CN108351597A - The keeping method and exposure method of object holding apparatus, exposure device, the manufacturing method of flat-panel monitor, device making method, object - Google Patents
The keeping method and exposure method of object holding apparatus, exposure device, the manufacturing method of flat-panel monitor, device making method, object Download PDFInfo
- Publication number
- CN108351597A CN108351597A CN201680062678.XA CN201680062678A CN108351597A CN 108351597 A CN108351597 A CN 108351597A CN 201680062678 A CN201680062678 A CN 201680062678A CN 108351597 A CN108351597 A CN 108351597A
- Authority
- CN
- China
- Prior art keywords
- exposure
- holding
- light shield
- holding apparatus
- supporting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
- G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70258—Projection system adjustments, e.g. adjustments during exposure or alignment during assembly of projection system
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Polarising Elements (AREA)
Abstract
The mask stage device (14) of the holding light shield (M) of the present invention has：Rest pad (50) supports light shield (M) from below；Absorption layer (46), it has the retaining surface that the face of the light shield (M) to being supported by rest pad (50) and being bent by the dead weight of light shield (M) is kept, and keeps retaining surface movable in a manner of along the face of the light shield of flexure (M) and keeps light shield using retaining surface；With suction port (46b), the light shield (M) of flexure is adsorbed in retaining surface.
Description
Technical field
The present invention relates to object holding apparatus, exposure device, the manufacturing method of flat-panel monitor, device making method, objects
The keeping method and exposure method of body the present invention relates to the object holding apparatus for keeping object and method, include in more detail
The exposure device of above-mentioned object holding apparatus, the exposure method comprising above-mentioned object keeping method, using above-mentioned exposure device or
The flat-panel monitor of method or the manufacturing method of device.
Background technology
In the past, in electronic devices (microdevice) such as manufacture liquid crystal display element, semiconductor elements (integrated circuit etc.)
In photo-mask process, having used the exposure device of step-scan (step and scan) mode, (so-called scanning stepper is (also referred to as
For scanner)) etc., which makes light shield or graticule (hereinafter collectively referred to as " light shield ") and glass plate or chip etc. on one side
(hereinafter collectively referred to as " substrate ") will be formed in the pattern of light shield using energy beam on one side along defined scanning direction synchronizing moving
It is transferred on substrate.
This exposure device, which has, to be kept light shield and the light shield is made to be moved in a scanning direction with defined speed and precision
Mask stage device (referring for example to patent document 1).
Here, since common mask stage device is in a manner of the not light path of interfering energy beam to the end of light shield M
Nearby (region that mask pattern is not formed) is kept the structure of (or bearing), is scratched so light shield can be generated because of dead weight
It is bent.The flexure of this light shield can ensure exposure accuracy, but the feelings unstable in the deflection profile of light shield by optical compensation
Under condition, there are problems that being not easy to carry out optical compensation.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2011-85671 bulletins
Invention content
The present invention is to propose in view of the foregoing, according to first method, provides a kind of object holding apparatus, is kept
Object, the object holding apparatus have：Supporting part supports the object from below；Maintaining part has to by the bearing
The retaining surface that portion supports and the face of the object that is bent by the dead weight of the object is kept, makes the retaining surface with edge
It the mode in the face of the object of flexure and movably and using the retaining surface keeps the object；And adsorption section, it will be described
The object of flexure is adsorbed in the retaining surface.
According to second method, a kind of exposure device is provided, is had：Object holding apparatus；And patterning device, lead to
It crosses and is moved using the exposure that energy beam is exposed exposure object object via the object kept by the object holding apparatus
Make, and pattern possessed by the object is formed onto the exposure object object.
According to Third Way, a kind of manufacturing method of flat-panel monitor is provided comprising：Using exposure device to the exposure
Light object is exposed；Develop with the exposure object object after exposing.
According to fourth way, a kind of device making method is provided comprising：Using exposure device to the exposure object object
It is exposed；Develop with the exposure object object after exposing.
According to the 5th mode, a kind of object keeping method is provided, is kept using the object for having supporting part and retaining surface
Device keeps object, which includes：The object is supported from below using the supporting part；Make to by described
The retaining surface that supporting part supports and the face of the object that is bent by the dead weight of the object is kept is with along scratching
The mode in the face of the bent object is movable；With so that the object of flexure is adsorbed in the retaining surface.
According to the 6th mode, a kind of exposure method is provided comprising：Object keeping method；With by via with the object
The object that body keeping method is kept and exposure object object is exposed using energy beam exposure actions, and by the object
Pattern possessed by body is formed onto the exposure object object.
According to the 7th mode, a kind of manufacturing method of flat-panel monitor is provided comprising：Using exposure method to the exposure
Light object is exposed；Develop with the exposure object object after exposing.
According to eighth mode, a kind of device making method is provided comprising：Using exposure method to the exposure object object
It is exposed；Develop with the exposure object object after exposing.
Description of the drawings
Fig. 1 is the figure of the structure for the liquid crystal exposure apparatus that outlined first embodiment.
Fig. 2 is the vertical view of mask stage device possessed by the liquid crystal exposure apparatus of Fig. 1.
(a) of Fig. 3 is the portions the 3A enlarged drawing of Fig. 2, and (b) of Fig. 3 is the 3B-3B line sectional views of Fig. 3 (a).
(c) of (a) of Fig. 4~Fig. 4 is figure (its acted for illustrating the loading of the light shield relative to mask stage device
1~its 3).
(a) of Fig. 5 is the figure of the supporting arrangement for the light shield for indicating comparative example, and (b) of Fig. 5 indicates first embodiment
The figure of the supporting arrangement of light shield, (c) of Fig. 5 are adsorptive pressure and the displacement for indicating the light shield in comparative example and first embodiment
The chart of the relationship of amount.
(a) of Fig. 6 and (b) of Fig. 6 are that the figure of the first variation for the mask stage device for indicating first embodiment (divides
It Wei sectional view and vertical view).
Fig. 7 is the figure of the second variation of the mask stage device for indicating first embodiment.
Fig. 8 is the figure of the third variation for the mask stage device for indicating first embodiment.
Fig. 9 is the figure of the 4th variation of the mask stage device for indicating first embodiment.
Figure 10 is the figure of the 5th variation for the mask stage device for indicating first embodiment.
(a) of Figure 11 and (b) of Figure 11 are structure and the action of the mask stage device for illustrating second embodiment
Figure (its 1 and its 2).
Figure 12 is the figure of the variation for the mask stage device for indicating second embodiment.
Figure 13 is the vertical view of the mask stage device of third embodiment.
Specific implementation mode
《First embodiment》
Hereinafter, being illustrated to first embodiment with (c) of Fig. 1~Fig. 5.
The structure of the liquid crystal exposure apparatus 10 of first embodiment is shown schematically in Fig. 1.Liquid crystal exposure apparatus 10
It will be used for the glass substrate P (hereinafter referred to as substrate P) of the rectangle (rectangular) of liquid crystal display device (flat-panel monitor) etc. in this way
The projection aligner of step-scan mode as exposure object object, i.e., so-called scanner.
Liquid crystal exposure apparatus 10 has lighting system 12, is kept to the light shield M for being formed with the patterns such as circuit pattern
Mask stage device 14, projection optical system 16, at surface (towards the face of+Z sides in Fig. 1) coated with resist (induction agent)
The baseplate carrier device 20 that is kept of substrate P and their control system etc..Hereinafter, will in exposure light shield M and base
Plate P relative to projection optical system 16 respectively by the direction of relative scanning as X-direction, will be orthogonal to X-axis in the horizontal plane
Direction illustrated as Z-direction as Y direction, and using the direction orthogonal with X-axis and Y-axis.In addition, will around X-axis,
The direction of rotation of Y-axis and Z axis is illustrated respectively as θ x, θ y and the directions θ z.
