JP6778402B2 - Mask holding device, exposure device, flat panel display manufacturing method, device manufacturing method, mask holding method, and exposure method - Google Patents

Description

The present invention, the mask holding device, an exposure device, a method of manufacturing a flat panel display device manufacturing method, a mask holding method, and an exposure method and, more particularly, the mask holding device and method for holding the mask, the mask holding device The present invention relates to an exposure apparatus including the above, an exposure method including the mask holding method, a flat panel display using the exposure apparatus or method, or a method for manufacturing a device.

Conventionally, in a lithography process for manufacturing electronic devices (microdevices) such as liquid crystal display elements and semiconductor elements (integrated circuits, etc.), masks or reticle (hereinafter collectively referred to as "masks") and glass plates or wafers (hereinafter referred to as "masks") are used. , "Substrate") are synchronously moved along a predetermined scanning direction, and a step-and-scan exposure apparatus (so-called) that transfers a pattern formed on a mask onto a substrate using an energy beam. Scanning steppers (also called scanners)) are used.

This type of exposure apparatus has a mask stage apparatus that holds the mask and moves the mask in the scanning direction at a predetermined speed and accuracy (see, for example, Patent Document 1).

Here, since a general mask stage device has a structure that holds (or supports) the vicinity of the end of the mask M (the region where the mask pattern is not formed) so as not to interfere with the optical path of the energy beam. , The mask is bent due to its own weight. Although it is possible to ensure the exposure accuracy by optically compensating for such bending of the mask, there is a problem that it becomes difficult to optically compensate if the bending shape of the mask is not stable. ..

Japanese Unexamined Patent Publication No. 2011-85671

The present invention has been made under the above-mentioned circumstances, and according to the first aspect, it is a mask holding device for holding the mask , which is used in an exposure device for transferring a pattern formed on a mask onto a substrate. A suction surface that sucks and holds a plurality of supported portions on the mask that are separated from each other in a predetermined direction from below, and a plurality of supported regions other than the supported regions on the mask. anda plurality of holding portions which have a, the plurality of the support portions, bending in the direction of gravity region between the plurality of the supported region by the weight of the mask of the mask, a predetermined deflection shape The supported region of the mask is supported, and the holding portion is displaced by the suction surface that can be displaced so as to imitate the held region of the mask having a predetermined bending shape by the support of the supporting portion. The held region is attracted and held, and the supporting portion contacts the supported region at a position different from the position where the holding portion contacts the held region in the direction of gravity, and the supported region comes into contact with the supported region. the support, the mask holding device is provided.
According to the second aspect, the mask holding device for holding the mask, which is used in the exposure device for transferring the pattern formed on the mask onto the substrate, is a plurality of masks separated in a predetermined direction on the mask. It has a plurality of support portions for supporting the support region from below, and a plurality of holding portions having a suction surface for sucking and holding the plurality of held regions other than the supported region on the mask. The support portion supports the supported region of the mask in which the region between the plurality of supported regions of the mask bends in the direction of gravity due to the weight of the mask itself and has a predetermined bending shape, and the holding portion In order to hold the predetermined bending shape of the mask that has been bent by the support of the support portion, the mask is held in contact with the held region on the side surface of the mask, and the support portion is held in contact with the holding region in the direction of gravity. Provided is a mask holding device that contacts the supported region at a position different from the position where the holding portion contacts the held region and supports the supported region.

According to a third aspect, the mask holding device according to the first or second aspect, the exposure operation for exposing the substrate with an energy beam through the mask held by the mask holding device, the mask an exposure apparatus and a pattern forming apparatus that forms on the substrate a pattern with the is provided.

According to a fourth aspect, the method comprising: exposing the substrate using an exposure apparatus according to a third aspect, the exposure process for the preparation of a flat panel display comprising, and developing the substrate, is provided To.

According to a fifth aspect, the method comprising exposing a substrate by using the exposure apparatus according to a third aspect, the exposed device manufacturing method comprising, and developing the substrate is provided.

According to the sixth aspect, it is a mask holding method for holding the mask, which is used in an exposure apparatus for transferring a pattern formed on the mask onto a substrate, and a plurality of masks separated in a predetermined direction on the mask. adsorption and be supported lifting using a plurality of supporting portions to support region, supported by said support portion, said object holding area on the mask thus deflected the weight of the mask with respect to the gravity direction intersecting the predetermined direction By holding the held region by using a holding portion having a suction surface for holding the mask, the region between the plurality of supported regions of the mask is the mask. By supporting and holding the supported region of the mask that has become a predetermined bending shape by bending in the direction of gravity due to its own weight, the mask that has become the predetermined bending shape due to the support of the supporting portion is held. By holding and supporting the held region by the suction surface that can be displaced so as to imitate the region, the holding portion is held at a position different from the position where the holding portion contacts the held region in the direction of gravity. in contact with the supported area, for supporting the supported region, the mask holding method is provided.
According to a seventh aspect, it is a mask holding method for holding the mask, which is used in an exposure apparatus for transferring a pattern formed on the mask onto a substrate, and is a plurality of masks separated in a predetermined direction on the mask. The support region is supported by a plurality of support portions, and the held region on the mask that is supported by the support portion and is bent by the weight of the mask with respect to the direction of gravity intersecting the predetermined direction is attracted. By holding the held region by using a holding portion having a suction surface to be held and supporting the mask, a region between a plurality of the supported regions of the mask is the weight of the mask. By supporting and holding the supported region of the mask that has become a predetermined bending shape by bending in the direction of gravity, the predetermined bending shape of the mask that has been bent by the support of the supporting portion is maintained. In addition, by contacting and holding the mask in contact with the held region on the side surface of the mask and supporting the mask, the mask is held at a position different from the position where the holding portion contacts the held region in the direction of gravity. A mask holding method is provided that contacts the support area and supports the supported area.

According to the eighth aspect, the mask holding method according to the sixth or seventh aspect and the exposure operation for exposing the substrate with an energy beam through the mask held by the mask holding method are used. the exposure method comprising forming a pattern mask having the substrate, the is provided.

According to a ninth aspect, the method comprising exposing a substrate by using the exposure method according to the eighth aspect, the exposed method of manufacturing a flat panel display comprising, and developing the substrate, is provided To.

