TWI403545B - 白色預浸片、白色積層板及金屬箔貼面積層板 - Google Patents
白色預浸片、白色積層板及金屬箔貼面積層板 Download PDFInfo
- Publication number
- TWI403545B TWI403545B TW095112838A TW95112838A TWI403545B TW I403545 B TWI403545 B TW I403545B TW 095112838 A TW095112838 A TW 095112838A TW 95112838 A TW95112838 A TW 95112838A TW I403545 B TWI403545 B TW I403545B
- Authority
- TW
- Taiwan
- Prior art keywords
- white
- epoxy resin
- prepreg
- weight
- metal foil
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims description 36
- 239000002184 metal Substances 0.000 title claims description 36
- 239000003822 epoxy resin Substances 0.000 claims abstract description 59
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 59
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 239000011342 resin composition Substances 0.000 claims abstract description 28
- 239000003365 glass fiber Substances 0.000 claims abstract description 26
- 125000002723 alicyclic group Chemical group 0.000 claims abstract description 23
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims abstract description 15
- 239000012463 white pigment Substances 0.000 claims abstract description 14
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 3
- 239000011888 foil Substances 0.000 claims description 34
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 14
- 239000004408 titanium dioxide Substances 0.000 claims description 9
- 239000004848 polyfunctional curative Substances 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- 229920000642 polymer Polymers 0.000 claims description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- 229920001577 copolymer Polymers 0.000 claims description 4
- -1 glycidyl ester Chemical class 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 3
- 229920003986 novolac Polymers 0.000 claims description 3
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 229910021647 smectite Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- 125000000217 alkyl group Chemical group 0.000 claims description 2
- 125000004432 carbon atom Chemical group C* 0.000 claims description 2
- 229920001519 homopolymer Polymers 0.000 claims description 2
- 229910052739 hydrogen Inorganic materials 0.000 claims description 2
- 239000001257 hydrogen Substances 0.000 claims description 2
