CN102053482B - 防尘薄膜组件剥离用夹具及剥离方法 - Google Patents

防尘薄膜组件剥离用夹具及剥离方法 Download PDF

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Publication number
CN102053482B
CN102053482B CN201010225329XA CN201010225329A CN102053482B CN 102053482 B CN102053482 B CN 102053482B CN 201010225329X A CN201010225329X A CN 201010225329XA CN 201010225329 A CN201010225329 A CN 201010225329A CN 102053482 B CN102053482 B CN 102053482B
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CN
China
Prior art keywords
dustproof film
film component
light shield
adhesive linkage
anchor clamps
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Expired - Fee Related
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CN201010225329XA
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English (en)
Chinese (zh)
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CN102053482A (zh
Inventor
关原一敏
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Publication of CN102053482A publication Critical patent/CN102053482A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201010225329XA 2009-10-29 2010-07-12 防尘薄膜组件剥离用夹具及剥离方法 Expired - Fee Related CN102053482B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009-248548 2009-10-29
JP2009248548A JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法

Publications (2)

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CN102053482A CN102053482A (zh) 2011-05-11
CN102053482B true CN102053482B (zh) 2012-11-21

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CN201010225329XA Expired - Fee Related CN102053482B (zh) 2009-10-29 2010-07-12 防尘薄膜组件剥离用夹具及剥离方法

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JP (1) JP4879308B2 (xx)
KR (1) KR101564115B1 (xx)
CN (1) CN102053482B (xx)
HK (1) HK1155232A1 (xx)
TW (1) TWI423382B (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125348B2 (ja) * 2013-06-24 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
CN110756403B (zh) * 2019-10-08 2020-10-02 东莞市欧珀精密电子有限公司 一种显示屏组件擦胶的夹具及其加工方法
WO2021117816A1 (ja) * 2019-12-13 2021-06-17 三井化学株式会社 ペリクルのデマウント方法、及び、ペリクルのデマウント前処理装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101075088A (zh) * 2006-05-15 2007-11-21 信越化学工业株式会社 防护薄膜组件及防护薄膜组件剥离装置
CN101464626A (zh) * 2007-12-18 2009-06-24 Hap精密技术自动处理有限公司 从掩模板移除护膜的装置和方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181036A (ja) * 1988-01-14 1989-07-19 Fujitsu General Ltd 空気調和機の風向調節装置
JPH02247651A (ja) * 1989-03-20 1990-10-03 Fujitsu Ltd ペリクル除去装置
JP2520964B2 (ja) * 1989-09-25 1996-07-31 本田技研工業株式会社 複数ロ―ラ式シャシ―ダイナモメ―タ
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
JP2006146085A (ja) * 2004-11-24 2006-06-08 Shin Etsu Chem Co Ltd 大型ペリクル
JP4677632B2 (ja) 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
JP2007241204A (ja) * 2006-03-08 2007-09-20 Sigma Meltec Ltd ペリクル剥離方法および装置
JP2007333910A (ja) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd ペリクル
JP4999634B2 (ja) 2007-05-08 2012-08-15 松下精機株式会社 ペクリル剥離装置及びその方法
CN102681334B (zh) * 2007-07-06 2015-09-30 旭化成电子材料株式会社 从容纳容器取出大型表膜构件的取出方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101075088A (zh) * 2006-05-15 2007-11-21 信越化学工业株式会社 防护薄膜组件及防护薄膜组件剥离装置
CN101464626A (zh) * 2007-12-18 2009-06-24 Hap精密技术自动处理有限公司 从掩模板移除护膜的装置和方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP特开2007-17811A 2007.01.25
JP特开2007-241204A 2007.09.20
JP特开2008-304886A 2008.12.18

Also Published As

Publication number Publication date
JP4879308B2 (ja) 2012-02-22
KR20110047110A (ko) 2011-05-06
JP2011095453A (ja) 2011-05-12
TWI423382B (zh) 2014-01-11
KR101564115B1 (ko) 2015-10-28
CN102053482A (zh) 2011-05-11
HK1155232A1 (en) 2012-05-11
TW201115680A (en) 2011-05-01

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