JP5209544B2 - 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法 - Google Patents

描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法 Download PDF

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JP5209544B2
JP5209544B2 JP2009050388A JP2009050388A JP5209544B2 JP 5209544 B2 JP5209544 B2 JP 5209544B2 JP 2009050388 A JP2009050388 A JP 2009050388A JP 2009050388 A JP2009050388 A JP 2009050388A JP 5209544 B2 JP5209544 B2 JP 5209544B2
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Japanese (ja)
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JP2010204421A (ja
Inventor
智 八坂
亮 山田
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Screen Holdings Co Ltd
Dainippon Screen Manufacturing Co Ltd
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Priority to JP2009050388A priority Critical patent/JP5209544B2/ja
Priority to TW099101254A priority patent/TWI417676B/zh
Priority to KR1020100017834A priority patent/KR101151494B1/ko
Publication of JP2010204421A publication Critical patent/JP2010204421A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
    • G03F7/704—Scanned exposure beam, e.g. raster-, rotary- and vector scanning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70681—Metrology strategies
    • G03F7/70683—Mark designs
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706835—Metrology information management or control
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/706843—Metrology apparatus
    • G03F7/706845—Calibration, e.g. tool-to-tool calibration, beam alignment, spot position or focus

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2009050388A 2009-03-04 2009-03-04 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法 Active JP5209544B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009050388A JP5209544B2 (ja) 2009-03-04 2009-03-04 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法
TW099101254A TWI417676B (zh) 2009-03-04 2010-01-18 描繪裝置、描繪裝置用資料處理裝置、及描繪裝置用之描繪資料產生方法
KR1020100017834A KR101151494B1 (ko) 2009-03-04 2010-02-26 묘화장치, 묘화장치용의 데이터 처리장치 및 묘화장치용의 묘화 데이터 생성방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009050388A JP5209544B2 (ja) 2009-03-04 2009-03-04 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法

Publications (2)

Publication Number Publication Date
JP2010204421A JP2010204421A (ja) 2010-09-16
JP5209544B2 true JP5209544B2 (ja) 2013-06-12

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JP2009050388A Active JP5209544B2 (ja) 2009-03-04 2009-03-04 描画装置、描画装置用のデータ処理装置、および描画装置用の描画データ生成方法

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JP (1) JP5209544B2 (ko)
KR (1) KR101151494B1 (ko)
TW (1) TWI417676B (ko)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5496041B2 (ja) 2010-09-30 2014-05-21 大日本スクリーン製造株式会社 変位算出方法、描画データの補正方法、描画方法および描画装置
JP5752967B2 (ja) * 2011-03-29 2015-07-22 株式会社Ｓｃｒｅｅｎホールディングス パターン描画方法、パターン描画装置およびコンピュータプログラム
JP5435747B2 (ja) * 2011-03-30 2014-03-05 富士フイルム株式会社 パターン形成方法およびパターン形成装置
KR20130006919A (ko) * 2011-06-27 2013-01-18 삼성전기주식회사 노광시스템 및 노광방법
JP6013097B2 (ja) * 2012-09-14 2016-10-25 株式会社Ｓｃｒｅｅｎホールディングス パターン描画装置、パターン描画方法
JP6150560B2 (ja) * 2013-03-01 2017-06-21 株式会社Ｓｃｒｅｅｎホールディングス データ変換方法、描画システムおよびプログラム
JP2014178536A (ja) 2013-03-15 2014-09-25 Dainippon Screen Mfg Co Ltd 描画データ生成方法、描画方法、描画データ生成装置、および描画装置
JP6228382B2 (ja) * 2013-03-22 2017-11-08 ビアメカニクス株式会社 描画方法及び描画装置
JP7133379B2 (ja) * 2018-07-20 2022-09-08 株式会社Ｓｃｒｅｅｎホールディングス 描画装置および描画方法
JP7210991B2 (ja) * 2018-10-11 2023-01-24 株式会社ニューフレアテクノロジー マルチ荷電粒子ビーム描画装置及びマルチ荷電粒子ビーム描画方法
JP7463154B2 (ja) * 2020-03-24 2024-04-08 株式会社Ｓｃｒｅｅｎホールディングス 描画装置、データ処理装置、描画方法、および描画データ生成方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE9800665D0 (sv) * 1998-03-02 1998-03-02 Micronic Laser Systems Ab Improved method for projection printing using a micromirror SLM
JP2000122303A (ja) * 1998-10-20 2000-04-28 Asahi Optical Co Ltd 描画装置
JP4505270B2 (ja) * 2003-07-02 2010-07-21 富士フイルム株式会社 画像記録装置、画像記録方法及びプログラム
JP4478496B2 (ja) * 2004-04-07 2010-06-09 株式会社オーク製作所 ローカルアライメント機能を有する露光装置
JP5339671B2 (ja) * 2006-06-26 2013-11-13 株式会社オーク製作所 描画システム
JP2008058797A (ja) * 2006-09-01 2008-03-13 Fujifilm Corp 描画装置及び描画方法

Also Published As

Publication number Publication date
KR20100100626A (ko) 2010-09-15
KR101151494B1 (ko) 2012-05-31
TWI417676B (zh) 2013-12-01
TW201033755A (en) 2010-09-16
JP2010204421A (ja) 2010-09-16

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