TWI423382B - 防塵薄膜組件剝離用夾具及剝離方法 - Google Patents

防塵薄膜組件剝離用夾具及剝離方法 Download PDF

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Publication number
TWI423382B
TWI423382B TW099122972A TW99122972A TWI423382B TW I423382 B TWI423382 B TW I423382B TW 099122972 A TW099122972 A TW 099122972A TW 99122972 A TW99122972 A TW 99122972A TW I423382 B TWI423382 B TW I423382B
Authority
TW
Taiwan
Prior art keywords
pellicle
peeling
jig
mask
reticle
Prior art date
Application number
TW099122972A
Other languages
English (en)
Chinese (zh)
Other versions
TW201115680A (en
Inventor
Kazutoshi Sekihara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of TW201115680A publication Critical patent/TW201115680A/zh
Application granted granted Critical
Publication of TWI423382B publication Critical patent/TWI423382B/zh

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
TW099122972A 2009-10-29 2010-07-13 防塵薄膜組件剝離用夾具及剝離方法 TWI423382B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009248548A JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法

Publications (2)

Publication Number Publication Date
TW201115680A TW201115680A (en) 2011-05-01
TWI423382B true TWI423382B (zh) 2014-01-11

Family

ID=43957952

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099122972A TWI423382B (zh) 2009-10-29 2010-07-13 防塵薄膜組件剝離用夾具及剝離方法

Country Status (5)

Country Link
JP (1) JP4879308B2 (xx)
KR (1) KR101564115B1 (xx)
CN (1) CN102053482B (xx)
HK (1) HK1155232A1 (xx)
TW (1) TWI423382B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125348B2 (ja) * 2013-06-24 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
US11183410B2 (en) * 2017-04-24 2021-11-23 Photronics, Inc. Pellicle removal tool
CN110756403B (zh) * 2019-10-08 2020-10-02 东莞市欧珀精密电子有限公司 一种显示屏组件擦胶的夹具及其加工方法
CN114641725A (zh) * 2019-12-13 2022-06-17 三井化学株式会社 防护膜组件的拆卸方法及防护膜组件的拆卸前处理装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247651A (ja) * 1989-03-20 1990-10-03 Fujitsu Ltd ペリクル除去装置
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
US20060110664A1 (en) * 2004-11-24 2006-05-25 Shin-Etsu Chemical Co., Ltd. Large pellicle
TW200801821A (en) * 2006-06-14 2008-01-01 Shinetsu Chemical Co Pellicle
TW200919081A (en) * 2007-07-06 2009-05-01 Asahi Kasei Emd Corp Large pellicle frame and a method for holding such a frame

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181036A (ja) * 1988-01-14 1989-07-19 Fujitsu General Ltd 空気調和機の風向調節装置
JP2520964B2 (ja) * 1989-09-25 1996-07-31 本田技研工業株式会社 複数ロ―ラ式シャシ―ダイナモメ―タ
JP4677632B2 (ja) 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
JP2007241204A (ja) * 2006-03-08 2007-09-20 Sigma Meltec Ltd ペリクル剥離方法および装置
JP4637053B2 (ja) 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
JP4999634B2 (ja) 2007-05-08 2012-08-15 松下精機株式会社 ペクリル剥離装置及びその方法
DE102007063383B4 (de) * 2007-12-18 2020-07-02 HAP Handhabungs-, Automatisierungs- und Präzisionstechnik GmbH Vorrichtung und Verfahren zur Entfernung von Pelliclen von Masken

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02247651A (ja) * 1989-03-20 1990-10-03 Fujitsu Ltd ペリクル除去装置
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
US20060110664A1 (en) * 2004-11-24 2006-05-25 Shin-Etsu Chemical Co., Ltd. Large pellicle
TW200801821A (en) * 2006-06-14 2008-01-01 Shinetsu Chemical Co Pellicle
TW200919081A (en) * 2007-07-06 2009-05-01 Asahi Kasei Emd Corp Large pellicle frame and a method for holding such a frame

Also Published As

Publication number Publication date
JP4879308B2 (ja) 2012-02-22
JP2011095453A (ja) 2011-05-12
CN102053482A (zh) 2011-05-11
KR20110047110A (ko) 2011-05-06
KR101564115B1 (ko) 2015-10-28
TW201115680A (en) 2011-05-01
CN102053482B (zh) 2012-11-21
HK1155232A1 (en) 2012-05-11

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