WO2017057471A1 - Exposure device, method for manufacturing flat panel display, method for manufacturing device, and exposure method - Google Patents
Exposure device, method for manufacturing flat panel display, method for manufacturing device, and exposure method Download PDFInfo
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- WO2017057471A1 WO2017057471A1 PCT/JP2016/078642 JP2016078642W WO2017057471A1 WO 2017057471 A1 WO2017057471 A1 WO 2017057471A1 JP 2016078642 W JP2016078642 W JP 2016078642W WO 2017057471 A1 WO2017057471 A1 WO 2017057471A1
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- substrate
- unit
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- exposure apparatus
- exposure
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70681—Metrology strategies
- G03F7/70683—Mark designs
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/70141—Illumination system adjustment, e.g. adjustments during exposure or alignment during assembly of illumination system
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
Definitions
- the present invention relates to an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, and an exposure method, and more specifically, an exposure apparatus and an exposure method for exposing an object while scanning with illumination light through an optical system,
- the present invention relates to a flat panel display using the exposure apparatus or a device manufacturing method.
- a mask or reticle such as liquid crystal display elements and semiconductor elements (such as integrated circuits)
- a glass plate or a wafer hereinafter referred to as “mask”.
- substrate Collectively referred to as a “substrate”)
- step-and-scan type exposure apparatus so-called “so-called” that transfers a pattern formed on a mask onto a substrate using an energy beam while moving in synchronization along a predetermined scanning direction. Scanning steppers (also called scanners)) are used.
- This type of exposure apparatus performs position measurement (so-called alignment measurement) of marks formed on a substrate using an alignment detection system before the start of the exposure operation in order to position the substrate during the exposure operation.
- position measurement so-called alignment measurement
- Patent Document 1 Japanese Patent Document 1
- the object having a plurality of marks is irradiated with the illumination light via the optical system, and the object is relatively driven with respect to the illumination light, thereby the plurality of partitioned regions of the object
- An exposure apparatus that scans and exposes each of the plurality of partitioned regions arranged side by side in at least one of the first and second directions intersecting each other, and A holding unit that holds the object that is supported in a non-contact manner by one support unit; a detection unit that performs a detection operation for detecting the plurality of marks provided in the plurality of partition regions; and the holding unit that holds the object
- An exposure apparatus comprising: a first drive unit that drives the holding unit relative to the first support unit so that a part of the object on which the detection operation has been performed is detached from the first support unit. Is done.
- a flat panel display manufacturing method comprising: exposing the object using the exposure apparatus according to the first aspect; and developing the exposed object. Provided.
- a device manufacturing method including exposing the object using the exposure apparatus according to the first aspect and developing the exposed object.
- the object having the plurality of marks is irradiated with the illumination light via the optical system, and the object is relatively driven with respect to the illumination light, so that the plurality of partitioned regions of the object Each of the plurality of partition regions arranged side by side in at least one of the first and second directions intersecting each other by a first support portion, and Holding the object supported in a non-contact manner by the first support unit by a holding unit; performing a detection operation of detecting the plurality of marks provided in the plurality of partition regions by a detection unit; and the holding unit
- the first drive unit is used to drive the holding unit relative to the first support unit so that a part of the object that is held by the detection operation is removed from the first support unit. And including dew Method, is provided.
- FIG. 2 is a sectional view taken along line AA in FIG. 1. It is a figure which shows the detail of the substrate stage apparatus with which the liquid-crystal exposure apparatus of FIG. 1 is provided. It is a principal part enlarged view of a substrate stage apparatus. It is a conceptual diagram of the board
- FIGS. 8A and 8B are views (a plan view and a front view, respectively) for explaining the operation (part 1) of the substrate stage apparatus during the exposure operation.
- FIGS. 9A and 9B are views (a plan view and a front view, respectively) for explaining the operation (part 2) of the substrate stage apparatus during the exposure operation.
- FIGS. 10A and 10B are views (a plan view and a front view, respectively) for explaining the operation (part 3) of the substrate stage apparatus during the exposure operation.
- FIGS. 8A and 8B are views (a plan view and a front view, respectively) for explaining the operation (part 1) of the substrate stage apparatus during the exposure operation.
- FIGS. 9A and 9B are views (a plan view and a front view, respectively) for explaining the operation (part 2) of the substrate stage apparatus during the exposure operation.
- FIGS. 10A and 10B are views (a plan view and a front view, respectively) for explaining the operation (part 3) of the substrate stage apparatus during the exposure operation.
- FIGS. 11A and 11B are views (a plan view and a front view, respectively) for explaining the operation (part 4) of the substrate stage apparatus during the exposure operation.
- 12A and 12B are views (a plan view and a front view, respectively) for explaining the operation (No. 5) of the substrate stage apparatus during the exposure operation.
- FIGS. 13A and 13B are views (a plan view and a front view, respectively) for explaining the operation (No. 6) of the substrate stage apparatus during the exposure operation.
- FIG. 14A and FIG. 14B are views (a plan view and a front view, respectively) for explaining the operation (part 7) of the substrate stage apparatus during the exposure operation.
- FIGS. 15A and 15B are views (a plan view and a front view, respectively) for explaining the operation (No. 8) of the substrate stage apparatus during the exposure operation.
- FIGS. 16A and 16B are views (a cross-sectional view and a plan view, respectively) showing a substrate stage apparatus according to the second embodiment.
- FIG. 1 schematically shows a configuration of a liquid crystal exposure apparatus 10 according to the first embodiment.
- the liquid crystal exposure apparatus 10 employs a step-and-scan method in which a rectangular (square) glass substrate P (hereinafter simply referred to as a substrate P) used in, for example, a liquid crystal display device (flat panel display) is an exposure object.
- a projection exposure apparatus a so-called scanner.
- the liquid crystal exposure apparatus 10 includes an illumination system 12, a mask stage 14 that holds a mask M on which a pattern such as a circuit pattern is formed, a projection optical system 16, an apparatus body 18, and a surface (a surface facing the + Z side in FIG. 1). It has a substrate stage device 20 that holds a substrate P coated with a resist (sensitive agent), a control system for these, and the like.
- the direction in which the mask M and the substrate P are relatively scanned with respect to the projection optical system 16 at the time of exposure is defined as the X-axis direction
- the direction orthogonal to the X-axis in the horizontal plane is defined as the Y-axis direction, the X-axis, and the Y-axis.
- the illumination system 12 is configured similarly to the illumination system disclosed in, for example, US Pat. No. 5,729,331. That is, the illumination system 12 emits light emitted from a light source (not shown) (for example, a mercury lamp) through exposure mirrors (not shown), dichroic mirrors, shutters, wavelength selection filters, various lenses, and the like. Irradiation light) is applied to the mask M as IL.
- a light source for example, a mercury lamp
- Irradiation light is applied to the mask M as IL.
- the illumination light IL for example, light such as i-line (wavelength 365 nm), g-line (wavelength 436 nm), h-line (wavelength 405 nm), or the combined light of the i-line, g-line, and h-line is used.
- the mask stage 14 holds a light transmission type mask M.
- the main controller 50 moves the mask stage 14 (that is, the mask M) to the illumination system 12 (illumination light IL) via a mask stage drive system 52 (see FIG. 7) including, for example, a linear motor. While driving with a predetermined long stroke in the X-axis direction (scan direction), it is slightly driven in the Y-axis direction and the ⁇ z direction.
- the position information of the mask stage 14 in the horizontal plane is obtained by a mask stage position measurement system 54 (see FIG. 7) including a laser interferometer, for example.
- the projection optical system 16 is disposed below the mask stage 14.
- the projection optical system 16 is a so-called multi-lens type projection optical system having the same configuration as the projection optical system disclosed in, for example, US Pat. No. 6,552,775, and forms, for example, an erect image. It has multiple optical systems that are telecentric on both sides.
- the optical axis AX of the illumination light IL projected from the projection optical system 16 onto the substrate P is substantially parallel to the Z axis.
- the illumination light IL that has passed through the mask M is illuminated via the projection optical system 16.
- a projection image (partial pattern image) of the pattern of the mask M in the region is formed in the exposure region on the substrate P.
- the mask M moves relative to the illumination area (illumination light IL) in the scanning direction
- the substrate P moves relative to the exposure area (illumination light IL) in the scanning direction.
- One shot area is scanned and exposed, and the pattern formed on the mask M (the entire pattern corresponding to the scanning range of the mask M) is transferred to the shot area.
- the illumination area on the mask M and the exposure area (illumination light irradiation area) on the substrate P are optically conjugate with each other by the projection optical system 16.
- the apparatus main body 18 is a part that supports the mask stage 14 and the projection optical system 16, and is installed on the floor F of the clean room via a plurality of vibration isolation devices 18d.
- the apparatus main body 18 is configured in the same manner as the apparatus main body disclosed in, for example, US Patent Application Publication No. 2008/0030702, and an upper base 18a (also referred to as an optical surface plate or the like) that supports the projection optical system 16. 1), a pair of the undercarriage portions 18b (in FIG. 1, one is not shown because it overlaps in the depth direction of the paper surface, see FIG. 2), and a pair of the undercarriage portions 18c.