- 239000004849 latent hardener Substances 0.000 claims description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 claims 2
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 claims 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 claims 1
- 150000003254 radicals Chemical class 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 abstract description 23
- 229920005989 resin Polymers 0.000 abstract description 18
- 239000011347 resin Substances 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 5
- 238000010030 laminating Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 abstract description 2
- 238000001035 drying Methods 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 12
- 239000002966 varnish Substances 0.000 description 11
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 238000002845 discoloration Methods 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 7
- 238000005286 illumination Methods 0.000 description 7
- 238000000465 moulding Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000004744 fabric Substances 0.000 description 6
- 229920001187 thermosetting polymer Polymers 0.000 description 6
- 230000006866 deterioration Effects 0.000 description 5
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 4
- 230000006750 UV protection Effects 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011256 inorganic filler Substances 0.000 description 4
- 229910003475 inorganic filler Inorganic materials 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000001721 transfer moulding Methods 0.000 description 4
- 230000004913 activation Effects 0.000 description 3
- 229910000420 cerium oxide Inorganic materials 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 150000003219 pyrazolines Chemical class 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- 229930185605 Bisphenol Natural products 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000004202 carbamide Substances 0.000 description 2
- 235000013877 carbamide Nutrition 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 2
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 2
- 125000000113 cyclohexyl group Chemical class [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 239000006081 fluorescent whitening agent Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000004745 nonwoven fabric Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 150000003512 tertiary amines Chemical class 0.000 description 2