Structure in the same manner as the lighting system such as disclosed in No. 5,729,331 specifications of U.S. Patent No. of lighting system 12
At.That is, the light that lighting system 12 will be projected from light source (not shown) (such as mercury lamp) is as exposure illumination light (illumination light) IL
And it is irradiated respectively to light shield M through not shown speculum, dichronic mirror, shutter, wavelength selective filters, various lens etc..Make
For illumination light IL, such as use light (or the above-mentioned i of i lines (wavelength 365nm), g lines (wavelength 436nm), h lines (wavelength 405nm) etc.
The synthesis light of line, g lines, h lines).It is substantially parallel from lighting system 12 to the optical axis AX of the light shield M illumination light IL irradiated and Z axis.
Mask stage device 14 has the microscope carrier main body 30 for the light shield M for keeping light-transmission type.Microscope carrier main body 30 by with X/Y plane
The plate-shaped member configured substantially in parallel is constituted, and the opening portion 32 being inserted into for light shield M is formed in central portion.Microscope carrier main body 30
Such as by comprising the mask stage drive system including linear motor and relative to lighting system 12 (illumination light IL) in X-axis side
It is driven on (scanning direction) with defined long stroke, and by small driving in Y direction and the directions θ z.Microscope carrier main body 30
Location information in the horizontal plane is for example by including the mask stage position including laser interferometer system (or encoder system)
It sets measuring system (not shown) and finds out.About the holding structure of the light shield M based on microscope carrier main body 30, see below.
Projection optical system 16 is configured at the lower section of mask stage device 14.Projection optical system 16 is, for example, special with the U.S.
Projection optical system disclosed in sharp No. 6,552,775 specification etc. is the projection optics system of the so-called poly-lens type of same structure
System, and have the multiple optical systems (optical projection system module 16a) for the both sides telecentricity for for example forming upright erect image.
In liquid crystal exposure apparatus 10, when by the illumination light IL from lighting system 12 to being located at defined illumination region
When interior light shield M is illuminated, using from light shield M by illumination light IL will be in the illumination region via projection optical system 16
Projection image's (picture of local pattern) of pattern of light shield M be formed in the exposure area in substrate P.Then, by making light shield M phases
Illumination region (illumination light IL) is relatively moved in a scanning direction, and makes substrate P relative to exposure area (illumination light
IL it) relatively moves in a scanning direction, carries out the scan exposure of an irradiation area in substrate P, and will be formed on light shield M
Pattern (pattern corresponding with the scanning range of light shield M whole) be transferred to the irradiation area.Here, the lighting area on light shield M
Domain becomes the pass of optical conjugate each other with the exposure area (irradiation area of illumination light) in substrate P by projection optical system 16
System.
Baseplate carrier device 20 is the portion relative to projection optical system 16 (illumination light IL) high accuracy positioning by substrate P
Point.Baseplate carrier device 20 has the holding member (also referred to as substrate holder etc.) for keeping substrate P and by the holding member
(i.e. substrate P) with defined long stroke drive and in six-freedom degree direction along horizontal plane (X-direction and Y direction)
The upper drive system for carrying out small driving.The location information in the six-freedom degree direction of holding member (i.e. substrate P) for example passes through
Including the baseplate carrier position measuring system (not shown) of laser interferometer system (or encoder system) and find out.
Then, to based on microscope carrier main body 30 possessed by mask stage device 14 to the bearing of light shield M and holding structure into
Row explanation.
As shown in Fig. 2, mask stage device 14 has multiple (being, for example, six in the present embodiment) supporting arrangements 40.
For example, six supporting arrangements 40 are respectively provided with the rest pad 50 of bearing light shield M from below.In addition, such as six supporting arrangements 40
It is respectively provided with the absorption layer 46 that absorption holding is carried out to light shield M.That is, light shield M by rest pad 50 support it is different from each other for example
Six parts, and absorption holding is carried out to such as six parts different from each other by absorption layer 46.
Such as three in six supporting arrangements 40 from the wall surfaces of the sides+Y in the wall surface of formation (regulation) opening portion 32 to
Prominent configuration in opening portion 32, the prominent configuration into opening portion 32 of remaining three wall surfaces from the sides-Y.Three of the above-mentioned sides+Y
Supporting arrangement 40 and three supporting arrangements 40 of the sides-Y configure at predetermined intervals in the X-axis direction respectively.
Here, in the lower surface (pattern plane) of light shield M, it has been formed about and has been unpatterned in the respective end of four edges
Region (hereinafter referred to as " white space ").In addition, in the region of pattern formed in the lower surface of light shield M (with clear area
The region of inside of the domain compared to light shield M) film (pellicle) (not shown) of pattern protection is installed.Such as six bearings
White space near the end of three sides+Y that bearing is formed in light shield M from below of the sides+Y in device 40 is (not with film
The region of interference) and carry out absorption holding to it, and three of the sides-Y from below bearing be formed in light shield M the sides-Y ends
Neighbouring white space simultaneously carries out absorption holding to it.
Then, the structure of supporting arrangement 40 is illustrated.Since the structure of such as six supporting arrangements 40 is substantially
It is identical, so being illustrated to one of them.As shown in (a) of Fig. 3 and (b) of Fig. 3, supporting arrangement 40 have base portion 42,
Leaf spring 44, absorption layer 46, rest pad 50 etc..
It is constituted for the flat component of rectangle when base portion 42 is by overlooking, one end is (in (a) of Fig. 3 and (b) of Fig. 3
For the end of the sides-Y) it is fixed on the lower surface of microscope carrier main body 30.The other end of base portion 42 is (in (a) of Fig. 3 and (b) of Fig. 3
For the end of the sides+Y) it is prominent into opening portion 32 from microscope carrier main body 30.Base portion 42 is formed with layer in the middle part about Y direction
Poor portion, slightly (degree for not influencing the rigidity of base portion 42 itself) is thin compared with the region of one end side in the region of the other end side
Ground is formed.
Upper surface near the other end of base portion 42 is fixed with rest pad 50.Rest pad 50 along X-direction by extending
YZ rectangular cross-sections component constitute.In the present embodiment, rest pad 50 is for example formed by stainless steel and other metal materials,
But it is not limited to this, such as can also be formed by the consistent ceramics of precision.In addition, rest pad 50 due to under light shield M
Surface is in direct contact, so can also be formed by glass identical with light shield M.In addition, in the present embodiment, rest pad 50
It is set as individual component with base portion 42, but they can also be integrally formed.
Leaf spring 44 is formed by the plank (such as steel plate) with spring performance (elasticity).Leaf spring 44 is substantially flat with X/Y plane
It configures capablely, on the one hand there is elasticity on Z axis and the directions θ x, on the one hand about direction (the especially X-axis parallel with X/Y plane
Direction) and there is defined rigidity.One end of leaf spring 44 is fixed on the upper surface of base portion 42 across gasket 48a by bolt 48
In compared with layers of difference portion closer to the region of one end (the thicker side of thickness).The other end of leaf spring 44 is (hereinafter referred to as " preceding
End ") it is prominent closer to the region of front end side (side of thinner thickness) compared with layers of difference portion into the upper surface of base portion 42,
And defined gap is formed between the upper surface of base portion 42 and the lower surface of leaf spring 44.In addition, the bearing of present embodiment
Device 40 has such as two panels leaf spring 44 detached in the X-axis direction, but the quantity of leaf spring 44 is not particularly limited.
