JP2011095453A - Tool and method for separating pellicle - Google Patents

Tool and method for separating pellicle Download PDF

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JP2011095453A
JP2011095453A JP2009248548A JP2009248548A JP2011095453A JP 2011095453 A JP2011095453 A JP 2011095453A JP 2009248548 A JP2009248548 A JP 2009248548A JP 2009248548 A JP2009248548 A JP 2009248548A JP 2011095453 A JP2011095453 A JP 2011095453A
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pellicle
photomask
jig
adhesive layer
peeling
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JP4879308B2 (en
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Kazutoshi Sekihara
一敏 関原
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2009248548A priority Critical patent/JP4879308B2/en
Priority to KR1020100045927A priority patent/KR101564115B1/en
Priority to CN201010225329XA priority patent/CN102053482B/en
Priority to TW099122972A priority patent/TWI423382B/en
Publication of JP2011095453A publication Critical patent/JP2011095453A/en
Priority to HK11109232.6A priority patent/HK1155232A1/en
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a simple tool easily and safely separating pellicle mounted to a photo mask, and to provide a separating method. <P>SOLUTION: The mutual positional relation between the photo mask and the pellicle is fixed by the pellicle separating tool including a fixing member for the photo mask and an adhesive layer for the pellicle, and in the fixed state, a mask adhesive layer is extracted and removed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、半導体デバイス、プリント基板あるいは液晶ディスプレイ等を製造する際のゴミよけとして使用されるペリクルに関するものである。   The present invention relates to a pellicle used as a dust guard when manufacturing a semiconductor device, a printed circuit board, a liquid crystal display, or the like.

LSI、超LSIなどの半導体製造或は液晶ディスプレイ等の製造においては、半導体ウエハーあるいは液晶用原板に光を照射してパターンを作製するが、この時に用いるレチクル等のフォトマスクにゴミが付着していると、このゴミが光を吸収したり光を曲げてしまうために、転写したパターンが変形したり、エッジががさついたものとなるほか、下地が黒く汚れたりするなど、寸法、品質、外観などが損なわれるという問題があった。   In the manufacture of semiconductors such as LSI and VLSI, or liquid crystal displays, patterns are created by irradiating light onto a semiconductor wafer or liquid crystal master, but dust adheres to the reticle or other photomask used at this time. If this is the case, the dust will absorb light or bend the light, so the transferred pattern will be deformed, the edges will be rough, the ground will be black, etc. There was a problem that was damaged.

このため、これらの作業は通常クリーンルームで行われているが、それでもフォトマスクを常に清浄に保つことが難しい。そこで、フォトマスク表面にゴミよけとしてペリクルを貼り付けした後に露光を行っている。この場合、異物はフォトマスクの表面には直接付着せず、ペリクル上に付着するため、リソグラフィー時に焦点をフォトマスクのパターン上に合わせておけば、ペリクル上の異物は転写に無関係となる。 For this reason, these operations are usually performed in a clean room, but it is still difficult to keep the photomask clean. Therefore, exposure is performed after a pellicle is attached to the surface of the photomask to prevent dust. In this case, the foreign matter does not adhere directly to the surface of the photomask but adheres to the pellicle. Therefore, if the focus is set on the pattern of the photomask during lithography, the foreign matter on the pellicle becomes irrelevant to the transfer.

一般に、ペリクルは、光を良く透過させるニトロセルロース、酢酸セルロースあるいはフッ素樹脂などからなる透明なペリクル膜を、アルミニウム、ステンレス、ポリエチレンなどからなるペリクルフレームの上端面に接着剤によって貼り付ける。さらに、ペリクルフレームの下端にはフォトマスクに装着するためのポリブデン樹脂、ポリ酢酸ビニル樹脂、アクリル樹脂、シリコーン樹脂等からなるマスク粘着層、及び粘着層の保護を目的とした離型シート(セパレータ)が設けられる。   In general, a pellicle has a transparent pellicle film made of nitrocellulose, cellulose acetate, fluororesin, or the like that transmits light well, and is attached to an upper end surface of a pellicle frame made of aluminum, stainless steel, polyethylene, or the like with an adhesive. Furthermore, at the lower end of the pellicle frame, a mask adhesive layer made of polybutene resin, polyvinyl acetate resin, acrylic resin, silicone resin, etc. for mounting on a photomask, and a release sheet (separator) for the purpose of protecting the adhesive layer Is provided.

そして、フォトマスクへのペリクルの貼付は、通常、専用の装置または冶具により行われる。どのような装置でも基本的な動作は共通で、ペリクル、フォトマスク相互の位置関係を調整した後、ペリクルフレームをフォトマスクと平行に一定時間加圧することでペリクルが貼り付けられる。   The pellicle is usually attached to the photomask with a dedicated device or jig. The basic operation is the same in any apparatus. After adjusting the positional relationship between the pellicle and the photomask, the pellicle is attached by pressing the pellicle frame in parallel with the photomask for a certain period of time.

