M440884 五、新型說明： 【新型所屬之技術領域】 本案係屬於面板貼合製程的領域，特別是針對 種撓性基材而設計之貼合治具構造。 【先前技術】M440884 V. New description: [New technical field] This case belongs to the field of panel bonding process, especially the structure of bonding fixture designed for flexible substrates. [Prior Art]
近年來，作為面板貼合時的基材除壓克力外， 也有使用厚度薄的玻璃’這類的基材因具有些許的 撓性而能隨著貼合製程作些許的撓曲，故稱之為撓 但，這類的撓性基材仍有其撓曲的限度因而 不會直接以手搬運；一般而言 這類撓性基材在加 工或搬運的過程中都會以玻璃或塑膠所製成之一载 板，還是需要足夠的支撐力及保護，以利製程對位 以及避免這類撓性基材在運送時發生碎裂的問題 為此，一般於生產線上加工’或於廠房内進行 時，係於該撓性基材之一面塗佈一液態石夕膠，將其 烘烤乾燥後而形成一黏著層，再將其貼合於一載板 表面而作為承載體。當完成製程後，係將該撓性基 材與該載板分離，再於其底部之黏著層表面貼附一 薄膜’避免該黏著層吸附粉塵而被污染。但，由於 上述黏著層係以液態方式進行塗佈，由於其所使用 的有機溶劑’容易導致某些薄膜材料產生霧化或腐 姓現象，且其塗佈或烘乾過程須於無塵室内完成， 故會大·.幅增加-設備成本及生產成本。再者，欲將該 M440884 撓性基材與該載板分離的過程中，還有可能造成其 他層產生脆裂的情況。 有鑑於此，本案創作人曾提出一種撓性基材在 製程上所使用之雙面膠帶，其係以聚乙烯對苯二甲 酸酯（poly ethyl enet erephtha late，PET)所製成， 並於其中一表面上塗佈一減黏黏著劑，如：UV減黏 夥，以供貼合一該撓性基材，而另一表面係塗佈一 石夕膠’以供貼合該載板，因而能利用該減黏黏著劑 受紫外光照射後，而輕易地將該撓性基材與該載板 分離。但，該載板並無法提供有效的定位（對位） 效果，因而還是會造成製程中的阻礙，故有必要加 以改良。 【新型内容】 有鑑於此’本創作之—目的，旨在提供一種撓 性基材貼合治具，俾於厚度3mm以下之一底板上設 有一膠體，而利用該膠體作為貼合製程中暫時定位 一撓性基材之媒介，以有效提昇貼合效率及品質。 本創作之次一目的，旨在提供一種撓性基材貼 。冶具，俾能選用可透光或不透光之材質作為該底 板，以符合黃光製程或貼合製程使用。 本創作之另一目的，旨在提供一種撓性基材貼 〇 /。具，俾於該底板上設有一定位構造以提昇定 位該撓性基板的效果。 為達上述.目的，本創作之撓性基材貼合治具， 4 係供定位放置該撓性基材，以便進行各種製程其包 括：一底板’係選用厚度3mm以下的板材而製成， 以提供貼合製程所需之支撐力，且該底板之至少一 面係為一定位面；及一膠體，佈設於該定位面上， 以供暫時貼附該撓性基材，於貼合製程時，該撓性 基材不致產生值移而能提昇貼合效率及品質。 於一實施例中’為了對應一般貼合製程或是黃 光製程’該底板係選自可透光材質或不透光材質其 中之一者而製成。如該底板選用可透光材質而製成 時’而能便於光線穿透，故適用於黃光製程，該底 板的材質係選自如：塑膠、壓克力或玻璃其中之一 者。又或該底板係為不透光材質而製成時，不需要 光線穿透之效果，故適用於一般貼合製程，該底板 之材質可選用如不鏽鋼、鋁、銅或鈦等金屬材質， 或塑膠、壓克力或玻璃其中之一者。 再者’本創作所使用之該膠體係選自如雙面膠 或矽膠其中之一者。若使用之該膠體為雙面膠時， 該膠體與該撓性基材接觸之一面更具有一減黏膠 層’受UV光照射後而黏著力降低，以便將該撓性基 材自該膠體分離。 於一實施例中，本創作之該撓性基材貼合治 具，更具有至少一定位構造，該定位構造係設於定 位面上，以供靠合定位該撓性基材之至少相鄰二側 緣。其中該定位.構造係為一定位塊且·該定位塊係 呈L字形結構體而凸出於該定位面上；或該定位構 造係為一定位凹槽，且該定位凹槽係對應該撓性基 材的形狀而設置，以供容置該撓性基材於其内；或 該定位構造係由複數個定位柱所構成，該等定位柱 係排列成L字形且凸出於該定位面上，以上均能夠 將該撓性基材確實定位於製程加工中的固定位置 【實施方式】 為使貴審查委員能清楚了解本創作之内容，僅 以下列說明搭配圖式，敬請參閱。 請參閱第1、2圖，係為本創作較佳實施例的結 構示意圖及其使用狀態不意圖。如圖中所示，本創 作之撓性基材貼合治具1係包括一底板n及—膠體 12，以供定位放置一撓性基材，以便進行各種製程。 其中該底板11係選用厚度3 mm以下的板材而製 成’以提供貼合製程所需之支撐力，且該底板n之 至少一面係為一定位面111。應注意的是，本創作 之該底板11係依據現場需求而選用可透光材質或 不透光材質其中之一者而製成。當欲使用於黃光製 程時，該底板11係選用如：塑膠、壓克力或玻璃等 可透光材質其中之一者而製成，而能夠使光線透過 而進行黃光製程。當欲使用於一般貼合製程時，該 底板11則可選用如：不鏽鋼、鋁、銅或鈦等金屬材 質（不透光材質）’或是選用如：塑膠、壓克力或玻 璃等.可.it光-材質.或不透光材質其中之一者而製-成·。一 iV144〇884 而該膠體12係佈設於該定位面111上，該膠體 12係選自如雙面膠或矽膠其中之一者。當該膠體12 係選用雙面膠時，該膠體12與該撓性基材2接觸之 —面更具有一減黏膠層1 21，受UV光照射後而能夠 使黏著力降低，進而便於將該撓性基材2自該膠體 12上作分離，以供暫時貼附該撓性基材2,於黃光 或貼合製程進行時，該撓性基材2不致產生位移而 _ 能提昇貼合效率及品質。 請再參閱第3、4、5圖，係為本創作較佳實施 例的各種實施態樣。為了進一步提昇將該撓性基材 2放置於該撓性基材貼合治具1上的定位效果，本 創作特別設置有一定位構造1 3，且該定位構造i 3 係設於定位面丨丨丨上，以供靠合定位該撓性基材2 之至少相鄰二側緣，於第一實施態樣中，該定位構 造1 3係為一定位塊！ 3丨，且該定位塊i 3丨係呈L字 _ 形結構體而凸出於該定位面lu上，操作人員僅需 要將該撓性基材2之相鄰二側緣，直接靠合於該定 位塊131上，並利用該膠體12將該撓性基材2暫時 固疋，以達到定位之效果，亦能防止操作人員謓操 作的問題。於第二實施態樣中，該定位構造丨3係為 一定位凹槽132,且該定位凹槽132係對應該撓性 基材2的形狀而設置，並將該膠體12設於該定位凹 槽132内部，以供容置並暫時黏附該撓性基材2於 •.其.内，.故能夠有-效框圍該爲性_基材2两不致每笔程 M440884 中發生滑動的現象’且這樣的設計還能用來作為檢 驗用的治具，以檢驗經裁切後之該撓性基材2是否 符合製程需求。於第三實施態樣中，該定位構造13 係由複數個定位柱1 33所構成，該等定位柱丨33係 排列成L字形且凸出於該定位面111上，同樣係用 來靠合該撓性基材2之二相鄰侧緣，再利用該膠體 1 2將該撓性基材2暫時固定，以達到定位之效果， 避免操作人員之誤操作。 综上，本創作之該撓性基材貼合治具丨係利用 厚度3mm以下之該底板Η上設有該膠體12，作為 黃光或貼合製程中暫時定位該撓性基材2之媒介， 而有效提昇貼合效率及品質。再者，該底板u並可 依據實際製程上的需求，而選用可透光或不透光之 材質，以提向各種製程的設計彈性。另外，該撓性 基材貼合治具1係於該底板11上設有一定位構造 3而扼升疋位該撓性基板2的效果，同時可避免 操作人員之誤操作而降低不良品之產生。 连兩不創作 、 ...... 一·〜·一八〜叩 〇 並非用以限疋本創作音> #阁 ..^ 、 个剃作實施之範圍，故該所屬技術 域中呈有通常知44¾. 另力夫識者，或是熟悉此技術所作出等 或輕易的變化者， 嘗在不脫離本創作之精神與範圍 所作之均等變化盥彳欠& ~ 匕與修飾，皆應涵蓋於本創作之 範圍内。 8 M440884 【圖式簡單說明】 第1圖，為本創作較佳實施例的結構示意圖。 第2圖，為本創作較佳實施例的使用狀態示意圖。 第3圖，為本創作較佳實施例的第一實施態樣。 第4圖，為本創作較佳實施例的第二實施態樣。 第5圖，為本創作較佳實施例的第三實施態樣。 