- TXVWTOBHDDIASC-UHFFFAOYSA-N 1,2-diphenylethene-1,2-diamine Chemical class C=1C=CC=CC=1C(N)=C(N)C1=CC=CC=C1 TXVWTOBHDDIASC-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- REJHVSOVQBJEBF-OWOJBTEDSA-N 5-azaniumyl-2-[(e)-2-(4-azaniumyl-2-sulfonatophenyl)ethenyl]benzenesulfonate Chemical class OS(=O)(=O)C1=CC(N)=CC=C1\C=C\C1=CC=C(N)C=C1S(O)(=O)=O REJHVSOVQBJEBF-OWOJBTEDSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- CFNMUZCFSDMZPQ-GHXNOFRVSA-N 7-[(z)-3-methyl-4-(4-methyl-5-oxo-2h-furan-2-yl)but-2-enoxy]chromen-2-one Chemical compound C=1C=C2C=CC(=O)OC2=CC=1OC/C=C(/C)CC1OC(=O)C(C)=C1 CFNMUZCFSDMZPQ-GHXNOFRVSA-N 0.000 description 1
- ABBQHOQBGMUPJH-UHFFFAOYSA-M Sodium salicylate Chemical compound [Na+].OC1=CC=CC=C1C([O-])=O ABBQHOQBGMUPJH-UHFFFAOYSA-M 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- FNAQSUUGMSOBHW-UHFFFAOYSA-H calcium citrate Chemical compound [Ca+2].[Ca+2].[Ca+2].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O.[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O FNAQSUUGMSOBHW-UHFFFAOYSA-H 0.000 description 1
- 239000001354 calcium citrate Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 150000004775 coumarins Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- NJLLQSBAHIKGKF-UHFFFAOYSA-N dipotassium dioxido(oxo)titanium Chemical compound [K+].[K+].[O-][Ti]([O-])=O NJLLQSBAHIKGKF-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 229940079865 intestinal antiinfectives imidazole derivative Drugs 0.000 description 1
- 239000005340 laminated glass Substances 0.000 description 1
- 239000002648 laminated material Substances 0.000 description 1
- 238000001748 luminescence spectrum Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000005191 phase separation Methods 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000002755 pyrazolinyl group Chemical group 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 229960004025 sodium salicylate Drugs 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- RSPCKAHMRANGJZ-UHFFFAOYSA-N thiohydroxylamine Chemical class SN RSPCKAHMRANGJZ-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 235000013337 tricalcium citrate Nutrition 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/04—Layered products comprising a layer of synthetic resin as impregnant, bonding, or embedding substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