- the substrate stage device 20 is a part that positions the substrate P with high precision with respect to the projection optical system 16 (illumination light IL), and has a predetermined long stroke along the horizontal plane (X-axis direction and Y-axis direction). And is slightly driven in the direction of 6 degrees of freedom.
- the substrate stage device 20 includes a base frame 22, a coarse movement stage 24, a weight cancellation device 26, an X guide bar 28, a substrate table 30, a non-contact holder 32, a pair of auxiliary tables 34, a substrate carrier 40, and the like.
- the base frame 22 includes a pair of X beams 22a.
- the X beam 22a is made of a member having a rectangular YZ section extending in the X axis direction.
- the pair of X beams 22a are arranged at predetermined intervals in the Y-axis direction, and are installed on the floor F in a state of being physically separated (vibrated and insulated) from the apparatus main body 18 via the leg portions 22b.
- the pair of X beams 22a and the leg portions 22b are integrally connected by connecting members 22c.
- the coarse movement stage 24 is a portion for driving the substrate P with a long stroke in the X-axis direction, and includes a pair of X carriages 24a corresponding to the pair of X beams 22a.
- the X carriage 24a is formed in an inverted L-shaped YZ section, and is placed on the corresponding X beam 22a via a plurality of mechanical linear guide devices 24c.
- Each of the pair of X carriages 24a corresponds by the main controller 50 (see FIG. 7) via an X linear actuator which is a part of the substrate table drive system 56 (see FIG. 7) for driving the substrate table 30. It is synchronously driven along the X beam 22a with a predetermined long stroke in the X axis direction (about 1 to 1.5 times the length of the substrate P in the X axis direction).
- the type of the X linear actuator for driving the X carriage 24a can be changed as appropriate.
- a linear motor 24d including a mover included in the X carriage 24a and a stator included in the corresponding X beam 22a.
- the present invention is not limited to this.
- a feed screw (ball screw) device or the like can also be used.
- the coarse movement stage 24 has a pair of Y stators 62a.
- the Y stator 62a is made of a member extending in the Y-axis direction (see FIG. 1).
- One Y stator 62a is near the + X side end of the coarse movement stage 24, and the other Y stator 62a is near the -X side end of the coarse movement stage 24, respectively, on the pair of X carriages 24a. (See FIG. 1).
- the function of the Y stator 62a will be described later.
- the weight canceling device 26 is inserted between the pair of X carriages 24a of the coarse movement stage 24, and supports the weight of the system including the substrate table 30 and the non-contact holder 32 from below.
- the details of the weight cancellation device 26 are disclosed in, for example, US Patent Application Publication No. 2010/0018950, and thus the description thereof is omitted.
- the weight cancellation device 26 is mechanically connected to the coarse motion stage 24 via a plurality of connection devices 26a (also referred to as flexure devices) extending radially from the weight cancellation device 26, and the coarse motion stage. By being pulled by 24, it moves in the X-axis direction integrally with the coarse movement stage 24.
- the weight canceling device 26 is connected to the coarse movement stage 24 via a connecting device 26a extending radially from the weight canceling device 26. However, since the weight canceling device 26 moves only in the X-axis direction, the connecting device extends in the X direction.
- the configuration may be such that it is connected to the coarse movement stage 24 by 26a.
- the X guide bar 28 is a part that functions as a surface plate when the weight cancellation device 26 moves.
- the X guide bar 28 is composed of a member extending in the X-axis direction, and is inserted between a pair of X beams 22a included in the base frame 22 as shown in FIG. It is fixed to. With respect to the Y-axis direction, the center of the X guide bar 28 substantially coincides with the center of the exposure region generated on the substrate P by the illumination light IL.
- the upper surface of the X guide bar 28 is set parallel to the XY plane (horizontal plane).
- the weight cancellation device 26 is placed on the X guide bar 28 in a non-contact state via, for example, an air bearing 26b. When the coarse movement stage 24 moves on the base frame 22 in the X-axis direction, the weight cancellation device 26 moves on the X guide bar 28 in the X-axis direction.
- the substrate table 30 is made of a rectangular plate (or box-shaped) member whose longitudinal direction is the X-axis direction in plan view, and as shown in FIG. 2, the center portion is XY plane via a spherical bearing device 26 c.
- the weight cancellation device 26 is supported in a non-contact manner from below in a swingable manner.
- a pair of auxiliary tables 34 (not shown in FIG. 2) are connected to the substrate table 30. The function of the pair of auxiliary tables 34 will be described later.
- the substrate table 30 is a part of the substrate table drive system 56 (see FIG. 7), and includes a plurality of linear elements including a stator included in the coarse movement stage 24 and a mover included in the substrate table 30 itself.
- a direction intersecting a horizontal plane (XY plane) with respect to coarse movement stage 24 by motor 30a for example, a voice coil motor
- motor 30a for example, a voice coil motor
- Z tilt direction a Z tilt direction
- the substrate table 30 is mechanically connected to the coarse movement stage 24 via a plurality of connection devices 30b (flexure devices) extending radially from the substrate table 30.
- the connection device 30b includes, for example, a ball joint, and does not hinder relative movement of the substrate table 30 with respect to the coarse movement stage 24 in a minute stroke in the Z tilt direction. Further, when the coarse movement stage 24 moves in the X-axis direction with a long stroke, the coarse movement stage 24 and the substrate table 30 are pulled by the coarse movement stage 24 through the plurality of connection devices 30b. , Move in the X-axis direction integrally.
- the coarse movement stage 24 is not connected via the connection devices 30b extending in a radial direction with respect to the coarse movement stage 24 but via a plurality of connection devices 30b parallel to the X-axis direction. You may make it connect to.
- the non-contact holder 32 is made of a rectangular plate-shaped (or box-shaped) member whose longitudinal direction is the X-axis direction in plan view, and supports the substrate P from below on its upper surface.
- the non-contact holder 32 has a function of preventing sagging and wrinkles from occurring on the substrate P (correcting the plane).
- the non-contact holder 32 is fixed to the upper surface of the substrate table 30 and moves with a long stroke in the X-axis direction integrally with the substrate table 30 and moves slightly in the Z tilt direction.
- the length of each of the four sides on the upper surface (substrate support surface) of the non-contact holder 32 is set to be substantially the same as the length of each of the four sides of the substrate P (actually slightly shorter). Therefore, the non-contact holder 32 supports substantially the entire substrate P from below, specifically, an exposure target region on the substrate P (region excluding a blank region formed near the end of the substrate P). Support is possible from below.
- the non-contact holder 32 is connected to a pressurized gas supply device (not shown) installed outside the substrate stage device 20 and a vacuum suction device via a piping member such as a tube.
- a plurality of minute holes communicating with the piping member are formed on the upper surface (substrate placement surface) of the non-contact holder 32.
- the non-contact holder 32 floats the substrate P by ejecting pressurized gas (for example, compressed air) supplied from the pressurized gas supply device to the lower surface of the substrate P through (a part of) the hole. .
- pressurized gas for example, compressed air
- a load acts on the substrate P, and the plane is corrected along the upper surface of the non-contact holder 32.
- a load acts on the substrate P, and the plane is corrected along the upper surface of the non-contact holder 32.
- a gap is formed between the substrate P and the non-contact holder 32, the relative movement of the substrate P and the non-contact holder 32 in the direction parallel to the horizontal plane is not hindered.
- the substrate carrier 40 is a part that holds the substrate P, and the substrate P is arranged in three-degree-of-freedom directions (X-axis direction, Y-axis direction, and ⁇ z direction) in a horizontal plane with respect to the illumination light IL (see FIG. 1). Move.
- the substrate carrier 40 is formed in a rectangular frame shape (frame shape) in plan view, and holds the region (blank region) near the end (outer peripheral edge) of the substrate P in the non-contact holder 32. On the other hand, it moves along the XY plane. Details of the substrate carrier 40 will be described below with reference to FIG.
- the substrate carrier 40 includes a pair of X frames 42x and a pair of Y frames 42y, as shown in FIG.
- the pair of X frames 42x are each composed of a flat plate-like member extending in the X-axis direction, and are arranged in the Y-axis direction at a predetermined interval (wider than the dimension of the substrate P and the non-contact holder 32 in the Y-axis direction).
- the pair of Y frames 42y are each formed of a flat plate-like member extending in the Y-axis direction, and are arranged at predetermined intervals (wider than the dimensions of the substrate P and the non-contact holder 32 in the X-axis direction) in the X-axis direction. ing.
- the + X side Y frame 42y is connected to the lower surface in the vicinity of the + X side end of each of the pair of X frames 42x via a spacer 42a.
- the ⁇ X side Y frame 42y is connected to the lower surface in the vicinity of the ⁇ X side end of each of the pair of X frames 42x via a spacer 42a.
- the height position (position in the Z-axis direction) of the upper surface of the pair of Y frames 42y is set lower ( ⁇ Z side) than the height position of the lower surface of the pair of X frames 42x.
- a pair of suction pads 44 are attached to the lower surfaces of the pair of X frames 42x so as to be separated from each other in the X-axis direction.
- the substrate carrier 40 has, for example, four suction pads 44 in total.
- the suction pad 44 is disposed so as to protrude from the surface where the pair of X frames 42x face each other in a direction facing each other (inside the substrate carrier 40).