Absorption layer 46 is fixed on leaf spring by being constituted along the flat component that X-direction extends (with reference to (a) of Fig. 3)
On the upper surface of the region of 44 front end side, i.e. free end side.Above-mentioned rest pad 50 is configured at light shield M compared with absorption layer 46
Central portion side (in (b) of Fig. 3 be the sides+Y).It is formed in the upper surface (adsorption plane) of absorption layer 46 and extends along X-direction
Slot 46a, the central portion in the bottom surface of slot 46a is formed with suction port 46b.Suction port 46b is opened in the side of absorption layer 46
The opening portion 46c of the external connection of mouth is (not shown in (a) of Fig. 3.With reference to (b) of Fig. 3) connection.Via above-mentioned opening portion
Slot 46a supply vacuum attractions of the 46c and suction port 46b externally to absorption layer 46.In addition, the upper surface of absorption layer 46 (is inhaled
Attached face) height and position be set to become the position (+Z side) higher than the upper surface of rest pad 50.In addition, at (b) of Fig. 3
In, light shield M is for easy understanding shown with the state (inclination) than actual flexure.
Then, with (c) of (a) of Fig. 4~Fig. 4 to loading supporting arrangement when light shield M relative to mask stage device 14
40 action illustrates.
As shown in (a) of Fig. 4, when light shield M not shown light shield loaders carry out decline driving (with reference to (a) of Fig. 4
Arrow) when, the lower surface of light shield M is contacted with absorption layer 46 first.At this moment, absorption layer 46 is without vacuum attraction.Therefore, it adsorbs
Pad 46 is not intended to limit light shield M, and front end is bent downwards leaf spring 44 due to the dead weight of light shield M.In addition, leaf spring 44 is due in freedom
End side is fixed with absorption layer 46, so the mode of ends sag slightly becomes before meeting in the state of not supporting light shield M
Shape, but it is not limited to this.
Then, as shown in (b) of Fig. 4, the lower surface of light shield M is contacted with rest pad 50.As a result, in the Z-axis direction, light shield
Bearing table device 14 mechanically determines the bearing position (position indicated with circular mark S in (b) of Fig. 4) of light shield M.
This, since rest pad 50 extends along X-direction, so rest pad 50 is contacted with light shield M lines.Light shield M is due in the sides+Y and the sides-Y
End nearby support (reference Fig. 2) from below by multiple rest pads 50, so can due to it is conducted oneself with dignity with in Y direction in
Centre portion is bent to the convex mode outstanding of -Z direction.
In addition, after supporting light shield M by rest pad 50, as shown in (c) of Fig. 4, absorption layer 46 adsorbs light shield M
It keeps.At this moment, in supporting arrangement 40, since rest pad 50 carries (limited about -Z direction) in advance light shield M, so light
Covering M will not move due to the attraction from absorption layer 46 to -Z direction.At this moment, absorption layer 46 is by the effect of leaf spring 44
Make adsorption plane along the lower surface displacement of (according to) light shield M, attraction acts perpendicularly to the lower surface of light shield M (with reference to Fig. 4's
(c) arrow).In addition, since as long as light shield M can be limited in X/Y plane, so the attraction of absorption layer 46 can
With smaller, and the torque acted on around the above-mentioned bearing position S of light shield M is small to the degree that can ignore that.That is, absorption layer 46
By light shield M limitations (fixation) in microscope carrier main body 30 in a manner of not influencing to bend caused by the dead weight of light shield M.
Here, as described above, although light shield M is bent because of dead weight, its deflection is because of position in the Y-axis direction
It sets and different, the deflection of the central portion in the Y direction of light shield M nearby becomes larger than the both ends in Y direction.Therefore, light
Cover the upper surface (plane of exposure) of pattern plane and the substrate P (referring to Fig.1) of M interval (from the pattern plane of light shield M to imaging surface away from
From) generate difference (deviation).
In contrast, (respectively referring to figure using projection optical system 16 in the liquid crystal exposure apparatus 10 of present embodiment
1) above-mentioned deviation is compensated.That is, as shown in Figure 1, projection optical system 16 is so-called poly-lens optical system, have cross-shaped
More (being, for example, five in Fig. 1) optical projection system module 16a of configuration, the more optical projection system module 16a are separately
Have focus adjusting mechanism, image shift mechanism, multiplying power adjustment mechanism etc..Therefore, as described above, even if light shield M has occurred
(deviation has occurred in the distance between light shield M and substrate P) is bent caused by dead weight, it also can be by according to its deflection independence
Ground controls each optical projection system module 16a and adjusts image-forming condition to ensure desired exposure accuracy.In addition, optical projection system module
The radical etc. of 16a is an example, can be suitably changed.
Then, by comparison the functions and effects of the mask stage device 14 of present embodiment are said with comparative example
It is bright.The supporting arrangement 90 of the mask stage device of comparative example is shown in (a) of Fig. 5.Supporting arrangement 90 is relative to microscope carrier main body
The configuration of 30 (with reference to Fig. 2) is set as identical as the supporting arrangement of present embodiment 40.
In the supporting arrangement 40 of the present embodiment shown in (b) of Fig. 5, absorption layer 46 is by 44 cantilever support of leaf spring, phase
For this, in the supporting arrangement 90 of the comparative example shown in (a) of Fig. 5, absorption layer is directly fixed in the upper surface of base portion 92
94.That is, the absorption layer 46 (with reference to (b) of Fig. 5) of present embodiment can make adsorption plane according to the lower surface displacement of light shield M (in Z
Moved on axis and the directions θ x), in contrast, the absorption layer 94 (with reference to (a) of Fig. 5) of comparative example is flat with the position of adsorption plane and XY
The substantially parallel state in face is fixed.Therefore, in supporting arrangement 90, also have to the light shield M absorption layers 94 for carrying out absorption holding
Function as the bearing part for supporting light shield M on bearing position S.In addition, the purpose of the supporting arrangement 90 of comparative example is,
By adsorption pressure from absorption layer 94 in a manner of keeping the lower surface of light shield M with respect to the horizontal plane parallel to light shield M into
Row plane rectification (absolute value for reducing flexure).In contrast, the supporting arrangement 40 of present embodiment shown in (b) of Fig. 5 is
Allow the structure of the flexure (flexure of light shield M carries out optical compensation) caused by the dead weight of light shield M.
Here, as shown in the chart of (c) of Fig. 5 it is found that in the supporting arrangement 90 of comparative example, it is (negative relative to adsorption pressure
Pressure) variation, the displacement generated by freely bend of light shield M (deflection only by acting on the generation of conducting oneself with dignity of light shield M)
Very big (deflection delicately changes relative to the variation of negative pressure).That is, in the supporting arrangement 90 of comparative example, from absorption
In the case of the adsorption pressure variation of pad 94, the deflection (deflection profile) of light shield M is simultaneously unstable.In this case, due to light shield M
It is unstable with the interval of substrate P (referring to Fig.1), so the flexure of poly-lens optical system not easy to use compensation light shield M.Above-mentioned suction
Attached pressure variation be easy because the depth of parallelism between the adsorption plane and the lower surface of light shield M of absorption layer 94 decline (units of micrometers
The generation of minim gap) and generate.
In contrast, in the supporting arrangement 40 of the present embodiment shown in (b) of Fig. 5, have the function of supporting light shield M
Rest pad 50 detached with the absorption layer 46 of function for carrying out absorption holding to light shield M.Absorption layer 46 is to by rest pad 50
The light shield M supported in advance carries out absorption holding, and the adsorption plane of absorption layer 46 can be along the lower surface position of (according to) light shield M
It moves.As a result, from the chart of (c) of Fig. 5 it is found that in the supporting arrangement 40 of present embodiment, even if adsorption pressure changes, because of light shield
Freely bending for M and the deviation of displacement that generates is also seldom.Therefore, even if the absorption buckling that absorption layer 46 generates light shield M
Dynamic, also very little, light shield M and the interval of substrate P (referring to Fig.1) are stablized for the variation of the deflection of light shield M.As a result, as described above, energy
Poly-lens optical system is enough used easily to compensate the flexure of light shield M, exposure accuracy improves.
