TWI423382B - Pellicle peeling jig and peeling method - Google Patents

Description

Dust film assembly peeling jig and peeling method

The present invention relates to a pellicle for use as a dustproof device in the manufacture of a semiconductor device, a printed substrate, or a liquid crystal display.

In the manufacturing process of a semiconductor device such as an LSI or a super LSI, or a liquid crystal display, a semiconductor wafer or a liquid crystal original plate is irradiated with light to form a pattern, but a mask such as a preliminary mask used at this time is used. If dust adheres, the dust absorbs light and reflects the light. In addition to deforming the transferred pattern and roughening the edges, the substrate is stained and the size, quality, appearance, and the like are damaged.

Therefore, these operations are usually carried out in a clean room, but even so, it is still quite difficult to keep the mask clean. Then, the pellicle is attached to the surface of the photomask as a dustproof device, and then exposed. At this time, the foreign matter is not directly attached to the surface of the mask, but is attached to the pellicle assembly, so that the foreign matter on the pellicle assembly is not caused by the transfer as long as the focus is on the pattern of the mask during the lithography. influences.

In general, the pellicle film is attached or bonded to a transparent pellicle made of nitrocellulose, cellulose acetate or fluororesin having good light transmittance, such as aluminum, stainless steel, or polyethylene. The upper end surface of the constructed pellicle frame. Then, at the lower end of the pellicle frame, a bonding layer made of a material such as polybutylene resin, polyvinyl acetate resin, or acrylic resin is attached to the photomask, and the protective layer is protected. Release layer (isolation).

Then, the pellicle is attached to the reticle, usually by a dedicated device or jig. Regardless of the device, the basic actions are common. After adjusting the positional relationship between the pellicle and the reticle, the pellicle frame is placed in parallel with the reticle and pressurized for a period of time to protect it from dust. Thin film assembly.

The pellicle attached to the reticle must be peeled off if there is a reason to replace it. Conventionally, as shown in FIG. 3, a peeling jig having a thin projection at the front end is inserted into the portion of the mask adhesive layer 33 between the pellicle frame 32 and the photomask 31 from the outside, by the principle of leverage. The pellicle frame 32 is peeled off, or a pin-shaped jig is inserted into a circular hole provided on the outer side surface of the pellicle frame to peel off the pellicle frame 32.

These methods are simple and easy to peel off the pellicle film assembly, but since the force exerting a greater adhesive force than the reticle bonding layer barely peels the pellicle film from the reticle surface, The residue of the mask bonding layer remaining on the mask becomes large, and the subsequent cleaning step can be troublesome. In addition, when the pellicle is peeled off from the reticle, the mask adhesive layer may be offset to adhere to the pattern of the reticle, and the pattern may be damaged or contaminated. Therefore, when the side of the pellicle is long and belongs to a large pellicle, it cannot be peeled off at all, and a part of it must be peeled off, and it must be considered how to prevent the peeled portion from being re-adhered again. Therefore, the work efficiency is very poor.

On the other hand, there is a method of removing the entire adhesive layer without damaging the adhesive layer (Patent Document 1). In this method, the residue of the adhesive layer is small after peeling, and although it is a good method, it can be used, but it is limited to an adhesive which is not easily broken and broken when stretched, and finally, a pellicle film when peeling off the adhesive layer. Since the component frame is completely free to move and thus moves in the lateral direction, the pellicle frame is particularly likely to cause damage to the pattern surface.

For example, regardless of the method of peeling off the pellicle, the pellicle frame must be fixed at the time of peeling to prevent the positional deviation, and the pellicle is peeled off while being fixed so that its position does not move. It is quite difficult. When the hand is pressed, the work efficiency is also lowered, and the reliability is still problematic.

Therefore, there has also been disclosed a device for performing the peeling operation (Patent Document 2). Secure the pellicle frame with a strong gripping member and then peel it off the reticle. However, the device tends to become larger. Therefore, the method of peeling off the pellicle assembly with care by hand while still being used is still in the mainstream, but the risk of damage to the reticle is still high, and the production efficiency is very poor.

[Advanced technical literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 09-068792

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2009-151306

The problem to be solved by the present invention is to provide a simple pellicle for peeling off a pellicle film assembly and a peeling method which can be attached to a reticle in a manner that does not damage the pattern surface, is safe, simple, and has a short working time. The pellicle assembly is peeled off from the reticle.

