TWI417676B - 描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法 - Google Patents

描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法 Download PDF

Info

Publication number
TWI417676B
TWI417676B TW099101254A TW99101254A TWI417676B TW I417676 B TWI417676 B TW I417676B TW 099101254 A TW099101254 A TW 099101254A TW 99101254 A TW99101254 A TW 99101254A TW I417676 B TWI417676 B TW I417676B
Authority
TW
Taiwan
Prior art keywords
data
substrate
mesh
area
image
Prior art date
Application number
TW099101254A
Other languages
English (en)
Chinese (zh)
Other versions
TW201033755A (en
Inventor
Satoru Yasaka
Ryo Yamada
Original Assignee
Dainippon Screen Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dainippon Screen Mfg filed Critical Dainippon Screen Mfg
Publication of TW201033755A publication Critical patent/TW201033755A/zh
Application granted granted Critical
Publication of TWI417676B publication Critical patent/TWI417676B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099101254A 2009-03-04 2010-01-18 描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法 TWI417676B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050388A JP5209544B2 (ja) 2009-03-04 2009-03-04 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法

Publications (2)

Publication Number Publication Date
TW201033755A TW201033755A (en) 2010-09-16
TWI417676B true TWI417676B (zh) 2013-12-01

Family

ID=42965968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099101254A TWI417676B (zh) 2009-03-04 2010-01-18 描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法

Country Status (3)

Country Link
JP (1) JP5209544B2 (ko)
KR (1) KR101151494B1 (ko)
TW (1) TWI417676B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI728344B (zh) * 2018-07-20 2021-05-21 日商斯庫林集團股份有限公司 描繪裝置以及描繪方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5496041B2 (ja) 2010-09-30 2014-05-21 大日本スクリーン製造株式会社 変位算出方法、描画データの補正方法、描画方法および描画装置
JP5752967B2 (ja) * 2011-03-29 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス パターン描画方法、パターン描画装置およびコンピュータプログラム
JP5435747B2 (ja) * 2011-03-30 2014-03-05 富士フイルム株式会社 パターン形成方法およびパターン形成装置
KR20130006919A (ko) * 2011-06-27 2013-01-18 삼성전기주식회사 노광시스템 및 노광방법
JP6013097B2 (ja) * 2012-09-14 2016-10-25 株式会社Ｓｃｒｅｅｎホールディングス パターン描画装置、パターン描画方法
JP6150560B2 (ja) * 2013-03-01 2017-06-21 株式会社Ｓｃｒｅｅｎホールディングス データ変換方法、描画システムおよびプログラム
JP2014178536A (ja) 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd 描画データ生成方法、描画方法、描画データ生成装置、および描画装置
JP6228382B2 (ja) * 2013-03-22 2017-11-08 ビアメカニクス株式会社 描画方法及び描画装置
JP7210991B2 (ja) * 2018-10-11 2023-01-24 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
JP7463154B2 (ja) 2020-03-24 2024-04-08 株式会社Ｓｃｒｅｅｎホールディングス 描画装置、データ処理装置、描画方法、および描画データ生成方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999045439A1 (en) * 1998-03-02 1999-09-10 Micronic Laser Systems Ab Improved pattern generator
JP2005037911A (ja) * 2003-07-02 2005-02-10 Fuji Photo Film Co Ltd 画像記録装置、画像記録方法及びプログラム
JP2008003504A (ja) * 2006-06-26 2008-01-10 Orc Mfg Co Ltd 描画システム

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000122303A (ja) * 1998-10-20 2000-04-28 Asahi Optical Co Ltd 描画装置
JP4478496B2 (ja) * 2004-04-07 2010-06-09 株式会社オーク製作所 ローカルアライメント機能を有する露光装置
JP2008058797A (ja) * 2006-09-01 2008-03-13 Fujifilm Corp 描画装置及び描画方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999045439A1 (en) * 1998-03-02 1999-09-10 Micronic Laser Systems Ab Improved pattern generator
JP2005037911A (ja) * 2003-07-02 2005-02-10 Fuji Photo Film Co Ltd 画像記録装置、画像記録方法及びプログラム
JP2008003504A (ja) * 2006-06-26 2008-01-10 Orc Mfg Co Ltd 描画システム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI728344B (zh) * 2018-07-20 2021-05-21 日商斯庫林集團股份有限公司 描繪裝置以及描繪方法

Also Published As

Publication number Publication date
JP5209544B2 (ja) 2013-06-12
KR101151494B1 (ko) 2012-05-31
KR20100100626A (ko) 2010-09-15
JP2010204421A (ja) 2010-09-16
TW201033755A (en) 2010-09-16

Similar Documents

Publication Publication Date Title
TWI417676B (zh) 描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法
KR101480589B1 (ko) 묘화 데이터의 보정 장치 및 묘화 장치
US10429742B2 (en) Stitchless direct imaging for high resolution electronic patterning
JP5852374B2 (ja) 描画装置および描画方法
JP7133379B2 (ja) 描画装置および描画方法
KR101689964B1 (ko) 데이터 보정 장치, 묘화 장치, 검사 장치, 데이터 보정 방법, 묘화 방법, 검사 방법 및 프로그램을 기록한 기록 매체
TWI648603B (zh) 描繪裝置及描繪方法
JP2014178536A (ja) 描画データ生成方法、描画方法、描画データ生成装置、および描画装置
JP6466277B2 (ja) データ補正装置、描画装置、検査装置、データ補正方法、描画方法、検査方法およびプログラム
TWI792211B (zh) 描繪裝置、資料處理裝置、描繪方法以及描繪資料生成方法
JP6114151B2 (ja) 描画装置、基板処理システムおよび描画方法
JP6109692B2 (ja) データ補正方法、データ変換方法、データ補正装置、データ変換装置、描画システムおよびプログラム
JP2023032758A (ja) 描画装置、描画方法およびプログラム
JP4904301B2 (ja) データ変換方法、描画システムおよびプログラム
JP2022052111A (ja) 基板位置検出方法、描画方法、基板位置検出装置および描画装置
JP6131108B2 (ja) 露光描画装置、露光描画方法およびプログラム
KR20180020084A (ko) 데이터 보정 장치, 묘화 장치, 데이터 보정 방법, 묘화 방법 및 기록 매체에 기록된 프로그램