According to a tenth aspect, the method comprising exposing a substrate by using the exposure method according to the eighth aspect, the exposed device manufacturing method comprising, and developing the substrate is provided.

It is a figure which shows schematic the structure of the liquid crystal exposure apparatus which concerns on 1st Embodiment. It is a top view of the mask stage apparatus which the liquid crystal exposure apparatus of FIG. 1 has. 3A is an enlarged view of part 3A of FIG. 2, and FIG. 3B is a sectional view taken along line 3B-3B of FIG. 3A. 4 (a) to 4 (c) are diagrams (Nos. 1 to 3) for explaining the loading operation of the mask on the mask stage device. 5 (a) is a diagram showing a mask support device according to a comparative example, FIG. 5 (b) is a diagram showing a mask support device according to the first embodiment, and FIG. 5 (c) is a comparative example. It is a graph which shows the relationship between the suction pressure of the mask and the displacement amount in 1st Embodiment. 6 (a) and 6 (b) are views (cross-sectional view and plan view, respectively) showing a first modification of the mask stage device according to the first embodiment. It is a figure which shows the 2nd modification of the mask stage apparatus which concerns on 1st Embodiment. It is a figure which shows the 3rd modification of the mask stage apparatus which concerns on 1st Embodiment. It is a figure which shows the 4th modification of the mask stage apparatus which concerns on 1st Embodiment. It is a figure which shows the 5th modification of the mask stage apparatus which concerns on 1st Embodiment. 11 (a) and 11 (b) are diagrams (No. 1 and No. 2) for explaining the configuration and operation of the mask stage device according to the second embodiment. It is a figure which shows the modification of the mask stage apparatus which concerns on 2nd Embodiment. It is a top view of the mask stage apparatus which concerns on 3rd Embodiment.

<< First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 5 (c).

FIG. 1 schematically shows the configuration of the liquid crystal exposure apparatus 10 according to the first embodiment. The liquid crystal exposure apparatus 10 is a step-and-scan system in which a rectangular (square) glass substrate P (hereinafter, simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is used as an exposure object. It is a projection exposure device, a so-called scanner.

The liquid crystal exposure device 10 resists (sensitizes) the illumination system 12, the mask stage device 14 that holds the mask M on which patterns such as circuit patterns are formed, the projection optical system 16, and the surface (the surface facing the + Z side in FIG. 1). It has a substrate stage device 20 for holding the substrate P coated with the agent), a control system for these, and the like. Hereinafter, the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 during exposure is defined as the X-axis direction, and the directions orthogonal to the X-axis in the horizontal plane are defined as the Y-axis direction, the X-axis, and the Y-axis. The direction perpendicular to each other will be described as the Z-axis direction. Further, the rotation directions around the X-axis, the Y-axis, and the Z-axis will be described as θx, θy, and θz directions, respectively.

The lighting system 12 is configured in the same manner as the lighting system disclosed in, for example, US Pat. No. 5,729,331. That is, the illumination system 12 emits light emitted from a light source (for example, a mercury lamp) (not shown) through a reflector, a dichroic mirror, a shutter, a wavelength selection filter, various lenses, and the like (not shown) for exposure illumination (for example). Illumination light) Irradiate the mask M as IL. As the illumination light IL, for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm) (or the composite light of the i-line, g-line, and h-line) is used. The optical axis AX of the illumination light IL emitted from the illumination system 12 to the mask M is substantially parallel to the Z axis.

The mask stage device 14 has a stage body 30 that holds a light-transmitting mask M. The stage body 30 is made of a plate-shaped member arranged substantially parallel to the XY plane, and an opening 32 into which the mask M is inserted is formed in the central portion. The stage body 30 is driven in the X-axis direction (scan direction) with a predetermined long stroke with respect to the illumination system 12 (illumination light IL) via, for example, a mask stage drive system including a linear motor, and is driven in the Y-axis direction. And it is slightly driven in the θz direction. The position information of the stage body 30 in the horizontal plane is obtained by, for example, a mask stage position measurement system (not shown) including a laser interferometer system (or an encoder system). The holding structure of the mask M by the stage body 30 will be described later.

The projection optical system 16 is arranged below the mask stage device 14. The projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms, for example, an erect image. It is provided with a plurality of optical systems (projection system modules 16a) that are telecentric on both sides.

In the liquid crystal exposure apparatus 10, when the mask M located in the predetermined illumination region is illuminated by the illumination light IL from the illumination system 12, the illumination light IL passing through the mask M illuminates the mask M via the projection optical system 16. A projected image (partial pattern image) of the mask M pattern in the region is formed in the exposed region on the substrate P. Then, the mask M moves relative to the illumination region (illumination light IL) in the scanning direction, and the substrate P moves relative to the exposure region (illumination light IL) in the scanning direction, so that 1 on the substrate P Scanning exposure of one shot area is performed, and a pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the shot area. Here, the illumination region on the mask M and the exposure region (irradiation region of the illumination light) on the substrate P are optically coupled to each other by the projection optical system 16.

The substrate stage device 20 is a portion for positioning the substrate P with respect to the projection optical system 16 (illumination light IL) with high accuracy. The substrate stage device 20 has a holding member (also referred to as a substrate holder or the like) for holding the substrate P and a predetermined length of the holding member (that is, the substrate P) along a horizontal plane (X-axis direction and Y-axis direction). It has a drive system that is driven by a stroke and is slightly driven in the direction of 6 degrees of freedom. The position information of the holding member (that is, the substrate P) in the six degrees of freedom direction is obtained by, for example, a substrate stage position measurement system (not shown) including a laser interferometer system (or an encoder system).

Next, the support and holding structure of the mask M by the stage body 30 included in the mask stage device 14 will be described.

As shown in FIG. 2, the mask stage device 14 has a plurality of (for example, six in this embodiment) support devices 40. For example, each of the six support devices 40 has a support block 50 that supports the mask M from below. Further, for example, each of the six support devices 40 has a suction pad 46 that sucks and holds the mask M. That is, the masks M are different from each other, for example, six parts are supported by the support block 50, and different parts, for example, six parts are sucked and held by the suction pad 46.

