JP2008523578A5 - - Google Patents

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Publication number
JP2008523578A5
JP2008523578A5 JP2007523915A JP2007523915A JP2008523578A5 JP 2008523578 A5 JP2008523578 A5 JP 2008523578A5 JP 2007523915 A JP2007523915 A JP 2007523915A JP 2007523915 A JP2007523915 A JP 2007523915A JP 2008523578 A5 JP2008523578 A5 JP 2008523578A5
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JP
Japan
Prior art keywords
light emitting
emitting device
semiconductor light
base material
convex portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007523915A
Other languages
English (en)
Japanese (ja)
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JP2008523578A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2005/022906 external-priority patent/WO2006062239A1/en
Publication of JP2008523578A publication Critical patent/JP2008523578A/ja
Publication of JP2008523578A5 publication Critical patent/JP2008523578A5/ja
Pending legal-status Critical Current

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JP2007523915A 2004-12-10 2005-12-07 半導体発光装置、発光モジュール及び照明装置 Pending JP2008523578A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004358455 2004-12-10
PCT/JP2005/022906 WO2006062239A1 (en) 2004-12-10 2005-12-07 Semiconductor light-emitting device, light-emitting module and lighting unit

Publications (2)

Publication Number Publication Date
JP2008523578A JP2008523578A (ja) 2008-07-03
JP2008523578A5 true JP2008523578A5 (https=) 2010-08-12

Family

ID=36177320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007523915A Pending JP2008523578A (ja) 2004-12-10 2005-12-07 半導体発光装置、発光モジュール及び照明装置

Country Status (4)

Country Link
US (1) US7791091B2 (https=)
JP (1) JP2008523578A (https=)
TW (1) TWI420686B (https=)
WO (1) WO2006062239A1 (https=)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4871694B2 (ja) * 2006-10-06 2012-02-08 日立アプライアンス株式会社 発光ダイオードパッケージ
JP4899931B2 (ja) * 2007-02-28 2012-03-21 日亜化学工業株式会社 照明装置
JP5407116B2 (ja) * 2007-06-22 2014-02-05 豊田合成株式会社 発光装置
JP5405731B2 (ja) * 2007-10-23 2014-02-05 日立コンシューマエレクトロニクス株式会社 光源モジュール
WO2010050067A1 (ja) * 2008-10-31 2010-05-06 電気化学工業株式会社 発光素子パッケージ用基板及び発光素子パッケージ
JP4686643B2 (ja) * 2009-07-03 2011-05-25 シャープ株式会社 半導体発光素子搭載用基板、バックライトシャーシ、表示装置、及び、テレビ受信装置
JP4686625B2 (ja) 2009-08-03 2011-05-25 株式会社東芝 半導体発光装置の製造方法
CN102804430B (zh) * 2010-01-19 2015-11-25 Lg伊诺特有限公司 封装结构及其制造方法
KR100969100B1 (ko) * 2010-02-12 2010-07-09 엘지이노텍 주식회사 발광소자, 발광소자의 제조방법 및 발광소자 패키지
US10649799B2 (en) 2010-03-17 2020-05-12 Zerto Ltd. Hypervisor virtual server system, and method for providing data services within a hypervisor virtual server system
US9442748B2 (en) 2010-03-17 2016-09-13 Zerto, Ltd. Multi-RPO data protection
US9710294B2 (en) 2010-03-17 2017-07-18 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US11256529B2 (en) 2010-03-17 2022-02-22 Zerto Ltd. Methods and apparatus for providing hypervisor level data services for server virtualization
US9389892B2 (en) 2010-03-17 2016-07-12 Zerto Ltd. Multiple points in time disk images for disaster recovery
JP5209075B2 (ja) * 2010-05-21 2013-06-12 有限会社 ナプラ 電子デバイス及びその製造方法
JP5426481B2 (ja) * 2010-05-26 2014-02-26 株式会社東芝 発光装置
US8901586B2 (en) * 2010-07-12 2014-12-02 Samsung Electronics Co., Ltd. Light emitting device and method of manufacturing the same
KR101194844B1 (ko) * 2010-11-15 2012-10-25 삼성전자주식회사 발광소자 및 그 제조방법
US8502255B2 (en) * 2011-11-21 2013-08-06 Foxsemicon Integrated Technology, Inc. Light emitting diode
TWI484674B (zh) * 2011-12-08 2015-05-11 新世紀光電股份有限公司 電子元件
KR101891257B1 (ko) * 2012-04-02 2018-08-24 삼성전자주식회사 반도체 발광장치 및 그 제조방법
TWI481082B (zh) * 2012-06-15 2015-04-11 茂邦電子有限公司 A light emitting diode package and use of the heat dissipation module
CN103515508A (zh) * 2012-06-19 2014-01-15 茂邦电子有限公司 发光二极管封装及其所使用的散热模块
JP6085459B2 (ja) * 2012-12-05 2017-02-22 星和電機株式会社 照明装置
US20140209961A1 (en) * 2013-01-30 2014-07-31 Luxo-Led Co., Limited Alternating current light emitting diode flip-chip
JP6623508B2 (ja) * 2014-09-30 2019-12-25 日亜化学工業株式会社 光源及びその製造方法、実装方法
CN104393137B (zh) * 2014-09-30 2017-08-25 厦门市三安光电科技有限公司 一种倒装发光器件及其制作方法
JP6960268B2 (ja) * 2017-07-26 2021-11-05 旭化成株式会社 半導体発光装置
US10879420B2 (en) 2018-07-09 2020-12-29 University Of Iowa Research Foundation Cascaded superlattice LED system

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3257455B2 (ja) 1997-07-17 2002-02-18 松下電器産業株式会社 発光装置
DE19928576C2 (de) 1999-06-22 2003-05-22 Osram Opto Semiconductors Gmbh Oberflächenmontierbares LED-Bauelement mit verbesserter Wärmeabfuhr
JP4305896B2 (ja) * 2002-11-15 2009-07-29 シチズン電子株式会社 高輝度発光装置及びその製造方法
CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
US7495322B2 (en) * 2003-05-26 2009-02-24 Panasonic Electric Works Co., Ltd. Light-emitting device
US7553683B2 (en) * 2004-06-09 2009-06-30 Philips Lumiled Lighting Co., Llc Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices

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