- B32B5/28—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer impregnated with or embedded in a plastic substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
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Description
本發明係關於使用為供安裝發光二極體用之印刷電路基板的白色積層板、金屬箔貼面白色積層板、及供積層該白色積層板、與製造該金屬箔貼面白色積層板用的白色預浸片。
近年,電子機器諸如行動電話、相機合體式VTR、行動CD、MD播放器等方面,不僅朝輕量化、薄型化演進,尚講求外觀、操作性及辨視性等附加價值。所以,大多使用視覺效果較高的發光體,該發光體係使用小型且消耗功率較少的發光二極體(以下稱「LED」)。
但是,該等LED隨近年技術的進步,除習知的紅色、黃色、綠色之外,尚有藍色、白色LED亦達實用化,特別係對藍色、白色發光二極體的需求正急遽增加。此外,近年隨LED的高輝度化演進,超高輝度LED亦正開始實用化。
習知主要係使用將發光體部利用樹脂密封的砲彈形式LED,惟近年因為電子機器的小型、薄型化,因而使用在基板表面上直接安裝元件的晶片LED正增加中。該晶片LED相較於當初所使用的砲彈形式LED之下,仍有輝度偏低的問題,雖利用爾後的改良,已達未遜色於砲彈形式的程度。藉由增加晶片LED的輝度,將晶片LED施行高密度積體亦可利用為表面光源。此種表面光源特適用於要求薄型的液晶顯示器用背光源,此外亦可應用為表面發光型照明裝置的引導顯示照明燈、緊急逃生口照明燈、廣告燈等。
但是,在白色LED的發光方法方面,有如:藍色發光元件與黃色螢光體併用的形式,或紅色、藍色、綠色等3原色併用的形式,或紫外發光元件與螢光體併用的形式。
搭載LED元件的印刷電路基板自習知起,便使用將含潤有熱硬化性樹脂的薄片狀玻璃纖維基材層(預浸片),施行加熱加壓成形的積層板。特別係對於藍色、白色的晶片LED而言,於可見光短波長區域中的反射是重要的,自習知起便使用在熱硬化性樹脂中含有著色顏料的二氧化鈦等白色物質。
惟,截至目前為止,印刷電路基板用白色積層板的熱硬化性樹脂部分,將因長期使用或加工時的熱,而出現變色、反射率降低的問題。其中,使用紫外發光元件的LED,其安裝LED晶片的基板將因紫外線而劣化、變色,因而不適用於近年的高輝度LED安裝。故而強烈渴求因紫外線、熱所產生變色現象極少的基板。此外,當晶片LED安裝之際,為能在晶片LED密封步驟時不致發生漏液等不良狀況,亦將要求高板厚精度,渴求二者兼備的基板。
所以,為能解決上述課題而經深入鑽研,結果發明出即使因熱或紫外線所產生的劣化、變色現象仍極少、反射率降低狀況極少的印刷電路基板用白色預浸片,以及將該白色預浸片1片至複數片積層的白色積層板,暨將金屬箔積層配置的金屬箔貼面白色積層板,遂完成本發明。此外,該白色積層板、及金屬箔貼面白色積層板係具有高耐熱性,且板厚精度亦佳、加工性亦優越。
為解決上述課題,本發明係具有以下(1)~(13)構成:(1)本發明的白色預浸片係將以含脂環式環氧樹脂(A1)的環氧樹脂(A)、(甲基)丙烯酸縮水甘油酯系聚合物(B)、白色顏料(C)及硬化劑(D)為必要成分的樹脂組成物(E),含潤於薄片狀玻璃纖維基材中並乾燥。
(2)本發明的白色預浸片較佳者為,上述含脂環式環氧樹脂(A1)的環氧樹脂(A)係選擇自雙酚類二縮水甘油醚型、苯酚類酚醛型、縮水甘油胺型、及縮水甘油酯型中的通用環氧樹脂(A2),在環氧樹脂(A)中含有5~60重量%。
(3)本發明的白色預浸片較佳者為,上述樹脂組成物(E)係由(A):20~85重量%、(B):5~40重量%、(C):10~75重量%、(D):(E)中所含環氧基每1當量為0.5~2當量比之調配量的組成比所構成。
(4)本發明的白色預浸片較佳者為,上述脂環式環氧樹脂(A1)係具有下式(1)所示構造。
式(1)
式(1)中,R係指氫或具有碳數1~5直鏈或側鏈的烷基。n係指1至30的整數。
(5)本發明的白色預浸片較佳者為,上述(甲基)丙烯酸縮水甘油酯系聚合物(B)係(甲基)丙烯酸縮水甘油酯均聚物。
(6)本發明的白色預浸片較佳者為,上述(甲基)丙烯酸縮水甘油酯系聚合物(B)係(甲基)丙烯酸縮水甘油酯與自由基聚合性單體的共聚物。
(7)本發明的白色預浸片較佳者為,上述白色顏料(C)係從氧化鋅、碳酸鈣、二氧化鈦、氧化鋁、及合成綠土中選擇1種或2種以上。
(8)本發明的白色預浸片較佳者為,上述白色顏料(C)係二氧化鈦。
(9)本發明的白色預浸片較佳者為,上述硬化劑(D)係潛在性硬化劑。
(10)本發明的白色積層板較佳者為,將(1)~(9)項所記載之白色預浸片1片或複數片的積層物,施行加熱加壓成形。
(11)本發明的金屬箔貼面白色積層板較佳者為,在(1)~(9)項所記載白色預浸片1片或複數片積層物上,更積層配置金屬箔,並施行加熱加壓成形。
(12)如(10)項之白色積層板,較佳者為使用為供晶片型發光二極體安裝用的印刷電路基板。
(13)如(11)項之金屬箔貼面白色積層板,較佳者為使用為供晶片型發光二極體安裝用的印刷電路基板。