【主要元件符號說明】 1 撓性基材貼合治具In recent years, as a substrate for panel bonding, in addition to acrylic, there is also a substrate made of a thin glass. Such a substrate has a slight flexibility and can be slightly deflected with the bonding process. However, such flexible substrates still have the limit of deflection and are not directly handled by hand; in general, such flexible substrates are made of glass or plastic during processing or handling. As a carrier board, it still needs sufficient support and protection to facilitate the process alignment and avoid the problem of such flexible substrate being broken during transportation. For this reason, it is generally processed on the production line' or in the factory. When a liquid stone is coated on one side of the flexible substrate, it is baked and dried to form an adhesive layer, which is then attached to the surface of a carrier to serve as a carrier. When the process is completed, the flexible substrate is separated from the carrier, and a film is attached to the surface of the adhesive layer at the bottom thereof to prevent the adhesive layer from adsorbing dust and being contaminated. However, since the above-mentioned adhesive layer is applied in a liquid state, the organic solvent used therein is liable to cause fogging or rot of some film materials, and the coating or drying process must be completed in a clean room. Therefore, it will increase the size of the equipment - equipment costs and production costs. Furthermore, in the process of separating the M440884 flexible substrate from the carrier, there is a possibility that the other layers may be brittle. In view of this, the creator of this case has proposed a double-sided tape used in the manufacturing process of flexible substrate, which is made of polyethyl enet erephtha late (PET). One of the surfaces is coated with a tack-reducing adhesive, such as a UV-reducing adhesive for bonding a flexible substrate, and the other surface is coated with a stone-like adhesive for attaching the carrier. The flexible substrate can be easily separated from the carrier after the photoresist is exposed to ultraviolet light. However, the carrier does not provide an effective positioning (alignment) effect, and thus it will cause obstacles in the process, so it is necessary to improve. [New content] In view of the purpose of this creation, it is intended to provide a flexible substrate bonding fixture, which is provided with a colloid on a substrate having a thickness of 3 mm or less, and the colloid is used as a temporary bonding process. Position the medium of a flexible substrate to effectively improve the bonding efficiency and quality. The second purpose of this creation is to provide a flexible substrate sticker. For the tool, you can use the material that can be opaque or opaque as the bottom plate to meet the yellow light process or the bonding process. Another purpose of this creation is to provide a flexible substrate affixing /. A positioning structure is provided on the bottom plate to enhance the effect of positioning the flexible substrate. In order to achieve the above purpose, the flexible substrate bonding fixture of the present invention, 4 series, is used for positioning and placing the flexible substrate for various processes, including: a bottom plate is made of a plate having a thickness of 3 mm or less. Providing the supporting force required for the bonding process, and at least one side of the bottom plate is a positioning surface; and a colloid disposed on the positioning surface for temporarily attaching the flexible substrate during the bonding process The flexible substrate does not cause a value shift and can improve the bonding efficiency and quality. In one embodiment, the bottom plate is made of one of a light transmissive material or an opaque material in order to correspond to a general lamination process or a yellow process. If the bottom plate is made of a permeable material, it can be easily penetrated by light, so it is suitable for the yellow light process. The material of the bottom plate is selected from one of plastic, acrylic or glass. Moreover, when