supports the suction pad 46. In addition to the elasticity in the Z-axis direction, the cylindrical leaf spring 56 also has elasticity in the θ x direction and the θ y direction, and can support the suction pad 46 to swing (swing head movement) freely. In this case, as in the second modification (see FIG. 7) described above, the suction pad 46 can be pressed against the mask M.

"Second Embodiment"

Next, the mask stage device 114 of the second embodiment will be described with reference to FIGS. 11(a) and 11(b). The configuration of the mask stage device 114 of the second embodiment is the same as that of the above-mentioned first embodiment except for the configuration of the supporting device 60 of the mask M. Therefore, only the differences will be described below. The elements that have the same configuration and function as the form are given the same reference numerals as in the first embodiment described above, and the description thereof is omitted.

In contrast to the above-mentioned first embodiment (see FIG. 3(b), etc.), the suction pad 46 sucks and holds the bottom surface of the photomask M, and the supporting device 60 of the photomask stage device 114 of the second embodiment is shown in FIG. As shown in 11(b), the difference is that the adsorption pad 62 adsorbs and holds the upper surface of the mask M. Hereinafter, the structure and operation of the support device 60 will be described. In addition, in the mask stage device 114, although a plurality of (for example, six) support devices 60 are mounted on the stage body 130 in the same configuration (see FIG. 2 etc.) as in the above-mentioned first embodiment, as shown in FIG. 11 In (a) and Figure 11(b), one of them is shown.

At the front end of the base portion 142 of the support device 60, a support pad 68 is installed through the ball 68a with bolts 68b. The supporting surface of the supporting pad 68 faces the +Z direction (upward) so as to face the bottom of the mask M, and can be tilted relative to the horizontal plane by the sphere 68a (can swing relative to the base 142 in the θ x and θ y directions) . Therefore, the support pad 68 does not hinder the deformation (natural bending) of the mask M due to its own weight. Moreover, although the support pad 68 can touch the blank area of the mask M (Area outside the outer film PL) The position of the mask M in the Z-axis direction is set (prescribed), but suction and holding are not performed.

In the supporting device 60, the restraint (holding) of the position in the XY plane of the mask M is performed by the suction pad 62. The suction pad 62 is attached to one end of the leaf spring 64 in the same manner as in the first embodiment described above. The other end of the suction pad 62 is connected to the actuator 66, and the suction pad 62 and the plate spring 64 are integrally driven by the actuator 66 to rotate in the θ x direction. The actuator 66 is fixed to the stage main body 130 through a mounting member not shown. The suction pad 62 is housed in a recess (notch) 130A formed on the stage main body 130 when the photomask M is loaded. When the photomask M is placed on the support pad 68, it is performed by the actuator 66. Rotational drive of 180° degree (refer to the arrow in Figure 11(b)). Accordingly, the blank area of the mask M is clamped in the vertical (Z axis) direction by the support pad 68 and the suction pad 62. Since the suction pad 62 sucks and holds the photomask M by the vacuum suction force supplied from the outside, the point is the same as that of the above-mentioned first embodiment, so the description is omitted. In this case, as in the first embodiment described above, the suction pad 62 preferably holds the mask M by suction pressure that does not hinder the deformation (natural flexure) of the mask M due to its own weight. The mask stage device 114 of the second embodiment can also obtain the same effect as the first embodiment described above, that is, without affecting the deformation (natural deflection) of the mask M due to its own weight, Keep the mask M.

In addition, the configuration of the second embodiment described above can be appropriately modified. For example, as shown in FIG. 12, the support device 60A of the mask stage device 114A of the modification of the second embodiment, the suction pad 62A attached to the base 142A through the actuator 66 can suck and hold the side surface of the mask M . In this case, the suction pad 62A is also preferable to hold the mask M by suction pressure that does not prevent the mask M from being deformed (naturally flexed) due to its own weight. In this modification, since the rotation angle of the suction pad 62A is smaller than that of the second embodiment (refer to FIG. 11(b)), the light can be performed more quickly. Keep the cover M. In addition, the concave portion for accommodating the suction pad 62A may not be formed in the main body 30 of the stage.

