TWI402165B - Copper foil and the use of its copper clad laminate - Google Patents
Copper foil and the use of its copper clad laminate Download PDFInfo
- Publication number
- TWI402165B TWI402165B TW099146067A TW99146067A TWI402165B TW I402165 B TWI402165 B TW I402165B TW 099146067 A TW099146067 A TW 099146067A TW 99146067 A TW99146067 A TW 99146067A TW I402165 B TWI402165 B TW I402165B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper foil
- copper
- less
- oil film
- film equivalent
- Prior art date
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 129
- 239000011889 copper foil Substances 0.000 title claims description 89
- 229910052802 copper Inorganic materials 0.000 title claims description 40
- 239000010949 copper Substances 0.000 title claims description 40
- 238000005482 strain hardening Methods 0.000 claims description 36
- 238000005452 bending Methods 0.000 claims description 31
- 238000000137 annealing Methods 0.000 claims description 22
- 239000010410 layer Substances 0.000 claims description 22
- 238000005097 cold rolling Methods 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 238000005096 rolling process Methods 0.000 claims description 18
- 230000003746 surface roughness Effects 0.000 claims description 17
- 238000003490 calendering Methods 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 239000003921 oil Substances 0.000 description 35
- 239000000463 material Substances 0.000 description 23
- 238000000034 method Methods 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 9
- 238000012545 processing Methods 0.000 description 8
- 238000001953 recrystallisation Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- 239000000203 mixture Substances 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010731 rolling oil Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- 238000005266 casting Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21B—ROLLING OF METAL
- B21B3/00—Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metal Rolling (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009297461A JP5094834B2 (ja) | 2009-12-28 | 2009-12-28 | 銅箔の製造方法、銅箔及び銅張積層板 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201124269A TW201124269A (en) | 2011-07-16 |
TWI402165B true TWI402165B (zh) | 2013-07-21 |
Family
ID=44226453
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW099146067A TWI402165B (zh) | 2009-12-28 | 2010-12-27 | Copper foil and the use of its copper clad laminate |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP5094834B2 (ja) |
KR (1) | KR101396214B1 (ja) |
CN (1) | CN102655956B (ja) |
TW (1) | TWI402165B (ja) |
WO (1) | WO2011081044A1 (ja) |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5822669B2 (ja) | 2011-02-18 | 2015-11-24 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔及びそれを用いたグラフェンの製造方法 |
JP5850720B2 (ja) | 2011-06-02 | 2016-02-03 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP5752536B2 (ja) * | 2011-08-23 | 2015-07-22 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP5676401B2 (ja) * | 2011-09-21 | 2015-02-25 | Jx日鉱日石金属株式会社 | フレキシブルプリント配線板用銅箔 |
JP5679580B2 (ja) * | 2011-11-07 | 2015-03-04 | Jx日鉱日石金属株式会社 | 圧延銅箔 |
JP5721609B2 (ja) * | 2011-11-15 | 2015-05-20 | Jx日鉱日石金属株式会社 | グラフェン製造用銅箔、及びグラフェンの製造方法 |
JP5650099B2 (ja) * | 2011-11-22 | 2015-01-07 | Jx日鉱日石金属株式会社 | 超電導膜形成用圧延銅箔 |
