HK1155232A1 - Pellicle peeling jig and peeling method - Google Patents

Pellicle peeling jig and peeling method

Info

Publication number
HK1155232A1
HK1155232A1 HK11109232.6A HK11109232A HK1155232A1 HK 1155232 A1 HK1155232 A1 HK 1155232A1 HK 11109232 A HK11109232 A HK 11109232A HK 1155232 A1 HK1155232 A1 HK 1155232A1
Authority
HK
Hong Kong
Prior art keywords
peeling
pellicle
jig
peeling method
peeling jig
Prior art date
Application number
HK11109232.6A
Other languages
English (en)
Inventor
Kazutoshi Sekihara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of HK1155232A1 publication Critical patent/HK1155232A1/xx

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK11109232.6A 2009-10-29 2011-09-01 Pellicle peeling jig and peeling method HK1155232A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009248548A JP4879308B2 (ja) 2009-10-29 2009-10-29 ペリクル剥離用冶具および剥離方法

Publications (1)

Publication Number Publication Date
HK1155232A1 true HK1155232A1 (en) 2012-05-11

Family

ID=43957952

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11109232.6A HK1155232A1 (en) 2009-10-29 2011-09-01 Pellicle peeling jig and peeling method

Country Status (5)

Country Link
JP (1) JP4879308B2 (xx)
KR (1) KR101564115B1 (xx)
CN (1) CN102053482B (xx)
HK (1) HK1155232A1 (xx)
TW (1) TWI423382B (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125348B2 (ja) * 2013-06-24 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6376601B2 (ja) * 2015-05-18 2018-08-22 信越化学工業株式会社 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
CN110756403B (zh) * 2019-10-08 2020-10-02 东莞市欧珀精密电子有限公司 一种显示屏组件擦胶的夹具及其加工方法
WO2021117816A1 (ja) * 2019-12-13 2021-06-17 三井化学株式会社 ペリクルのデマウント方法、及び、ペリクルのデマウント前処理装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181036A (ja) * 1988-01-14 1989-07-19 Fujitsu General Ltd 空気調和機の風向調節装置
JPH02247651A (ja) * 1989-03-20 1990-10-03 Fujitsu Ltd ペリクル除去装置
JP2520964B2 (ja) * 1989-09-25 1996-07-31 本田技研工業株式会社 複数ロ―ラ式シャシ―ダイナモメ―タ
JP2002131892A (ja) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd ペリクルの剥離方法及びその装置
JP2006146085A (ja) * 2004-11-24 2006-06-08 Shin Etsu Chem Co Ltd 大型ペリクル
JP4677632B2 (ja) 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
JP2007241204A (ja) * 2006-03-08 2007-09-20 Sigma Meltec Ltd ペリクル剥離方法および装置
JP4637053B2 (ja) * 2006-05-15 2011-02-23 信越化学工業株式会社 ペリクルおよびペリクル剥離装置
JP2007333910A (ja) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd ペリクル
JP4999634B2 (ja) 2007-05-08 2012-08-15 松下精機株式会社 ペクリル剥離装置及びその方法
CN102681334B (zh) * 2007-07-06 2015-09-30 旭化成电子材料株式会社 从容纳容器取出大型表膜构件的取出方法
DE102007063383B4 (de) * 2007-12-18 2020-07-02 HAP Handhabungs-, Automatisierungs- und Präzisionstechnik GmbH Vorrichtung und Verfahren zur Entfernung von Pelliclen von Masken

Also Published As

Publication number Publication date
JP4879308B2 (ja) 2012-02-22
KR20110047110A (ko) 2011-05-06
JP2011095453A (ja) 2011-05-12
TWI423382B (zh) 2014-01-11
KR101564115B1 (ko) 2015-10-28
CN102053482A (zh) 2011-05-11
CN102053482B (zh) 2012-11-21
TW201115680A (en) 2011-05-01

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180712