"The third embodiment"

Next, the mask stage device 214 of the third embodiment will be described using FIG. 13. The configuration of the mask stage device 214 of the third embodiment is the same as that of the above-mentioned first embodiment except that the configuration of the holding device 80 of the mask M is different. Therefore, the following describes the differences with respect to the above-mentioned first embodiment. The elements of the embodiment having the same configuration and function are assigned the same reference numerals as those of the above-mentioned first embodiment, and the description thereof is omitted.

In contrast to the first and second embodiments described above, the suction pad 46 (refer to FIG. 3(b)), 62 (refer to FIG. 11(b)) applies suction to the mask M, and the suction pad is generated by the suction The frictional force between 46, 62 and the mask M restricts the position in the XY plane of the mask M. The difference in the third embodiment is that it forms the carrier body 230 of the mask carrier device 214. A part of the wall surface of the opening 232 is pressed by the holding device 80 to restrict the position of the mask M in the XY plane. Hereinafter, the structure and operation of the holding device 80 included in the photomask stage device 214 will be described.

As shown in FIG. 13, an opening 232 is formed in the center of the stage body 230 of the mask stage device 214, and the mask M is inserted into the opening 232. Therefore, the side surfaces of each of the four sides of the mask M and the wall surface forming the opening 232 are opposed to each other through a predetermined gap.

The holding device 80 includes a pressing member 82, an actuator 84 and a pair of reference members 88. The pair of reference members 88 are located between the side surface on the -X side of the mask M and the wall surface facing the side surface on the -X side (the wall surface facing the +X direction), and are arranged separately in the Y axis direction. A pair of reference members 88 are fixed to the stage main body 230, and their function is to serve as a reference for positioning the mask M to the stage main body 230. The pressing member 82 is arranged on the +X side of the mask M and the +X side Between the facing walls (the walls facing the -X direction). The pressing member 82 is connected to an actuator 84 housed in a recess 230a formed by the stage body 230, and can be moved with a predetermined stroke in the X-axis direction by the actuator 84.

The holding device 80, after the photomask M is supported by the plurality of support blocks 50, presses the center part of the photomask M in the Y-axis direction by the actuator 84 through the pressing member 82 in the -X direction, thereby pressing the photomask M于对reference member 88. That is, with respect to the above-mentioned first and second embodiments (refer to FIG. 3(b) and FIG. 11(b), respectively), the mask M is held on the stage main bodies 30, 130 by friction. In the third embodiment, the mask M is directly held on the stage main body 230 by pressing force. In the third embodiment, even when the blank area of the mask M is narrow (it is difficult to maintain the vacuum suction using suction pads), the mask M can be held reliably. In addition, the holding device 80 exerts a pressing force on the mask M in the scanning direction (refer to the arrow in FIG. 13), so it will not hinder the deflection due to the weight of the mask M (it will not free the mask M due to the pressing force). The amount of deflection affects). Therefore, the projection optical system 16 (refer to FIG. 1) can be used to optically suppress the influence on the exposure accuracy.

In addition, the configuration of each of the first to third embodiments (including their modified examples. The same hereinafter) described above is only an example, and can be appropriately changed. That is, as the mask stage device, as long as the mask M is supported by the supporting member (for example, the support block 50 of the above-mentioned first embodiment) in a manner that does not affect the deflection generated from below (reproducible as The structure of the mask M is not particularly limited if it holds the characteristics like the graph in FIG. 5(c). For example, in each of the above embodiments, the mask M is supported by the support block 50 (a rod-shaped member with a rectangular cross-section) as shown in FIG. 3(b), or the support rod 52 (a circular cross-section) as shown in FIG. 6(a). Shaped rod-shaped member), so the photomask M is in line contact with the support block 50 (or support rod 52), but it is not limited to this. The photomask stage device can also An example is a configuration in which a plurality of spheres arranged at predetermined intervals in the X-axis direction are supported by a plurality of points (the mask M is in point contact with each sphere).

In addition, for example, in the second embodiment described above, although the photomask stage device 114 is supported by the support pad 68 from below (with natural bending) held by the suction pad 62, the photomask M is not limited to this, for example, it can be omitted. The suction pad 62 is sucked and held by the support pad 68 under the mask M. In this case, in order to avoid the movement of the stage main body 130 in the scanning direction to move the mask M relative to the stage main body 130 during the exposure operation, the possible tilt direction of the support pad 68 is restricted to the θ x direction (or the mask M is restricted after being held The tilting action itself) is better.