For example, of the six support devices 40, three of the wall surfaces forming (defining) the opening 32 are arranged so as to project from the wall surface on the + Y side into the opening 32, and the remaining three are arranged on the −Y side. It is arranged so as to protrude from the wall surface into the opening 32. The three support devices 40 on the + Y side and the three support devices 40 on the −Y side are arranged at predetermined intervals in the X-axis direction, respectively.

Here, on the lower surface (pattern surface) of the mask M, a region in which a pattern is not formed (hereinafter, referred to as a “margin region”) is formed in the vicinity of each end of each of the four sides. Further, a pellicle (not shown) for pattern protection is attached to a region on the lower surface of the mask M where a pattern is formed (a region inside the mask M rather than a margin region). For example, of the six support devices 40, three on the + Y side support and hold the margin region (region that does not interfere with the pellicle) formed near the end on the + Y side of the mask M from below, and hold the mask M by suction. The three sides support and hold the margin region formed near the end on the −Y side of the mask M from below.

Next, the configuration of the support device 40 will be described. For example, since the configurations of the six support devices 40 are substantially the same, one of them will be described. As shown in FIGS. 3A and 3B, the support device 40 includes a base portion 42, a leaf spring 44, a suction pad 46, a support block 50, and the like.

The base portion 42 is made of a flat plate-shaped member having a rectangular shape in a plan view, and one end (the end portion on the −Y side in FIGS. 3A and 3B) is fixed to the lower surface of the stage body 30. The other end of the base portion 42 (the end portion on the + Y side in FIGS. 3A and 3B) protrudes from the stage body 30 into the opening 32. The base portion 42 has a stepped portion formed in the middle portion in the Y-axis direction, and the region on the other end portion side is somewhat larger than the region on the one end portion side (to the extent that the rigidity of the base portion 42 itself is not affected). ) It is thinly formed.

A support block 50 is fixed to the upper surface near the other end of the base portion 42. The support block 50 is composed of a member having a rectangular YZ cross section extending in the X-axis direction. In the present embodiment, the support block 50 is formed of a metal material such as stainless steel, but is not limited to this, and may be formed of, for example, a ceramic having a small change in accuracy. Further, since the support block 50 comes into direct contact with the lower surface of the mask M, it may be formed of the same glass as the mask M. Further, in the present embodiment, the support block 50 and the base portion 42 are separate members, but these may be integrally formed.

The leaf spring 44 is formed of a plate material (for example, a steel plate) having a spring property (elasticity). The leaf spring 44 is arranged substantially parallel to the XY plane and has elasticity in the Z axis and the θx direction, while having a predetermined rigidity in the direction parallel to the XY plane (particularly in the X axis direction). ing. One end of the leaf spring 44 is fixed to a region on the upper surface of the base portion 42 on the one end side (thick side) of the step portion by a bolt 48 via a shim 48a. The other end of the leaf spring 44 (hereinafter referred to as "tip portion") protrudes from the step portion on the upper surface of the base portion 42 to the region on the tip side (thinner side), and the upper surface of the base portion 42 and the leaf spring. A predetermined gap is formed between the 44 and the lower surface of the 44. The support device 40 of the present embodiment has, for example, two leaf springs 44 separated in the X-axis direction, but the number of leaf springs 44 is not particularly limited.

The suction pad 46 is made of a flat plate-shaped member extending in the X-axis direction (see FIG. 3A), and is fixed on the region on the tip end side of the leaf spring 44, that is, on the upper surface on the free end side. The support block 50 described above is arranged on the central portion side of the mask M (+ Y side in FIG. 3B) with respect to the suction pad 46. A groove 46a extending in the X-axis direction is formed on the upper surface (suction surface) of the suction pad 46, and a suction port 46b is formed in the central portion of the bottom surface of the groove 46a. The suction port 46b communicates with an opening 46c for external connection (not shown in FIG. 3A, see FIG. 3B) that opens on the side surface of the suction pad 46. Vacuum suction force is supplied to the groove 46a of the suction pad 46 from the outside through the opening 46c and the suction port 46b. Further, the height position of the upper surface (suction surface) of the suction pad 46 is set to be higher than the upper end surface (+ Z side) of the support block 50. In addition, in FIG. 3B, the mask M is shown in a state of being bent (tilted) more than it actually is for the sake of easy understanding.

Next, the operation of the support device 40 when the mask M is loaded onto the mask stage device 14 will be described with reference to FIGS. 4 (a) to 4 (c).

As shown in FIG. 4A, when the mask M is driven downward by a mask loader (not shown) (see the arrow in FIG. 4A), the lower surface of the mask M first contacts the suction pad 46. .. At this time, the suction pad 46 does not perform vacuum suction. Therefore, the suction pad 46 does not restrain the mask M, and the tip of the leaf spring 44 bends downward due to the weight of the mask M. Since the suction pad 46 is fixed to the free end side of the leaf spring 44, the leaf spring 44 is slightly deformed so that the tip portion hangs down even when the mask M is not supported, but the present invention is not limited to this.

Then, as shown in FIG. 4B, the lower surface of the mask M comes into contact with the support block 50. As a result, the support position of the mask M by the mask stage device 14 (the position indicated by the circle S in FIG. 4B) is mechanically determined in the Z-axis direction. Here, since the support block 50 extends in the X-axis direction, the support block 50 and the mask M are in line contact with each other. Since the mask M is supported by a plurality of support blocks 50 from below near the ends on the + Y side and the -Y side (see FIG. 2), the central portion in the Y-axis direction is-due to its own weight. Deflection occurs so as to project convexly in the Z direction.

Further, after the mask M is supported by the support block 50, the suction pad 46 sucks and holds the mask M as shown in FIG. 4C. At this time, in the support device 40, since the support block 50 supports the mask M in advance (constrained in the −Z direction), the mask M does not move in the −Z direction depending on the suction force from the suction pad 46. .. At this time, the suction surface of the suction pad 46 is displaced (similarly) along the lower surface of the mask M by the action of the leaf spring 44, and the suction force acts perpendicularly to the lower surface of the mask M (FIG. 4 (FIG. 4). c) Refer to the arrow). Further, since it is sufficient that the mask M can be restrained in the XY plane, the suction force by the suction pad 46 may be relatively small, and the moment around the support position S acting on the mask M is negligibly small. That is, the suction pad 46 restrains (fixes) the mask M with respect to the stage body 30 so as not to affect the bending caused by the weight of the mask M.