フォトマスクへ貼付した後のペリクルは、何らかの理由で貼替えが必要になれば剥離しなければならない。従来は、図3に示すように、ペリクルフレーム32とフォトマスク31の間のマスク粘着層33の部分に、先端に薄い突起を持つ剥離用治具を外側から差し込んで梃子の原理でペリクルフレーム32を持ち上げて剥離したり、ペリクルフレーム外側面に設けた丸孔にピン状の治具を差し込んでペリクルフレーム32を持ち上げて剥離する方法などが行われてきた。   The pellicle after being attached to the photomask must be peeled off if it is necessary to change the pellicle for some reason. Conventionally, as shown in FIG. 3, a peeling jig having a thin protrusion at the tip is inserted from the outside into a portion of the mask adhesive layer 33 between the pellicle frame 32 and the photomask 31, and the pellicle frame 32 is based on the principle of leverage. And a method of lifting and peeling the pellicle frame 32 by inserting a pin-shaped jig into a round hole provided on the outer surface of the pellicle frame.

これらの手法は簡便で、容易にペリクルを剥離することができるが、フォトマスク粘着層の粘着力以上の力を加えて無理やりフォトマスク表面からペリクルを引き剥がすため、フォトマスク上に残るマスク粘着層の残渣が多くなり、その後の洗浄が大変になるという問題がある。また、フォトマスク上からペリクルを剥離した際にマスク粘着層がずれてフォトマスクのパターン上にくっついてしまい、パターンを傷つけたり汚染したりする恐れもある。そのうえ、ペリクルの辺長が長い大型のペリクルの場合には一気に全てを剥離できないため、一部分づつ剥離していかなくてはならないが、先に剥離した部分が再び粘着しないような考慮が必要となり、作業性が悪い。 These methods are simple and can easily peel off the pellicle, but because the pellicle is forcibly peeled off from the photomask surface by applying a force greater than the adhesive strength of the photomask adhesive layer, the mask adhesive layer that remains on the photomask There is a problem that the amount of residue increases and subsequent cleaning becomes difficult. Further, when the pellicle is peeled from the photomask, the mask adhesive layer is displaced and sticks onto the photomask pattern, which may damage or contaminate the pattern. In addition, in the case of a large pellicle with a long side length of the pellicle, it is impossible to peel all at once, so it must be peeled off part by part, but it is necessary to consider that the part that was peeled off does not stick again, Workability is poor.

一方、粘着層を破断させず一体のまま引きずりだして除去するという方法もある(特許文献1)。この方法は剥離後の粘着層の残渣が少なくなるため好適であるが、適用できるのが、引っ張った際に破断しにくい粘着剤に限定される他、最後に粘着層がはがれた際にペリクルフレームが完全に自由になり、横方向へ動いてしまうため、ペリクルフレームによるパターン面損傷の恐れが特に大きい。 On the other hand, there is a method of dragging and removing the adhesive layer as it is without breaking (Patent Document 1). This method is suitable because there is less residue of the adhesive layer after peeling, but it can be applied only to adhesives that do not easily break when pulled, and the pellicle frame when the adhesive layer is finally peeled off Is completely free and moves in the lateral direction, and there is a particularly high risk of damage to the pattern surface by the pellicle frame.

このように、いずれのペリクル剥離方法においても、ペリクルフレームは剥離する際に位置ずれしないよう固定しておく必要があるが、ペリクルを剥離しながら、一方では位置が移動しないよう固定するのは実際にはかなり困難である。手で押さえる場合は作業性もさることながら信頼性の点で問題がある。 As described above, in any of the pellicle peeling methods, the pellicle frame needs to be fixed so as not to be displaced when peeling, but it is actually fixed so that the position does not move while peeling the pellicle. It is quite difficult. In the case of holding by hand, there is a problem in terms of reliability as well as workability.

そのため、この剥離作業を行う装置も提案されている(特許文献2)。強力なクランプでペリクルフレームを固定し、フォトマスク上から引き剥がす。しかし、装置が非常に大掛かりなものとなってしまう。そのため、これまでは、手で押さえながら注意深くペリクルを剥離する方法が主流であり、フォトマスク損傷の危険が大きい上に、生産性が非常に悪いという問題があった。 Therefore, an apparatus for performing this peeling work has also been proposed (Patent Document 2). Fix the pellicle frame with a strong clamp and peel it off the photomask. However, the apparatus becomes very large. Therefore, until now, the method of carefully peeling the pellicle while holding it with the hand has been the mainstream, and there has been a problem that the risk of photomask damage is great and the productivity is very poor.

特開平09−068792号公報JP 09-068792 A 特開2009−151306号公報JP 2009-151306 A

本発明が解決しようとする課題は、フォトマスクに貼り付けられたペリクルを、パターン面を傷つけることなく安全かつ容易に短時間でフォトマスクから剥離することができる簡便なペリクル剥離用治具と剥離方法を提供することにある。 The problem to be solved by the present invention is a simple pellicle peeling jig and a peeling tool that can peel a pellicle attached to a photomask safely and easily in a short time without damaging the pattern surface. It is to provide a method.