In addition, for example, in the third embodiment described above, the mask stage device 214 applies a pressing force parallel to the X axis to the mask M to hold the mask M, but as long as the pressing force acting on the mask M is not affected If the deflection shape of the mask M is affected, it is not limited to this. For example, the pressing force can be applied to the Y-axis direction. In addition, although the photomask stage device 214 applies a pressing force to the photomask M to hold the photomask M, it is not limited to this. For example, a pulling force can be applied to the photomask M to hold the photomask M.

In addition, in each of the above embodiments, the mask stage device 14 and the like support the blank areas formed near the both ends of the mask M in the Y-axis direction from below using the support block 50 or the like. When a blank area (non-pattern area) is formed near the central portion in the axial direction, a support member that supports the blank area near the central portion may be further provided. In this case, in the same way, when using the suction pad 46 or the like to keep the mask M in a supported state near both ends and near the center, the front and rear deflection shape (deflection amount) may be maintained substantially unchanged.

In addition, although the photomask M is held by the vacuum suction of the suction pad 46 in each of the above-mentioned embodiments, it is not limited to this, and it may be held by mechanical means such as electrostatic suction or clamping.

In addition, in the first and second embodiments described above, although each of the suction pad 46 and the support block 50 (or support rod 52) is attached to the common base 42, it is not limited to this. The base member on which the suction pad 46 is attached is The base member on which the support block 50 is installed may be a different member. In addition, in the above-mentioned first embodiment, although the support block 50 is arranged protrudingly from the suction pad 46 on the center side of the Y-axis direction of the mask M, it is not limited to this. The position of the support block 50 and the suction pad 46 in the Y-axis direction Can be repeated.

Moreover, in the liquid crystal exposure apparatus 10, the exposure target substrate P can be hold|maintained by the object support apparatus (for example, the several support apparatus 40 of the said 1st Embodiment) of each said embodiment.

In addition, the light source used in the illumination system 12 and the wavelength of the illumination light IL irradiated from the light source are not particularly limited, and may be, for example, ArF excimer laser light (wavelength 193nm), KrF excimer laser light (wavelength 248nm), etc. Vacuum ultraviolet light such as ultraviolet light or F ₂ laser light (wavelength 157nm).

In addition, in each of the above-mentioned embodiments, although the same magnification system is used as the projection optical system 16, it is not limited to this, and a reduction system or an enlargement system may also be used.

In addition, although the above embodiments have been described for the case where the liquid crystal exposure device is a scanning stepping type, it is not limited to this, and the photomask carrier of the above embodiments can also be used in a stationary exposure device such as a stepper.台装置14 etc..

In addition, the use of the exposure device is not limited to the exposure device for liquid crystal that transfers the pattern of the liquid crystal display element to the square glass plate, but can also be widely applied to, for example, exposure devices for the manufacture of organic EL (Electro-Luminescence) panels and semiconductor manufacturing. Exposure equipment used, exposure equipment used to manufacture thin film magnetic heads, micromachines and DNA chips. In addition, not only It is a micro-element such as a semiconductor element. It is used to make a reticle or photomask used in light exposure equipment, EUV exposure equipment, X-ray exposure equipment and electron beam exposure equipment, and transfer circuit patterns to glass substrates or silicon crystals. It is also applicable to the manufacture of exposure devices such as circles.

In addition, the object to be exposed is not limited to a glass plate, and may be other objects such as a wafer ceramic substrate, a thin film member, or a mask master (blank mask). In addition, the object to be exposed is not limited to a glass plate, and may be, for example, a wafer, a ceramic substrate, a thin film member, or other objects. In addition, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film shape (a flexible sheet member). In addition, the exposure apparatus of this embodiment is particularly effective when the exposure target is a substrate having a side length or a diagonal length of 500 mm or more. Furthermore, when the substrate to be exposed is a flexible sheet, the sheet substrate may be formed in a roll shape.

Electronic components such as liquid crystal display components (or semiconductor components) are through the steps of designing the functional performance of the components, the steps of making masks (or reticles) according to this design step, and the steps of making glass substrates (or wafers) , The lithography step of transferring the pattern of the mask (reticle) to the glass substrate by the exposure device and the exposure method of the above embodiments, the development step of developing the exposed glass substrate, and the remaining resist The exposed member of the part other than the part is manufactured by an etching step in which etching is removed, a resist removal step in which unnecessary resist is removed after etching, a component assembly step, an inspection step, and the like. In this case, in the lithography step, the exposure device of the above embodiment is used to implement the aforementioned exposure method to form a device pattern on the glass substrate, so that a high-integration device can be manufactured with good productivity.