Here, as described above, the mask M is bent due to its own weight, but the amount of bending differs depending on the position in the Y-axis direction, and the amount of bending in the central portion of the mask M in the Y-axis direction is , It is larger than the vicinity of both ends in the Y-axis direction. Therefore, there is a difference (variation) in the distance (distance from the pattern surface of the mask M to the image plane) between the pattern surface of the mask M and the upper surface (exposed surface) of the substrate P (see FIG. 1).

On the other hand, in the liquid crystal exposure apparatus 10 of the present embodiment, the projection optical system 16 (see FIG. 1 for each) is used to compensate for the above variation. That is, as shown in FIG. 1, the projection optical system 16 is a so-called multi-lens optical system, and includes a plurality of projection system modules 16a (for example, five in FIG. 1) arranged in a staggered pattern. Each of the projection system modules 16a of the above independently includes a focus position adjusting mechanism, an image shifting mechanism, a magnification adjusting mechanism, and the like. Therefore, as described above, even if the mask M is bent due to its own weight (even if the distance between the mask M and the substrate P varies), each projection system module 16a depends on the amount of the bending. The desired exposure accuracy can be ensured by independently controlling and adjusting the imaging conditions. The number of projection system modules 16a and the like is an example, and can be changed as appropriate.

Next, the operation and effect of the mask stage device 14 according to the present embodiment will be described in comparison with a comparative example. FIG. 5A shows the support device 90 of the mask stage device according to the comparative example. The arrangement of the support device 90 with respect to the stage main body 30 (see FIG. 2) is the same as that of the support device 40 of the present embodiment.

In the support device 40 of the present embodiment shown in FIG. 5 (b), the suction pad 46 is cantilevered by the leaf spring 44, whereas in the support device 90 of the comparative example shown in FIG. 5 (a). The suction pad 94 is directly fixed to the upper surface of the base portion 92. That is, in the suction pad 46 (see FIG. 5B) according to the present embodiment, the suction surface can be displaced (moved in the Z-axis and the θx direction) according to the lower surface of the mask M, whereas it is compared. The suction pad 94 (see FIG. 5A) according to the example is fixed so that the position of the suction surface is substantially parallel to the XY plane. Therefore, in the support device 90, the suction pad 94 that sucks and holds the mask M also has a function as a support member that supports the mask M at the support position S. Further, the support device 90 according to the comparative example straightens the mask M so that the lower surface of the mask M is parallel to the horizontal plane by the suction pressure from the suction pad 94 (reduces the absolute value of the deflection). ) Is intended. On the other hand, the support device 40 of the present embodiment shown in FIG. 5B has a configuration that allows bending due to the weight of the mask M (the bending of the mask M is optically compensated).

Here, as shown in the graph of FIG. 5C, in the support device 90 according to the comparative example, only the free deflection of the mask M (only its own weight acting on the mask M) with respect to the change of the suction pressure (negative pressure). It can be seen that the amount of displacement from (the amount of deflection due to) is large (the amount of deflection changes sensitively to changes in negative pressure). That is, in the support device 90 according to the comparative example, when the suction pressure from the suction pad 94 changes, the amount of deflection (deflection shape) of the mask M is not stable. In this case, since the distance between the mask M and the substrate P (see FIG. 1) is not stable, it becomes difficult to compensate for the deflection of the mask M by using the multi-lens optical system. The change in the suction pressure is easily caused by a decrease in parallelism between the suction surface of the suction pad 94 and the lower surface of the mask M (generation of minute gaps on the order of microns).

On the other hand, in the support device 40 according to the present embodiment shown in FIG. 5B, the support block 50 having a function of supporting the mask M and the suction pad 46 having a function of sucking and holding the mask M are provided. It is separated. The suction pad 46 sucks and holds the mask M previously supported by the support block 50, and the suction surface of the suction pad 46 can be displaced (similarly) along the lower surface of the mask M. As a result, as can be seen from the graph of FIG. 5C, in the support device 40 according to the present embodiment, even if the suction pressure changes, the amount of displacement of the mask M from the free deflection is small. Therefore, even if the suction pressure of the mask M by the suction pad 46 fluctuates, the change in the amount of deflection of the mask M is small, and the distance between the mask M and the substrate P (see FIG. 1) is stable. As a result, as described above, the deflection of the mask M can be easily compensated by using the multi-lens optical system, and the exposure accuracy is improved.

In the support device 90 according to the comparative example, it is conceivable to incline the base portion 92 in advance in consideration of the amount of free bending of the mask M, but the position of the support position S of the mask M by the suction pad 94 is Since it changes depending on the amount of free bending of the mask M, it is difficult to stabilize the amount of bending of the mask M.

According to the mask stage device 14 of the first embodiment described above, even when the mask M is reloaded onto the mask stage device 14 (including the case of reloading between different exposure devices), the mask M is bent. The reproducibility of the amount (deflection shape) is improved. Therefore, the multi-lens type projection optical system 16 can be used to reliably compensate for the deflection of the mask M and improve the exposure accuracy.

The configuration of the mask M support device 40 according to the first embodiment described above is an example, and can be appropriately modified. For example, the support member attached to the tip of the base portion 42 and supporting the lower surface of the mask M is not limited to the member having a rectangular cross section (support block 50) as in the first embodiment above, and for example, FIG. It may be made of a member having a circular cross section, such as the support rod 52 included in the support device 40A of the mask M according to the first modification shown in a) and FIG. 6 (b). Further, the length of the support member (including the support block 50) may be longer than the length of the mask M in the X-axis direction, as in the support rod 52 shown in FIG. 6B, for example, three bases. The support rod 52 may be erected on the portion 42. The support rod 52 may be individually provided for the base portion 42 of each support device 40A, as in the first embodiment. In the support device 40A according to the present modification, the straightness of the contact portion where the mask M and the support rod 52 are in line contact can be easily improved as compared with the support block 50 by processing. The cross section of the support rod 52 is not particularly limited as long as the mask M and the support rod 52 can be brought into line contact with each other, and may be, for example, a semicircular shape.