the bottom plate is made of an opaque material, the effect of light penetration is not required, so it is suitable for a general bonding process, and the material of the bottom plate can be selected from metal materials such as stainless steel, aluminum, copper or titanium, or One of plastic, acrylic or glass. Further, the gum system used in the present invention is selected from one of a double-sided tape or a silicone rubber. If the colloid used is a double-sided tape, the colloid and the flexible substrate are in contact with one side of the flexible substrate, and the adhesive layer is reduced by the UV light, so that the flexible substrate is removed from the colloid. Separation. In one embodiment, the flexible substrate bonding fixture of the present invention further has at least one positioning structure disposed on the positioning surface for at least adjacent to the flexible substrate. Two side edges. Wherein the positioning is a positioning block and the positioning block is an L-shaped structure protruding from the positioning surface; or the positioning structure is a positioning groove, and the positioning groove is corresponding to the positioning a shape of the substrate for accommodating the flexible substrate therein; or the positioning structure is composed of a plurality of positioning posts arranged in an L shape and protruding from the positioning surface In the above, the flexible substrate can be reliably positioned at a fixed position in the process processing. [Embodiment] In order to enable the reviewing committee to clearly understand the content of the creation, only the following description is used in conjunction with the drawing, please refer to it. Please refer to Figures 1 and 2 for a schematic view of the structure of the preferred embodiment and its use. As shown in the figure, the flexible substrate bonding fixture 1 of the present invention comprises a bottom plate n and a colloid 12 for positioning a flexible substrate for various processes. The bottom plate 11 is made of a plate having a thickness of 3 mm or less to provide a supporting force for providing a bonding process, and at least one side of the bottom plate n is a positioning surface 111. It should be noted that the bottom plate 11 of the present invention is made of one of a light-transmitting material or an opaque material depending on the site requirements. When it is intended to be used in a yellow light process, the bottom plate 11 is made of one of a light-transmitting material such as plastic, acrylic or glass, and is capable of transmitting light for a yellow light process. When it is intended to be used in a general lamination process, the bottom plate 11 may be selected from a metal material such as stainless steel, aluminum, copper or titanium (opaque material) or may be selected such as: plastic, acrylic or glass. .it light-material. Or one of the opaque materials - made. An iV144 884 and the colloid 12 is disposed on the positioning surface 111. The colloid 12 is selected from one of a double-sided tape or a silicone. When the colloid 12 is selected from the double-sided tape, the colloid 12 and the flexible substrate 2 are in contact with each other to have an anti-adhesive layer 211. After being irradiated with UV light, the adhesion can be reduced, thereby facilitating the The flexible substrate 2 is separated from the colloid 12 for temporarily attaching the flexible substrate 2, and the flexible substrate 2 is not displaced when the yellow light or the bonding process is performed. Efficiency and quality. Please refer to Figures 3, 4 and 5 again for various embodiments of the preferred embodiment of the present invention. In order to further improve the positioning effect of placing the flexible substrate 2 on the flexible substrate bonding fixture 1, the present invention is specially provided with a positioning structure 13 and the positioning structure i 3 is disposed on the positioning surface. In the first embodiment, the positioning structure 13 is a positioning block in the first embodiment. 