本発明のペリクル剥離用治具は、治具をフォトマスクに固定する為の固定部材と、治具をペリクルに固定する為の粘着層(以下「治具粘着層」という。)とを備えていることを特徴としている。   The pellicle peeling jig of the present invention includes a fixing member for fixing the jig to the photomask, and an adhesive layer (hereinafter referred to as “jig adhesive layer”) for fixing the jig to the pellicle. It is characterized by being.

治具をフォトマスクに固定する為の固定部材は、フォトマスクと当接する当接面を有する第1アームと、押圧部材を有する第2アームからなり、第2アームの押圧部材がフォトマスクを第1アームの当接面に押圧することで治具がフォトマスクに固定されるように構成されていることが好ましい。当該押圧部材としてはネジ部材を使用することが好ましい。   The fixing member for fixing the jig to the photomask includes a first arm having a contact surface that comes into contact with the photomask and a second arm having a pressing member. The pressing member of the second arm holds the photomask first. It is preferable that the jig is fixed to the photomask by pressing against the contact surface of one arm. It is preferable to use a screw member as the pressing member.

治具粘着層を形成する粘着剤はシリコーン樹脂であることが好ましい。   The pressure-sensitive adhesive forming the jig pressure-sensitive adhesive layer is preferably a silicone resin.

本発明のペリクルの剥離方法は、上述した本発明のペリクル剥離用冶具によってフォトマスクとペリクルを固定し、次いで、ペリクルとフォトマスクの間のマスク粘着層を引き出して除去しペリクルを剥離する方法である。   The pellicle peeling method of the present invention is a method in which the pellicle peeling jig of the present invention described above fixes the photomask and pellicle, and then pulls out and removes the mask adhesive layer between the pellicle and the photomask to peel the pellicle. is there.

本発明のペリクル剥離用冶具によってペリクルとフォトマスクを共に固定することで、ペリクルとフォトマスクは相互の位置関係が固定される。この状態で、フォトマスクとペリクルを粘着しているマスク粘着層を除去する。その後、フォトマスクとペリクル剥離用冶具の間の固定を解除し、ペリクルを冶具粘着層に貼り付けたままフォトマスク上から取り外す。 By fixing the pellicle and the photomask together with the pellicle peeling jig of the present invention, the positional relationship between the pellicle and the photomask is fixed. In this state, the mask adhesive layer that adheres the photomask and pellicle is removed. Thereafter, the fixing between the photomask and the pellicle peeling jig is released, and the pellicle is removed from the photomask while being attached to the jig adhesive layer.

本発明によれば、ペリクルは、マスク粘着層の除去作業の間フォトマスク上で位置が保持されるため、フォトマスクのパターン面に接触することがなくパターン面を傷つけることがない。また、マスク粘着層の除去後は、フォトマスクとペリクル剥離用冶具の間の固定を解除して、ペリクルを治具に貼り付けたままでフォトマスク上から別の場所に移動させることができる。この移動に際しても、ペリクルはフォトマスクのパターン面に接触することがない。したがって、本発明により、安全かつ容易にペリクルの除去が可能となり、人手を要さずに短時間で作業をすすめることができる。 According to the present invention, since the position of the pellicle is held on the photomask during the mask adhesive layer removing operation, the pellicle does not come into contact with the pattern surface of the photomask and does not damage the pattern surface. Further, after the mask adhesive layer is removed, the fixing between the photomask and the pellicle peeling jig can be released, and the pellicle can be moved from the photomask to another place while being attached to the jig. Even during this movement, the pellicle does not contact the pattern surface of the photomask. Therefore, according to the present invention, it is possible to remove the pellicle safely and easily, and work can be performed in a short time without the need for manpower.

特に、治具粘着層を形成する粘着剤としてシリコーン樹脂を使用した場合は、ペリクル膜がフッ素樹脂である場合でも粘着し固定でき、また、一度使用したペリクル剥離用冶具の治具粘着層を交換する場合、剥離後の残渣(糊残り)をほとんど無いものとすることができる。 In particular, when silicone resin is used as the adhesive to form the jig adhesive layer, it can be adhered and fixed even when the pellicle film is a fluororesin, and the jig adhesive layer of the pellicle peeling tool once used can be replaced. In this case, there can be almost no residue (glue residue) after peeling.

本発明のペリクル剥離用治具の一実施形態とその使用状態を示す図であり、(a)は平面図、(b)はA−A線による断面図、(c)はB部拡大図である。It is a figure which shows one Embodiment of the pellicle peeling jig | tool of this invention, and its use condition, (a) is a top view, (b) is sectional drawing by the AA line, (c) is the B section enlarged view. is there. 本発明のペリクルの剥離方法を示す説明図である。It is explanatory drawing which shows the peeling method of the pellicle of this invention. 従来のペリクルの剥離方法の一例を示す説明図である。It is explanatory drawing which shows an example of the peeling method of the conventional pellicle.

以下、本発明を実施するための形態について説明するが、本発明はこれに限定されるものでなはい。また、本発明は液晶製造用途で使用される、一辺の長さが500mmを超えるような大型のペリクルにおいて特に効果が大きいが、半導体用途で使用される、一辺が150mm程度の小型のペリクルについて適用しても有効性は高く、特にその用途が限定されるものではない。   Hereinafter, although the form for implementing this invention is demonstrated, this invention is not limited to this. The present invention is particularly effective for large pellicles with a side length exceeding 500 mm, which are used in liquid crystal manufacturing applications. However, the present invention is applied to small pellicles with a side of about 150 mm used in semiconductor applications. Even if it is effective, its use is not particularly limited.