Further, as in the support device 40B according to the second modification shown in FIG. 7, the compression coil spring 54 is inserted between the lower surface of the leaf spring 44 and the upper surface of the base portion 42, and the compression coil spring 54 is inserted into the suction pad 46 upward in the direction of gravity. (The force that presses the suction pad 46 against the mask M) may be applied. In this case, it is possible to ensure that the suction surface of the suction pad 46 and the lower surface of the mask M are in contact with each other (suppressing the formation of a gap between the suction pad 46 and the mask M). In addition, the vibration of the suction pad 46 can be suppressed. The force applied by the compression coil spring 54 upward in the gravity direction to the suction pad 46 is preferably large (strength) so as not to affect the amount of bending due to the weight of the mask M. Further, instead of the compression coil spring 54, for example, another spring member such as a leaf spring, or an elastic body formed of a rubber-based or synthetic resin-based material is inserted between the leaf spring 44 and the base portion 42. You may.

Further, as in the support device 40C according to the third modification shown in FIG. 8, a bent portion may be formed in the intermediate portion in the longitudinal direction of the leaf spring 44C. In this case as well, the suction pad 46 can be pressed against the mask M in the same manner as in the second modification (see FIG. 7).

Further, as in the support device 40D according to the fourth modification shown in FIG. 9, the suction pad 46 is provided via two types of leaf springs 44D ₁ and leaf springs 44D ₂ having different thicknesses (spring constants). It may be attached to the base portion 42, and the suction pad 46 may be pressed against the mask M in the same manner as in the second modification (see FIG. 7).

Further, as in the support device 40E according to the fifth modification shown in FIG. 10, the suction pad is replaced with the leaf spring 44 (see FIG. 3B, respectively) of the support device 40 of the first embodiment. A tubular leaf spring 56 may be arranged between the 46 and the base portion 42, and the suction pad 46 may be supported only by the tubular leaf spring 56. The tubular leaf spring 56 has elasticity in the θx direction and the θy direction in addition to elasticity in the Z-axis direction, and supports the suction pad 46 so as to swing (swing operation) freely. In this case as well, the suction pad 46 can be pressed against the mask M in the same manner as in the second modification (see FIG. 7).

<< Second Embodiment >>
Next, the mask stage device 114 according to the second embodiment will be described with reference to FIGS. 11 (a) and 11 (b). The configuration of the mask stage device 114 according to the second embodiment is the same as that of the first embodiment except that the configuration of the support device 60 of the mask M is different. Therefore, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

In the first embodiment (see FIG. 3B and the like), the suction pad 46 sucks and holds the lower surface of the mask M, whereas the support device 60 of the mask stage device 114 according to the second embodiment. The difference is that the suction pad 62 sucks and holds the upper surface of the mask M as shown in FIG. 11B. Hereinafter, the configuration and operation of the support device 60 will be described. In the mask stage device 114, a plurality of (for example, six) support devices 60 are attached to the stage main body 130 in the same arrangement as in the first embodiment (see FIG. 2 and the like). One of them is shown in (a) and 11 (b).

A support pad 68 is attached to the tip of the base portion 142 of the support device 60 via a ball 68a by a bolt 68b. The support surface of the support pad 68 faces the + Z direction (upward) so as to face the lower surface of the mask M, and can be inclined with respect to the horizontal plane by the ball 68a (in the θx and θy directions with respect to the base portion 142). Can swing). Therefore, the support pad 68 does not hinder the deformation (natural bending) of the mask M due to its own weight. The support pad 68 sets (defines) the position of the mask M in the Z-axis direction by contacting the margin region (region outside the pellicle PL) of the mask M, but does not hold the mask M by suction.

In the support device 60, the suction pad 62 restrains (holds) the position of the mask M in the XY plane. The suction pad 62 is attached to one end of the leaf spring 64 as in the first embodiment. The other end of the suction pad 62 is connected to the actuator 66, and the suction pad 62 and the leaf spring 64 are integrally rotationally driven by the actuator 66 in the θx direction. The actuator 66 is fixed to the stage body 130 via a mounting member (not shown). The suction pad 62 is housed in a recess (notch) 130A formed on the upper surface of the stage body 130 when the mask M is loaded, and when the mask M is placed on the support pad 68, the actuator 66 For example, it is rotationally driven by about 180 ° (see the arrow in FIG. 11B). As a result, the margin region of the mask M is sandwiched between the support pad 68 and the suction pad 62 described above in the vertical (Z-axis) direction. The point that the suction pad 62 sucks and holds the mask M by the vacuum suction force supplied from the outside is the same as that of the first embodiment, and thus the description thereof will be omitted. In this case as well, it is preferable that the suction pad 62 sucks and holds the mask M at a suction pressure that does not hinder the deformation (natural bending) of the mask M due to its own weight, as in the first embodiment. The mask stage device 114 according to the second embodiment also obtains the same effect as that of the first embodiment, that is, the mask M can be used without affecting the deformation (natural bending) due to the weight of the mask M. Can be retained.

The configuration of the second embodiment described above can be appropriately modified. For example, as in the support device 60A of the mask stage device 114A according to the modified example of the second embodiment shown in FIG. 12, the suction pad 62A attached to the base portion 142A via the actuator 66 sucks the side surface of the mask M. You may hold it. Also in this case, it is preferable that the suction pad 62A sucks and holds the mask M at a suction pressure that does not hinder the deformation (natural bending) of the mask M due to its own weight. In this modification, since the rotation angle of the suction pad 62A is smaller than that of the second embodiment (see FIG. 11B), the mask M can be held more quickly. Further, it is not necessary to form a recess for accommodating the suction pad 62A in the stage body 30.

<< Third Embodiment >>
Next, the mask stage device 214 according to the third embodiment will be described with reference to FIG. The configuration of the mask stage device 214 according to the third embodiment is the same as that of the first embodiment except that the configuration of the mask M holding device 80 is different. Therefore, only the differences will be described below. Elements having the same configuration and function as those of the first embodiment are designated by the same reference numerals as those of the first embodiment, and the description thereof will be omitted.