The pellicle for peeling off the pellicle of the present invention comprises: a fixing member for fixing the jig to the photomask; and an adhesive layer (hereinafter referred to as "clamp bonding layer") for fixing the jig to the pellicle film And the peeling operation is performed so that the positional relationship between the pellicle and the reticle is fixed.

Preferably, the fixing member for fixing the jig to the photomask is constituted by the first arm portion and the second arm portion, and the first arm portion includes an abutting surface that abuts against the photomask, and the second arm portion has a push In the pressing member, the pressing member of the second arm portion presses the reticle to the abutting surface of the first arm portion to fix the jig to the reticle. The pressing member is preferably a threaded member.

The adhesive forming the bonding layer of the jig is preferably a silicone resin.

The peeling method of the pellicle according to the present invention is to fix the photomask and the pellicle assembly by the above-mentioned pellicle for peeling off the pellicle assembly of the present invention, and then pull out the mask adhesive layer between the pellicle and the photomask. Remove the method to peel off the pellicle.

The pellicle assembly peeling jig of the present invention fixes the pellicle assembly together with the reticle to fix the positional relationship between the pellicle and the reticle. In this state, the mask adhesive layer that bonds the photomask to the pellicle assembly is removed. Thereafter, the fixing between the photomask and the pellicle peeling jig is released, and the pellicle assembly is removed from the photomask while being attached to the jig bonding layer.

According to the present invention, since the position of the pellicle is maintained on the reticle during the removal operation of the mask adhesive layer, it does not contact the pattern surface of the reticle and is damaged. Pattern surface. Further, after the mask adhesive layer is removed, the fixing between the photomask and the pellicle peeling jig can be released, and the pellicle assembly can be moved from the photomask to another place while still attached to the jig. go with. When moving, the pellicle assembly does not come into contact with the pattern surface of the reticle. Therefore, according to the present invention, the pellicle assembly can be removed in a safe and easy manner, and the work can be completed in a short time without increasing the number of persons.

In particular, when a silicone resin is used as the adhesive for forming the jig adhesive layer, even if the pellicle is made of a fluororesin, it can be bonded and fixed, and the jig is bonded to the jig for peeling the used pellicle. In the case of the layer, almost no residue (adhesive residue) after peeling remains.

Hereinafter, the embodiments of the present invention will be described, but the present invention is not limited thereto. Further, the present invention is particularly effective for a large-sized pellicle having a length of more than 500 mm, which is used for liquid crystal manufacturing applications. However, it is also effective for use in a small pellicle module of about 150 mm for use in semiconductor applications. There is no particular limitation.

Fig. 1 shows an embodiment of a pellicle for peeling off a pellicle according to the present invention and a state of use thereof.

As shown in Fig. 1(b), the pellicle chip peeling jig 10 is disposed above the pellicle film assembly 12 and the photomask 11, and the first arm portion 14a is provided at both ends of the base portion 13 of the pellicle chip peeling jig. The second arm portion 14b serves as a fixing member for fixing the jig to the photomask, and the first arm portion 14a has an abutting surface that abuts against the outer periphery of the photomask 11, and the second arm portion 14b has a pressing force. The threaded member 14c of the member. The first arm portion 14a is a positioning reference of the mask, and the screw member 14c of the second arm portion 14b presses the mask to abut against the abutting surface of the first arm portion 14a, and the holder can be fixed to the mask. Up and position the mask.

In this embodiment, the pressing member is constituted by the screw member 14c, but any member can be used as the pressing member as long as it can push the reticle.

The surface of the opposing pellicle 12 of the base portion 13 is provided with a jig bonding layer 16 via a base member 17, and a handle 15 is provided at an upper portion of the base portion 13.

The base portion 13 can be made of a rigid material such as engineering plastic or metal.

In this embodiment, the base portion 13 has a frame shape as shown in Fig. 1(a). However, if the base portion 13 can be surely provided with sufficient rigidity and bonding area to fix and hold the pellicle assembly 12 and the reticle 11, the base portion is What kind of shape is OK. For example, a flat member may be used as the base, or a member in which the flat member is attached under the frame member may be used as the base.