- the four suction pads 44 are positioned in the horizontal plane (X frame) so that the vicinity of the four corners (blank area) of the substrate P can be supported from below with the substrate P inserted between the pair of X frames 42x.
- the attachment position with respect to 42x is set.
- a vacuum suction device (not shown) is connected to each of the four suction pads 44.
- the suction pad 44 sucks and holds the lower surface of the substrate P by the vacuum suction force supplied from the vacuum suction device.
- the number of suction pads 44 is not limited to this, and can be changed as appropriate.
- the substrate P is supported from below by the suction pads 44 of the substrate carrier 40 (adsorption holding). ), And almost the entire surface including the central portion is non-contact supported by the non-contact holder 32 from below.
- the + X side and ⁇ X side ends of the substrate P protrude from the + X side and ⁇ X side ends of the non-contact holder 32, respectively.
- four suction pads 44 (partially in FIG. 2) (Not shown) sucks and holds the portion of the substrate P protruding from the non-contact holder 32. That is, the attachment position for the X frame 42x is set so that the suction pad 44 is positioned outside the non-contact holder 32 in the X-axis direction.
- the substrate carrier driving system 60 (see FIG. 7) for driving the substrate carrier 40 will be described.
- the main controller 50 (see FIG. 7) drives the substrate carrier 40 with a long stroke in the Y-axis direction with respect to the non-contact holder 32 via the substrate carrier driving system 60, and in the horizontal plane. Micro drive in the direction of 3 degrees of freedom.
- the main controller 50 synchronizes the non-contact holder 32 and the substrate carrier 40 in the X-axis direction via the substrate table drive system 56 (see FIG. 7) and the substrate carrier drive system 60 described above ( Drive (integrally).
- the substrate carrier drive system 60 includes a Y stator 62a included in the coarse movement stage 24 and a Y mover that generates thrust in the Y-axis direction in cooperation with the Y stator 62a.
- a pair of Y linear actuators 62 including 62b is provided.
- a Y stator 64a and an X stator 66a are attached to the Y mover 62b of each of the pair of Y linear actuators 62.
- the Y stator 64a constitutes a Y voice coil motor 64 that applies thrust in the Y-axis direction to the substrate carrier 40 in cooperation with the Y mover 64b attached to the substrate carrier 40 (the lower surface of the Y frame 42y).
- the X stator 66a constitutes an X voice coil motor 66 that applies thrust in the X-axis direction to the substrate carrier 40 in cooperation with the X mover 66b attached to the substrate carrier 40 (the lower surface of the Y frame 42y). is doing.
- the substrate stage apparatus 20 has one Y voice coil motor 64 and one X voice coil motor 66 on each of the + X side and the ⁇ X side of the substrate carrier 40.
- the Y voice coil motor 64 and the X voice coil motor 66 are arranged point-symmetrically around the position of the center of gravity of the substrate P, respectively. Accordingly, when thrust is applied to the substrate carrier 40 in the X-axis direction by using the X voice coil motor 66 on the + X side of the substrate carrier 40 and the X voice coil motor 66 on the ⁇ X side of the substrate carrier 40, It is possible to obtain the same effect as when a thrust is applied to the position of the center of gravity in parallel with the X-axis direction, that is, to prevent the moment in the ⁇ z direction from acting on the substrate carrier 40 (substrate P).
- the pair of Y voice coil motors 64 are arranged with the center of gravity (line) of the substrate P in the X-axis direction interposed therebetween, so that no moment in the ⁇ z direction acts on the substrate carrier 40.
- the substrate carrier 40 is moved to the coarse movement stage 24 (that is, the non-contact holder 32) by the main controller 50 (see FIG. 7) via the pair of Y voice coil motors 64 and the pair of X voice coil motors 66. Is slightly driven in the direction of three degrees of freedom in the horizontal plane. Further, when the coarse movement stage 24 (that is, the non-contact holder 32) moves in a long stroke in the X-axis direction, the main controller 50 causes the non-contact holder 32 and the substrate carrier 40 to be integrally extended in the X-axis direction. A thrust in the X-axis direction is applied to the substrate carrier 40 by using the pair of X voice coil motors 66 so as to move in a stroke.
- the main controller 50 uses the pair of Y linear actuators 62 and the pair of Y voice coil motors 64 to move the substrate carrier 40 with respect to the non-contact holder 32 in a long stroke in the Y-axis direction. Move the relative position with. More specifically, the main controller 50 moves the Y mover 62b of the pair of Y linear actuators 62 in the Y-axis direction, and includes a Y voice coil including a Y stator 64a attached to the Y mover 62b. A thrust in the Y-axis direction is applied to the substrate carrier 40 using the motor 64. Accordingly, the substrate carrier 40 moves with a long stroke in the Y-axis direction independently (separated) from the non-contact holder 32.
- the substrate carrier 40 that holds the substrate P moves in a long stroke integrally with the non-contact holder 32 in the X axis (scanning) direction, and the Y axis direction. With respect to, it moves with a long stroke independently of the non-contact holder 32.
- the Z position of the suction pad 44 and the Z position of the non-contact holder 32 partially overlap, but the substrate carrier 40 moves relative to the non-contact holder 32 with a long stroke. Since only the Y-axis direction is performed, there is no possibility that the suction pad 44 and the non-contact holder 32 come into contact with each other.
- the substrate table 30 that is, the non-contact holder 32
- the substrate P that has been flattened on the non-contact holder 32 changes its posture in the Z tilt direction together with the non-contact holder 32.
- the substrate carrier 40 that sucks and holds P changes its posture in the Z tilt direction together with the substrate P. Note that the posture of the substrate carrier 40 may not be changed by the elastic deformation of the suction pad 44.
- the pair of auxiliary tables 34 are held by the substrate carrier 40 in cooperation with the non-contact holder 32 when the substrate carrier 40 separates from the non-contact holder 32 and moves relative to the Y-axis direction. It is a device that supports the lower surface of the substrate P. As described above, since the substrate carrier 40 moves relative to the non-contact holder 32 while holding the substrate P, for example, when the substrate carrier 40 moves in the + Y direction from the state shown in FIG. The vicinity of the + Y side end of the contact is not supported by the non-contact holder 32.
- the substrate P is supported from below by using one of the pair of auxiliary tables 34 in order to suppress bending due to the weight of the portion of the substrate P that is not supported by the non-contact holder 32.
- the pair of auxiliary tables 34 have substantially the same structure except that they are arranged symmetrically on the paper surface.
- the auxiliary table 34 has a plurality of air levitation units 36 as shown in FIG.
- the air levitation unit 36 is formed in a rod shape extending in the Y-axis direction, and a plurality of air levitation units 36 are arranged at predetermined intervals in the X-axis direction.
- the shape, number, arrangement, and the like are not particularly limited as long as the resulting deflection can be suppressed.
- the plurality of air levitation units 36 are supported from below by arm-shaped support members 36 a protruding from the side surface of the substrate table 30.
- a minute gap is formed between the plurality of air levitation units 36 and the non-contact holder 32.
- the height position of the upper surface of the air levitation unit 36 is set to be substantially the same (or somewhat lower) as the height position of the upper surface of the non-contact holder 32.
- the air levitation unit 36 supports the substrate P in a non-contact manner by ejecting gas (for example, air) from its upper surface to the lower surface of the substrate P.
- gas for example, air
- the non-contact holder 32 described above applies a preload to the substrate P to correct the surface of the substrate P.
- the air levitation unit 36 only needs to be able to suppress the deflection of the substrate P, and therefore simply the substrate P.
- the gas may be supplied only to the lower surface of the substrate, and the height position of the substrate P on the air levitation unit 36 may not be particularly managed.
- the substrate position measurement system obtains position information in a direction intersecting the horizontal plane of the substrate table 30 (position information in the Z-axis direction, rotation amount information in the ⁇ x and ⁇ y directions, hereinafter referred to as “Z tilt position information”).
- the position in the horizontal plane for obtaining the tilt position measurement system 58 (see FIG. 7) and position information (position information in the X-axis direction and Y-axis direction, and rotation amount information in the ⁇ z direction) of the substrate carrier 40 in the XY plane.
- a measurement system 70 see FIG. 7).
- the Z tilt position measurement system 58 is a plurality of (at least three) laser displacement meters fixed on the lower surface of the substrate table 30 and around the spherical bearing device 26c. 58a.
- the laser displacement meter 58a irradiates the target 58b fixed to the casing of the weight canceling device 26 with measurement light and receives the reflected light, whereby the Z axis of the substrate table 30 at the measurement light irradiation point is received.
- the direction displacement information is supplied to the main controller 50 (see FIG. 7).
- At least three laser displacement meters 58a are arranged at three places (for example, positions corresponding to the vertices of an equilateral triangle) that are not on the same straight line, and the main controller 50 includes the at least three laser displacement meters 58a.
- the Z tilt position information of the substrate table 30 (that is, the substrate P) is obtained. Since the weight cancellation device 26 moves along the upper surface (horizontal plane) of the X guide bar 28, the main control device 50 measures the posture change of the substrate table 30 with respect to the horizontal plane regardless of the X position of the substrate table 30. Can do.