根據本發明,將可提供在可見光區域中的反射率較高,且因加熱、紫外線所發生的變色現象將明顯減少,具有高耐熱性、板厚精度亦優越的印刷電路基板用白色預浸片、白色積層板、及金屬箔貼面白色積層板。
本發明的白色預浸片中,在薄片狀玻璃纖維基材中所含潤的樹脂組成物(E),其構成要件之一的環氧樹脂(A)必需含有脂環式環氧樹脂(A1)。該脂環式環氧樹脂(A1)係熱硬化性樹脂之一,在耐紫外線對策上極為有效,將可獲得因紫外線產生的劣化、變色現象極少,反射率降低狀況極少的白色預浸片、白色積層板、及金屬箔貼面白色積層板。此外,為能獲得耐熱性,該脂環式環氧樹脂(A1)之中,最好使用硬化物的玻璃轉移溫度較高之樹脂。樹脂硬化物的玻璃轉移溫度最好在150~300℃範圍內,尤以180~250℃為佳。
一般脂環式環氧樹脂(A1)係除氫化雙酚A之二縮水甘油醚型、環己烯氧化型之外,尚可舉例如在環己烷衍生物的縮合物上,直接鍵結環氧基的脂環式環氧樹脂(上述結構式(1))等。
但是,上述氫化雙酚A的二縮水甘油醚型環氧樹脂,反應性較低,且雖隨硬化劑而有所不同,但是一般硬化物的玻璃轉移溫度亦大多為120℃左右的偏低溫度。此外,環己烯氧化型環氧樹脂雖硬化物的玻璃轉移溫度較高(一般為180℃至200℃左右),但是反應性卻偏低。但是,已知任一脂環式環氧樹脂的耐紫外線性均較高,因而藉由選擇酸酐系硬化劑,便可適用為本發明的環氧樹脂(A)。上述結構式(1)所示脂環式環氧樹脂(A1)因為具有高耐熱性與耐紫外線性,因而最適用為本發明的環氧樹脂(A)。
脂環式環氧樹脂(A1)的熔融黏度較低,在對預浸片施行加熱加壓成形之際,將有出現板厚精度惡化問題的可能性,因而本發明的白色預浸片中,薄片狀玻璃纖維基材所含潤的樹脂組成物(E)中,相較於環氧樹脂(A)僅使用脂環式環氧樹脂(A1)的情況下,最好摻混入其他環氧樹脂。
本發明的環氧樹脂(A)中,為能改善上述不良情況與改進製造成本,亦可添加通用環氧樹脂(A2)。即,可減少環氧樹脂(A)中的脂環式環氧樹脂(A1)比例,並將其餘部分取代為通用環氧樹脂(A2)。該通用環氧樹脂(A2)的添加量係在環氧樹脂(A)中含有5~60重量%,較佳為30~50重量%。若相對於環氧樹脂(A)的添加量在60重量%以下,使用脂環式環氧樹脂(A1)所產生的效果將不致降低,即較不易因熱或紫外線而發生劣化、變色狀況。
本發明環氧樹脂(A)中所添加的通用環氧樹脂(A2),有如:雙酚類(雙酚A、F、或S等)二縮水甘油醚型、苯酚類(苯酚、甲酚等)酚醛型、縮水甘油胺型、縮水甘油酯型等,並無特別的限制,就成本與性能均衡佳的觀點,最好為雙酚類(特別係A及F)二縮水甘油醚型環氧樹脂。
本發明的白色預浸片中,薄片狀玻璃纖維基材所含潤樹脂組成物(E),其構成要件之一的含脂環式環氧樹脂(A1)的環氧樹脂(A)含有量,最好為樹脂組成物(E)(非揮發成分)的20~85重量%。若達20重量%以上,將可獲得上述效果,若在85重量%以下,便不致有因脂環式環氧樹脂(A1)熔融黏度降低所引發,在對預浸片施行加熱加壓成形之際發生板厚精度惡化問題的可能性,且亦不致對成本面造成不利。
本發明的白色預浸片中,在薄片狀玻璃纖維基材所含潤的樹脂組成物(E)中,必需添加(甲基)丙烯酸縮水甘油酯系聚合物(B)。藉此,便將改善樹脂組成物(E)的顏料分散性、與預浸片成形時的樹脂流動性,且亦可迴避如前述的脂環式環氧樹脂(A1)熔融黏度降低,在對預浸片施行加熱加壓成形之際出現板厚精度惡化的問題。藉由改善顏料的分散性便將使外觀變佳,且藉由改善成形時的樹脂流動性,便將提升積層板的板厚精度。
上述(甲基)丙烯酸縮水甘油酯系聚合物(B)的環氧當量最好100~1000g/eq左右,最好為重量平均分子量200~250,000範圍內的(甲基)丙烯酸縮水甘油酯均聚物、或(甲基)丙烯酸縮水甘油酯與自由基聚合性單體的共聚物,將可提升耐熱性。共聚合的比例係相對於(甲基)丙烯酸縮水甘油酯之下,自由基聚合性單體最好在5~75重量%範圍內。且,較適合使用的自由基聚合性單體有如:苯乙烯、(甲基)丙烯酸甲酯等(甲基)丙烯酸酯衍生物;(甲基)丙烯酸環己酯等。
上述(甲基)丙烯酸縮水甘油酯系聚合物(B)的添加量,可在樹脂組成物(E)中添加5~40重量%。當添加前述通用環氧樹脂(A2)時,藉由相對於樹脂組成物(E)之下,添加上述(甲基)丙烯酸縮水甘油酯系聚合物(B)5重量%以上,便可抑制耐熱性降低,並抑制脂環式環氧樹脂(A1)與通用環氧樹脂(A2)的硬化物中之相分離狀況,特別係添加10~20重量%的話將最能發揮效果。且,若在40重量%以下,樹脂組成物(E)對薄片狀玻璃纖維基材的含潤性將不致惡化。
本發明的樹脂組成物(E)中必需添加白色顏料(C)。所添加的白色顏料(C)可例示如:氧化鋅、碳酸鈣、二氧化鈦、氧化鋁、合成綠土等,只要屬於白色無機粉末的話便可,其餘並無特別的限制,就從可見光反射率、白色度、或電氣特性的觀點,最好使用二氧化鈦。
二氧化鈦的結晶構造有銳鈦礦型與金紅石型。若舉二者特徵說明,銳鈦礦型在可見光短波長區域中的反射率佳,而金紅石型的長期耐久性、耐變色性較優越。在本發明樹脂組成物(E)中所添加的白色顏料(C)將可為任一者,其餘並無特別的限制。當然亦可將二者混合使用。
本發明樹脂組成物(E)中所含白色顏料(C)的含有量,最好在樹脂組成物(E)中含有10~75重量%。若在10重量%以上,將可獲得充分的白色度、反射率,若在75重量%以下,將不致發生對薄片狀玻璃纖維基材的含潤性降低、或與金屬箔間的黏合強度降低等不良狀況。