In the first and second embodiments, the suction pads 46 (see FIG. 3 (b)) and 62 (see FIG. 11 (b)) exert a suction force on the mask M, and the suction pads 46 due to the suction force, The frictional force between the mask M and the mask M constrains the position of the mask M in the XY plane, whereas in the third embodiment, the opening 232 of the stage body 230 included in the mask stage device 214 is opened. The difference is that the holding device 80 constrains the position of the mask M in the XY plane with respect to a part of the wall surface to be formed. Hereinafter, the configuration and operation of the holding device 80 included in the mask stage device 214 will be described.

As shown in FIG. 13, an opening 232 is formed in the central portion of the stage main body 230 of the mask stage device 214, and the mask M is inserted into the opening 232. Therefore, the side surfaces of each of the four sides of the mask M and the wall surface forming the opening 232 face each other with a predetermined gap.

The holding device 80 includes a pressing member 82, an actuator 84, and a pair of reference members 88. The pair of reference members 88 are arranged apart from each other in the Y-axis direction between the side surface of the mask M on the −X side and the wall surface facing the side surface on the −X side (the wall surface facing the + X direction). There is. The pair of reference members 88 are fixed to the stage main body 230 and function as a reference for positioning the mask M with respect to the stage main body 230. The pressing member 82 is arranged between the side surface of the mask M on the + X side and the wall surface facing the side surface on the + X side (the wall surface facing the −X direction). The pressing member 82 is connected to an actuator 84 housed in a recess 230a formed in the stage main body 230, and the actuator 84 can move the pressing member 82 in a predetermined stroke in the X-axis direction.

The holding device 80 presses the mask M in the −X direction by the actuator 84 pressing the central portion of the mask M in the Y-axis direction via the pressing member 82 after the mask M is supported by the plurality of support blocks 50. It is pressed against the pair of reference members 88. That is, in the first and second embodiments (see FIGS. 3 (b) and 11 (b), respectively), the mask M is held by the stage bodies 30 and 130 by frictional force, whereas the third embodiment In the embodiment, the mask M is directly gripped by the stage body 230 by the pressing force. In the third embodiment, the mask M can be reliably held even when the margin area of the mask M is narrow (it is difficult to hold the vacuum suction by the suction pad). Further, since the holding device 80 exerts a pressing force on the mask M in the scanning direction (see the arrow in FIG. 13), the holding device 80 does not hinder the bending due to the own weight of the mask M (the pressing force affects the amount of free bending of the mask M). There is no). Therefore, the projection optical system 16 (see FIG. 1) can be used to optically suppress the influence on the exposure accuracy.

The configuration of each of the first to third embodiments described above (including a modified example thereof; the same applies hereinafter) is an example and can be changed as appropriate. That is, as the mask stage device, the mask M does not affect the bending caused in the state of being supported from below by the support member (for example, the support block 50 of the first embodiment) (FIG. 5 (c). The mask M is not particularly limited as long as the mask M can be held (so that the characteristics as shown in the graph of)) can be reproduced. For example, in each of the above embodiments, the mask M is the support block 50 (rod-shaped member having a rectangular cross section) shown in FIG. 3 (b) or the support rod 52 (rod-shaped member having a circular cross section) shown in FIG. 6 (a). ), The mask M and the support block 50 (or the support rod 52) are in line contact with each other, but the present invention is not limited to this, and the mask stage devices are arranged at predetermined intervals in the X-axis direction, for example. The mask M may be supported at a plurality of points by a plurality of spheres (the mask M and each sphere are in point contact).

Further, for example, in the second embodiment, the mask stage device 114 holds the mask M supported from below by the support pad 68 (natural bending occurs) by the suction pad 62, but the present invention is not limited to this, for example. The suction pad 62 may be omitted, and the support pad 68 may suck and hold the lower surface of the mask M. In this case, the tiltable direction of the support pad 68 is limited to the θx direction (or the mask M is held) so that the mask M does not move with respect to the stage body 130 due to the movement of the stage body 130 to the scanning method during the exposure operation. It is better to limit the tilting operation itself later).

Further, for example, in the third embodiment, the mask stage device 214 holds the mask M by applying a pressing force parallel to the X axis to the mask M, but the mask is held by the pressing force applied to the mask M. As long as it does not affect the bending shape of M, the present invention is not limited to this, and for example, a pressing force may be applied in the Y-axis direction. Further, the mask stage device 214 holds the mask M by applying a pressing force to the mask M, but the present invention is not limited to this, and for example, a tensile force may be applied to the mask M to hold the mask M.

Further, in each of the above embodiments, the mask stage device 14 and the like support the margin regions formed in the vicinity of both ends in the Y-axis direction of the mask M from below by using the support block 50 and the like. When a margin region (non-patterned region) is formed in the vicinity of the central portion in the axial direction, a support member that supports the margin region in the vicinity of the central portion may be further provided. Even in this case, when the mask M in which the vicinity of both ends and the vicinity of the center are supported is held by using the suction pad 46 or the like, the bending shape (deflection amount) substantially changes before and after holding. Don't do it.

Further, in each of the above embodiments, the mask M is held by vacuum suction by the suction pad 46, but the present invention is not limited to this, and the mask M may be held by a mechanical method such as electrostatic suction or a clamp.

Further, in the first and second embodiments, the suction pad 46 and the support block 50 (or the support rod 52) are attached to the common base portion 42, but the suction pad 46 is not limited to this. The base member to which the support block 50 is attached and the base member to which the support block 50 is attached may be separate members. Further, in the first embodiment, the support block 50 is arranged so as to project from the suction pad 46 toward the central portion of the mask M in the Y-axis direction, but the present invention is not limited to this, and the support block 50 and the suction pad 46 are not limited to this. The positions in the Y-axis direction may overlap.

Further, in the liquid crystal exposure apparatus 10, the substrate P, which is an object to be exposed, may be held by a support device for an object according to each of the above embodiments (for example, a plurality of support devices 40 according to the first embodiment).

The wavelengths of the light source used in the illumination system 12 and the illumination light IL emitted from the light source are not particularly limited, and are ultraviolet rays such as ArF excimer laser light (wavelength 193 nm) and KrF excimer laser light (wavelength 248 nm). It may be light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm).

