JP2008523578A - 半導体発光装置、発光モジュール及び照明装置 - Google Patents

半導体発光装置、発光モジュール及び照明装置 Download PDF

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Publication number
JP2008523578A
JP2008523578A JP2007523915A JP2007523915A JP2008523578A JP 2008523578 A JP2008523578 A JP 2008523578A JP 2007523915 A JP2007523915 A JP 2007523915A JP 2007523915 A JP2007523915 A JP 2007523915A JP 2008523578 A JP2008523578 A JP 2008523578A
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JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor
layer
emitting module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007523915A
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English (en)
Japanese (ja)
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JP2008523578A5 (https=
Inventor
秀男 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Publication of JP2008523578A publication Critical patent/JP2008523578A/ja
Publication of JP2008523578A5 publication Critical patent/JP2008523578A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8582—Means for heat extraction or cooling characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/921—Structures or relative sizes of bond pads
    • H10W72/923—Bond pads having multiple stacked layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Landscapes

  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
JP2007523915A 2004-12-10 2005-12-07 半導体発光装置、発光モジュール及び照明装置 Pending JP2008523578A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004358455 2004-12-10
PCT/JP2005/022906 WO2006062239A1 (en) 2004-12-10 2005-12-07 Semiconductor light-emitting device, light-emitting module and lighting unit

Publications (2)

Publication Number Publication Date
JP2008523578A true JP2008523578A (ja) 2008-07-03
JP2008523578A5 JP2008523578A5 (https=) 2010-08-12

Family

ID=36177320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523915A Pending JP2008523578A (ja) 2004-12-10 2005-12-07 半導体発光装置、発光モジュール及び照明装置

Country Status (4)

Country Link
US (1) US7791091B2 (https=)
JP (1) JP2008523578A (https=)
TW (1) TWI420686B (https=)
WO (1) WO2006062239A1 (https=)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218484A (ja) * 2007-02-28 2008-09-18 Nichia Chem Ind Ltd 照明装置
JP2011249501A (ja) * 2010-05-26 2011-12-08 Toshiba Corp 発光装置
JP2014112495A (ja) * 2012-12-05 2014-06-19 Seiwa Electric Mfg Co Ltd 照明装置
JP2019029414A (ja) * 2017-07-26 2019-02-21 旭化成株式会社 半導体発光装置

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4871694B2 (ja) * 2006-10-06 2012-02-08 日立アプライアンス株式会社 発光ダイオードパッケージ
JP5407116B2 (ja) * 2007-06-22 2014-02-05 豊田合成株式会社 発光装置
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
WO2010050067A1 (ja) * 2008-10-31 2010-05-06 電気化学工業株式会社 発光素子パッケージ用基板及び発光素子パッケージ
JP4686643B2 (ja) * 2009-07-03 2011-05-25 シャープ株式会社 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP4686625B2 (ja) 2009-08-03 2011-05-25 株式会社東芝 半導体発光装置の製造方法
CN102804430B (zh) * 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
KR100969100B1 (ko) * 2010-02-12 2010-07-09 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US10649799B2 (en) 2010-03-17 2020-05-12 Zerto Ltd. Hypervisor virtual server system, and method for providing data services within a hypervisor virtual server system
US9442748B2 (en) 2010-03-17 2016-09-13 Zerto, Ltd. Multi-RPO data protection
US9710294B2 (en) 2010-03-17 2017-07-18 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US11256529B2 (en) 2010-03-17 2022-02-22 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US9389892B2 (en) 2010-03-17 2016-07-12 Zerto Ltd. Multiple points in time disk images for disaster recovery
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
KR101194844B1 (ko) * 2010-11-15 2012-10-25 삼성전자주식회사 발광소자 및 그 제조방법
US8502255B2 (en) * 2011-11-21 2013-08-06 Foxsemicon Integrated Technology, Inc. Light emitting diode
TWI484674B (zh) * 2011-12-08 2015-05-11 新世紀光電股份有限公司 電子元件
KR101891257B1 (ko) * 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
TWI481082B (zh) * 2012-06-15 2015-04-11 茂邦電子有限公司 A light emitting diode package and use of the heat dissipation module
CN103515508A (zh) * 2012-06-19 2014-01-15 茂邦电子有限公司 发光二极管封装及其所使用的散热模块
US20140209961A1 (en) * 2013-01-30 2014-07-31 Luxo-Led Co., Limited Alternating current light emitting diode flip-chip
JP6623508B2 (ja) * 2014-09-30 2019-12-25 日亜化学工業株式会社 光源及びその製造方法、実装方法
CN104393137B (zh) * 2014-09-30 2017-08-25 厦门市三安光电科技有限公司 一种倒装发光器件及其制作方法
US10879420B2 (en) 2018-07-09 2020-12-29 University Of Iowa Research Foundation Cascaded superlattice LED system

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257455B2 (ja) 1997-07-17 2002-02-18 松下電器産業株式会社 発光装置
DE19928576C2 (de) 1999-06-22 2003-05-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares LED-Bauelement mit verbesserter Wärmeabfuhr
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
WO2004105142A1 (en) * 2003-05-26 2004-12-02 Matsushita Electric Works, Ltd. Light-emitting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218484A (ja) * 2007-02-28 2008-09-18 Nichia Chem Ind Ltd 照明装置
JP2011249501A (ja) * 2010-05-26 2011-12-08 Toshiba Corp 発光装置
JP2014112495A (ja) * 2012-12-05 2014-06-19 Seiwa Electric Mfg Co Ltd 照明装置
JP2019029414A (ja) * 2017-07-26 2019-02-21 旭化成株式会社 半導体発光装置

Also Published As

Publication number Publication date
TW200633269A (en) 2006-09-16
US20090224278A1 (en) 2009-09-10
TWI420686B (zh) 2013-12-21
US7791091B2 (en) 2010-09-07
WO2006062239A1 (en) 2006-06-15

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