The jig bonding layer 16 may be directly provided on the bottom surface of the base without interposing the base member 17.

Further, in the embodiment, the fixing member for the mask is disposed so as to fix only the short axis direction of the mask, but it is also possible to fix only the long axis direction or the two directions perpendicular to each other.

The adhesive constituting the jig bonding layer 16 is not particularly limited, and may be determined by the adhesiveness of the pellicle film 12a to be bonded, and an acrylic resin, an epoxy resin, a silicone resin, or the like may be used. Oxygenated resin.

The epoxy resin can also be bonded and fixed in the case where the dustproof film is a fluororesin. In addition, since the pellicle for peeling off the pellicle is used once, the pellicle film or the like adheres to the jig bonding layer, so it is necessary to peel it off and replace the new jig bonding layer, because the silicone resin is stretched. It is not easily broken, so there is almost no residue (adhesive residue) after peeling, and the workability is excellent.

In the method of forming the jig bonding layer 16, the adhesive may be directly applied to the base 13, but if an adhesive is applied to both sides of a thin film such as PET to form an adhesive layer, and the two-sided film is formed When the material-like member is cut to a desired size and then attached and utilized, the work efficiency is better.

The base member 17 is a plate-shaped member provided for the purpose of adjusting the height between the base and the pellicle frame 12b, preventing damage to the member such as the mask 11, and adjusting the adhesive force. When the adhesion of the adhesive layer 16 to the pellicle film 12a is poor, the use of a soft resin such as rubber as the plate-like member improves the adhesion, and the adhesive strength can be adjusted by adjusting the size and shape. The base member 17 preferably has antistatic properties to prevent docking The near reticle causes electrostatic damage.

The material of the first arm portion and the second arm portion is not required. However, in order to have sufficient rigidity for fixing, and the mask is not damaged by contact, it is preferable to use a resin, and it is preferable to reduce the adhesion of foreign matter as much as possible. Anti-static properties to prevent electrostatic damage to the pattern surface of the mask, it is recommended to use conductive MC resistant, conductive PEEK, conductive HDPE and other materials.

It is preferable that all of the other members constituting the pellicle for peeling off the pellicle film, such as the base portion 13, the handle 15, and the jig bonding layer, are made of a material having antistatic properties to prevent electrostatic breakdown of the photomask or to prevent static electricity from being carried by the operator.

Next, a peeling method of the pellicle film assembly using the pellicle chip peeling jig will be described with reference to FIG.

First, as shown in Fig. 2(a), the screw member 14c of the second arm portion 14b is retracted, and the handle 15 is gripped, and the first arm portion 14a is placed on the pellicle assembly while being in contact with the end of the mask 11. Above 12. Then, finally, as shown in Fig. 2(b), the jig bonding layer 16 provided on the bottom surface of the base portion 13 is directly bonded to the uppermost portion of the pellicle film assembly 12, that is, the pellicle film 12a. In this state, the screw member 14c of the second arm portion 14b is locked, and the pellicle assembly peeling jig 10 fixes the mask 11.

Next, the mask adhesive layer 12c is removed. In the embodiment of Fig. 2 (c-1), the mask adhesive layer 12c is sandwiched and pulled out from the outside of the pellicle frame 12b by the tweezers 28. By pulling it out along the entire circumference like this, the adhesive layer can be completely removed. Further, as shown in Fig. 2 (c-2), the adhesive substance 29b is adhered to the surface of the thin plate 29a such as stainless steel or resin to form the adhesive layer drawing jig 29, which is removed from the pellicle film. The outside of the module frame 12b is inserted, and the method of attaching the mask bonding layer 12c to the outside is also effective. Further, when the mask adhesive layer 12c is hard to be pulled out, the mask adhesive layer 12c may be softened while using a heat gun (not shown) or the like to apply FIG. 2(c-1), Method of c-2).