図1に本発明のペリクル剥離用治具の一実施形態とその使用状態を示す。   FIG. 1 shows an embodiment of a pellicle peeling jig according to the present invention and its usage.

図1(b)に示すように、ペリクル剥離用治具10は、ペリクル12ならびにフォトマスク11の上方に配置され、ペリクル剥離用治具の基部13の両端にはフォトマスク11の外周に当接する当接面を有する第1アーム14aと、押圧部材としてのネジ部材14cを有する第2アーム14bが、治具をフォトマスクに固定する為の固定部材として設けられている。第1アーム14aはフォトマスクを位置決めする基準となり、第2アーム14bのネジ部材14cがフォトマスクを第1アーム14aの前記当接面に押圧することで治具がフォトマスクに固定され、フォトマスクが位置決めされる。   As shown in FIG. 1B, the pellicle peeling jig 10 is arranged above the pellicle 12 and the photomask 11, and the both ends of the base 13 of the pellicle peeling jig are in contact with the outer periphery of the photomask 11. A first arm 14a having a contact surface and a second arm 14b having a screw member 14c as a pressing member are provided as fixing members for fixing the jig to the photomask. The first arm 14a serves as a reference for positioning the photomask, and the jig 14 is fixed to the photomask by the screw member 14c of the second arm 14b pressing the photomask against the contact surface of the first arm 14a. Is positioned.

この実施態様では、押圧部材をネジ部材14cで構成したが、フォトマスクを押圧できる部材であれば如何なる機構のものであっても押圧部材として使用
できる。
In this embodiment, the pressing member is composed of the screw member 14c. However, any mechanism that can press the photomask can be used as the pressing member.

基部13のペリクル12に対向した面には下地部材17を介して治具粘着層16が設けられ、基部13の上部にはハンドル15が設けられている。   A jig adhesive layer 16 is provided on the surface of the base 13 facing the pellicle 12 via a base member 17, and a handle 15 is provided on the top of the base 13.

基部13は、エンジニアリングプラスチップ、金属等の剛性のある材料を用いて作成するのが良い。 The base 13 is preferably made of a rigid material such as an engineering plus chip or metal.

この実施形態で、基部13は図1(a)に示すように枠形状としたが、ペリクル12およびフォトマスク11を固定、ハンドリングするのに十分な剛性と粘着面積が確保できれば、基部の形状はどのようなものであっても良い。例えば、平板状の部材を基部としても、あるいは、枠形状の部材の下にさらに平板状の部材を取り付けたものを基部としてもよい。 In this embodiment, the base 13 has a frame shape as shown in FIG. 1A. However, if the rigidity and adhesion area sufficient to fix and handle the pellicle 12 and the photomask 11 can be secured, the shape of the base is It can be anything. For example, a plate-shaped member may be used as the base, or a plate-shaped member attached to a frame-shaped member may be used as the base.

治具粘着層16は、下地部材17を介さずに直接基部の下面に設けてもよい。 The jig adhesive layer 16 may be provided directly on the lower surface of the base without using the base member 17.

また、この実施形態ではフォトマスク用の固定部材がフォトマスクの短軸方向だけを固定するように配置したが、長軸方向だけ、あるいは直交する両方向を固定するようにしても良い。   In this embodiment, the photomask fixing member is arranged to fix only the short axis direction of the photomask. However, only the long axis direction or both orthogonal directions may be fixed.

治具粘着層16を構成する粘着剤は特に限定されないが、粘着する対象であるペリクル膜12aへの粘着性を考慮して決定することが良く、アクリル樹脂、エポキシ樹脂、シリコーン樹脂等が使用できるが、中でもシリコーン樹脂を使用することが好ましい。   The pressure-sensitive adhesive constituting the jig pressure-sensitive adhesive layer 16 is not particularly limited, but is preferably determined in consideration of the pressure-sensitive adhesiveness to the pellicle film 12a to be bonded, and acrylic resin, epoxy resin, silicone resin, etc. can be used. However, among these, it is preferable to use a silicone resin.

シリコーン樹脂は、ペリクル膜がフッ素樹脂である場合でも粘着し固定できる。また、一度使用したペリクル剥離用冶具は、治具粘着層にペリクル膜の破片等が付着しているので、これを剥離して新しい治具粘着層と交換する必要があるが、シリコーン樹脂の場合、引っ張った際に破断しにくいので、剥離後の残渣(糊残り)をほとんど無いものとすることができ、作業性が極めて良い。   The silicone resin can be adhered and fixed even when the pellicle film is a fluororesin. Also, once the pellicle stripping jig has been used, it is necessary to peel off the pellicle film from the jig adhesive layer and replace it with a new jig adhesive layer. Since it is difficult to break when pulled, the residue (paste residue) after peeling can be almost eliminated, and workability is extremely good.