- the horizontal plane position measurement system 70 (see FIG. 7) has a pair of head units 72 as shown in FIG. One head unit 72 is disposed on the ⁇ Y side of the projection optical system 16, and the other head unit 72 is disposed on the + Y side of the projection optical system 16.
- Each of the pair of head units 72 obtains position information of the substrate P in the horizontal plane using a reflection type diffraction grating of the substrate carrier 40.
- a plurality of (for example, six in FIG. 3) scale plates 46 are attached to the upper surfaces of the pair of X frames 42x of the substrate carrier 40 corresponding to the pair of head units 72, as shown in FIG. It has been.
- the scale plate 46 is made of a band-like member in plan view that extends in the X-axis direction.
- the length of the scale plate 46 in the X-axis direction is shorter than the length of the X frame 42x in the X-axis direction, and a plurality of scale plates 46 are arranged at predetermined intervals (separated from each other) in the X-axis direction. ing.
- FIG. 5 shows an X frame 42x on the + Y side and a head unit 72 corresponding thereto.
- An X scale 48x and a Y scale 48y are formed on each of the plurality of scale plates 46 fixed on the X frame 42x.
- the X scale 48 x is formed in a half area on the ⁇ Y side of the scale plate 46
- the Y scale 48 y is formed in a half area on the + Y side of the scale plate 46.
- the X scale 48x has a reflective X diffraction grating
- the Y scale 48y has a reflective Y diffraction grating.
- the interval (pitch) between the plurality of lattice lines forming the X scale 48x and the Y scale 48y is shown wider than actual.
- the head unit 72 includes a Y linear actuator 74 and a Y slider 76 driven by the Y linear actuator 74 with a predetermined stroke in the Y-axis direction with respect to the projection optical system 16 (see FIG. 1). And a plurality of measurement heads (X encoder heads 78x and 80x, Y encoder heads 78y and 80y) fixed to the Y slider 76.
- the pair of head units 72 are configured similarly except that they are configured symmetrically in FIG. 1 and FIG.
- the plurality of scale plates 46 fixed on the pair of X frames 42x are also symmetrically configured in FIGS.
- the Y linear actuator 74 is fixed to the lower surface of the upper base portion 18a of the apparatus main body 18.
- the Y linear actuator 74 includes a linear guide that linearly guides the Y slider 76 in the Y-axis direction, and a drive system that applies thrust to the Y slider 76.
- the type of the linear guide is not particularly limited, but an air bearing with high repeatability is suitable.
- the type of drive system is not particularly limited, and for example, a linear motor, a belt (or wire) drive device, or the like can be used.
- the Y linear actuator 74 is controlled by the main controller 50 (see FIG. 7).
- the stroke amount of the Y slider 76 in the Y axis direction by the Y linear actuator 74 is set to be equal to the stroke amount of the substrate P (substrate carrier 40) in the Y axis direction.
- the head unit 72 includes a pair of X encoder heads 78x (hereinafter referred to as “X heads 78x”) and a pair of Y encoder heads 78y (hereinafter referred to as “Y heads 78y”). Yes.
- the pair of X heads 78x and the pair of Y heads 78y are respectively spaced apart by a predetermined distance in the X-axis direction.
- the X head 78x and the Y head 78y are so-called diffraction interference type encoder heads as disclosed in, for example, US Patent Application Publication No. 2008/0094592, and have corresponding scales (X scale 48x, Y scale 48y). ) Is irradiated downward ( ⁇ Z direction), and the beam (return light) from the scale is received, so that the displacement information of the substrate carrier 40 is transmitted to the main controller 50 (see FIG. 7). Supply.
- a total of the pair of head units 72 includes, for example, four X heads 78x and an X scale 48x facing the X heads 78x.
- four X linear encoder systems for obtaining position information in the X-axis direction are configured.
- a total of the pair of head units 72 has, for example, four Y heads 78y and a Y scale 48y facing the Y heads 78y to obtain position information in the Y-axis direction of the substrate carrier 40, for example.
- Four Y linear encoder systems are configured.
- the distance between the pair of X heads 78x and the pair of Y heads 78y of the head unit 72 in the X-axis direction is set wider than the distance between the adjacent scale plates 46.
- the pair of X heads 78x regardless of the position of the substrate carrier 40 in the X axis direction, at least one of the pair of X heads 78x always faces the X scale 48x, and the pair of Y heads 78y. At least one of them always faces the Y scale 48y.
- the main controller 50 determines that the substrate carrier 40 is based on the average value of the outputs of the pair of X heads 78x when both the pair of X heads 78x face the X scale 48x. X position information is obtained. In addition, main controller 50 obtains the X position information of substrate carrier 40 based only on the output of one X head 78x when only one of the pair of X heads 78x faces X scale 48x. Therefore, the X encoder system can supply the position information of the substrate carrier 40 to the main controller 50 without interruption. The same applies to the Y encoder system.
- the main controller 50 (see FIG. 7) is configured with the X heads 78x, Y
- the Y sliders 76 (see FIG. 4) of each of the pair of head units 72 are set in accordance with the position of the substrate carrier 40 in the Y-axis direction so that the heads 78y are opposed to the corresponding scales 48x and 48y. Then, it is driven in the Y-axis direction via a Y linear actuator 74 (see FIG. 4) so as to follow the substrate carrier 40.
- the main controller 50 combines the amount of displacement (position information) in the Y-axis direction of the Y slider 76 (that is, each head 78x, 78y) and the output from each head 78x, 78y in a comprehensive manner. Find position information in the horizontal plane.
- the position (displacement amount) information in the horizontal plane of the Y slider 76 is obtained by an encoder system having the same measurement accuracy as the encoder system using the X head 78x and the Y head 78y. 4 and 5, the Y slider 76 includes a pair of X encoder heads 80x (hereinafter referred to as “X heads 80x”) and a pair of Y encoder heads 80y (hereinafter referred to as “Y heads 80y”). Have.
- the pair of X heads 80x and the pair of Y heads 80y are respectively disposed at a predetermined distance apart in the Y-axis direction.
- the main control device 50 uses the plurality of scale plates 82 fixed to the lower surface of the gantry 18a (see FIG. 1) of the device body 18 to obtain positional information of the Y slider 76 in the horizontal plane.
- the scale plate 82 is made of a band-shaped member that extends in the Y-axis direction in plan view. In the present embodiment, for example, two scale plates 82 are disposed above each of the pair of head units 72 at a predetermined interval (separated from each other) in the Y-axis direction.
- an X scale 84x is formed in the + X side region on the lower surface of the scale plate 82 so as to face the pair of X heads 80x, and an ⁇ X side region on the lower surface of the scale plate 82 is formed. Is formed with a Y scale 84y facing the pair of Y heads 80y.
- the X scale 84x and the Y scale 84y are light reflecting diffraction gratings having substantially the same configuration as the X scale 48x and Y scale 48y formed on the scale plate 46 described above.
- the X head 80x and the Y head 80y are also diffraction interference type encoder heads having the same configuration as the X head 78x and the Y head 78y (downward head) described above.
- the pair of X heads 80x and the pair of Y heads 80y irradiate a measurement beam upward (+ Z direction) with respect to the corresponding scale (X scale 84x, Y scale 84y), and receive the beam from the scale.
- the displacement information in the horizontal plane of the Y slider 76 (see FIG. 4) is supplied to the main controller 50 (see FIG. 7).
- the distance between the pair of X heads 80x and the pair of Y heads 80y in the Y-axis direction is set wider than the distance between adjacent scale plates 82.
- the position information of the Y slider 76 can be supplied to the main controller 50 (see FIG. 7) without interruption.
- the alignment measurement system 90 detects the position of the end of the substrate P after the loading operation of the substrate P (see FIG. 1) with respect to the substrate stage device 20 (see FIG. 1). Sensors 92 and 94 and a fine alignment sensor 96 (hereinafter simply referred to as “alignment sensor 96”) for detecting an alignment mark formed on the substrate P are provided.
- the pre-alignment sensor 92 has an end on the + X side of the substrate P in a state where the non-contact holder 32 and the substrate carrier 40 are positioned at a predetermined loading position (substrate replacement position). For example, one is disposed at a position where the part can be detected.
- two pre-alignment sensors 94 are arranged in the X-axis direction at positions where the end on the + Y side of the substrate P at the loading position can be detected.
- the pre-alignment sensor 92 is a known edge sensor, and includes a light source 92a and a light receiving unit 92b as shown in FIG.
- the light source 92a is, for example, fixed to the apparatus main body 18 (see FIG. 1), so that the light source 92a is disposed above the substrate P, and the light receiving unit 92b faces the light source 92a across the substrate P (below the substrate P).
- the cross section orthogonal to the optical axis of the measurement light emitted from the light source 92a has a line shape extending in the X-axis direction (see FIG. 6A), and the light receiving unit 92b receives the measurement light to receive the substrate P. + X side end of the is detected.
- the pre-alignment sensor 94 has the same configuration as the pre-alignment sensor 92 (the light source 94a and the light source 94a), except that the cross section perpendicular to the optical axis of the measurement light is a line shape (see FIG. 6A) extending in the Y-axis direction.
- the edge sensor is a light receiving unit 94b). 6A shows only the measurement light emitted from the light sources 92a and 94a for easy understanding, and the prealignment sensors 92 and 94 are denoted by the same reference numerals. ing.