Industrial availability

As explained above, the object holding device and method of the present invention are suitable for holding objects body. In addition, the exposure apparatus and method of the present invention are suitable for forming a predetermined pattern on an object to be exposed. In addition, the manufacturing method of the flat panel display of the present invention is suitable for the production of flat panel displays. The device manufacturing method of the present invention is suitable for the production of micro devices.

14: Mask stage device

30: Carrier body

32: Opening

40: Supporting device

42: Base

44: leaf spring

46: Adsorption pad

46a: Slot

46b: suction mouth

48: Bolt

48a: Gasket

50: Support block

M: Mask

Claims (46)

A photomask holding device for holding a photomask, which is used in an exposure device that transfers a pattern formed on the photomask to a substrate, and includes: a plurality of supporting parts supported on the photomask from below A plurality of supported regions separated in a predetermined direction; and a plurality of holding portions having suction surfaces for adsorbing and holding a plurality of supported regions on the mask except for the supported regions; the plurality of supporting portions supports one of the aforementioned masks The area between the plurality of supported areas is deflected in the direction of gravity due to the weight of the mask, and the mask becomes the supported area of the mask with a predetermined bending shape; the holding portion can be attached by The suction surface displaced by the support of the support portion to become the held area of the predetermined deflection shape of the mask, suction and hold the held area; the support portion is in the direction of gravity, A position different from the position where the holding portion contacts the held area contacts the supported area and supports the supported area. For example, the mask holding device of the first item of the scope of patent application includes: a main body with the holding part and the supporting part; the suction surface is set to be able to adhere to the predetermined bending shape relative to the main body Department tilt. For example, the mask holding device of item 1 or 2 of the scope of patent application, wherein the suction surface is inclined in such a way as to adhere to the predetermined bending shape, so that the suction force acts on the phase With respect to the above-mentioned held area in a substantially vertical direction, the above-mentioned held area is sucked and held. For example, the mask holding device of the first or second patent application, wherein the suction surface holds a held area on a second surface that is different from the first surface of the mask supported by the support portion. A photomask holding device for holding a photomask, which is used in an exposure device that transfers a pattern formed on the photomask to a substrate, and includes: a plurality of supporting parts supported on the photomask from below A plurality of supported regions separated in a predetermined direction; and a plurality of holding portions having suction surfaces for adsorbing and holding a plurality of supported regions on the mask except for the supported regions; the plurality of supporting portions supports one of the aforementioned masks The area between the plurality of supported areas is deflected in the direction of gravity due to the weight of the mask, and the mask becomes the supported area of the mask with a predetermined bending shape; the holding portion is used to hold The predetermined bending shape of the photomask that is flexed by the support portion is held in contact with the held area on the side surface of the photomask; the support portion is in contact with the holding portion in the direction of gravity The position where the position of the held area is different contacts the supported area, and supports the supported area. According to the photomask holding device of any one of 1, 2, and 5 in the scope of patent application, the support portion is arranged to be separated from each other in the predetermined direction intersecting the movable direction of the photomask retaining device. For example, the mask holding device of any one of the patents 1, 2, and 5, wherein: The holding portion holds the held area on the photomask that is different from the supported area supported on the support portion in the predetermined direction. For example, the photomask holding device of claim 7, wherein the support portion supports the supported region on the center side of the photomask in the predetermined direction than the retained region. For example, the mask holding device of claim 8, wherein the supporting portion has a pair of supporting members arranged at different positions in the predetermined direction; the holding portion has a pair of holding members arranged at different positions in the predetermined direction ; The interval between the pair of supporting members in the predetermined direction is narrower than the interval between the pair of holding members in the predetermined direction. For example, the photomask holding device of any one of the claims 1, 2, and 5, wherein the supporting portion has a pair of supporting members arranged in different positions in the predetermined direction; the holding portion has a pair of supporting members arranged in the predetermined direction A pair of holding members in different positions; the interval between the pair of supporting members in the predetermined direction is shorter than the interval between the pair of holding members in the predetermined direction. For example, the mask holding device of any one of items 1, 2, and 5 in the scope of patent application, wherein the holding portion controls the suction force to the held area to suppress the bending into the predetermined bending shape. Changes in the amount of deflection of the mask. The photomask holding device according