In addition, in the supporting arrangement 90 of comparative example, it is also contemplated that in view of the free deflection of light shield M the case where
In advance be arranged obliquely base portion 92 down, but due to the position of the bearing position S of the light shield M based on absorption layer 94 because light shield M from
Changed by deflection, so being not easy to make the deflection of light shield M to stabilize.
The mask stage device 14 of first embodiment from the description above, even light shield M is reloaded into light
On cover bearing table device 14 in the case of the case where (be also included within different exposure devices between reloading), the flexure of light shield M
The reproducibility of amount (deflection profile) can also improve.Therefore, it is possible to use the projection optical system 16 of poly-lens type reliably to compensate
The flexure of light shield M is so that exposure accuracy improves.
In addition, the structure of the supporting arrangement 40 of the light shield M of first embodiment described above is an example, Neng Goushi
Work as deformation.Such as the bearing part for the front end and the lower surface of bearing light shield M for being installed on base portion 42 is not limited to above-mentioned first
The component (rest pad 50) of rectangular cross-section as embodiment, such as can also be as shown in (a) of Fig. 6 and (b) of Fig. 6
Support rod 52 possessed by the supporting arrangement 40A of the light shield M of first variation is like that circular component is constituted by section.Separately
Outside, X-axis that both can be than light shield M length support rod 52 as shown in (b) of Fig. 6 of bearing part (including rest pad 50)
The length in direction is long, can also be provided with support rod 52 on such as three base portions 42.In addition, support rod 52 can also with it is above-mentioned
First embodiment is similarly separately provided relative to the respective base portions of each supporting arrangement 40A 42.It is installed in the branch of this variation
It sets in 40A, compared with above-mentioned rest pad 50, can by handling ease improve light shield M and be contacted with what 52 line of support rod contacted
Partial straightness.In addition, as long as light shield M can be made to be contacted with 52 line of support rod, there is no special in the section of support rod 52
It does not limit, such as can also be semicircle.
Alternatively, it is also possible to as the supporting arrangement 40B of the second variation shown in Fig. 7, the lower surface of leaf spring 44 with
Between the upper surface of base portion 42 be inserted into compression helical spring 54, with to the upward power in 46 acting gravity force direction of absorption layer (to light shield M
Push down the power of absorption layer 46).In this case, the adsorption plane of absorption layer 46 can be made reliably to be contacted with the lower surface of light shield M
(inhibiting to form gap between absorption layer 46 and light shield M).In addition, the vibration of absorption layer 46 can also be inhibited.In addition, compression spiral bullet
The upward power of gravity direction that spring 54 assigns absorption layer 46 does not influence the journey of the deflection generated by the dead weight of light shield M preferably
The size (intensity) of degree.In addition, instead of compression helical spring 54, for example, can also will other spring members as leaf spring,
Or between the material elastomer insertion leaf spring 44 formed and base portion 42 for passing through rubber, synthetic resin.
Alternatively, it is also possible to the length direction in leaf spring 44C as the supporting arrangement 40C of third variation shown in Fig. 8
Middle section is formed with bending section.It in this case, also can be in the same manner as above-mentioned second variation (with reference to Fig. 7) relative to light shield
M pushes down absorption layer 46.
Alternatively, it is also possible to which as the supporting arrangement 40D of the 4th variation shown in Fig. 9, by thickness each other, (spring is normal
Number) different two kinds of leaf spring 44D1, leaf spring 44D2And absorption layer 46 is installed on base portion 42, and with above-mentioned second variation (reference
Fig. 7) similarly absorption layer 46 is pushed down relative to light shield M.
Alternatively, it is also possible to the supporting arrangement 40E as 5th variation shown in Fig. 10, instead of above-mentioned first embodiment party
The leaf spring 44 ((b) that respectively refers to Fig. 3) of the supporting arrangement 40 of formula and between absorption layer 46 and base portion 42 configure tubular leaf spring
56, and absorption layer 46 is only supported by the tubular leaf spring 56.The tubular leaf spring 56 other than with the elasticity to Z-direction,
Also there is the elasticity to the directions θ x and the directions θ y, and swing (head shaking movement) and support absorption layer 46 freely.In this case,
In the same manner as above-mentioned second variation (with reference to Fig. 7) absorption layer 46 can be pushed down relative to light shield M.
《Second embodiment》
Then, the mask stage device 114 of second embodiment is illustrated with (b) of (a) of Figure 11 and Figure 11.The
The structure of the mask stage device 114 of two embodiments other than the structure difference this point of the supporting arrangement 60 of light shield M, with
Above-mentioned first embodiment is identical, therefore, is only illustrated below to difference.For having and above-mentioned first embodiment phase
The element of same structure and function marks the reference numeral being the same as the above first embodiment and the description thereof will be omitted.
In above-mentioned first embodiment (with reference to (b) etc. of Fig. 3), absorption layer 46 adsorbs the lower surface of light shield M
It keeps, in contrast, in the supporting arrangement 60 of the mask stage device 114 of this second embodiment, such as (b) institute of Figure 11
Show, this point that absorption layer 62 carries out the upper surface of light shield M absorption holding is different.Hereinafter, structure to supporting arrangement 60 and
Action illustrates.In addition, in mask stage device 114, by multiple (such as six) supporting arrangements 60 with above-mentioned first
Embodiment, which similarly configures, to be mounted on (with reference to Fig. 2 etc.) in microscope carrier main body 130, but is shown in (b) of (a) of Figure 11 and Figure 11
One of them is gone out.
The front end of base portion 142 possessed by supporting arrangement 60 is equipped with support pads via ball 68a by bolt 68b
68.The bearing surface of support pads 68 by can it is opposite with the lower surface of light shield M in a manner of towards +Z direction (upward), and pass through ball
68a can be inclined relative to horizontal and (can be swung up in the sides y θ x and θ relative to base portion 142).Therefore, support pads 68 are not
Interfere deformation (the bending naturally) caused by the dead weight of light shield M.In addition, support pads 68 pass through it is (thin with the white space of light shield M
The region in the outside of film PL) it contacts to set the positions of (regulation) light shield M in the Z-axis direction, but without absorption holding etc..
In supporting arrangement 60, the limitation (holding) of positions of the light shield M in X/Y plane is carried out by absorption layer 62.Absorption layer
62 are installed on one end of leaf spring 64 similarly to the first embodiment.The other end of absorption layer 62 connects with executing agency 66
It connects, absorption layer 62 integrally carries out rotation driving by executing agency 66 with leaf spring 64 on the directions θ x.Executing agency 66 is not via
The installing component of diagram is fixed in microscope carrier main body 130.Absorption layer 62 is accommodated in when loading light shield M etc. and is formed in microscope carrier main body
In recess portion (incised notch mouth) 130A of 130 upper surface, when light shield M is placed on support pads 68, is rotated and driven by executing agency 66
It moves such as 180 ° or so (arrows of 1 (b) referring to Fig.1).The white space of light shield M is by above-mentioned support pads 68 and suction as a result,
Vertically (Z axis) direction is clamped attached pad 62.Light shield M is inhaled by the pull of vacuum being externally supplied about absorption layer 62
This point of attached holding, is the same as the above first embodiment, and therefore, omits the description.In this case, also real with above-mentioned first
Apply mode similarly, absorption layer 62 is preferably inhaled not interfere as the deformation (bending naturally) because of caused by the dead weight of light shield M
Attached pressure carries out absorption holding to light shield M.In the mask stage device 114 of this second embodiment, can also obtain with it is above-mentioned
The same effect of first embodiment, that is, in the case where not influencing deformation (the bending naturally) because of caused by the dead weight of light shield M
Keep light shield M.