Further, in each of the above embodiments, the same magnification system is used as the projection optical system 16, but the present invention is not limited to this, and a reduction system or an expansion system may be used.

Further, in each of the above embodiments, the case where the liquid crystal exposure apparatus is a scanning stepper type has been described, but the present invention is not limited to this, and the mask stage apparatus 14 or the like of each of the above embodiments is used for a static exposure apparatus such as a stepper. Is also good.

Further, the application of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern to a square glass plate, for example, an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor. It can be widely applied to an exposure apparatus for manufacturing, a thin film magnetic head, a micromachine, an exposure apparatus for manufacturing a DNA chip, and the like. Further, in order to manufacture masks or reticle used not only in microdevices such as semiconductor elements but also in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment and the like, glass substrates or silicon wafers and the like are used. It can also be applied to an exposure apparatus that transfers a circuit pattern.

Further, the object to be exposed is not limited to the glass plate, and may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. When the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and for example, a film-like (flexible sheet-like member) is also included. The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or a diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is in the form of a flexible sheet, the sheet may be formed in a roll shape.

For electronic devices such as liquid crystal display elements (or semiconductor elements), a step of designing the function and performance of the device, a step of manufacturing a mask (or reticle) based on this design step, and a step of manufacturing a glass substrate (or wafer). Except for the etching apparatus of each of the above-described embodiments, the lithography step of transferring the mask (reticle) pattern to the glass substrate by the exposure method, the developing step of developing the exposed glass substrate, and the portion where the resist remains. It is manufactured through an etching step of removing an exposed member of a portion by etching, a resist removing step of removing a resist that is no longer needed after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-mentioned exposure method is executed using the exposure apparatus of the above embodiment, and the device pattern is formed on the glass substrate, so that a device having a high degree of integration can be manufactured with high productivity. ..

As described above, the mask holding device and method of the present invention are suitable for holding a mask . Further, the exposure apparatus and method of the present invention are suitable for forming a predetermined pattern on an exposed object. Further, the method for manufacturing a flat panel display of the present invention is suitable for producing a flat panel display. Moreover, the device manufacturing method of the present invention is suitable for the production of microdevices.

10 ... Liquid crystal exposure device, 14 ... Mask stage device, 30 ... Stage body, 40 ... Support device, 42 ... Base part, 44 ... Leaf spring, 46 ... Suction pad, 50 ... Support block, M ... Mask.

Claims (44)