當白色顏料(C)係使用二氧化鈦的情況時,亦可對二氧化鈦施行氧化鋁、二氧化矽處理等表面處理。且,亦可施行矽烷系偶合劑、鈦酸鹽系偶合劑處理。
在薄片狀玻璃纖維基材所含潤的樹脂組成物(E)中,除上述白色顏料(C)以外,視需要尚可含有二氧化矽等無機填充材。可含有的無機填充材有如:二氧化矽、氫氧化鋁、氫氧化鎂、E玻璃粉末、氧化鎂、鈦酸鉀、矽酸鈣、黏土、滑石等,可單獨使用,亦可合併使用2種以上。藉由含有該等無機填充材,將提升基板的剛性率。調配量並無特別的限制,相對於樹脂組成物(E)之下最好含有50重量%以下。若在50重量%以下,便幾乎不致有發生對薄片狀玻璃纖維基材的含潤性降低、或與金屬箔間之黏合強度降低等不良狀況的可能性。
在薄片狀玻璃纖維基材所含潤的樹脂組成物(E)中,除上述白色顏料(C)、無機填充材之外,視需要尚可調配入螢光劑。藉由調配入螢光劑,便可提高可見光短波長區域中的表觀反射率。此處所謂「螢光劑」係指具有會將光、放射線、紫外線等光能源吸收,再改變為其他波長光並放射之特性的化合物,例如有機物的二胺基二苯乙烯衍生物、蒽、水楊酸鈉、二胺基二苯乙烯二磺酸衍生物、咪唑衍生物、香豆素衍生物、吡唑啉衍生物、癸基胺衍生物等。而無機物則有如ZnCdS:Ag、ZnS:Pb、ZnS:Cu等。螢光劑最好反射率降低明顯,且在可見光短波長區域(380~470nm)中存在有放射波長,上述螢光劑中,最好為一般通稱螢光增白劑的二胺基二苯乙烯二磺酸衍生物、咪唑衍生物、香豆素衍生物、吡唑啉衍生物等。相關其添加量並無限制,當為吡唑啉衍生物的情況時,相對於樹脂組成物(E)之下,添加0.1重量%左右將發揮效果,若添加量越多所產生的效果越大。此外,所添加的螢光增白劑最好可溶於溶劑中。
在本發明所使用的環氧樹脂系中必需含有硬化劑(D)。環氧樹脂的硬化劑係除一級胺〔二胺基二苯碸(以下稱「DDS」)等〕、二級胺、三級胺之外,尚有如:酸酐或其衍生物、及芳香族重氮鹽、芳香族硫鹽等光硬化劑。
本發明所使用的硬化劑(D)在屬於上述硬化劑的前提下,並無特別的限制,當脂環式環氧樹脂(A1)係使用上述結構式(1)所示化合物的情況時,最好使用二氰基二醯胺(以下稱「DICY」)等潛在性硬化劑。
此處所謂「潛在性硬化劑」係指若超越某溫度便將發揮硬化劑的功能,而使熱硬化性樹脂硬化的化合物。此種溫度一般稱為「活化溫度」,在較低於活化溫度的溫度下,在實質上將不會產生熱硬化性樹脂的硬化。該活化溫度並無特別的限制,最好在80~170℃範圍內,較容易處置且實用上較為有利。
潛在性硬化劑係除上述DICY之外,尚可使用如:尿素系硬化劑、有機酸醯肼系硬化劑、聚胺鹽系硬化劑、胺加成系硬化劑等。
硬化劑(D)的調配量係隨硬化劑種類而異,一般最好設定為從環氧當量與胺(酸)當量所求得的比例。即,在本發明白色預浸片所使用的樹脂組成物(E)中,硬化劑(D)相對於環氧樹脂類〔(Al)+(A2)+(B)〕的配合比率,最好設定為環氧基每1當量為0.5~2當量比的調配量。
再者,當硬化劑(D)係使用上述DICY之際,除該硬化劑之外,視需要尚可添加三級胺、咪唑類等硬化促進劑。咪唑類係可舉例如:2-甲基咪唑、2-乙基-4甲基咪唑、2-苯基咪唑、1-氰乙基-2-十一烷基咪唑、2-苯基-4-甲基咪唑等。該硬化促進劑的添加量係相對於環氧樹脂類與硬化劑〔(A1)+(A2)+(B)+(D)〕之下,最好添加0.05~5重量%左右。
本發明的白色預浸片所使用薄片狀玻璃纖維基材,可為玻璃纖維布、不織布等任一者,亦可合併使用玻璃纖維布與不織布。當使用玻璃纖維布的情況時,雖以平織構造為基礎,但是亦可為棋盤格梭織、緞子織、斜紋織等織物構造,並無特別的限制。為能不致損及外觀與加工性,最好使用經紗與緯紗的交叉部間隙較小編織構造。相關玻璃纖維布的厚度並無特別的限制,就較容易處置的觀點,最好設定為0.02~0.3mm範圍內。
再者,對薄片狀玻璃纖維基材亦可利用矽烷偶合劑等施行表面處理。此外,薄片狀玻璃纖維基材本身亦可著色為白色。
在如上述所説明的樹脂組成物中添加甲乙酮等溶劑而調製成樹脂清漆,再含潤於由玻璃纖維布等所構成薄片狀玻璃纖維基材中,經乾燥便製得本發明的白色預浸片。使樹脂組成物含潤於薄片狀玻璃纖維基材中並乾燥的方法,並無特別的限制,例如可採取在樹脂組成物中利用浸漬等方式而含潤於薄片狀玻璃纖維基材中之後,再於100℃~180℃左右的溫度下施行加熱,而將溶劑去除及使環氧樹脂半硬化的方法等。薄片狀玻璃纖維基材所含潤且乾燥而製得白色預浸片的樹脂組成物含潤量,並無特別的限制,最好30-60重量%。
將所獲得白色預浸片1片或複數片積層物,施行加熱加壓成形便可製得本發明的白色積層板。且,在所獲得白色預浸片1片或複數片積層物上,更進一步積層配置金屬箔,經加熱加壓成形便可製得本發明的金屬箔貼面白色積層板。重疊的片數並無特別的限制,單層基板係白色預浸片1片或重疊2~10片,當屬於金屬箔貼面白色積層板的情況時,一般係在其上面或上下積層配置金屬箔。多層基板係將上述單層基板複數片積層而製得,相關重疊片數並無特別的限制。金屬箔係可使用銅箔、鋁箔等。且,金屬箔厚度一般係3μm~105μm,特別以12μm~35μm為佳。此外’亦可僅將本發明白色預浸片的積層物使用為表面層,而中間層則使用習知技術的預浸片。依此所獲得的本發明白色積層板、金屬箔貼面白色積層板,將成為在可見光區域中的反射率較高,因加熱、紫外線所產生的變色將明顯減少、具有高耐熱性、且板厚精度優越的印刷電路基板用白色積層板、及金屬箔貼面白色積層板。