to any one of the claims 1, 2, and 5, wherein the supporting portion supports the supported area by making the supporting portion point contact with the supported area. For example, the mask holding device of any one of items 1, 2, and 5 in the scope of patent application, wherein: The support portion supports the supported area so that the support portion linearly contacts the supported area. For example, in the mask holding device of claim 6, wherein a plurality of the support parts are arranged in a row and arranged separately from each other in the moving direction. For example, the photomask holding device of any one of the claims 1, 2, and 5, wherein the holding portion has: a pressing portion that makes the holding portion relative to the holding portion in such a manner that the holding portion contacts the held area Pressed by the holding area. For example, the photomask holding device of claim 6, wherein the holding portion has: a pressing portion for pressing the holding portion from the moving direction relative to the held area so that the holding portion contacts the held area . An exposure apparatus comprising: a photomask holding device according to any one of the scope of patent application 1 to 16; and a pattern forming device which is made by passing through the photomask held by the photomask holding device with an energy beam In the exposure operation of the substrate exposure, the pattern possessed by the photomask is formed on the substrate. For example, the exposure device of item 17 of the scope of patent application further includes a projection optical system that is arranged between the mask and the substrate to image the pattern on the substrate; the projection optical system can be based on the aforementioned The predetermined deflection shape adjusts the imaging conditions. Such as the exposure device of item 18 of the scope of patent application, wherein the aforementioned projection optical system is When the pattern is formed on the plurality of exposure areas provided on the substrate by the pattern forming device, the imaging conditions can be adjusted for each of the plurality of exposure areas. Such as the exposure device of the 17th patent application, wherein the aforementioned substrate is used for the exposure substrate of the flat panel display. For example, the exposure device of item 20 of the scope of patent application, wherein the length or diagonal length of at least one side of the aforementioned exposure substrate is 500 mm or more. A method of manufacturing a flat panel display, comprising: using the exposure device of any one of the 17 to 21 patents to expose the substrate; and developing the substrate after the exposure. A method for manufacturing a device, comprising: using the exposure device of any one of the 17th to 21st patent applications to expose the aforementioned substrate; and the operation of developing the aforementioned substrate after exposure. A photomask holding method for holding a photomask, which is used in an exposure device that transfers the pattern formed on the photomask to a substrate, and includes: using a plurality of supporting parts to support the photomask separated in a predetermined direction The supporting action of a plurality of supported areas; and the use of the held area on the photomask that is supported by the support portion and is bent by the weight of the photomask in the direction of gravity crossing the predetermined direction. The holding part of the suction surface maintains the holding action of the aforementioned held area; in the aforementioned supporting action, the support The region between the plurality of supported regions in the photomask is deflected in the direction of gravity due to the weight of the photomask, and the photomask becomes the supported region of the photomask having a predetermined bending shape; in the foregoing In the holding operation, the holding area is held by the suction surface that can be displaced in such a way that the holding area of the photomask that is supported by the support portion becomes the predetermined bending shape is held; in the holding operation Wherein, in the direction of gravity, the supported area is contacted at a position different from the position where the holding portion contacts the held area to support the supported area. For example, the photomask holding method of claim 24, wherein in the holding operation, the suction surface is made to adhere to the predetermined bending shape relative to the main body provided with the holding portion and the supporting portion The part is inclined to maintain the previously held area. For example, the photomask holding method of item 24 or 25 of the scope of patent application, wherein, in the holding operation, the suction surface is inclined in such a manner as to adhere to the held area of the predetermined bending shape of the photomask, so that The suction force acts in a direction substantially perpendicular to the held area, and the held area is sucked and held. The method for holding a photomask as claimed in claim 24 or 25, wherein, in the holding operation, the held area on the second surface different from the first surface of the photomask supported by the support portion is held. A photomask holding method for holding a photomask, which is used in an exposure device that transfers the pattern formed on the photomask to a substrate, and includes: using a plurality of supporting parts to support the photomask separated in a predetermined direction Multiple supported Supporting action of the area; and the use of the suction surface holding the area to be held on the photomask that is supported by the support portion and flexed by the weight of the photomask in the direction of gravity crossing the predetermined direction Part, the holding action for holding the held area; in the supporting action, the area between the plurality of supported areas in the photomask is flexed in the direction of gravity due to the weight of the