3丨, and the positioning block i 3 is an L-shaped structure protruding from the positioning surface lu, the operator only needs to directly abut the adjacent two side edges of the flexible substrate 2 The positioning block 131 is used to temporarily fix the flexible substrate 2 by the colloid 12 to achieve the positioning effect, and also to prevent the operator from operating. In the second embodiment, the positioning structure 丨3 is a positioning groove 132, and the positioning groove 132 is disposed corresponding to the shape of the flexible substrate 2, and the colloid 12 is disposed on the positioning concave. The inside of the groove 132 is for accommodating and temporarily adhering the flexible substrate 2 to the inside of the flexible substrate 2, so that it can be surrounded by the effect frame _ the substrate 2 does not slip in each stroke M440884 'And such a design can also be used as a fixture for inspection to verify whether the cut flexible substrate 2 meets the process requirements. In the third embodiment, the positioning structure 13 is composed of a plurality of positioning posts 133 which are arranged in an L shape and protrude from the positioning surface 111, and are also used for the positioning. The adjacent side edges of the flexible substrate 2 are temporarily fixed by the colloid 12 to achieve the positioning effect, thereby avoiding the operator's erroneous operation. In summary, the flexible substrate bonding fixture of the present invention is provided with the colloid 12 on the bottom plate having a thickness of 3 mm or less, as a medium for temporarily positioning the flexible substrate 2 in a yellow light or bonding process. , and effectively improve the efficiency and quality of the fit. Furthermore, the bottom plate u can be made of a material that can be permeable or opaque according to the requirements of the actual process to improve the design flexibility of various processes. Further, the flexible substrate bonding jig 1 has an effect of providing a positioning structure 3 on the bottom plate 11 to raise the position of the flexible substrate 2, and at the same time, avoiding an erroneous operation by an operator and reducing the occurrence of defective products. Even the two do not create, ... one ~ ~ · one eight ~ 叩〇 is not used to limit the creation of the sound >#阁..^, the scope of the shaving implementation, so the technical domain is There is a general knowledge of 443⁄4. Others who are familiar with, or who are familiar with the changes made by this technology, or who have made it easy to change, should not be divorced from the spirit and scope of this creation. The owing & ~ 匕 and decoration should cover Within the scope of this creation. 8 M440884 [Simplified description of the drawings] Fig. 1 is a schematic structural view of a preferred embodiment of the present invention. Fig. 2 is a schematic view showing the state of use of the preferred embodiment of the present invention. Figure 3 is a first embodiment of the preferred embodiment of the present invention. Figure 4 is a second embodiment of the preferred embodiment of the present invention. Figure 5 is a third embodiment of the preferred embodiment of the present invention. [Main component symbol description] 1 Flexible substrate bonding fixture
11 底板 111 定位面 12 膠體 121 減黏膠層 13 定位構造 131 定位塊 132 定位凹槽 13 3 定位柱11 Base plate 111 Positioning surface 12 Colloid 121 Debonding layer 13 Positioning structure 131 Positioning block 132 Positioning groove 13 3 Positioning column
2 撓性基材 92 flexible substrate 9