A mask holding device for holding the mask , which is used in an exposure device for transferring a pattern formed on a mask onto a substrate .
A plurality of support portions for supporting a plurality of supported regions separated in a predetermined direction on the mask from below,
Anda plurality of holding portions which have a suction surface for holding by suction a plurality of the held region other than the supported area on said mask,
The plurality of supporting portions support the supported region of the mask having a predetermined bending shape in which a region between the plurality of supported regions of the mask bends in the direction of gravity due to the weight of the mask itself.
The holding portion sucks and holds the held region by the suction surface that can be displaced so as to imitate the held region of the mask that has a predetermined bending shape due to the support of the support portion .
The support portion is a mask holding device that contacts the supported region at a position different from the position where the holding portion contacts the held region in the direction of gravity to support the supported region . A main body portion provided with the holding portion and the supporting portion is provided.
The mask holding device according to claim 1, wherein the suction surface is provided so as to be inclined with respect to the main body portion so as to follow the predetermined bending shape. The suction surface is inclined so as to follow the predetermined bending shape, and a suction force is applied in a direction substantially perpendicular to the held region to suck and hold the mask, according to claim 1 or 2. Mask holding device. The mask holding device according to any one of claims 1 to 3, wherein the suction surface holds a second surface different from the first surface of the mask supported by the support portion. A mask holding device for holding the mask, which is used in an exposure device for transferring a pattern formed on a mask onto a substrate.
A plurality of support portions for supporting a plurality of supported regions separated in a predetermined direction on the mask from below,
It has a plurality of holding portions having a suction surface for sucking and holding a plurality of held regions other than the supported region on the mask.
The plurality of supporting portions support the supported region of the mask having a predetermined bending shape in which a region between the plurality of supported regions of the mask bends in the direction of gravity due to the weight of the mask itself.
The holding portion is held in contact with the held region on the side surface of the mask in order to hold the predetermined bending shape of the mask that has been bent by the support of the support portion.
The support portion is a mask holding device that contacts the supported region at a position different from the position where the holding portion contacts the held region in the direction of gravity to support the supported region. Said support portion, the mask holding device according to any one of claims 1-5, wherein the mask holding device is spaced apart from each other with respect to the predetermined direction intersecting the movement direction movable. The mask holding device according to any one of claims 1 to 6, wherein the holding portion holds the held region on the mask different from the supported region supported by the support portion in the predetermined direction. .. The mask holding device according to claim 7 , wherein the support portion supports the supported region on the center side of the mask with respect to the predetermined direction from the held region portion. The support portion has a pair of support members arranged at different positions in the predetermined direction.
The holding portion has a pair of holding members arranged at different positions in the predetermined direction.
The distance in a predetermined direction about the pair of support members, the mask holding device according to the above for a given direction according shorter than the distance between the pair of holding portions to claim 7 or 8. The one according to any one of claims 1 to 9 , wherein the holding portion controls the suction force to the held region so as to suppress the fluctuation of the bending amount of the mask bent into the predetermined bending shape . Mask holding device. The mask holding device according to any one of claims 1 to 10 , wherein the support portion is in point contact with the supported region to support the supported region . It said support portion, the mask holding device according to any one of claims 1 to 11, wherein the support portion is in line contact to the supported area for supporting the supported region. The mask holding device according to claim 6, wherein the plurality of support portions are arranged side by side so as to be separated from each other in the moving direction. The holding portion, the mask holding device according to any one of claims 1 to 13, wherein the holding portion has a pressing portion for pressing against said mask the holding portion in contact with the object holding area. The holding portion, the mask holding device according to claim 5, wherein the holding portion has a pressing portion for pressing the holding portion in contact with the object holding area from the direction of movement relative to said mask. The mask holding device according to any one of claims 1 to 15 .
An exposure apparatus and a pattern forming apparatus that forms on the substrate by the exposure operation, a pattern in which the mask has to expose the substrate with an energy beam through the mask held by the mask holding device. A projection optical system provided between the mask and the substrate and for forming the pattern on the substrate is further provided.
It said projection optical system, in response to said predetermined deflection shape of the mask, the exposure apparatus according to claim 16 imaging condition is adjustable. According to claim 17 , when the projection optical system forms the pattern in a plurality of exposure regions provided on the substrate by the pattern forming apparatus, the imaging conditions can be adjusted for each of the plurality of exposure regions. The exposure apparatus according to the description. The exposure apparatus according to any one of claims 16 to 18 , wherein the substrate is an exposure substrate used for a flat panel display. The exposure apparatus according to claim 19 , wherein the exposure substrate has at least one side length or a diagonal length of 500 mm or more. To expose the substrate by using the exposure apparatus according to any one of claims 16 to 19 .
A method for manufacturing a flat panel display, comprising developing the exposed substrate . To expose the substrate by using the exposure apparatus according to any one of claims 16 to 19 .
A device manufacturing method comprising developing the exposed substrate . A mask holding method for holding the mask, which is used in an exposure apparatus that transfers a pattern formed on a mask onto a substrate .
The method comprising supporting lifting using a plurality of supporting portions the plurality of the supported region apart in a predetermined direction on the mask,
Supported by said support portion, the object holding with holding portions having a suction surface for holding by adsorbing the holding area on said mask predetermined direction deflected depending on its own weight of the mask with respect to the gravity direction intersecting with Including holding the area ,
By supporting the mask, the region between the plurality of supported regions of the mask bends in the direction of gravity due to the weight of the mask to support the supported region of the mask having a predetermined bending shape.
In the holding, the held region is held by the suction surface that can be displaced so as to imitate the held region of the mask that has become the predetermined flexible shape by the support of the support portion.
The support method is a mask holding method in which the holding portion contacts the supported region at a position different from the position where the holding portion contacts the held region in the direction of gravity to support the supported region . In the holding, the suction surface is inclined with respect to the main body portion provided with the holding portion and the supporting portion so as to imitate the predetermined bending shape, and the held region is held. Item 23. The mask holding method. In the holding, the suction surface is inclined so as to imitate the held region having a predetermined bending shape of the mask, and a suction force is applied in a direction substantially perpendicular to the held region to make the mask. The mask holding method according to claim 23 or 24, which is attracted and held. The mask holding method according to any one of claims 23 to 25, wherein holding the mask holds a second surface different from the first surface of the mask supported by the support portion. A mask holding method for holding the mask, which is used in an exposure apparatus that transfers a pattern formed on a mask onto a substrate.
Supporting a plurality of supported regions separated in a predetermined direction on the mask by using a plurality of supporting portions,
The held region is supported by the supporting portion and has a suction surface that attracts and holds the held region on the mask that is bent by the weight of the mask with respect to the direction of gravity intersecting the predetermined direction. To hold and have,
By supporting the mask, the region between the plurality of supported regions of the mask bends in the direction of gravity due to the weight of the mask to support the supported region of the mask having a predetermined bending shape.
In the holding, in order to hold a predetermined bending shape of the mask bent by the support of the support portion, the side surface of the mask contacts and holds the held region of the mask.
The support method is a mask holding method in which the holding portion contacts the supported region at a position different from the position where the holding portion contacts the held region in the direction of gravity to support the supported region. Wherein by supporting supports said support region by said supporting portions disposed apart from each other regarding the different positions in the predetermined direction in which the mask intersects the movement direction movable, according to claim 23 to 27 The mask holding method according to any one item . The mask holding method according to any one of claims 23 to 28, wherein holding the mask holds a held area on the mask that is different from the supported area in the predetermined direction. The mask holding method according to claim 29 , wherein the support is supported on the center side of the mask in the predetermined direction with respect to the held area . In the support, a pair of support members support different positions in the predetermined direction.
In the holding, the pair of holding members hold different positions in the predetermined direction.
The mask holding method according to claim 29 or 30 , wherein the distance between the pair of support members in the predetermined direction is shorter than the distance between the pair of holding members in the predetermined direction. The invention according to any one of claims 23 to 31 , wherein by holding the mask , the suction force is controlled so as to suppress the fluctuation of the amount of bending of the mask having the predetermined bending shape to hold the held region . Mask holding method. Wherein by supporting the mask holding method according to any one of claims 23-32, wherein the support portion and the to point contact with the supported area for supporting the supported region. Wherein by supporting a mask holding method according to any one of claims 23 to 33 wherein the support portion is a contact line in the supported area for supporting the supported region. 28. The mask holding method according to claim 28, wherein a plurality of the supporting portions are arranged side by side so as to be separated from each other in the moving direction. Wherein by holding the mask holding method according to any one of claims 23 to 35 wherein the holding portion to press said holder against said mask in contact with the object holding area. The mask holding method according to claim 27 , wherein the holding portion presses the holding portion against the mask from the moving direction so that the holding portion is in contact with the held region . The mask holding method according to any one of claims 23 to 37 ,
The exposure operation for exposing the substrate with an energy beam through the mask held by the mask holding method, the exposure method comprising, forming a pattern in which the mask has the substrate. In the formation, the pattern is formed on the substrate via a projection optical system provided between the mask and the substrate .
It said projection optical system, an exposure method according to claim 38, in response to said predetermined deflection shape of the mask, adjusts the imaging conditions. In the above-mentioned formation, the pattern is formed in a plurality of exposed regions provided on the substrate .
The exposure method according to claim 39 , wherein the projection optical system adjusts imaging conditions for each of the plurality of exposure regions. The exposure method according to any one of claims 38 to 40, wherein the substrate is an exposure substrate used for a flat panel display. The exposure method according to claim 41 , wherein the exposure substrate has at least one side length or a diagonal length of 500 mm or more. To expose the substrate by using the exposure method according to any one of claims 38 to 42 .
A method for manufacturing a flat panel display, comprising developing the exposed substrate . To expose the substrate by using the exposure method according to any one of claims 38 to 43 .
A device manufacturing method comprising developing the exposed substrate .

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