- the main controller 50 (see FIG. 7), for example, has three degrees of freedom in the horizontal plane of the substrate P based on the outputs of the light receiving portion 92b of one pre-alignment sensor 92 and the light receiving portions 94b of, for example, two pre-alignment sensors 94. Perform a rough (rough) position measurement of the direction. Since the substrate P may be rotated in the ⁇ z direction when it is transported onto the substrate stage device 20 by, for example, a loading device (not shown), the main controller 50 determines that the rotation amount exceeds a predetermined threshold value. If this happens, the substrate P is reloaded (reloading operation). If the rotation amount of the substrate P is within the threshold value, the substrate P is held by the substrate carrier 40. If necessary, the position of the substrate P is finely adjusted by rotating the substrate carrier 40 holding the substrate P in the ⁇ z direction.
- FIG. 6B for example, six alignment sensors 96 are provided at a predetermined interval in the Y-axis direction on the + X side of the projection optical system 16 (not shown in FIGS. 1 and 2). (Illustrated). Further, as shown in FIG. 6A, a plurality of alignment marks Mk (hereinafter simply referred to as “marks Mk”) are formed on the substrate P. Specifically, on the substrate P, mark rows made of, for example, six marks Mk that are separated from each other in the Y-axis direction are arranged at predetermined intervals in the X-axis direction, for example, four rows (that is, a total of 24 marks Mk). Is formed).
- four shot areas (rectangular partition areas) S1 to S4 are set on the substrate P, and, for example, six marks Mk are formed in one shot area. Is done. More specifically, in one shot area, for example, three marks Mk are formed near the end on the + X side, and for example, three marks Mk are formed near the end on the ⁇ X side.
- the number and arrangement of the marks Mk can be appropriately changed according to, for example, the number of shot areas.
- the mark Mk is indicated by a circle, but the actual shape of the mark is not limited to this and can be changed as appropriate.
- the mark Mk is shown much larger than the actual size for easy understanding.
- the mark Mk may be formed in a region between adjacent shot regions (that is, outside the shot region).
- the intervals in the Y-axis direction of the above-described six alignment sensors 96 are set to be substantially the same as the intervals in the Y-axis direction of, for example, the six marks Mk forming the above-described mark row.
- the six alignment sensors 96 can simultaneously detect, for example, six alignment marks Mk having the same position in the X-axis direction.
- detection regions for example, extending in the Y-axis direction
- the same reference numerals as those of the alignment sensor 96 are given to the band-like regions).
- the center of the detection region (see reference numeral 96 in FIG. 6A) formed by the six alignment sensors 96 in the Y-axis direction is formed on the substrate P by the projection optical system 16 (see FIG. 6B).
- the attachment positions of the six alignment sensors 96 are set so as to substantially coincide with the center of the exposure area IA in the Y-axis direction.
- the center position of the X guide bar 28 (that is, the non-contact holder 32) in the Y-axis direction substantially coincides with the center position of the exposure area IA in the Y-axis direction.
- the six alignment sensors 96 are, for example, six alignment marks Mk to be detected in a state where the Y position of the substrate carrier 40 is positioned so that almost all of the substrate P is supported by the non-contact holder 32. Are detected at the same time.
- the outputs of the six alignment sensors 96 are supplied to the main controller 50 (see FIG. 7). The fine alignment operation performed by the main controller 50 based on the alignment sensor 96 will be described later.
- FIG. 7 is a block diagram showing the input / output relationship of the main controller 50 that centrally configures the control system of the liquid crystal exposure apparatus 10 (see FIG. 1) and controls the overall components.
- the main controller 50 includes a workstation (or a microcomputer) and the like, and comprehensively controls each part of the liquid crystal exposure apparatus 10.
- a case where four shot areas are set on one substrate P in the case of so-called four chamfering
- the number of shot areas set on one substrate P is described.
- the exposure process is described as being performed from the first shot area S1 set on the ⁇ Y side and the + X side of the substrate P as an example.
- some elements of the substrate stage apparatus 20 are omitted in FIGS. 8A to 10B.
- a plurality of layers are formed on the substrate P by superimposing and transferring a plurality of mask patterns, and in the following description, patterns in the second and subsequent layers are used.
- the case where the pattern is formed on the substrate P on which the pattern (and the plurality of marks Mk) has already been formed at least once will be described.
- the mask M is loaded onto the mask stage 14 by a mask loader (not shown) under the control of the main controller 50 (see FIG. 7).
- the substrate P is loaded onto the substrate stage device 20 (the substrate carrier 40 and the non-contact holder 32) by the substrate loader.
- the main controller 50 performs a pre-alignment operation using the above-described pre-alignment sensors 92 and 94 (see FIGS. 6A and 6B) after loading the substrate P onto the substrate stage device 20.
- main controller 50 After the pre-alignment operation, main controller 50 (see FIG. 7) performs fine alignment operation using a plurality of alignment sensors 96. As described above, in the present embodiment, the main controller 50 starts scanning exposure from the first shot region S1 (see FIG. 6A) set on the ⁇ Y side and the + X side of the substrate P. Prior to the exposure operation of the first shot region S1, for example, twelve marks Mk formed on the + X side half of the substrate P are detected.
- the main controller 50 (see FIG. 7), for example, from the + X side of the four mark rows formed on the substrate P directly below the plurality of alignment sensors 96.
- the substrate stage device 20 is controlled to position the substrate P so that the second mark row is positioned.
- the plurality of alignment sensors 96 are directly below.
- the position in the XY plane of the positioned mark Mk (not shown in FIG. 8B, see the black mark Mk in FIG. 8A) is measured.
- the main control device 50 controls the substrate stage device 20 as shown in FIG. 9A, for example, among the four mark rows formed on the substrate P.
- the substrate P is positioned so that the mark row formed on the + X side is located immediately below the plurality of alignment sensors 96.
- the position in the XY plane of the mark Mk positioned immediately below is measured.
- the main controller 50 determines the known enhanced global alignment (EGA) based on the positional information of the 12 marks Mk in total obtained by the measurement operation of the two alignment marks Mk.
- the arrangement information of the first shot area S1 (see FIG. 6A) (including information on the position (coordinate value), shape, etc. of the partition area) is calculated by the method.
- the second mark row from the + X side is first detected in order to suppress the movement amount of the substrate stage apparatus 20 when shifting to the exposure operation of the first shot region S1, which is the next step. After that, the mark row on the most + X side is detected.
- the detection order may be reversed.
- the main controller 50 calculates the arrangement information of the first shot area S1, and then performs the scanning exposure operation of the first shot area S1, as shown in FIG.
- the substrate P is positioned at a predetermined exposure start position by driving the substrate carrier 40 with a predetermined stroke in the + Y direction with respect to the non-contact holder 32 (about half the length of the substrate P in the Y-axis direction).
- the non-contact holder 32 the vicinity of the + Y side end portion of the substrate P is removed from the non-contact holder 32, so that the plane correction is not performed, but the region including the first shot region S1 (see FIG. 6A) to be exposed is Since the flattened state is maintained, the exposure accuracy is not affected. Further, the non-contact holder 32, the pair of auxiliary tables 34, and the substrate carrier 40 are integrally driven in the ⁇ X direction so that the exposure area IA is located outside the substrate P (+ X side).
- the non-contact holder 32, the pair of auxiliary tables 34, and the substrate carrier 40 are integrally driven in the + X direction (acceleration, constant speed movement).
- the projection optical system 16 projects illumination light IL (not shown in FIG. 11A) that has passed through the mask M (see FIG. 1) onto the substrate P that moves at a constant speed.
- the main controller 50 finely positions the substrate carrier 40 in the three-degree-of-freedom direction in the horizontal plane based on the output of the mask alignment system (not shown) and the calculation result of the array information (FIG.
- the substrate P is moved in the + X direction with respect to the illumination light IL (exposure area IA) while performing the white arrow reference (a) and the ⁇ z direction). Further, in the liquid crystal exposure apparatus 10 (see FIG. 1), in parallel with the fine alignment operation, focus mapping using an unillustrated autofocus sensor (surface position measurement system of the substrate P) is performed in advance. During the scanning exposure operation, the main controller 50 appropriately drives the non-contact holder 32 minutely in the Z tilt direction according to the result of the focus mapping. 11A and 11B show the substrate stage device 20 immediately after the scanning exposure operation for the first shot region S1 is completed.
- liquid crystal exposure apparatus 10 has been described as performing the focus mapping for determining the position of the substrate P in the Z direction in advance, it is not performed in advance, and the focus mapping is performed at any time immediately before performing the scanning exposure while performing the scanning exposure operation. Good to do.
- main controller 50 performs an exposure operation on second shot region S2 (see FIG. 6A) set on the + Y side of first shot region S1, so FIG.
- main controller 50 performs an exposure operation on second shot region S2 (see FIG. 6A) set on the + Y side of first shot region S1, so FIG.
- the substrate carrier 40 is driven in the ⁇ Y direction with respect to the non-contact holder 32.