In addition, the structure of second embodiment described above can be deformed suitably.Such as it can also be as shown in Figure 12
The supporting arrangement 60A of the mask stage device 114A of the variation of second embodiment is such, is installed on via executing agency 66
The absorption layer 62A of base portion 142A carries out absorption holding to the side of light shield M.In this case, absorption layer 62A is it is also preferred that there is no harm in
Adsorption pressure carries out absorption holding to light shield M as hindering the deformation (bending naturally) because of caused by the dead weight of light shield M.In this change
In shape example, since the rotation angle of absorption layer 62A is smaller than above-mentioned second embodiment (1 (b) referring to Fig.1), so can be more
Promptly carry out the holding of light shield M.Alternatively, it is also possible to not form the recess portion for storing absorption layer 62A in microscope carrier main body 30.
《Third embodiment》
Then, the mask stage device 214 of third embodiment is illustrated with Figure 13.The light shield of third embodiment
The structure of bearing table device 214 other than the structure difference this point of the holding meanss 80 of light shield M, with above-mentioned first embodiment party
Formula is identical, therefore, is only illustrated below to difference.For have the function of the structure being the same as the above first embodiment and
Element, mark the reference numeral that is the same as the above first embodiment and the description thereof will be omitted.
In above-mentioned first embodiment and second embodiment, absorption layer 46 (with reference to (b) of Fig. 3), 62 (referring to Fig.1 1
(b)) so that attraction is acted on light shield M, and pass through the friction between absorption layer 46,62 and light shield M caused by the attraction
Power limit positions of the light shield M in X/Y plane in contrast, in this third embodiment passes through 80 phase of holding meanss
For the part pressing light shield M of the wall surface of the formation opening portion 232 of microscope carrier main body 230 possessed by mask stage device 214
To limit this point difference of positions of the light shield M in X/Y plane.Hereinafter, to keeping dress possessed by mask stage device 214
The structure and action for setting 80 illustrate.
As shown in figure 13, it is formed with opening portion 232 in the central portion of the microscope carrier main body 230 of mask stage device 214, at this
Inserted with light shield M in opening portion 232.Therefore, the respective side of the four edges of light shield M with formed opening portion 232 wall surface across
Defined gap is opposite.
Holding meanss 80 include pressing component 82, executing agency 84 and a pair of of reference component 88.A pair of of reference component 88 exists
Along Y direction between the side of the sides-X of light shield M and the wall surface opposite with the side of the sides-X (towards the wall surface of +X direction)
Separate configuration.A pair of of reference component 88 is fixed in microscope carrier main body 230, and the positioning as light shield M relative to microscope carrier main body 230
Benchmark and function.Pressing component 82 is configured at the side of the sides+X of light shield M and the wall surface (court opposite with the side of the sides+X
To the wall surface of -X direction) between.Pressing component 82 and the execution machine being accommodated in the recess portion 230a for being formed in microscope carrier main body 230
Structure 84 connects, and can be moved in the X-axis direction with defined stroke by the executing agency 84.
After supporting light shield M by multiple rest pads 50, executing agency 84 is via pressing component 82 by the Y-axis side of light shield M
Upward central portion is pressed to -X direction, and holding meanss 80 push down light shield M relative to a pair of of reference component 88 as a result,.That is,
In first and second above-mentioned embodiment (respectively referring to (b) of Fig. 3, (b) of Figure 11), light shield M is maintained at by frictional force
In microscope carrier main body 30,130, in contrast, in this third embodiment, light shield M is directly held by pressing force in microscope carrier
In main body 230.In this third embodiment, even the very narrow (vacuum suction carried out by absorption layer of the white space of light shield M
Keep highly difficult) in the case of, it also can reliably keep light shield M.In addition, holding meanss 80 are due to making pressing force along scanning direction
(3 arrows referring to Fig.1) act on light shield M, so will not interfere the flexure caused by the dead weight of light shield M (will not be because of pressing
Power and the free deflection for influencing light shield M).Therefore, it is possible to use projection optical system 16 (referring to Fig.1) optically to inhibit pair
The influence of exposure accuracy.
In addition, each embodiment of first~third described above (also includes its variation.Structure similarly hereinafter) is one
A example can suitably change.That is, as mask stage device, as long as can be not influence in light shield M by bearing part (example
As above-mentioned first embodiment rest pad 50) from below support in the state of generate flexure mode (with reproduce such as Fig. 5
(c) mode of characteristic as chart) keep light shield M, structure to be not particularly limited.Such as in above-mentioned each reality
It applies in mode, (a) of rest pad 50 shown in (b) due to light shield M by Fig. 3 (the rodlike component of rectangular cross-section) or Fig. 6
Shown in support rod 52 (section be circular rodlike component) bearing, so being light shield M and rest pad 50 (or support rod 52)
The structure of line contact, but it is not limited to this, and mask stage device for example can also be by configuring at predetermined intervals in the X-axis direction
Multiple spheres and with the structure of multiple dot point light shield M (light shield M with each sphere point contact).
In addition, for example in the above-described 2nd embodiment, mask stage device 114 is by absorption layer 62 to by support pads 68
The light shield M of bearing (producing nature flexure) is kept from below, and but it is not limited to this, such as can also omit absorption layer 62
And absorption holding is carried out to the lower surface of light shield M by support pads 68.In this case, as long as microscope carrier master when passing through exposure actions
Movement of the body 130 to scanning direction makes the mode that light shield M is not moved relative to microscope carrier main body 130, by capable of inclining for support pads 68
Oblique direction is limited to the directions θ x (or tilting action itself is limited after keeping light shield M).
In addition, for example in the above-described 3rd embodiment, mask stage device 214 makes the pressing force effect parallel with X-axis
Light shield M is kept in light shield M, but as long as not causing shadow to the deflection profile of light shield M by the pressing force for acting on light shield M
Sound, it is just without being limited thereto, such as pressing force can also be made to act in the Y-axis direction.In addition, mask stage device 214 make by
Pressure acts on light shield M to keep light shield M, and but it is not limited to this, such as can also make tensile force effect in light shield M to keep
Light shield M.
In addition, in the respective embodiments described above, mask stage device 14 is equal to support light shield M from below using rest pad 50 equal
The white space formed near both ends in the Y-axis direction, but near the central portion for example in the Y direction of light shield M
In the case of being formed with white space (non-area of the pattern), can also also have the branch for supporting the white space near the central portion
Bearing portion part.Even in this case, equal to being near both ends and being carry near central portion using absorption layer 46
In the state of light shield M when having carried out holding, as long as deflection profile (deflection) is keeping front and back non-substantial variations.
In addition, in the respective embodiments described above, light shield M is kept by the vacuum suction carried out by absorption layer 46, but simultaneously
It is not limited to this, can also be kept by the mechanical method such as Electrostatic Absorption or fixture.
In addition, in first and second above-mentioned embodiment, absorption layer 46 and rest pad 50 (or support rod 52) are pacified respectively
Loaded on common base portion 42, but it is not limited to this, the base member and the base member for the installation of rest pad 50 installed for absorption layer 46
It can also be individual component.In addition, in the above-described first embodiment, rest pad 50 is compared with absorption layer 46 to the Y of light shield M
Central portion side in axis direction protrudes configuration, and but it is not limited to this, rest pad 50 and the position of absorption layer 46 in the Y-axis direction
It can repeat.