If the entire mask adhesive layer 12c is completely removed, the pellicle film assembly 12 is adhered and held by the jig bonding layer 16 of the pellicle assembly peeling jig 10 without being moved, and is held in the reticle 11 The state of being lifted off and suspended. after that, As shown in Fig. 2(d), the screw member 14c of the second arm portion 14b is retracted to be released, and the gripper 15 is grasped to lift the pellicle chip peeling jig 10 upward, and the pellicle assembly 12 is bonded thereto. The pellicle is peeled off from the jig 10 and completely separated from the photomask 11. During this series of operations, the pellicle assembly 12 does not contact the reticle 11 at all, so that the reticle can be completely prevented from being damaged. Then, finally, the pellicle film assembly 12 adhered to the jig bonding layer 16 of the pellicle of the pellicle is peeled off in a safe place, and the new jig bonding layer 16 is attached to prepare for the next work.

[Examples]

The embodiments of the present invention are described below, but the present invention is not limited thereto.

A pellicle for peeling off the pellicle film assembly having the structure shown in Fig. 1 was produced. The base portion 13 is formed into a frame shape by a pressed hollow material of A6063 aluminum alloy having a cross section of 30 mm × 30 mm, and the first arm portion 14a and the second arm portion 14b made of the antistatic ultrahigh molecular polyethylene are attached to both ends thereof. . A screw member 14c having antistatic MC resistance as a material is attached to the second arm portion 14b. Further, a handle 15 made of an antistatic resin is attached to the base portion 13.

Then, a base member 17 made of an antistatic PVC is provided under the base 13. Then, a tantalum-oxygen adhesive (trade name: KR3700/manufactured by Shin-Etsu Chemical Co., Ltd.) was applied to both surfaces of a PET film having a thickness of 100 μm, and the film thickness after drying was 50 μm, which was cut into the base member 17 after heat curing. The shape is attached to the bottom surface of the base member 17 to form the adhesive layer 16.

The pellicle 10 for peeling the pellicle film assembly thus produced is fixed to the photomask 11 to which the pellicle film assembly 12 is attached, and the state of FIG. 1 is formed. Here, the photomask 11 is a member made of quartz glass of 1100 mm × 1620 mm × 17 mm, and the outer diameter of the pellicle film assembly 12 is 1068 mm × 1526 mm, the inner dimension is 1031 mm × 1490 mm, the height is 8 mm, and the material of the pellicle film is fluororesin. The pellicle frame is a member made of A5052 aluminum alloy, and the mask bonding layer is composed of a niobium oxide adhesive.

Fixing as shown in Fig. 2(a) starts from a state in which the screw member 14c of the second arm portion 14b is retracted. After confirming that the jig bonding layer 16 and the pellicle film 12a have been surely bonded to fix the pellicle assembly, the screw member 14c of the second arm portion 14b is used. The shutter 11 is fixed by the jig 10 for peeling off the pellicle. Next, as shown in FIG. 2(c-2), the adhesive layer drawing jig 29 of the niobium oxide adhesive 29b is applied onto the stainless steel thin plate 29a having a thickness of 0.5 mm from the outside of the mask adhesive layer 12c. The mask bonding layer 12c is bonded and pulled out. Thereafter, the pulling operation is continued to remove the entire surrounding bonding layer.

At this time, if the pull-out length of the mask adhesive layer is too long, it becomes difficult to handle, so when the length reaches 30-40 cm, the scissors are cut and the work is continued. Further, when such work is performed, a static eliminator is provided above to prevent electrostatic damage to the reticle due to static electricity in all operations.

Then, after the completion of the mask bonding layer removal operation, the screw member 14c on the first arm portion 14b is loosened, and the two workers grasp the handlebar 15 and lift it upward upward, and the entire pellicle assembly 12 is removed from the light. The cover 11 is removed.

After that, the surrounding illumination was turned off, and the surface of the mask was inspected with a halogen lamp with an illumination of 300,000 Lx. The portion of the mask bonded to the adhesive layer was slightly stained, and the other portions were not damaged, and remained in a very clean state.

In addition, the adhered stain (residue of the adhesive) can be easily removed by wiping with an organic solvent (trade name: Isopar E, manufactured by Exxon Mobil Co., Ltd.). In these operations, not only is there no fear of damage to the reticle, but even a very large pellicle module such as this embodiment has an operation time of only about 10 minutes, and is extremely efficient.

Then, after all the peeling operations are completed, the pellicle film assembly 12 is removed from the pellicle peeling jig 10 in a safe place away from the reticle, and the new jig bonding layer 16 is replaced, which takes up to 5 times. Minutes.