- the main controller 50 removes the substrate carrier 40 and the non-contact holder 32 from the state shown in FIGS. 13A and 13B. While driving in the X direction, the illumination light IL is projected onto the substrate P, and the mask pattern is transferred to the second shot region S2. Also in this case, the vicinity of the ⁇ Y side end portion of the substrate P protrudes to the outside of the non-contact holder 32. However, since the second shot region S2 is flattened by the non-contact holder 32, the exposure accuracy is not affected. .
- the main controller 50 (see FIG. 7) is obtained by an alignment measurement operation (see FIGS. 8A to 9B) performed before the exposure operation for the first shot region S1. Based on the positional information of the twelve marks Mk, the arrangement information of the second shot area S2 is obtained, and the scanning exposure of the second shot area S2 is performed while finely positioning the substrate P in the direction of three degrees of freedom based on the arrangement information. Do. That is, in the present embodiment, since the alignment measurement region is formed across the first and second shot regions S1 and S2 by a plurality (for example, six in this embodiment) of the alignment sensors 96, the main controller 50 All marks Mk formed in the first and second shot areas S1 and S2 can be detected by the mark detection operation twice.
- the main controller 50 detects all the marks Mk formed in the first and second shot areas S1 and S2 prior to the scanning exposure operation of the first and second shot areas S1 and S2. Therefore, the main controller 50 does not detect the mark Mk in the second shot region S2 again before the exposure operation of the second shot region S2 (only by calculating the array information), and performs the first and second operations.
- the two shot areas S1 and S2 are continuously exposed.
- the main controller 50 When the scanning exposure operation for the second shot region S2 is completed, the main controller 50 (see FIG. 7) performs scanning exposure for the third and fourth shot regions S3 and S4 (see FIG. 6A, respectively). An operation of detecting the mark Mk formed in the third and fourth shot regions S3 and S4 is performed.
- the main controller 50 moves the substrate carrier 40 in the + Y direction as shown in FIGS. 14A and 14B in the same manner as in the mark detection operation in the first and second shot areas S1 and S2.
- the substrate P is positioned so that almost the entire substrate P is supported (flattened) by the non-contact holder 32.
- the main controller 50 includes, for example, four mark rows formed on the substrate P by the non-contact holder 32, the pair of auxiliary tables 34, and the substrate carrier 40 being integrally driven in the + X direction.
- the substrate P is positioned so that the third mark row as viewed from the + X side is located immediately below the plurality of alignment sensors 96.
- a plurality of alignment sensors 96 measure the positions in the XY plane of the mark Mk positioned immediately below (not shown in FIG. 14B, see black mark Mk in FIG. 14A).
- the main control device 50 controls the substrate stage device 20, as shown in FIG. 15A, for example, among the four mark rows formed on the substrate P.
- the substrate P is positioned so that the mark row formed on the ⁇ X side is located immediately below the plurality of alignment sensors 96.
- the position in the XY plane of the mark Mk positioned immediately below (not shown in FIG. 15B, see the black mark Mk in FIG. 15A) is measured.
- the main controller 50 determines the third and fourth shot areas S3, S4 by the EGA method based on the total position information obtained by the above-described two measurement operations of the alignment mark Mk, for example, the 12 marks Mk.
- the sequence information (see FIG. 6A) is calculated.
- the main controller 50 (see FIG. 7) (not shown) is similar to the scanning exposure operation (FIGS. 10A to 13B) for the first and second shot regions S1 and S2. Based on the arrangement information, scanning exposure operations are sequentially performed on the third and fourth shot regions S3 and S4 while appropriately controlling the substrate stage apparatus 20.
- the fine alignment measurement system including the six alignment sensors 96 has a plurality of shot areas (in the above embodiment, the first and second shot areas S1, S2,.
- the mark measurement time can be shortened as compared with the case where the mark detection operation is performed for each shot area. Therefore, the overall throughput is improved.
- the non-contact holder 32 has a size for flattening the substantially entire surface of the substrate P, as described above, even when the simultaneous position measurement of the mark Mk across a plurality of shot areas is performed.
- the plurality of shot areas can be flattened. Therefore, the position information of the plurality of marks Mk can be obtained reliably.
- FIGS. 16 (a) and 16 (b) The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment, except that the configuration of the substrate stage device 120 for positioning the substrate P with high precision with respect to the projection optical system 16 (see FIG. 1). Different.
- the second embodiment will be described only with respect to differences from the first embodiment, and elements having the same configuration and function as the first embodiment will be described with respect to the first embodiment. The same reference numerals are given and description thereof is omitted.
- the frame-shaped (frame-shaped) substrate carrier 40 that holds the substrate P is relatively opposed to the non-contact holder 32 with a predetermined stroke independently in the non-scanning direction (Y-axis direction).
- the substrate carrier 140 moves in the scanning direction (see FIG. 1A and FIG. 16B).
- the X-axis direction) and the non-scanning direction are different in that they move integrally with the non-contact holder 32 with a predetermined long stroke.
- the point that the substrate carrier 140 can be moved relative to the non-contact holder 32 in the direction of three degrees of freedom in the horizontal plane with a minute stroke is the same as the substrate stage apparatus 20 of the first embodiment.
- the coarse movement stage 124 is configured to be movable with a predetermined long stroke in the X-axis and Y-axis directions.
- a configuration for moving the coarse movement stage 124 with a long stroke in the Y-axis direction is not particularly limited, but a known gantry type XY as disclosed in, for example, US Patent Application Publication No. 2012/0057140 is disclosed.
- a stage device can be used.
- the weight cancellation device 26 is connected to the coarse movement stage 124 so as to move integrally with the coarse movement stage 124 in a predetermined long stroke in the X-axis and Y-axis directions.
- the X guide bar 28 (see FIG.
- the configuration for moving the X guide bar 28 with a long stroke in the Y-axis direction is not particularly limited.
- the X guide bar 28 may be mechanically connected to the Y stage in the XY stage device.
- the coarse movement stage 124 and the substrate table 30 are mechanically connected via a plurality of connection devices 30b (flexure devices) (but in a state where they can be moved minutely in the Z tilt direction) in the first embodiment.
- the form is the same.
- the substrate table 30 and the non-contact holder 32 move together with the coarse movement stage 124 with a predetermined long stroke in the X-axis and Y-axis directions.
- the substrate carrier 140 has a main body part 142 formed in a rectangular frame shape in plan view, and a suction part 144 fixed to the upper surface of the main body part 142.
- the suction part 144 is also formed in a rectangular frame shape in plan view, like the main body part 142.
- the substrate P is held by, for example, vacuum suction on the suction unit 144.
- the non-contact holder 32 is inserted into an opening of the suction portion 144 in a state where a predetermined gap is formed with respect to the inner wall surface of the suction portion 144. The point that the non-contact holder 32 applies a load (preload) to the substrate P to correct the plane without contact is the same as in the first embodiment.
- a plurality of (for example, four in this embodiment) guide plates 148 extend radially from the lower surface of the substrate table 30 along a horizontal plane.
- the substrate carrier 140 has a plurality of pads 146 including air bearings corresponding to the plurality of guide plates 148, and the static pressure of the pressurized gas ejected from the air bearings to the upper surface of the guide plate 148. It is placed on the guide plate 148 in a non-contact state.
- the plurality of guide plates 148 also move in the Z tilt direction integrally with the substrate table 30 (change in posture).
- the posture of the table 30, the non-contact holder 32, and the substrate carrier 140 that is, the substrate P) changes integrally.
- the substrate carrier 140 is attached to the substrate table 30 via a plurality of linear motors 152 (X voice coil motor and Y voice coil motor) including a mover included in the substrate carrier 140 and a stator included in the substrate table 30.
- a plurality of linear motors 152 X voice coil motor and Y voice coil motor
- it is finely driven in the direction of three degrees of freedom in the horizontal plane.
- the plurality of linear motors so that the substrate table 30 and the substrate carrier 140 integrally move with the long stroke along the XY plane.
- the point that thrust is applied to the substrate carrier 140 by 152 is the same as in the first embodiment.
- a plurality of scale plates 46 are fixed near the + Y side and ⁇ Y side ends on the upper surface of the substrate carrier 140.
- the method for obtaining the position information in the three-degree-of-freedom direction in the horizontal plane of the substrate carrier 140 (that is, the substrate P) using the scale plate 46 is the same as that in the first embodiment, and the description thereof is omitted.
- mark rows including, for example, six marks Mk arranged at predetermined intervals in the Y-axis direction are formed, for example, four rows at predetermined intervals in the X-axis direction.
- the main controller 50 moves the non-contact holder 32 and the substrate carrier 140 integrally in the X-axis direction so that the mark row is positioned within the detection visual field of the plurality of alignment sensors 96.
- the substrate carrier 40 moves in the Y-axis direction with a long stroke with respect to the non-contact holder 32 during the movement between shot areas (Y step movement) (see FIG. 12A, etc.).
- the non-contact holder 32 and the substrate carrier 140 are integrally moved in the Y-axis direction. Since the exposure operation using the substrate stage apparatus 120 according to the second embodiment is the same as the exposure operation of the substrate P using the conventional XY stage, the description thereof is omitted. Also in the second embodiment, the same effect as in the first embodiment can be obtained.
- the configurations described in the first and second embodiments can be changed as appropriate.
- a shape change disortion or the like
- the alignment measurement operation in S4 is performed after the scanning exposure for the first and second shot regions S1 and S2.
