HK1155232A1 - Pellicle peeling jig and peeling method - Google Patents

Pellicle peeling jig and peeling method

Info

Publication number
HK1155232A1
HK1155232A1 HK11109232.6A HK11109232A HK1155232A1 HK 1155232 A1 HK1155232 A1 HK 1155232A1 HK 11109232 A HK11109232 A HK 11109232A HK 1155232 A1 HK1155232 A1 HK 1155232A1
Authority
HK
Hong Kong
Prior art keywords
peeling
pellicle
jig
peeling method
peeling jig
Prior art date
Application number
HK11109232.6A
Inventor
Kazutoshi Sekihara
Original Assignee
Shinetsu Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Chemical Co filed Critical Shinetsu Chemical Co
Publication of HK1155232A1 publication Critical patent/HK1155232A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK11109232.6A 2009-10-29 2011-09-01 Pellicle peeling jig and peeling method HK1155232A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009248548A JP4879308B2 (en) 2009-10-29 2009-10-29 Pellicle stripping jig and stripping method

Publications (1)

Publication Number Publication Date
HK1155232A1 true HK1155232A1 (en) 2012-05-11

Family

ID=43957952

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11109232.6A HK1155232A1 (en) 2009-10-29 2011-09-01 Pellicle peeling jig and peeling method

Country Status (5)

Country Link
JP (1) JP4879308B2 (en)
KR (1) KR101564115B1 (en)
CN (1) CN102053482B (en)
HK (1) HK1155232A1 (en)
TW (1) TWI423382B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6125348B2 (en) * 2013-06-24 2017-05-10 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing apparatus and substrate processing method
JP6376601B2 (en) * 2015-05-18 2018-08-22 信越化学工業株式会社 Pellicle support means, pellicle support apparatus and pellicle mounting method using the same
US11183410B2 (en) * 2017-04-24 2021-11-23 Photronics, Inc. Pellicle removal tool
CN110756403B (en) * 2019-10-08 2020-10-02 东莞市欧珀精密电子有限公司 Clamp for gluing display screen assembly and processing method thereof
US20220365422A1 (en) * 2019-12-13 2022-11-17 Mitsui Chemicals, Inc. Pellicle demounting method and pellicle demounting preprocessing device

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01181036A (en) * 1988-01-14 1989-07-19 Fujitsu General Ltd Air flow direction adjusting device of air conditioner
JPH02247651A (en) * 1989-03-20 1990-10-03 Fujitsu Ltd Pellicle removing device
JP2520964B2 (en) * 1989-09-25 1996-07-31 本田技研工業株式会社 Multiple roller chassis dynamometer
JP2002131892A (en) * 2000-10-27 2002-05-09 Asahi Kasei Electronics Co Ltd Method for removing pellicle and apparatus for it
JP2006146085A (en) * 2004-11-24 2006-06-08 Shin Etsu Chem Co Ltd Large pellicle
JP4677632B2 (en) 2005-07-08 2011-04-27 レーザーテック株式会社 Pellicle liner or pellicle peeling apparatus, peeling method, and pattern substrate manufacturing method
JP2007241204A (en) * 2006-03-08 2007-09-20 Sigma Meltec Ltd Method and device for peeling pellicle
JP4637053B2 (en) * 2006-05-15 2011-02-23 信越化学工業株式会社 Pellicle and pellicle peeling device
JP2007333910A (en) * 2006-06-14 2007-12-27 Shin Etsu Chem Co Ltd Pellicle
JP4999634B2 (en) 2007-05-08 2012-08-15 松下精機株式会社 Pecryl peeling apparatus and method
KR101264571B1 (en) * 2007-07-06 2013-05-14 아사히 가세이 이-매터리얼즈 가부시키가이샤 Frame of large pellicle and grasping method of frame
DE102007063383B4 (en) * 2007-12-18 2020-07-02 HAP Handhabungs-, Automatisierungs- und Präzisionstechnik GmbH Device and method for removing pellicles from masks

Also Published As

Publication number Publication date
KR101564115B1 (en) 2015-10-28
JP2011095453A (en) 2011-05-12
JP4879308B2 (en) 2012-02-22
TW201115680A (en) 2011-05-01
CN102053482A (en) 2011-05-11
CN102053482B (en) 2012-11-21
KR20110047110A (en) 2011-05-06
TWI423382B (en) 2014-01-11

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180712