治具粘着層16の形成方法としては、粘着剤を直接基部13に塗布しても良いが、事前にPETなどの薄いフィルムの両面に粘着剤を塗布して粘着層を形成した、いわゆる両面シート状のものを所望の大きさに切断し、貼り付けて利用することが作業性の点から好ましい。   As a method for forming the jig adhesive layer 16, an adhesive may be applied directly to the base 13, but a so-called double-sided sheet in which an adhesive layer is formed by applying an adhesive to both surfaces of a thin film such as PET in advance. It is preferable from the viewpoint of workability to cut and paste the shape into a desired size and apply it.

下地部材17は、基部とペリクルフレーム12bと間の高さ調整ならびにフォトマスク11等の傷つき防止および粘着力調整の目的で設けられる板状部材である。粘着層16のペリクル膜12aへの粘着性が悪い場合には、ゴムのような軟質の樹脂を板状部材として使用することで粘着性を向上することができるし、大きさ、形状の調整によっても粘着力を調節することもできる。この下地部材17は近接するフォトマスクの静電破壊を防止する目的から帯電防止性を有することが好ましい。   The base member 17 is a plate-like member provided for the purpose of adjusting the height between the base and the pellicle frame 12b, preventing damage to the photomask 11 and the like, and adjusting the adhesive force. When the adhesion of the adhesive layer 16 to the pellicle film 12a is poor, the adhesiveness can be improved by using a soft resin such as rubber as a plate-like member, and by adjusting the size and shape. You can also adjust the adhesive strength. The base member 17 preferably has antistatic properties for the purpose of preventing electrostatic breakdown of adjacent photomasks.

第1アームと第2アームはその材質を問わないが、固定するのに十分な剛性を有し、接触によりフォトマスクを傷つけることが無いよう樹脂製であることが良いし、また、異物付着をできるだけ少なくすることと、フォトマスクのパターン面の静電破壊を防ぐ観点から帯電防止性能を有していることが良く、導電性MCナイロン、導電性PEEK、導電性HDPEなどが好適に利用できる。   The material of the first arm and the second arm is not limited, but it should be made of resin so that it has sufficient rigidity to fix, and the photomask will not be damaged by contact. From the viewpoint of reducing as much as possible and preventing electrostatic breakdown of the pattern surface of the photomask, it is preferable to have antistatic performance, and conductive MC nylon, conductive PEEK, conductive HDPE and the like can be suitably used.

基部13、ハンドル15、治具粘着層等のペリクル剥離用治具を構成する他の部材全般についても、フォトマスクの静電破壊を防止したり、作業者の帯電を防止する目的から帯電防止性を有する材料を使用することが好ましい。 For other members constituting the pellicle peeling jig such as the base 13, the handle 15, and the jig adhesive layer as well, antistatic properties are provided for the purpose of preventing electrostatic breakdown of the photomask and preventing the operator from being charged. It is preferable to use a material having

次に、このペリクル剥離用冶具を使用したペリクル剥離方法について図2を用いて説明する。   Next, a pellicle peeling method using this pellicle peeling jig will be described with reference to FIG.

はじめに、図2(a)のように第2アーム14bのネジ部材14cを後退させておき、ハンドル15を持って、第1アーム14aをフォトマスク11の一端に接触させながらペリクル12の上に載せていく。すると、最後には図2(b)のように、基部13の下面に設けられた治具粘着層16はペリクル12の最上部、すなわちペリクル膜12aに接触し、直ちに粘着される。この状態で、第2アーム14bのネジ部材14cを締め付け、ペリクル剥離用冶具10をフォトマスク11に対して固定する。   First, as shown in FIG. 2A, the screw member 14c of the second arm 14b is moved backward, and the handle 15 is held, and the first arm 14a is placed on the pellicle 12 while being in contact with one end of the photomask 11. To go. Then, finally, as shown in FIG. 2B, the jig adhesive layer 16 provided on the lower surface of the base 13 comes into contact with the uppermost part of the pellicle 12, that is, the pellicle film 12a, and is immediately adhered. In this state, the screw member 14c of the second arm 14b is tightened, and the pellicle peeling jig 10 is fixed to the photomask 11.

次に、マスク粘着層12cの除去を行う。図2(c−1)の実施形態では、ペリクルフレーム12bの外側からマスク粘着層12cをピンセット28で掴んで引き出している。このまま全周にわたって引き出せば、完全に粘着層は除去される。また、別の方法として図2(c−2)のように、ステンレス、樹脂などの薄板29aの表面に粘着性物質29bを付着させた粘着層引き出し具29を作製し、これをペリクルフレーム12b外側から差し込んで、マスク粘着層12cを付着させ、外側に引き出す方法も有効である。さらに、マスク粘着層12cが硬く引き出せない場合には、ホットエアーガン(図示しない)等を使用してマスク粘着層12cを軟化させながら図2(c−1)、(c−2)の方法を適用すると良い。 Next, the mask adhesive layer 12c is removed. In the embodiment of FIG. 2 (c-1), the mask adhesive layer 12 c is grasped and pulled out from the outside of the pellicle frame 12 b with tweezers 28. If the entire circumference is pulled out as it is, the adhesive layer is completely removed. As another method, as shown in FIG. 2 (c-2), an adhesive layer drawer 29 in which an adhesive substance 29b is attached to the surface of a thin plate 29a such as stainless steel or resin is prepared, and this is attached to the outside of the pellicle frame 12b. It is also effective to attach the mask adhesive layer 12c and pull it out to the outside. Further, when the mask adhesive layer 12c is hard and cannot be pulled out, the method shown in FIGS. 2C-1 and 2C-2 is applied while softening the mask adhesive layer 12c using a hot air gun (not shown). Good.

