TWI412314B - Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier - Google Patents

Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier Download PDF

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Publication number
TWI412314B
TWI412314B TW096134711A TW96134711A TWI412314B TW I412314 B TWI412314 B TW I412314B TW 096134711 A TW096134711 A TW 096134711A TW 96134711 A TW96134711 A TW 96134711A TW I412314 B TWI412314 B TW I412314B
Authority
TW
Taiwan
Prior art keywords
carrier
copper foil
sided flexible
clad laminate
double
Prior art date
Application number
TW096134711A
Other languages
English (en)
Chinese (zh)
Other versions
TW200822832A (en
Inventor
Makoto Ueno
Taeko Takarabe
Original Assignee
Nippon Steel & Sumikin Chem Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Steel & Sumikin Chem Co filed Critical Nippon Steel & Sumikin Chem Co
Publication of TW200822832A publication Critical patent/TW200822832A/zh
Application granted granted Critical
Publication of TWI412314B publication Critical patent/TWI412314B/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper

Landscapes

  • Laminated Bodies (AREA)
TW096134711A 2006-09-29 2007-09-17 Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier TWI412314B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006268380A JP2008091463A (ja) 2006-09-29 2006-09-29 両面フレキシブル銅張積層基板及びキャリア付両面フレキシブル銅張積層基板の製造方法

Publications (2)

Publication Number Publication Date
TW200822832A TW200822832A (en) 2008-05-16
TWI412314B true TWI412314B (zh) 2013-10-11

Family

ID=39375348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096134711A TWI412314B (zh) 2006-09-29 2007-09-17 Method for manufacturing double-sided flexible copper-clad laminated substrate and double-sided flexible copper-clad laminated substrate with carrier

Country Status (4)

Country Link
JP (1) JP2008091463A (ja)
KR (1) KR20080029806A (ja)
CN (1) CN101396895B (ja)
TW (1) TWI412314B (ja)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101328275B1 (ko) * 2010-09-29 2013-11-14 주식회사 포스코 화학적 박리 방법을 이용한 플렉서블 전자소자의 제조방법, 플렉서블 전자소자 및 플렉서블 기판
KR101514221B1 (ko) * 2011-12-07 2015-04-23 에스케이이노베이션 주식회사 다층 폴리이미드 구조의 연성금속적층판 제조방법
WO2015076373A1 (ja) * 2013-11-22 2015-05-28 三井金属鉱業株式会社 回路形成層付支持基板、両面回路形成層付支持基板、多層積層板、多層プリント配線板の製造方法及び多層プリント配線板
TWI616120B (zh) * 2014-06-09 2018-02-21 結合載板的可撓性電路板結構及其製造方法
KR102136542B1 (ko) * 2015-09-04 2020-07-22 타츠타 전선 주식회사 프린트 배선판의 제조 방법 및 상기 방법에 사용되는 프린트 배선판 보호 필름 및 시트형 적층체
CN110874104B (zh) * 2018-08-30 2021-07-30 广东生益科技股份有限公司 镜面钢板温度的在线控制方法、装置和系统
CN113179589A (zh) * 2021-03-12 2021-07-27 黄石广合精密电路有限公司 一种多层pcb外层基铜制作方法
CN117082728B (zh) * 2023-09-04 2024-03-19 江西省鑫聚能科技有限公司 单面fcob线路载板叠构及制作工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW538071B (en) * 2001-11-14 2003-06-21 Thinflex Corp Polyimide resin and cast-on-copper laminate
TW584596B (en) * 2001-12-10 2004-04-21 Mitsui Chemicals Inc Method for manufacturing a polyimide and metal compound sheet

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040260053A1 (en) * 2003-06-20 2004-12-23 Hsu Yen-Huey Polyimide resin and cast-on-copper laminate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW538071B (en) * 2001-11-14 2003-06-21 Thinflex Corp Polyimide resin and cast-on-copper laminate
TW584596B (en) * 2001-12-10 2004-04-21 Mitsui Chemicals Inc Method for manufacturing a polyimide and metal compound sheet

Also Published As

Publication number Publication date
TW200822832A (en) 2008-05-16
KR20080029806A (ko) 2008-04-03
CN101396895B (zh) 2012-11-28
CN101396895A (zh) 2009-04-01
JP2008091463A (ja) 2008-04-17

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