對所獲得白色積層板經利用添加法形成導體圖案,便可形成印刷電路基板。此外,在所獲得金屬箔貼面白色積層板的金屬箔上施行電路圖案印刷,經施行蝕刻便將形成印刷電路基板。在將晶片LED安裝於該印刷電路基板上方面,首先在印刷電路基板上塗佈焊錫,經在其上面載置晶片LED之後,再將其利用迴焊等方式而使焊錫熔融,便將晶片LED固定於印刷電路基板上。藉由將晶片LED施行高密度積體便可利用為表面光源,此種表面光源頗適用於特別要求薄型的液晶顯示器用背光源。此外,表面發光型照明裝置尚可應用於引導顯示照明燈、緊急逃生口照明燈、廣告燈等方面。
晶片LED安裝用基板的板厚精度,在將基板上所安裝元件利用轉注成形施行密封之際將屬極重要關鍵。此處所謂「轉注成形」係指將樹脂擠入於經模鎖之模具內的手法。晶片LED所使用基板的厚度,一般係0.06mm至1.0mm,若板厚精度差,在施行轉注成形之際,於模鎖時將在基板與模具間發生間隙,所擠入的樹脂便將從該間隙洩漏而發生成形不良狀況。此種轉注成形的基板板厚要求精度係例如厚度1.0mm的基板,便設定為容許差±0.05mm以下(範圍0.1mm),最好容許差±0.03mm以下(範圍0.06mm)。所以,若板厚精度較高的基板,在晶片LED之製造步驟中,將可大幅降低不良率,在產業上極具意義。
其次,針對本發明內容及效果利用實施例進行説明,惟本發明在不脫逸其主旨的前提下,並不僅侷限於下述實施例。
將脂環式環氧樹脂:EHPE-3150(Daicel化學工業(股)製)50重量份、雙酚A型環氧樹脂:AER-6051EK75(旭化成工業(股)製)40重量份、以及甲基丙烯酸縮水甘油酯共聚物:marproof G-0150M(日本油脂(股)製)10重量份,溶解於甲乙酮(以下稱「MEK」)50重量份中。...(清漆A)
將硬化劑的DICY(3重量份)、硬化促進劑的C11Z-CN(四國化成工業(股)製、1-氰乙基-2-十一烷基咪唑)0.1重量份,溶解於二甲基甲醯胺(以下稱「DMF」)25重量份中。...(清漆B)
將清漆A與清漆B混合,並添加白色顏料的金紅石型二氧化鈦R-21(堺化學工業(股)製)73重量份、螢光增白劑的HR-101(中央合成化學(股)製、吡唑啉衍生物、放射波長:450nm)0.3重量份,並在室溫下施行攪拌1小時,便獲得白色環氧清漆。
使該白色環氧清漆含潤於0.1mm厚玻璃纖維布WEA-116E(日東紡(股)製)中,並於150℃下施行5分鐘的預乾燥,便獲得樹脂組成物含有量50%的預浸片。對該預浸片1片、4片、及10片積層物,朝其上下重疊18μm厚的銅箔,並依壓力40kgf/cm2、溫度170℃的條件施行加熱加壓成形,便分別獲得0.1mm厚、0.4mm厚、及1mm厚的金屬箔貼面白色積層板。
除將白色環氧清漆的組成依下述進行改變之外,其餘均如同實施例1般的獲得白色積層板。
將雙酚A型環氧樹脂:AER-6051EK75(旭化成工業(股)製)50重量份、甲酚酚醛型環氧樹脂:YDCN-704(東都化成(股)製)50重量份,溶解於MEK40重量份中。...(清漆C)
將硬化劑的DDS(19重量份)、硬化促進劑的2P4MZ(四國化成工業(股)製、2-苯基-4-甲基咪唑)0.4重量份,溶解於DMF(30重量份)中。...(清漆D)
將清漆C與清漆D混合,並添加白色顏料的銳鈦礦型二氧化鈦TA-500(富士鈦工業(股)製)73重量份、螢光增白劑的HR-101(中央合成化學(股)製)0.3重量份,便獲得白色環氧清漆。
使用所獲得的白色環氧清漆,如同實施例1般的製成預浸片,將其積層,並在上下重疊上銅箔且施行加熱加壓成形,便分別獲得0.1mm厚、0.4mm厚、及1mm厚的金屬箔貼面白色積層板。
1)耐熱變色性將實施例1、比較例1所獲得0.1mm金屬箔貼面白色積層板的銅箔,利用蝕刻處理而去除之後,再根據JIS-Z8722測量該基板表面的可見光反射率,更在180℃下施行4小時加熱處理後,同樣的測量可見光反射率。結果如第1圖所示。由第1圖中得知,實施例1的基板相較於比較例1的基板之下,短波長區域中的劣化狀況較少,且提升耐熱性。
2)耐紫外線將實施例1、比較例1所獲得0.1mm金屬箔貼面白色積層板的銅箔,利用蝕刻處理而去除之後,再根據JIS-Z8722測量該基板表面的可見光反射率,再將400W的高壓水銀燈光(紫外部發光光譜:253.7nm、365nm),對基板依照射距離45cm(照射強度=約6W/m2
)施行500小時的照射處理後,再同樣的測量可見光反射率。
結果如第2圖所示。由第2圖中得知,實施例1的基板相較於比較例1的基板之下,短波長區域中的劣化狀況較少,且提升耐紫外線性。
3)玻璃轉移溫度玻璃轉移溫度係根據JIS-C6481求得。換言之,將實施例1、比較例1所獲得0.4mm厚的金屬箔貼面白色積層板的銅箔,利用蝕刻處理而去除後,再切取7mm×70mm大小,使用自由衰減型動態黏彈測定裝置(Rhesca公司製、型號:AD-1100AD),依升溫速度2℃/分施行測量,從測量數據的損失正切尖峰溫度求取玻璃轉移溫度。
實施例1、比較例1的白色積層板(金屬箔去除後)的玻璃轉移溫度,分別為200℃、190℃。由結果得知,實施例1、比較例1的白色積層板雖均具有實用上充分的耐熱性,但是實施例1的白色積層板則具較優越的耐熱性。
4)板厚精度將實施例1、比較例1所獲得1mm厚的金屬箔貼面白色積層板(1000mm×1000mm)板厚,利用1/1000mm測微器,依縱250mm間隔及橫70mm間隔共計測量60個地方,並求取板厚範圍、及最大值與最小值的差。實施例1、比較例1的金屬箔貼面白色積層板之板厚數據,如表1所示。實施例1與比較例1的板厚最大值與最小值差,分別為0.055mm、0.115mm。