- the present invention is not limited to this.
- all (first to fourth shots) are performed before the exposure operation for the first shot region S1, all (first to fourth shots) are performed.
- the detection operation of the mark Mk in the areas S1 to S4) may be performed, and the exposure operation of all the shot areas S1 to S4 may be continuously performed based on the detection result. In this case, the throughput is improved.
- six marks Mk on the substrate P are formed by a sensor group including, for example, six alignment sensors 96 that have the same position in the X-axis direction and are arranged at predetermined intervals in the Y-axis direction.
- the number and arrangement of the alignment sensors 96 are not limited to this, and can be changed as appropriate.
- another sensor group having the same configuration, for example, including six alignment sensors 96 may be disposed.
- the interval between the two sensor groups in the X-axis direction may be set so that the first and second mark rows (and the third and fourth mark rows) can be detected simultaneously when viewed from the + Y direction.
- the position measurement of all the marks Mk in the first and second shot areas S1 and S2 (or the third and fourth shot areas S3 and S4) can be performed by one mark detection operation.
- the substrate carrier 40 and the like are, for example, four frame members (in the first embodiment, a pair of X frames 42x and a pair) along the outer peripheral edge (four sides) of the substrate P.
- the Y frame 42y is formed in a rectangular frame shape, but the substrate carrier 40 and the like are not limited to this as long as the substrate P can be securely sucked and held. You may be comprised by the frame member along a part.
- the substrate carrier may be formed in a U shape in plan view by, for example, three frame members along the three sides of the substrate P, or on two adjacent sides of the substrate P.
- two frame members may be formed on the L shape in plan view.
- the substrate carrier may be formed by only one frame member along one side of the substrate P, for example.
- the substrate carrier may be constituted by a plurality of members that hold different portions of the substrate P and whose positions are controlled independently of each other.
- the Z tilt position measurement system 58 is attached to a target 58b fixed to the casing of the weight cancellation device 26 by a laser displacement meter 58a provided on the lower surface of the substrate table 30.
- the measurement light is irradiated and the reflected light is received to obtain the displacement amount information of the substrate table 30 in the Z-axis direction.
- the present invention is not limited to this.
- a Z sensor head 78z is arranged in the head unit 72 together with the X head 78x and the Y head 78y.
- a laser displacement meter is used as the Z sensor head 78z.
- a reflective surface is formed by mirror finishing in a region where a scale facing the X head 78x and the Y head 78y is not disposed.
- the Z sensor head 78z irradiates the measurement surface with the measurement beam, and receives the reflection beam from the reflection surface, whereby displacement information in the Z-axis direction of the substrate carriers 40 and 440 at the measurement beam irradiation point is obtained.
- the type of the Z head 78z is such that the displacement in the Z-axis direction of the substrate carriers 40 and 440 (more specifically, the X frame 42x) with reference to the apparatus main body 18 (see FIG. 1) can be achieved with desired accuracy (resolution). And if it can measure in non-contact, it will not specifically limit.
- the position information in the XY plane of each of the substrate P and the Y slider 76 is obtained by the X encoder head 78x and the Y encoder head 78y.
- a two-dimensional encoder head capable of measuring displacement information in the Z-axis direction. (XZ encoder head or YZ encoder head) may be used to obtain the Z tilt displacement information of each of the substrate P and Y slider 76 together with the positional information of the substrate P and Y slider 76 in the XY plane. .
- the scale plate 46 is as long as the X frame 42x. It is preferable that the two-dimensional encoder heads are arranged at a predetermined interval in the X-axis direction, for example, by three long scale plates.
- the plurality of scale plates 46 are arranged at predetermined intervals in the X-axis direction.
- the present invention is not limited to this, and for example, the substrate carrier 40 or the like is formed with a length similar to the length in the X-axis direction.
- a single long scale plate may be used.
- each head unit 72 has only one X head 78x and one Y head 78y.
- the scale plate 82 When a plurality of scale plates 46 are provided, the lengths of the scale plates 46 may be different from each other.
- the head unit 72 controls the position of the substrate P across different scale plates 46 during the scanning exposure operation. Can be avoided. Further, the length may be different between the scale arranged on one side of the projection optical system 16 and the scale arranged on the other side (for example, in the case of four chamfering and six chamfering).
- the encoder system although position measurement in horizontal surfaces, such as the board
- a bar mirror may be attached, and the position of the substrate carrier 40 or the like may be measured by an interferometer system using the bar mirror.
- the substrate carrier 40 and the like have the scale plate 46 (diffraction grating) and the head unit 72 has the measurement head.
- the present invention is not limited to this, and the substrate carrier 40 and the like. May have a measurement head, and a scale plate that moves in synchronization with the measurement head may be attached to the apparatus main body 18 (arrangement opposite to that in the above embodiments).
- the non-contact holder 32 supports the substrate P in a non-contact manner.
- the non-contact holder 32 is not limited to this as long as the relative movement in the direction parallel to the horizontal plane between the substrate P and the non-contact holder 32 is not hindered.
- it may be supported in a contact state via a rolling element such as a ball.
- the wavelength of the light source used in the illumination system 12 and the illumination light IL emitted from the light source is not particularly limited.
- ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or the like.
- Light or vacuum ultraviolet light such as F2 laser light (wavelength 157 nm) may be used.
- the projection optical system 16 is an equal magnification system.
- the present invention is not limited to this, and a reduction system or an enlargement system may be used.
- the use of the exposure apparatus is not limited to an exposure apparatus for liquid crystal that transfers a liquid crystal display element pattern onto a square glass plate.
- an exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, a semiconductor The present invention can be widely applied to an exposure apparatus for manufacturing, an exposure apparatus for manufacturing a thin film magnetic head, a micromachine, a DNA chip, and the like.
- an exposure apparatus for manufacturing a thin film magnetic head a micromachine, a DNA chip, and the like.
- the present invention can also be applied to an exposure apparatus that transfers a circuit pattern.
- the object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank.
- the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member).
- the exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target. Further, when the substrate to be exposed is a flexible sheet, the sheet may be formed in a roll shape.
- the step of designing the function and performance of the device the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer)
- the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .
- the exposure apparatus and exposure method of the present invention are suitable for exposure while scanning an object with illumination light through an optical system.
- the manufacturing method of the flat panel display of this invention is suitable for production of a flat panel display.
- the device manufacturing method of the present invention is suitable for the production of micro devices.
- SYMBOLS 10 Liquid crystal exposure apparatus, 20 ... Substrate stage apparatus, 32 ... Non-contact holder, 40 ... Substrate carrier, 50 ... Main controller, 90 ... Alignment measurement system, 92, 94 ... Pre-alignment sensor, 96 ... Fine alignment sensor, P ...substrate.
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Abstract
Description
以下、第1の実施形態について、図1~図15(b)を用いて説明する。 << First Embodiment >>
Hereinafter, the first embodiment will be described with reference to FIGS. 1 to 15B.
次に第2の実施形態について、図16(a)及び図16(b)を用いて説明する。第2の実施形態に係る液晶露光装置の構成は、基板Pを投影光学系16(図1参照)に対して高精度位置決めするための基板ステージ装置120の構成が、上記第1の実施形態と異なる。以下、本第2の実施形態については、上記第1の実施形態との相違点についてのみ説明し、上記第1の実施形態と同じ構成及び機能を有する要素については、上記第1の実施形態と同じ符号を付してその説明を省略する。 << Second Embodiment >>
Next, a second embodiment will be described with reference to FIGS. 16 (a) and 16 (b). The configuration of the liquid crystal exposure apparatus according to the second embodiment is the same as that of the first embodiment, except that the configuration of the
Claims (25)
- 光学系を介して照明光を複数のマークを有する物体に照射して、前記照明光に対して前記物体を相対駆動して前記物体の複数の区画領域をそれぞれ走査露光する露光装置であって、
互いに交差する第1及び第2方向の少なくとも一方の方向に並んで配置された前記複数の区画領域を非接触支持可能な第1支持部と、
前記第1支持部により非接触支持された前記物体を保持する保持部と、
前記複数の区画領域に設けられた前記複数のマークを検出する検出動作を行う検出部と、
前記保持部に保持され、前記検出動作が行われた前記物体の一部が前記第1支持部から外れるように、前記保持部を前記第1支持部に対して相対駆動させる第1駆動部と、を備える露光装置。 An exposure apparatus that irradiates an object having a plurality of marks through an optical system, and relatively drives the object with respect to the illumination light to scan and expose a plurality of partitioned regions of the object, respectively.
A first support part capable of supporting the plurality of partition regions arranged in a line in at least one of the first and second directions intersecting each other in a non-contact manner;
A holding unit for holding the object supported in a non-contact manner by the first support unit;
A detection unit that performs a detection operation of detecting the plurality of marks provided in the plurality of partition regions;
A first driving unit configured to drive the holding unit relative to the first support unit so that a part of the object held by the holding unit and subjected to the detection operation is detached from the first support unit; An exposure apparatus comprising: - 前記第1支持部を前記第1及び第2方向へ駆動する第2駆動部をさらに備え、
前記第1及び第2駆動部の少なくとも一方の駆動部は、前記検出部の検出領域内に検出対象の前記複数のマークが位置するように前記保持部を前記検出系に対して移動させる請求項1に記載の露光装置。 A second drive unit for driving the first support unit in the first and second directions;
The at least one drive unit of the first and second drive units moves the holding unit relative to the detection system so that the plurality of marks to be detected are positioned within a detection region of the detection unit. 2. The exposure apparatus according to 1. - 前記検出部は、前記第1支持部により前記物体に設けられた全ての区画領域が支持された状態で、前記検出動作を行う請求項1又は2に記載の露光装置。 3. The exposure apparatus according to claim 1, wherein the detection unit performs the detection operation in a state where all partition regions provided on the object are supported by the first support unit.