CN103290345B (zh) * | 2012-02-28 | 2015-07-01 | Jx日矿日石金属株式会社 | 轧制铜箔 |
JP5546571B2 (ja) * | 2012-03-29 | 2014-07-09 | Jx日鉱日石金属株式会社 | 銅箔、銅張積層体、フレキシブル配線板及び立体成型体 |
JP5826160B2 (ja) * | 2012-04-10 | 2015-12-02 | Jx日鉱日石金属株式会社 | 圧延銅箔、銅張積層板、フレキシブルプリント配線板及びその製造方法 |
JP5298225B1 (ja) * | 2012-06-29 | 2013-09-25 | Jx日鉱日石金属株式会社 | 圧延銅箔及びその製造方法、並びに、積層板 |
JP5261595B1 (ja) * | 2012-06-29 | 2013-08-14 | Jx日鉱日石金属株式会社 | 圧延銅箔及びその製造方法、並びに、積層板 |
JP5723849B2 (ja) * | 2012-07-19 | 2015-05-27 | Jx日鉱日石金属株式会社 | 高強度チタン銅箔及びその製造方法 |
JP5542898B2 (ja) * | 2012-10-24 | 2014-07-09 | Jx日鉱日石金属株式会社 | カメラモジュール及びチタン銅箔 |
JP5882932B2 (ja) * | 2012-11-06 | 2016-03-09 | Jx金属株式会社 | 圧延銅箔、表面処理銅箔及び積層板 |
JP6206195B2 (ja) * | 2014-01-10 | 2017-10-04 | 東レ株式会社 | 複合体、複合体にシーラント層を積層した構成体。 |
JP6078024B2 (ja) | 2014-06-13 | 2017-02-08 | Jx金属株式会社 | 2次元六角形格子化合物製造用圧延銅箔、及び2次元六角形格子化合物の製造方法 |
JP2016036829A (ja) * | 2014-08-07 | 2016-03-22 | Jx日鉱日石金属株式会社 | 圧延銅箔及びそれを用いた二次電池用集電体 |
JP6612168B2 (ja) * | 2016-03-30 | 2019-11-27 | Jx金属株式会社 | 銅箔、銅張積層板、並びにフレキシブルプリント基板及び電子機器 |
JP6647253B2 (ja) * | 2017-08-03 | 2020-02-14 | Jx金属株式会社 | フレキシブルプリント基板用銅箔、それを用いた銅張積層体、フレキシブルプリント基板、及び電子機器 |
JP6790153B2 (ja) * | 2019-03-04 | 2020-11-25 | Jx金属株式会社 | 二次電池負極集電体用圧延銅箔、それを用いた二次電池負極集電体及び二次電池並びに二次電池負極集電体用圧延銅箔の製造方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI263461B (en) * | 2003-12-26 | 2006-10-01 | Ind Tech Res Inst | Enhanced flexible copper foil structure and fabrication method thereof |
JP2009185376A (ja) * | 2008-01-08 | 2009-08-20 | Hitachi Cable Ltd | 圧延銅箔およびその製造方法 |
JP2009280855A (ja) * | 2008-05-21 | 2009-12-03 | Hitachi Cable Ltd | 圧延銅箔及びその製造方法 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6362728A (ja) * | 1986-09-03 | 1988-03-19 | 昭和アルミニウム株式会社 | 冷間成形性に優れた樹脂・アルミニウム複合材 |
JP3009383B2 (ja) * | 1998-03-31 | 2000-02-14 | 日鉱金属株式会社 | 圧延銅箔およびその製造方法 |
JP3856582B2 (ja) * | 1998-11-17 | 2006-12-13 | 日鉱金属株式会社 | フレキシブルプリント回路基板用圧延銅箔およびその製造方法 |
JP3797882B2 (ja) * | 2001-03-09 | 2006-07-19 | 株式会社神戸製鋼所 | 曲げ加工性が優れた銅合金板 |
JP4401998B2 (ja) * | 2005-03-31 | 2010-01-20 | 日鉱金属株式会社 | 銅張積層基板用高光沢圧延銅箔及びその製造方法 |
JP4522972B2 (ja) * | 2005-04-28 | 2010-08-11 | 日鉱金属株式会社 | 銅張積層基板用高光沢圧延銅箔 |
JP4224082B2 (ja) * | 2006-06-13 | 2009-02-12 | 三井金属鉱業株式会社 | フレキシブルプリント配線基板および半導体装置 |
-
2009
- 2009-12-28 JP JP2009297461A patent/JP5094834B2/ja active Active
-
2010
- 2010-12-20 CN CN201080059783.0A patent/CN102655956B/zh active Active
- 2010-12-20 KR KR1020127016529A patent/KR101396214B1/ko active IP Right Grant
- 2010-12-20 WO PCT/JP2010/072852 patent/WO2011081044A1/ja active Application Filing
- 2010-12-27 TW TW099146067A patent/TWI402165B/zh active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI263461B (en) * | 2003-12-26 | 2006-10-01 | Ind Tech Res Inst | Enhanced flexible copper foil structure and fabrication method thereof |
JP2009185376A (ja) * | 2008-01-08 | 2009-08-20 | Hitachi Cable Ltd | 圧延銅箔およびその製造方法 |
JP2009280855A (ja) * | 2008-05-21 | 2009-12-03 | Hitachi Cable Ltd | 圧延銅箔及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102655956B (zh) | 2014-11-26 |
JP2011136357A (ja) | 2011-07-14 |
JP5094834B2 (ja) | 2012-12-12 |
CN102655956A (zh) | 2012-09-05 |
TW201124269A (en) | 2011-07-16 |
WO2011081044A1 (ja) | 2011-07-07 |
KR101396214B1 (ko) | 2014-05-19 |
KR20120086740A (ko) | 2012-08-03 |
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