photomask, the photomask The supported region of the photomask having a predetermined deflection shape; in the holding operation, in order to maintain the predetermined deflection shape of the photomask that is flexed by the support of the support portion, the photomask The side surface of the photomask is in contact with and held by the held area; in the supporting action, in the direction of gravity, the holding portion contacts the held area at a position different from the position where the holding portion contacts the held area to support the Supported area. For example, the method for holding a photomask in any one of items 24, 25, and 28 in the scope of the patent application, wherein, in the aforementioned supporting action, by being at a different position in the predetermined direction that intersects with the movable direction of the photomask The support portions arranged separately from each other support the supported area. For example, the method for holding a photomask according to any one of items 24, 25, and 28 of the scope of patent application, wherein in the holding operation, the held area on the photomask that is different from the supported area is held in the predetermined direction. For example, the method for holding a mask according to the 30th patent application, wherein, in the aforementioned supporting action, the area to be held is in the predetermined direction between the aforementioned mask The center side supports the aforementioned supported area. For example, the mask holding method of the 31st patent application, wherein in the aforementioned supporting action, a pair of supporting members support different positions in the aforementioned predetermined direction; in the aforementioned holding action, a pair of holding members hold the aforementioned predetermined direction Different positions; the interval between the pair of supporting members in the predetermined direction is narrower than the interval between the pair of holding members in the predetermined direction. For example, the photomask holding method of any one of items 24, 25, and 28 in the scope of the patent application, wherein in the aforementioned supporting action, a pair of supporting members supports different positions in the aforementioned predetermined direction; in the aforementioned holding action, a The holding members are held at different positions in the predetermined direction; the interval between the pair of supporting members in the predetermined direction is narrower than the interval between the pair of holding members in the predetermined direction. Such as the mask holding method of any one of items 24, 25, and 28 in the scope of the patent application, wherein, in the holding operation, the suction force is controlled and the held area is held to suppress the predetermined deflection shape of the mask. Changes in deflection. The photomask holding method according to any one of claims 24, 25, and 28, wherein, in the supporting operation, the supporting portion is brought into point contact with the supported area to support the supported area. The photomask holding method according to any one of claims 24, 25, and 28, wherein, in the supporting operation, the supporting portion is brought into line contact with the supported area to support the supported area. Such as the mask holding method of claim 29, wherein, in the aforementioned supporting action, a plurality of the aforementioned supporting portions are separated from each other in the aforementioned moving direction Arrange and configure. For example, the photomask holding method of any one of claims 24, 25, and 28, wherein, in the holding operation, the holding part is held relative to the holding part so that the holding part contacts the holding area Area press. The method for holding a mask according to claim 29, wherein, in the holding operation, the holding portion is pressed against the held area from the moving direction in such a manner that the holding portion contacts the held area. An exposure method, comprising: the photomask holding method of any one of the scope of patent application 24 to 39; and the exposure action of exposing the substrate with energy beam through the photomask held by the photomask holding method, The formation operation of forming the pattern of the photomask on the substrate. For example, the exposure method of claim 40, wherein, in the forming operation, the pattern is imaged on the substrate through the projection optical system provided between the mask and the substrate; the projection optical system is based on the mask The aforementioned predetermined deflection shape adjusts the imaging conditions. Such as the exposure method of item 41 in the scope of patent application, wherein, in the aforementioned forming operation, the aforementioned pattern is formed on a plurality of exposure areas provided on the aforementioned substrate; the aforementioned projection optical system can adjust imaging for each of the aforementioned multiple exposure areas condition. Such as the exposure method of item 40 in the scope of patent application, among which, The aforementioned substrate is an exposure substrate for flat panel displays. For example, the exposure method of item 43 of the scope of patent application, wherein the length or diagonal length of at least one side of the aforementioned exposed substrate is 500mm or more. A method for manufacturing a flat panel display, which includes: the operation of exposing the aforementioned substrate by using the exposure method in any one of the scope of patent application 40 to 44; and the operation of developing the aforementioned substrate after the exposure. A method of manufacturing a device, comprising: an operation of exposing the aforementioned substrate using the exposure method of any one of the scope of the patent application items 40 to 44; and an operation of developing the aforementioned substrate after the exposure.

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