In addition, in liquid crystal exposure apparatus 10, can also by the supporting arrangement of the object of the respective embodiments described above (such as
Multiple supporting arrangements 40 of above-mentioned first embodiment) keep the substrate P as exposure object object.
In addition, there is no special for the wavelength of light source and the illumination light IL irradiated from the light source used in lighting system 12
Limit, for example, can also be the ultraviolet lights such as ArF excimer laser (wavelength 193nm), KrF excimer laser (wavelength 248nm) or
The vacuum-ultraviolet lights such as person's F2 laser (wavelength 157nm).
In addition, in the respective embodiments described above, having used equimultiple system as projection optical system 16, but be not limited to
This, can also use reduction system or amplification system.
In addition, in the respective embodiments described above, liquid crystal exposure apparatus is illustrated for the case where scanning stepping type, but
It is not limited to this, the mask stage device 14 of the respective embodiments described above can also be used the silent oscillations exposure device such as stepper
Deng.
In addition, the purposes as exposure device, is not limited to for liquid crystal display element pattern to be transferred to rectangular glass
The exposure device of liquid crystal on plate can also be widely used in for example organic EL (Electro-Luminescence, electroluminescent hair
Light) exposure device of panel manufacture, the exposure device of semiconductor manufacturing, for manufacturing film magnetic head, micromachine and DNA
The exposure device of chip etc..In addition, the microdevices such as semiconductor element are not only, in order to manufacture optical exposure device, EUV exposures
Light shield or graticule used in device, X-ray exposure device and electric wire exposure device etc., can also apply to circuit pattern
The exposure device being transferred on glass substrate or silicon wafer etc..
In addition, the object as exposure object is not limited to glass plate, such as can also be chip, ceramic substrate, film
Other objects such as component or blank light shield.In addition, in the case where exposure object object is the substrate of flat-panel monitor, the substrate
Thickness be not particularly limited, for example, it also includes the substrate of film-form (component of flexible sheet).In addition, this implementation
The exposure device of mode is special in the case where the length of a line or diagonal length are exposure object objects for the substrate of 500mm or more
Not not effectively.In addition, in the case where the substrate of exposure object is flexible sheet, which can also be formed as roller
Shape.
The electronic devices such as liquid crystal display element (or semiconductor element) are manufactured via following steps：The function of progress device,
The step of performance design；The step of making light shield (or graticule) based on the design procedure；Make glass substrate (or chip)
The step of；The pattern of light shield (graticule) is transferred to glass by the exposure device and its exposure method of the respective embodiments described above
Lithography step on glass substrate；By the development step of the glass substrate development after exposure；To have in addition to remaining by etching against corrosion
The etching step that the exposing unit of part other than the part of agent removes；By the resist no longer needed after etching removal
Resist removes step；Device assembling steps；And checking step etc..In this case, above-mentioned reality is used in lithography step
The exposure device for applying mode executes exposure method above-mentioned, and forms device pattern on the glass substrate, therefore, it is possible to productivity
The device of high integration is manufactured well.
Industrial utilizability
As described above, object holding apparatus of the invention and method are suitable for keeping object.In addition, of the invention
Exposure device and method be suitable on exposure object object formed as defined in pattern.In addition, the system of the flat-panel monitor of the present invention
The method of making is suitable for the production of flat-panel monitor.In addition, the device making method of the present invention is suitable for the production of microdevice.
Reference sign
10 ... liquid crystal exposure apparatus, 14 ... mask stage devices, 30 ... microscope carrier main bodys, 40 ... supporting arrangements, 42 ... base portions,
44 ... leaf springs, 46 ... absorption layers, 50 ... rest pads, M ... light shields.
Claims (42)
1. a kind of object holding apparatus keeps object, the object holding apparatus to be characterized in that having：
Supporting part supports the object from below；
Maintaining part has and is carried out to the face for the object for being supported by the supporting part and being bent by the dead weight of the object
The retaining surface of holding is kept the retaining surface movable in a manner of along the face of the object of flexure and is protected using the retaining surface
Hold the object；With
The object of flexure is adsorbed in the retaining surface by adsorption section.
2. object holding apparatus according to claim 1, which is characterized in that the supporting part configuration is protected with the object
Hold the different location in the second direction that the first direction that device can move intersects.
3. object holding apparatus according to claim 2, which is characterized in that the maintaining part is arranged to inhibit by described
The object that maintaining part is kept is moved to the second direction.
4. object holding apparatus according to claim 2 or 3, which is characterized in that the maintaining part is in the second direction
The second part of Shang pair object different from the first part of the object supported by the supporting part is kept.
5. object holding apparatus according to claim 4, which is characterized in that the supporting part is compared with the second part
The first part described in the center side bearing by the object in this second direction.
6. object holding apparatus according to claim 4 or 5, which is characterized in that the supporting part has configuration described
The a pair of support member of different location in second direction,
The maintaining part has a pair of of holding member of the different location of configuration in this second direction,
The interval of the pair of bearing part in this second direction is than the pair of holding in this second direction
The interval of component is short.
7. according to object holding apparatus according to any one of claims 1 to 6, which is characterized in that the maintaining part is fixed on
The object holding apparatus,
It is controlled to the object of flexure in a manner of the variation of the deflection of the object of the adsorption section to inhibit flexure
Attraction.
8. object holding apparatus according to any one of claims 1 to 7, which is characterized in that the supporting part with it is described
Object point contact supports the object.
9. object holding apparatus according to any one of claims 1 to 7, which is characterized in that the supporting part makes described
Supporting part contacts to support the object with the object line.
10. according to object holding apparatus according to any one of claims 1 to 9, which is characterized in that the maintaining part have make
The press section of region pressing of the holding towards the object opposite with the retaining surface.
11. according to object holding apparatus according to any one of claims 1 to 10, which is characterized in that the retaining surface is with edge
The mode for the lower surface of the object of the supporting part bearing keeps the object.
12. according to object holding apparatus according to any one of claims 1 to 10, which is characterized in that the maintaining part pair with
The face that the lower surface of the object of the supporting part bearing is different is kept.
13. object holding apparatus according to claim 12, which is characterized in that upper table of the maintaining part from the object
Face or side are kept.
14. object holding apparatus according to claim 2, which is characterized in that the maintaining part passes through relative to the object
Body holding meanss press the object to keep the object in said first direction.
15. a kind of exposure device, which is characterized in that have：
Object holding apparatus described in any one of claim 1~14；With
Patterning device, by via the object that is kept by the object holding apparatus and using energy beam to exposure
The exposure actions that object is exposed, and pattern possessed by the object is formed onto the exposure object object.
16. exposure device according to claim 15, which is characterized in that be also equipped with projection optical system, the projection optics
System is arranged between the object and the exposure object object, and the pattern is made to be imaged on the exposure object object,
The projection optical system can adjust image-forming condition according to the deflection of the object.
17. exposure device according to claim 16, which is characterized in that when by the patterning device set on institute
When stating multiple exposure areas of exposure object object and forming the pattern, the projection optical system can be according to the multiple exposure
Each in region adjusts image-forming condition.
18. the exposure device according to any one of claim 15~17, which is characterized in that the exposure object object is to answer
Substrate for flat-panel monitor.
19. exposure device according to claim 18, which is characterized in that the length or right at least one side of the substrate
Angular length degree is 500mm or more.
20. a kind of manufacturing method of flat-panel monitor, which is characterized in that including：Use any one of claim 15~18 institute
The exposure device stated is exposed the exposure object object；Develop with the exposure object object after exposing.