[Comparative example]

The pellicle film assembly and the photomask which are the same as those of the above-described embodiment are subjected to a peeling operation by the peeling jig 30 shown in Fig. 3 . The peeling jig 30 is inserted into the lower end of the pellicle frame 32 to peel off the pellicle. The operation peeling jig 30 peels off the mask adhesive layer 33 from the surface of the photomask 31, and lifts the pellicle frame 32, but since it cannot be completely peeled off along the entire circumference of the frame, if it is retracted The peeling jig 30 is bonded to the mask 31 again. Therefore, it must The operation is performed while the peeled portion is sandwiched between the small pieces of the resin sheet, and the operation is continued along the entire periphery of the pellicle assembly until the entire peeling is completed.

At this time, in order to prevent the surface of the mask 31 from being damaged by the movement of the pellicle frame 32 on the mask 31, the operator is placed at each corner portion (not shown) of the pellicle frame 32, and in order to prevent the offset, It is necessary to work while pressing the pellicle frame 32. Then, after all of the mask adhesive layer 33 is peeled off, the operator simultaneously lifts the pellicle frame 32 from the photomask 31 and moves it to a safe place.

The number of people required for this operation is 4 persons who are pressed against the pellicle module outside the peeling operator, and at least 5 people must be required. The time required is about 1 hour, and the production efficiency is very poor. In addition, the pellicle has always been in danger of coming into contact with the reticle, and it is also very bad in quality management of work.

10‧‧‧Pneumatic film assembly peeling fixture

11, 31‧‧‧ mask

12‧‧‧Dust film assembly

12a‧‧‧Dust film

12b, 32‧‧‧Plastic membrane assembly frame

12c, 33‧‧‧ mask bonding layer

13‧‧‧ base

14a‧‧‧1st arm

14b‧‧‧2nd arm

14c‧‧‧Threaded components

15‧‧‧handle

16‧‧‧Jig bonding layer

17‧‧‧Base member

28‧‧‧镊子

29‧‧‧Adhesive layer pull-out fixture

29a‧‧‧Sheet

29b‧‧‧Adhesive substances

30‧‧‧Removal fixture

A-A‧‧‧ hatching

Part B‧‧‧

1(a) to 1(c) are views showing an embodiment of a pellicle for separating a pellicle according to the present invention and a state of use thereof, wherein (a) is a plan view and (b) is a cross-sectional view taken along line AA, (c) ) A magnified view of part B.

2(a) to 2(d) are explanatory views showing a peeling method of the pellicle according to the present invention.

Fig. 3 is an explanatory view showing an embodiment of a peeling method of a conventional pellicle.

10. . . Pneumatic film assembly peeling jig

11. . . Mask

12. . . Dust-proof film assembly

12a. . . Dust film

12b. . . Dust-proof film assembly frame

12c. . . Mask bonding layer

13. . . Base

14a. . . First arm

14b. . . Second arm

14c. . . Threaded member

15. . . Handle

16. . . Fixture bonding layer

17. . . Base member

A-A. . . Section line

B. . . section

Claims (5)

A pellicle for peeling off a pellicle, which is used when peeling a pellicle from a photomask, comprising: a fixing member for fixing the jig to the photomask; and an adhesive layer for holding the jig It is fixed to the pellicle assembly, and is peeled off so that the positional relationship between the pellicle and the reticle is fixed. The pellicle for peeling off the pellicle according to the first aspect of the invention, wherein the fixing member is composed of a first arm portion and a second arm portion, and the first arm portion includes an abutting surface that abuts against the photomask. The second arm portion includes a pressing member, and the pressing member of the second arm portion presses the reticle against the abutting surface of the first arm portion to fix the jig to the reticle. The pellicle for peeling off the pellicle according to the second aspect of the invention, wherein the pressing member is a screw member. The pellicle for peeling off the pellicle according to any one of the first to third aspects, wherein the adhesive for forming the adhesive layer is a silicone resin. A method for peeling off a pellicle film for peeling a pellicle film attached to a reticle by a mask adhesive layer from a reticle, characterized by using any one of claims 1 to 4 The pellicle peeling jig is fixed to fix the photomask and the pellicle assembly, and then the mask adhesive layer is pulled out and removed.