こうして、全てのマスク粘着層12cが完全に除去されても、ペリクル12はペリクル剥離用冶具10の治具粘着層16に粘着保持されているため動くことがなく、フォトマスク11から浮いた状態のまま保持される。その後、図2(d)のように、第2アーム14bのネジ部材14cを後退させて固定を解除し、ハンドル15を掴んでペリクル剥離用治具10を上方へ持ち上げると、ペリクル12はペリクル剥離用治具10に粘着したまま、フォトマスク11上から完全に除去される。この一連の作業の間、ペリクル12はフォトマスク11に接触することは一切無く、フォトマスクの損傷は完全に防止される。そして、最後には安全な場所でペリクル剥離用冶具10の治具粘着層16に粘着したペリクル12を剥がし取り、治具粘着層16を貼り代えれば、次回作業への準備が整う。 In this way, even if all the mask adhesive layers 12c are completely removed, the pellicle 12 does not move because it is adhered to the jig adhesive layer 16 of the pellicle peeling jig 10, and is lifted from the photomask 11. Is retained. Thereafter, as shown in FIG. 2 (d), the screw member 14c of the second arm 14b is retracted to release the fixation, and when the handle 15 is grasped and the pellicle peeling jig 10 is lifted upward, the pellicle 12 is peeled off. It is completely removed from the photomask 11 while sticking to the jig 10. During this series of operations, the pellicle 12 never contacts the photomask 11, and damage to the photomask is completely prevented. Finally, if the pellicle 12 adhered to the jig adhesive layer 16 of the pellicle peeling jig 10 is peeled off at a safe place and the jig adhesive layer 16 is attached, preparation for the next operation is completed.

以下に本発明の実施例を記述するが、本発明はこれに限定されるものではない。
図1に示すような構造のペリクル剥離用冶具を製作した。基部13を30mm×30mmの断面を持つA6063アルミニウム合金の押し出し中空材で枠状に作成し、その両端には帯電防止超高分子ポリエチレンで製作した第1アーム14aならびに第2アーム14bを取り付けた。第2アーム14bには帯電防止MCナイロンを素材とするネジ部材14cを取り付けた。また、基部13の上には帯電防止樹脂製のハンドル15を取り付けた。
Examples of the present invention will be described below, but the present invention is not limited thereto.
A pellicle peeling jig having a structure as shown in FIG. 1 was manufactured. The base 13 was made into a frame shape with an extruded hollow material of A6063 aluminum alloy having a cross section of 30 mm × 30 mm, and a first arm 14 a and a second arm 14 b made of antistatic ultrahigh molecular weight polyethylene were attached to both ends thereof. A screw member 14c made of antistatic MC nylon is attached to the second arm 14b. A handle 15 made of an antistatic resin was attached on the base 13.

そして、基部13の下には帯電防止PVC製の下地部材17を設けた。そして厚さ100μmのPETフィルムの両面にシリコーン粘着剤(商品名KR3700/信越化学工業製)を乾燥後膜厚が50μmとなるように塗布し、加熱キュアしておいたものを下地部材17の形状になるように切断し、下地部材17の下面に貼り付けて粘着層16を形成した。   A base member 17 made of antistatic PVC was provided under the base 13. Then, a silicone adhesive (trade name: KR3700 / manufactured by Shin-Etsu Chemical Co., Ltd.) is applied to both sides of a 100 μm thick PET film so that the film thickness is 50 μm after drying, and then heated and cured to form the shape of the base member 17 The adhesive layer 16 was formed by being cut and attached to the lower surface of the base member 17.

こうして製作したペリクル剥離用治具10を、図1の状態になるように、ペリクル12が貼着されたフォトマスク11に固定した。ここで、フォトマスク11は、1100mm×1620mm×17mmの石英ガラス製であり、ペリクル12は外寸1068mm×1526mm、内寸1031mm×1490mm、高さ8mmであり、ペリクル膜の材料はフッ素樹脂であり、ペリクルフレームはA5052アルミニウム合金製であり、マスク粘着層はシリコーン粘着剤から構成されている。   The pellicle peeling jig 10 thus manufactured was fixed to the photomask 11 to which the pellicle 12 was adhered so as to be in the state of FIG. Here, the photomask 11 is made of quartz glass of 1100 mm × 1620 mm × 17 mm, the pellicle 12 has an outer dimension of 1068 mm × 1526 mm, an inner dimension of 1031 mm × 1490 mm, and a height of 8 mm, and the material of the pellicle film is a fluororesin. The pellicle frame is made of A5052 aluminum alloy, and the mask adhesive layer is made of a silicone adhesive.