21. a kind of device making method, which is characterized in that including：Use the exposure described in any one of claim 15~18
Device is exposed the exposure object object；With
By the exposure object object development after exposure.
22. a kind of object keeping method keeps object using the object holding apparatus for having supporting part and retaining surface, described
Object keeping method is characterised by comprising：
The object is supported from below using the supporting part；
Described in making to keep the face by the object that the supporting part supports and bends by the dead weight of the object
Retaining surface is with movable along the mode in the face of the object of flexure；With
The object of flexure is set to be adsorbed in the retaining surface.
23. object keeping method according to claim 22, which is characterized in that supporting part configuration with the object
The different location in second direction that the first direction that holding meanss can move intersects.
24. object keeping method according to claim 23, which is characterized in that the maintaining part is arranged to inhibit by institute
The object for stating maintaining part holding is moved to the second direction.
25. the object keeping method according to claim 23 or 24, which is characterized in that in the holding, described
The second part of two directions on pair object different from the first part of the object that the supporting part supports is protected
It holds.
26. object keeping method according to claim 25, which is characterized in that in the bearing, with described second
Split-phase is than the first part described in the center side bearing by the object in this second direction.
27. the object keeping method according to claim 25 or 26, which is characterized in that in the bearing, propped up with a pair
Bearing portion part supports the different location in the second direction,
In the holding, the different location in the second direction is kept with a pair of of holding member,
The interval of the pair of bearing part in this second direction is than the pair of holding in this second direction
The interval of component is short.
28. the object keeping method according to any one of claim 22~27, which is characterized in that the maintaining part is fixed
In the object holding apparatus,
In the absorption, the object to flexure is controlled in a manner of the variation for inhibiting the deflection of the object of flexure
Attraction.
29. the object keeping method according to any one of claim 22~28, which is characterized in that in the bearing,
The object is supported with the object point contact.
30. the object keeping method according to any one of claim 22~28, which is characterized in that in the bearing,
The supporting part is set to be contacted with the object line to support the object.
31. the object keeping method according to any one of claim 22~30, which is characterized in that in the holding,
Make region pressing of the holding towards the object opposite with the retaining surface.
32. the object keeping method according to any one of claim 22~31, which is characterized in that in the holding,
The object is kept in a manner of the lower surface of the object supported along the supporting part.
33. the object keeping method according to any one of claim 22~31, which is characterized in that in the holding,
It pair is kept from the different face in the lower surface of the object of supporting part bearing.
34. object keeping method according to claim 33, which is characterized in that in the holding, from the object
Upper surface or side are kept.
35. object keeping method according to claim 23, which is characterized in that in the holding, relative to the object
Body holding meanss press the object in said first direction.
36. a kind of exposure method, which is characterized in that including：
Object keeping method described in any one of claim 22~35；With
By to exposure object object being exposed via the object kept with the object keeping method and using energy beam
Exposure actions, and pattern possessed by the object is formed on the exposure object object.
37. exposure method according to claim 36, which is characterized in that in the formation, via setting in the object
Projection optical system between body and the exposure object object makes the pattern be imaged on the exposure object object,
The projection optical system adjusts image-forming condition according to the deflection of the object.
38. according to the exposure method described in claim 37, which is characterized in that in the formation, set on the exposure pair
As multiple exposure areas of object form the pattern,
The projection optical system adjusts image-forming condition according to each in the multiple exposure area.
39. the exposure method according to any one of claim 36~38, which is characterized in that the exposure object object is to answer
Substrate for flat-panel monitor.
40. exposure method according to claim 39, which is characterized in that the length or right at least one side of the substrate
Angular length degree is 500mm or more.
41. a kind of manufacturing method of flat-panel monitor, which is characterized in that including：
The exposure object object is exposed using the exposure method described in any one of claim 36~39；With
By the exposure object object development after exposure.
42. a kind of device making method comprising：
The exposure object object is exposed using the exposure method described in any one of claim 36~39；With
By the exposure object object development after exposure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110085216.2A CN112859396B (en) | 2015-09-01 | 2016-08-30 | Mask holding device, exposure device, mask holding method, and exposure method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015172349 | 2015-09-01 | ||
| JP2015-172349 | 2015-09-01 | ||
| PCT/JP2016/075258 WO2017038788A1 (en) | 2015-09-01 | 2016-08-30 | Article-holding device, exposure device, method for manufacturing flat panel display, method for manufacturing device, method for holding article, and exposure method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110085216.2A Division CN112859396B (en) | 2015-09-01 | 2016-08-30 | Mask holding device, exposure device, mask holding method, and exposure method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108351597A true CN108351597A (en) | 2018-07-31 |
| CN108351597B CN108351597B (en) | 2021-02-09 |
Family
ID=58187535
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110085216.2A Active CN112859396B (en) | 2015-09-01 | 2016-08-30 | Mask holding device, exposure device, mask holding method, and exposure method |
| CN201680062678.XA Active CN108351597B (en) | 2015-09-01 | 2016-08-30 | Mask holding device, exposure device, method for manufacturing flat panel display, device manufacturing method, mask holding method, and exposure method |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110085216.2A Active CN112859396B (en) | 2015-09-01 | 2016-08-30 | Mask holding device, exposure device, mask holding method, and exposure method |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JP6778402B2 (en) |
| CN (2) | CN112859396B (en) |
| HK (1) | HK1256711A1 (en) |
| TW (2) | TWI713576B (en) |
| WO (1) | WO2017038788A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI793403B (en) * | 2019-03-25 | 2023-02-21 | 日商佳能股份有限公司 | Optical device, exposure device, and article manufacturing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110549588B (en) * | 2019-10-09 | 2024-05-28 | 伟时电子股份有限公司 | Flatness correction device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786139A (en) * | 1993-09-14 | 1995-03-31 | Nikon Corp | Aligner |
| JPH07192984A (en) * | 1993-12-27 | 1995-07-28 | Toshiba Mach Co Ltd | Thin-sheet fixing device |
| US20020154730A1 (en) * | 2001-04-24 | 2002-10-24 | Nikon Corporation | Methods and devices for holding a mirror for use in X-ray optical systems |
| JP2008170775A (en) * | 2007-01-12 | 2008-07-24 | San Ei Giken Inc | Exposure device |