由結果得知,實施例1的金屬箔貼面白色積層板相較於比較例1之下,將提升板厚精度,能充分滿足要求精度。
如上述所説明,根據本發明,將可提供在可見光區域中的反射率較高,且因加熱、紫外線所發生的變色現象將明顯減少,具有高耐熱性、板厚精度亦優越的印刷電路基板用白色預浸片、白色積層板、及金屬箔貼面白色積層板,頗有助於產業界。
第1圖係180℃下施行4小時加熱處理後的可見光反射率比較。
第2圖係高壓水銀燈(400W)光(紫外部主發光波長:253.7nm及365nm、照射強度:約6W/m2
),照射500小時處理後的可見光反射率比較。
Claims (10)
- 一種白色預浸片,係將以含脂環式環氧樹脂(A1)的環氧樹脂(A)、(甲基)丙烯酸縮水甘油酯系聚合物(B)、白色顏料(C)及硬化劑(D)為必要成分的樹脂組成物(E),含潤於薄片狀玻璃纖維基材中並乾燥,其中該含脂環式環氧樹脂(A1)的環氧樹脂(A)係除氫化雙酚A之二縮水甘油醚型、環己烯氧化型之外,係選擇自雙酚類二縮水甘油醚型、苯酚類酚醛型、縮水甘油胺型、及縮水甘油酯型中的通用環氧樹脂(A2),在環氧樹脂(A)中含有5~60重量%;該樹脂組成物(E)係由(A)為20~85重量%、(B)為5~40重量%、(C)為10~75重量%、(D)為在(E)中所含環氧基每1當量為0.5~2當量比之調配量的組成比所構成;以及該脂環式環氧樹脂(A1)係具有下式(1)所示構造:
- 如申請專利範圍第1項之白色預浸片,其中,該(甲基)丙烯酸縮水甘油酯系聚合物(B),係(甲基)丙烯酸縮水甘油酯均聚物。
- 如申請專利範圍第1項之白色預浸片,其中,該(甲基)丙烯酸縮水甘油酯系聚合物(B),係(甲基)丙烯酸縮水甘油酯與自由基聚合性單體的共聚物。
- 如申請專利範圍第1項之白色預浸片,其中,該白色顏料(C)係從氧化鋅、碳酸鈣、二氧化鈦、氧化鋁、及合成綠土中選擇1種或2種以上。
- 如申請專利範圍第1項之白色預浸片,其中,該白色顏料(C)係二氧化鈦。
- 如申請專利範圍第1項之白色預浸片,其中,該硬化劑(D)係潛在性硬化劑。
- 一種白色積層板,係對將如申請專利範圍第1至6項中任一項之白色預浸片1片或複數片的積層物,施行加熱加壓成形。
- 一種金屬箔貼面白色積層板,係在如申請專利範圍第1至6項中任一項之白色預浸片1片或複數片積層物上,更積層配置金屬箔,並施行加熱加壓成形。
- 一種印刷電路基板,係供安裝晶片型發光二極體用,並使用如申請專利範圍第7項之白色積層板所構成。
- 一種印刷電路基板,係供安裝晶片型發光二極體用,並使用如申請專利範圍第8項之金屬箔貼面白色積層板所構成。
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JP2005140406A JP4634856B2 (ja) | 2005-05-12 | 2005-05-12 | 白色プリプレグ、白色積層板、及び金属箔張り白色積層板 |
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US (1) | US20090194320A1 (zh) |
EP (1) | EP1887031B1 (zh) |
JP (1) | JP4634856B2 (zh) |
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CN (1) | CN101218285B (zh) |
CA (1) | CA2608179C (zh) |
DE (1) | DE602006011456D1 (zh) |
HK (1) | HK1120283A1 (zh) |
MY (1) | MY144427A (zh) |
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CN101218285B (zh) | 2011-03-30 |
CA2608179C (en) | 2010-06-29 |
JP2006316173A (ja) | 2006-11-24 |
HK1120283A1 (en) | 2009-03-27 |
EP1887031A4 (en) | 2009-05-13 |
MY144427A (en) | 2011-09-15 |
CN101218285A (zh) | 2008-07-09 |
EP1887031A1 (en) | 2008-02-13 |
EP1887031B1 (en) | 2009-12-30 |
WO2006121090A1 (ja) | 2006-11-16 |
JP4634856B2 (ja) | 2011-02-16 |
TW200704688A (en) | 2007-02-01 |
KR20080014830A (ko) | 2008-02-14 |
DE602006011456D1 (de) | 2010-02-11 |
KR100940232B1 (ko) | 2010-02-04 |
CA2608179A1 (en) | 2006-11-16 |
US20090194320A1 (en) | 2009-08-06 |
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