固定は図2(a)に示すように、第2アーム14bのネジ部材14cを後退させた状態から開始した。治具粘着層16がペリクル膜12aにしっかり粘着してペリクルを固定していることを確認した後、第2アーム14bのネジ部材14cを締め付けて、ペリクル剥離用治具10をフォトマスク11の外形に対して固定した。次いで、図2(c−2)に示すようにマスク粘着層12cの外側から厚さ0.5mmのステンレス製薄板29aにシリコーン粘着剤29bを塗布した粘着層引き出し具29を差込み、マスク粘着層12cを粘着させて引き出した。その後、連続的に引き出し、1周させて全ての粘着層を除去した。   As shown in FIG. 2A, the fixing was started from a state in which the screw member 14c of the second arm 14b was retracted. After confirming that the jig adhesive layer 16 firmly adheres to the pellicle film 12a and fixes the pellicle, the screw member 14c of the second arm 14b is tightened, and the pellicle peeling jig 10 is attached to the outer shape of the photomask 11. Fixed against. Next, as shown in FIG. 2 (c-2), from the outside of the mask adhesive layer 12c, an adhesive layer drawer 29 in which a silicone adhesive 29b is applied to a 0.5 mm thick stainless steel plate 29a is inserted, and the mask adhesive layer 12c is attached. It was pulled out with adhesion. Then, it pulled out continuously and made 1 round and removed all the adhesion layers.

このとき、マスク粘着層の引き出し長さが長すぎると取り扱いしにくくなるため、30−40cmの長さに鋏で切断しながら作業を行った。また、これらの作業を行う上方にはイオナイザを設置し、全ての作業において帯電によるフォトマスクの静電破壊が無いよう留意した。 At this time, since the handling of the mask adhesive layer that was too long would be difficult to handle, the work was performed while cutting with a scissors to a length of 30-40 cm. In addition, an ionizer was installed above these operations so that there was no electrostatic breakdown of the photomask due to charging in all operations.

そして、マスク粘着層除去作業の終了後、第1アーム14b上のネジ部材14cを緩め、ハンドル15を2名で掴んでゆっくりと上方へひきあげ、ペリクル12を完全にフォトマスク11上から除去した。 Then, after the mask adhesive layer removing operation was completed, the screw member 14c on the first arm 14b was loosened, the handle 15 was grasped by two persons, and slowly lifted upward, and the pellicle 12 was completely removed from the photomask 11.

その後、周囲の照明を消して暗くし、照度30万Lxのハロゲンランプにてフォトマスク表面を検査したが、うっすらとマスク粘着層が粘着していた部分が汚れていた他は特に傷などの損傷は見当たらず、非常に清浄な状態であった。 After that, the surrounding light was turned off and darkened, and the photomask surface was inspected with a halogen lamp with an illuminance of 300,000 Lx, but the part where the mask adhesive layer was slightly adhered was dirty, especially damage such as scratches Was not found and was in a very clean state.

また、付着していた汚れ(粘着剤の残渣)もワイパーに有機溶剤(商品名:アイソパーE、エクソンモービル製)を浸潤させて軽く拭き取るだけで容易に除去することができた。これらの作業は全くフォトマスク損傷の恐れがないばかりか、本実施例のような非常に大きなペリクルについてもわずか10分程度で作業することができ、きわめて効率の良いものであった。 In addition, the adhering dirt (residue residue) could be easily removed by simply wiping the wiper with an organic solvent (trade name: Isopar E, manufactured by ExxonMobil) and wiping it lightly. These operations are very efficient because not only there is no fear of damage to the photomask but also a very large pellicle like this embodiment can be operated in about 10 minutes.

そして、全ての剥離作業終了後、フォトマスクから離れた安全な場所でペリクル剥離用治具10からペリクル12を取り外し、治具粘着層16の交換を行ったが、この作業にかかる時間はたかだか5分程度であった。   After all the peeling operations were completed, the pellicle 12 was removed from the pellicle peeling jig 10 at a safe place away from the photomask and the jig adhesive layer 16 was replaced. It was about minutes.

[比較例]
上記実施例と同じペリクルおよびフォトマスクに対して、図3に示すような剥離用治具30を用いて剥離作業を行った。この剥離用治具30はペリクルフレーム32の下端に差し込んで、ペリクルを持ち上げて剥離するものである。剥離用治具30の操作によりマスク粘着層33はフォトマスク31の表面より引き剥がされ、ペリクルフレーム32は持ち上がるが、フレーム全周に渡って一気に全て引き剥がされる訳ではないため、剥離用治具30を戻すとまたフォトマスク31に粘着してしまう。そのため、剥離した部分には樹脂板の小片を挟みながら作業を行い、ペリクル全周に渡ってこれを続けて全てを剥離させた。
[Comparative example]
A peeling operation was performed on the same pellicle and photomask as in the above example using a peeling jig 30 as shown in FIG. The peeling jig 30 is inserted into the lower end of the pellicle frame 32 to lift and peel the pellicle. The mask adhesive layer 33 is peeled off from the surface of the photomask 31 by the operation of the peeling jig 30, and the pellicle frame 32 is lifted, but not all is peeled off all around the frame. If 30 is returned, it will adhere to the photomask 31 again. Therefore, the work was performed with a small piece of the resin plate sandwiched between the peeled portions, and this was continuously peeled over the entire periphery of the pellicle.