- 前記第1駆動部は、前記検出動作が行われた前記複数の区画領域のうちの前記走査露光される区画領域が支持された前記第1支持部内の支持位置が変化するように、前記保持部を前記第1支持部に対して相対駆動する請求項1~3のいずれか一項に記載の露光装置。 The first drive unit includes the holding unit such that a support position in the first support unit in which the partition region to be scanned and exposed among the plurality of partition regions in which the detection operation has been performed is supported is changed. 4. The exposure apparatus according to claim 1, wherein the exposure apparatus is driven relative to the first support portion.
- 前記物体のうち前記第1支持部に支持された領域以外の領域を支持する第2支持部をさらに備える請求項1~4のいずれか一項に記載の露光装置 The exposure apparatus according to any one of claims 1 to 4, further comprising a second support portion that supports a region of the object other than the region supported by the first support portion.
- 前記第1駆動部は、前記検出動作が行われた前記物体の一部が前記第1支持部から前記第2支持部に支持されるように、前記保持部を駆動する請求項5に記載の露光装置。 The said 1st drive part drives the said holding | maintenance part so that a part of said object by which the said detection operation was performed is supported by the said 2nd support part from the said 1st support part. Exposure device.
- 前記第1支持部および前記保持部は、互いに非接触に設けられる請求項1~6のいずれか一項に記載の露光装置。 The exposure apparatus according to any one of claims 1 to 6, wherein the first support part and the holding part are provided in non-contact with each other.
- 前記第1支持部は、前記保持部が保持する前記物体の保持領域とは異なる領域を支持する請求項1~7のいずれか一項に記載の露光装置。 The exposure apparatus according to any one of claims 1 to 7, wherein the first support unit supports a region different from a holding region of the object held by the holding unit.
- 前記第1支持部は、前記物体と前記第1支持部との間に気体を供給する第1給気給孔を有する請求項1~8のいずれか一項に記載の露光装置。 The exposure apparatus according to any one of claims 1 to 8, wherein the first support part has a first air supply hole for supplying gas between the object and the first support part.
- 前記第1支持部は、前記物体と前記第1支持部との間の気体を吸引する吸気孔を有する請求項9に記載の露光装置。 10. The exposure apparatus according to claim 9, wherein the first support part has an intake hole for sucking a gas between the object and the first support part.
- 前記第2方向に関して前記第1支持部の一側及び他側に設けられ、前記物体を支持する第2支持部を備え、
前記第2駆動系は、前記保持部に支持された前記物体を前記第1支持部と第2支持部との一方から他方へ移動させる請求項1~10のいずれか一項に記載の露光装置。 A second support part that is provided on one side and the other side of the first support part with respect to the second direction and supports the object;
The exposure apparatus according to any one of claims 1 to 10, wherein the second drive system moves the object supported by the holding unit from one of the first support unit and the second support unit to the other. . - 前記第2支持部は、前記物体と前記第2支持部との間に気体を供給する第2給気給孔を有する請求項11に記載の露光装置。 12. The exposure apparatus according to claim 11, wherein the second support part has a second air supply hole for supplying gas between the object and the second support part.
- 前記保持部を支持する第3支持部を備え、
前記第3支持部は、上下方向に関して前記第1支持部よりも低い位置に設けられる請求項1~12のいずれか一項に記載の露光装置。 A third support part for supporting the holding part;
The exposure apparatus according to any one of claims 1 to 12, wherein the third support part is provided at a position lower than the first support part in the vertical direction. - 前記保持部の位置情報を求めるエンコーダシステムを更に備え、
前記エンコーダシステムを構成するヘッド及びスケールの少なくとも一方は、前記保持部に設けられる請求項1~13のいずれか一項に記載の露光装置。 An encoder system for obtaining position information of the holding unit;
The exposure apparatus according to any one of claims 1 to 13, wherein at least one of a head and a scale constituting the encoder system is provided in the holding unit. - 前記保持部は、前記物体の外周縁部の少なくとも一部を支持する枠状部材を含む請求項1~14のいずれか一項に記載の露光装置。 The exposure apparatus according to any one of claims 1 to 14, wherein the holding unit includes a frame-shaped member that supports at least a part of an outer peripheral edge of the object.
- 前記物体は、フラットパネルディスプレイに用いられる基板である請求項1~15のいずれか一項に記載の露光装置。 The exposure apparatus according to any one of claims 1 to 15, wherein the object is a substrate used for a flat panel display.
- 前記基板は、少なくとも一辺の長さ又は対角長が500mm以上である請求項16に記載の露光装置。 The exposure apparatus according to claim 16, wherein the substrate has a length of at least one side or a diagonal length of 500 mm or more.
- 請求項1~17のいずれか一項に記載の露光装置を用いて前記物体を露光することと、
露光された前記物体を現像することと、を含むフラットパネルディスプレイの製造方法。 Exposing the object using the exposure apparatus according to any one of claims 1 to 17,
Developing the exposed object. A method of manufacturing a flat panel display. - 請求項1~17のいずれか一項に記載の露光装置を用いて前記物体を露光することと、
露光された前記物体を現像することと、を含むデバイス製造方法。 Exposing the object using the exposure apparatus according to any one of claims 1 to 17,
Developing the exposed object. - 光学系を介して照明光を複数のマークを有する物体に照射して、前記照明光に対して前記物体を相対駆動して前記物体の複数の区画領域をそれぞれ走査露光する露光方法であって、
互いに交差する第1及び第2方向の少なくとも一方の方向に並んで配置された前記複数の区画領域を第1支持部によって非接触支持することと、
前記第1支持部により非接触支持された前記物体を保持部によって保持することと、
前記複数の区画領域に設けられた前記複数のマークを検出部によって検出する検出動作を行なうことと、
前記保持部に保持され、前記検出動作が行われた前記物体の一部が前記第1支持部から外れるように、第1駆動部を用いて前記保持部を前記第1支持部に対して相対駆動させることと、を含む露光方法。 An exposure method that irradiates an object having a plurality of marks through an optical system, drives the object relative to the illumination light, and scans and exposes a plurality of partitioned regions of the object, respectively.
Non-contact support of the plurality of partition regions arranged side by side in at least one of the first and second directions intersecting each other by a first support portion;
Holding the object supported non-contact by the first support part by a holding part;
Performing a detection operation of detecting the plurality of marks provided in the plurality of partition regions by a detection unit;
The first drive unit is used to move the holding unit relative to the first support unit such that a part of the object held by the holding unit and subjected to the detection operation is detached from the first support unit. Driving the exposure method. - 第2駆動部を用いて前記第1支持部を前記第1及び第2方向へ駆動することをさらに含み、
前記第1及び第2駆動部の少なくとも一方を用いて、前記検出系の検出領域内に検出対象の前記複数のマークが位置するように前記保持部を前記検出系に対して移動させる請求項20に記載の露光方法。 Further driving the first support portion in the first and second directions using a second drive portion;
21. The holding unit is moved with respect to the detection system using at least one of the first and second drive units so that the plurality of marks to be detected are positioned within a detection region of the detection system. An exposure method according to 1. - 前記検出部を用いて、前記第1支持部により前記物体に設けられた全ての区画領域が支持された状態で、前記検出動作を行う請求項20又は21に記載の露光方法。 The exposure method according to claim 20 or 21, wherein the detection operation is performed using the detection unit in a state where all the partition regions provided on the object are supported by the first support unit.
- 前記第1駆動部を用いて、前記検出動作が行われた前記複数の区画領域のうちの前記走査露光される区画領域が支持された前記第1支持部内の支持位置が変化するように、前記保持部を前記第1支持部に対して相対駆動する請求項20~22のいずれか一項に記載の露光方法。 Using the first drive unit, the support position in the first support unit where the partition area to be scanned and exposed among the plurality of partition areas in which the detection operation has been performed is supported is changed. The exposure method according to any one of claims 20 to 22, wherein the holding unit is driven relative to the first support unit.
- 前記物体のうち前記第1支持部に支持された領域以外の領域を第2支持部によって支持することをさらに含む請求項20~23のいずれか一項に記載の露光方法。 The exposure method according to any one of claims 20 to 23, further comprising: supporting a region of the object other than the region supported by the first support portion with a second support portion.
- 前記第1駆動部を用いて、前記検出動作が行われた前記物体の一部が前記第1支持部から前記第2支持部に支持されるように、前記保持部を駆動する請求項24に記載の露光方法。 25. The holding unit is driven by using the first driving unit so that a part of the object on which the detection operation has been performed is supported by the second supporting unit from the first supporting unit. The exposure method as described.
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JP6885334B2 (en) | 2021-06-16 |
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