TWI420686B - 半導體發光裝置、發光模組及照明裝置 - Google Patents

半導體發光裝置、發光模組及照明裝置 Download PDF

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Publication number
TWI420686B
TWI420686B TW094142928A TW94142928A TWI420686B TW I420686 B TWI420686 B TW I420686B TW 094142928 A TW094142928 A TW 094142928A TW 94142928 A TW94142928 A TW 94142928A TW I420686 B TWI420686 B TW I420686B
Authority
TW
Taiwan
Prior art keywords
light
substrate
layer
semiconductor
emitting
Prior art date
Application number
TW094142928A
Other languages
English (en)
Chinese (zh)
Other versions
TW200633269A (en
Inventor
永井秀男
Original Assignee
松下電器產業股份有限公司
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Filing date
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Application filed by 松下電器產業股份有限公司 filed Critical 松下電器產業股份有限公司
Publication of TW200633269A publication Critical patent/TW200633269A/zh
Application granted granted Critical
Publication of TWI420686B publication Critical patent/TWI420686B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
TW094142928A 2004-12-10 2005-12-06 半導體發光裝置、發光模組及照明裝置 TWI420686B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004358455 2004-12-10

Publications (2)

Publication Number Publication Date
TW200633269A TW200633269A (en) 2006-09-16
TWI420686B true TWI420686B (zh) 2013-12-21

Family

ID=36177320

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094142928A TWI420686B (zh) 2004-12-10 2005-12-06 半導體發光裝置、發光模組及照明裝置

Country Status (4)

Country Link
US (1) US7791091B2 (https=)
JP (1) JP2008523578A (https=)
TW (1) TWI420686B (https=)
WO (1) WO2006062239A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103165800A (zh) * 2011-12-08 2013-06-19 新世纪光电股份有限公司 电子元件
US9306141B2 (en) 2009-08-03 2016-04-05 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor light emitting device

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* Cited by examiner, † Cited by third party
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JP4871694B2 (ja) * 2006-10-06 2012-02-08 日立アプライアンス株式会社 発光ダイオードパッケージ
JP4899931B2 (ja) * 2007-02-28 2012-03-21 日亜化学工業株式会社 照明装置
JP5407116B2 (ja) * 2007-06-22 2014-02-05 豊田合成株式会社 発光装置
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
WO2010050067A1 (ja) * 2008-10-31 2010-05-06 電気化学工業株式会社 発光素子パッケージ用基板及び発光素子パッケージ
JP4686643B2 (ja) * 2009-07-03 2011-05-25 シャープ株式会社 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
CN102804430B (zh) * 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
KR100969100B1 (ko) * 2010-02-12 2010-07-09 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US10649799B2 (en) 2010-03-17 2020-05-12 Zerto Ltd. Hypervisor virtual server system, and method for providing data services within a hypervisor virtual server system
US9442748B2 (en) 2010-03-17 2016-09-13 Zerto, Ltd. Multi-RPO data protection
US9710294B2 (en) 2010-03-17 2017-07-18 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US11256529B2 (en) 2010-03-17 2022-02-22 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US9389892B2 (en) 2010-03-17 2016-07-12 Zerto Ltd. Multiple points in time disk images for disaster recovery
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
KR101194844B1 (ko) * 2010-11-15 2012-10-25 삼성전자주식회사 발광소자 및 그 제조방법
US8502255B2 (en) * 2011-11-21 2013-08-06 Foxsemicon Integrated Technology, Inc. Light emitting diode
KR101891257B1 (ko) * 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
TWI481082B (zh) * 2012-06-15 2015-04-11 茂邦電子有限公司 A light emitting diode package and use of the heat dissipation module
CN103515508A (zh) * 2012-06-19 2014-01-15 茂邦电子有限公司 发光二极管封装及其所使用的散热模块
JP6085459B2 (ja) * 2012-12-05 2017-02-22 星和電機株式会社 照明装置
US20140209961A1 (en) * 2013-01-30 2014-07-31 Luxo-Led Co., Limited Alternating current light emitting diode flip-chip
JP6623508B2 (ja) * 2014-09-30 2019-12-25 日亜化学工業株式会社 光源及びその製造方法、実装方法
CN104393137B (zh) * 2014-09-30 2017-08-25 厦门市三安光电科技有限公司 一种倒装发光器件及其制作方法
JP6960268B2 (ja) * 2017-07-26 2021-11-05 旭化成株式会社 半導体発光装置
US10879420B2 (en) 2018-07-09 2020-12-29 University Of Iowa Research Foundation Cascaded superlattice LED system

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257455B2 (ja) 1997-07-17 2002-02-18 松下電器産業株式会社 発光装置
DE19928576C2 (de) 1999-06-22 2003-05-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares LED-Bauelement mit verbesserter Wärmeabfuhr
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9306141B2 (en) 2009-08-03 2016-04-05 Kabushiki Kaisha Toshiba Method for manufacturing semiconductor light emitting device
CN103165800A (zh) * 2011-12-08 2013-06-19 新世纪光电股份有限公司 电子元件

Also Published As

Publication number Publication date
TW200633269A (en) 2006-09-16
US20090224278A1 (en) 2009-09-10
US7791091B2 (en) 2010-09-07
WO2006062239A1 (en) 2006-06-15
JP2008523578A (ja) 2008-07-03

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