このとき、ペリクルフレーム32がフォトマスク31上で動いてフォトマスク31表面を損傷しないよう、ペリクルフレーム32の各コーナー部(図示しない)には作業者を配置し、ズレ防止のためにペリクルフレーム32を押さえながら作業を行った。そして、マスク粘着層33の全てが剥離した後、作業者全員で息を合わせてペリクルフレーム32をゆっくりとフォトマスク31上から持ち上げ、安全なところまで引き離した。 At this time, an operator is arranged at each corner (not shown) of the pellicle frame 32 so that the pellicle frame 32 does not move on the photomask 31 and damage the surface of the photomask 31, and the pellicle frame 32 is prevented from being displaced. Worked while holding down. Then, after all of the mask adhesive layer 33 was peeled off, all the workers breathed together and slowly lifted the pellicle frame 32 from the photomask 31 and pulled it away to a safe place.

この作業は、所要人数が剥離作業者1名に加えてペリクル押さえ要員4名の最低5名が必要であることに加え、所要時間はおよそ1時間かかる非常に生産性が悪いものであった。また、常にフォトマスクにペリクルが接触する恐れがあり、品質管理上からも非常に好ましくない作業であった。 This work requires a minimum of five people, including four pellicle pressers in addition to one peeling worker, and the time required is approximately one hour, which is very unproductive. In addition, there is a possibility that the pellicle always comes into contact with the photomask, which is a very undesirable operation in terms of quality control.

10 ペリクル剥離用治具
11 フォトマスク
12 ペリクル
12a ペリクル膜
12b ペリクルフレーム
12c マスク粘着層
13 基部
14a 第1アーム
14b 第2アーム
14c ネジ部材
15 ハンドル
16 治具粘着層
17 下地部材

28 ピンセット
29 粘着層引き出し具
29a 薄板
29b 粘着性物質

30 剥離用治具
31 フォトマスク
32 ペリクルフレーム
33 マスク粘着層
DESCRIPTION OF SYMBOLS 10 Pellicle peeling jig | tool 11 Photomask 12 Pellicle 12a Pellicle film 12b Pellicle frame 12c Mask adhesion layer 13 Base 14a First arm 14b Second arm 14c Screw member 15 Handle 16 Jig adhesion layer 17 Base member

28 Tweezers 29 Adhesive layer drawer 29a Thin plate 29b Adhesive substance

30 Peeling jig 31 Photomask 32 Pellicle frame 33 Mask adhesive layer

Claims (5)

フォトマスクからペリクルを剥離する際に使用されるペリクル剥離用冶具であって、治具をフォトマスクに固定する為の固定部材と、治具をペリクルに固定する為の粘着層とを備えてなることを特徴とするペリクル剥離用冶具。   A pellicle peeling tool used when peeling a pellicle from a photomask, comprising a fixing member for fixing a jig to the photomask and an adhesive layer for fixing the jig to the pellicle A pellicle stripping jig characterized by that. 固定部材が、フォトマスクと当接する当接面を有する第1アームと、押圧部材を有する第2アームからなり、第2アームの押圧部材がフォトマスクを第1アームの当接面に押圧することにより治具がフォトマスクに固定される請求項1記載のペリクル剥離用冶具。   The fixing member includes a first arm having a contact surface that contacts the photomask and a second arm having a pressing member, and the pressing member of the second arm presses the photomask against the contact surface of the first arm. The jig for peeling a pellicle according to claim 1, wherein the jig is fixed to the photomask. 押圧部材がねじ部材である請求項2記載のペリクル剥離用冶具。   The pellicle peeling jig according to claim 2, wherein the pressing member is a screw member. 粘着層を形成する粘着剤がシリコーン樹脂である請求項1〜3のいずれか1項記載のペリクル剥離用治具。   The jig for peeling a pellicle according to any one of claims 1 to 3, wherein the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is a silicone resin. マスク粘着層によってフォトマスクに貼着されたペリクルをフォトマスクから剥離する方法であって、請求項1〜4のいずれか1項記載のペリクル剥離用冶具によってフォトマスクとペリクルを固定し、次いで、マスク粘着層を引き出して除去することを特徴とするペリクルの剥離方法。   A method for peeling a pellicle attached to a photomask by a mask adhesive layer from the photomask, wherein the photomask and the pellicle are fixed by the pellicle peeling jig according to any one of claims 1 to 4, A method for peeling a pellicle, wherein the mask adhesive layer is pulled out and removed.
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KR1020100045927A KR101564115B1 (en) 2009-10-29 2010-05-17 Jig for peeling pellicle and peeling method
CN201010225329XA CN102053482B (en) 2009-10-29 2010-07-12 Peeling jig of dust-proof film assembly and peeling method
TW099122972A TWI423382B (en) 2009-10-29 2010-07-13 Pellicle peeling jig and peeling method
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