| JP2009267016A (en) * | 2008-04-24 | 2009-11-12 | Panasonic Corp | Exposure device and pattern forming method using the exposure device |
| CN103201201A (en) * | 2011-02-28 | 2013-07-10 | 信越工程株式会社 | Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system |
Family Cites Families (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326566A (en) * | 1994-05-31 | 1995-12-12 | Nikon Corp | Mask support pedestal |
| JPH09129548A (en) * | 1995-11-02 | 1997-05-16 | Hitachi Electron Eng Co Ltd | Substrate exposure system |
| JP3524295B2 (en) * | 1996-09-24 | 2004-05-10 | キヤノン株式会社 | Scanning exposure apparatus and device manufacturing method |
| JPH10142804A (en) * | 1996-11-11 | 1998-05-29 | Dainippon Printing Co Ltd | Aligner and exposing method for large-sized substrate |
| US6549271B2 (en) * | 1997-01-28 | 2003-04-15 | Nikon Corporation | Exposure apparatus and method |
| JPH11135412A (en) * | 1997-10-28 | 1999-05-21 | Nikon Corp | Projection aligner and method for holding reticule |
| JP2001023886A (en) * | 1999-07-08 | 2001-01-26 | Nikon Corp | Sample holding device and aligner |
| JP2001332480A (en) * | 2000-05-24 | 2001-11-30 | Canon Inc | Original chuck, aligner with original chuck, and semiconductor device-manufacturing method |
| JP2004247718A (en) * | 2003-01-23 | 2004-09-02 | Yamaha Corp | Photomask holder and method for fixing photomask |
| JP5245261B2 (en) * | 2007-03-02 | 2013-07-24 | 株式会社ニコン | Scanning exposure apparatus, exposure method, and device manufacturing method |
| CN101681092B (en) * | 2007-05-09 | 2012-07-25 | 株式会社尼康 | Photomask substrate, photomask substrate forming member, photomask substrate manufacturing method, photomask, and exposure method using photomask |
| JP2010008888A (en) * | 2008-06-30 | 2010-01-14 | Dainippon Screen Mfg Co Ltd | Pattern drawing device |
| KR101488832B1 (en) * | 2008-12-01 | 2015-02-06 | 삼성전자주식회사 | Information storage device using magnetic domain wall movement and method of operating the same |
| JP2010245222A (en) * | 2009-04-03 | 2010-10-28 | Canon Inc | Exposure apparatus and method of manufacturing device using the same |
| JP5451175B2 (en) * | 2009-05-15 | 2014-03-26 | サンエー技研株式会社 | Exposure equipment |
| JP2011085671A (en) * | 2009-10-14 | 2011-04-28 | Nikon Corp | Object holding device, exposure apparatus, and method for manufacturing device |
| WO2011158760A1 (en) * | 2010-06-17 | 2011-12-22 | Ｎｓｋテクノロジー株式会社 | Exposure apparatus |
| JP2012043992A (en) * | 2010-08-19 | 2012-03-01 | Nikon Corp | Cleaning apparatus, cleaning method, exposure apparatus, exposure method, and method for manufacturing device |
| JP2013205764A (en) * | 2012-03-29 | 2013-10-07 | Hitachi High-Technologies Corp | Exposure device |
| JP2014004819A (en) * | 2012-05-28 | 2014-01-16 | Hitachi High-Technologies Corp | Pattern forming method and forming apparatus thereof |
| CN104380201B (en) * | 2012-05-31 | 2016-11-23 | 卡尔蔡司Smt有限责任公司 | There is the optical imaging apparatus of multiple tolerance support unit |
| KR20140007555A (en) * | 2012-07-09 | 2014-01-20 | (주)Sy이노베이션 | Reticle case |
| JP2014026085A (en) * | 2012-07-26 | 2014-02-06 | Fujifilm Corp | Mask unit and exposure equipment |
| CN103631086A (en) * | 2012-08-21 | 2014-03-12 | 华中科技大学 | Manufacturing method for micro-nano graphs used for integrated optoelectronic device |
| KR102112751B1 (en) * | 2013-02-01 | 2020-05-19 | 삼성디스플레이 주식회사 | Method for manufacturing mask using laser beam and apparatus for manufactuing mask |
| CN104849955A (en) * | 2014-02-13 | 2015-08-19 | 中芯国际集成电路制造(上海)有限公司 | Masking plate supporting device and method for cleaning masking plate |
-
2016
- 2016-08-30 CN CN202110085216.2A patent/CN112859396B/en active Active
- 2016-08-30 CN CN201680062678.XA patent/CN108351597B/en active Active
- 2016-08-30 JP JP2017538030A patent/JP6778402B2/en active Active
- 2016-08-30 WO PCT/JP2016/075258 patent/WO2017038788A1/en active Application Filing
- 2016-09-01 TW TW105128231A patent/TWI713576B/en active
- 2016-09-01 TW TW109140499A patent/TWI779402B/en active
-
2018
- 2018-12-07 HK HK18115708.1A patent/HK1256711A1/en unknown
-
2020
- 2020-10-08 JP JP2020170451A patent/JP6981513B2/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0786139A (en) * | 1993-09-14 | 1995-03-31 | Nikon Corp | Aligner |
| JPH07192984A (en) * | 1993-12-27 | 1995-07-28 | Toshiba Mach Co Ltd | Thin-sheet fixing device |
| US20020154730A1 (en) * | 2001-04-24 | 2002-10-24 | Nikon Corporation | Methods and devices for holding a mirror for use in X-ray optical systems |
| JP2008170775A (en) * | 2007-01-12 | 2008-07-24 | San Ei Giken Inc | Exposure device |
| JP2009267016A (en) * | 2008-04-24 | 2009-11-12 | Panasonic Corp | Exposure device and pattern forming method using the exposure device |
| CN103201201A (en) * | 2011-02-28 | 2013-07-10 | 信越工程株式会社 | Thin plate-shaped workpiece adhesion and retention method, thin plate-shaped workpiece adhesion and retention device, and manufacturing system |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI793403B (en) * | 2019-03-25 | 2023-02-21 | 日商佳能股份有限公司 | Optical device, exposure device, and article manufacturing method |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1256711A1 (en) | 2019-10-04 |
| CN112859396B (en) | 2024-01-05 |
| CN112859396A (en) | 2021-05-28 |
| WO2017038788A1 (en) | 2017-03-09 |
| JP2021006931A (en) | 2021-01-21 |
| JP6778402B2 (en) | 2020-11-04 |
| TWI713576B (en) | 2020-12-21 |
| TW201712442A (en) | 2017-04-01 |
| TW202111447A (en) | 2021-03-16 |
| JP6981513B2 (en) | 2021-12-15 |
| CN108351597B (en) | 2021-02-09 |
| KR20180048815A (en) | 2018-05-10 |
| JPWO2017038788A1 (en) | 2018-06-14 |
| TWI779402B (en) | 2022-10-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6904384B2 (en) | Mobile device and object movement method, exposure device and exposure method, and flat panel display manufacturing method and device manufacturing method. | |
| JP6881537B2 (en) | Mobile device and exposure device, and device manufacturing method | |
| TWI703666B (en) | Carrier system and carrying method | |
| TWI701514B (en) | Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and movable body drive method | |
| TWI731628B (en) | Movable body apparatus, exposure apparatus,moving method, exposure method, flat-panel display manufacturing method, and device manufacturing method | |
| TWI719975B (en) | Exposure apparatus, manufacturing method of flat panel display, device manufacturing method, and exposure method | |
| TWI650612B (en) | Substrate processing apparatus and substrate processing method, component manufacturing method, and method of manufacturing flat panel display | |
| TWI728425B (en) | Movable body apparatus, exposure apparatus, manufacturing method of flat panel display, and device manufacturing method | |
| TWI772329B (en) | Movable body apparatus, moving method, exposure apparatus, exposure method, manufacturing method of flat panel display, and device manufacturing method | |
| JP6981513B2 (en) | Mask holding device, exposure device, mask holding method, and exposure method | |
| TWI719062B (en) | Exposure apparatus, manufacturing method of flat panel display and device manufacturing method, and exposure method | |
| KR102206141B1 (en) | Exposure method, method for manufacturing flat-panel display, and method for manufacturing device | |
| TW201723680A (en) | Movable body apparatus, exposure apparatus, flat-panel display manufacturing method, and device manufacturing method | |
| KR102679765B1 (en) | Object holding device, exposure device, flat panel display manufacturing method, device manufacturing method, object holding method, and exposure method | |
| TW514983B (en) | Stage device and exposure device | |
| KR20240100486A (en) | Article-holding device, exposure device, method for manufacturing flat panel display, method for manufacturing device, method for holding article, and exposure method | |
| TWI719061B (en) | Exposure apparatus, manufacturing method of flat panel display and device menufacturing method, and exposure method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| REG | Reference to a national code |
Ref country code: HK Ref legal event code: DE Ref document number: 1256711 Country of ref document: HK |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |