TWI400203B - 切割裝置、及使用該切割裝置之基板切斷裝置與方法 - Google Patents

切割裝置、及使用該切割裝置之基板切斷裝置與方法 Download PDF

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Publication number
TWI400203B
TWI400203B TW098114978A TW98114978A TWI400203B TW I400203 B TWI400203 B TW I400203B TW 098114978 A TW098114978 A TW 098114978A TW 98114978 A TW98114978 A TW 98114978A TW I400203 B TWI400203 B TW I400203B
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TW
Taiwan
Prior art keywords
cutting
mother board
unit
substrate
line
Prior art date
Application number
TW098114978A
Other languages
English (en)
Chinese (zh)
Other versions
TW200948730A (en
Inventor
Min-Woong Kim
Original Assignee
Semes Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Semes Co Ltd filed Critical Semes Co Ltd
Publication of TW200948730A publication Critical patent/TW200948730A/zh
Application granted granted Critical
Publication of TWI400203B publication Critical patent/TWI400203B/zh

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Landscapes

  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Liquid Crystal (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
TW098114978A 2008-05-06 2009-05-06 切割裝置、及使用該切割裝置之基板切斷裝置與方法 TWI400203B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020080041878A KR101010310B1 (ko) 2008-05-06 2008-05-06 스크라이빙 장치, 그리고 이를 이용한 기판 절단 장치 및방법

Publications (2)

Publication Number Publication Date
TW200948730A TW200948730A (en) 2009-12-01
TWI400203B true TWI400203B (zh) 2013-07-01

Family

ID=41270263

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098114978A TWI400203B (zh) 2008-05-06 2009-05-06 切割裝置、及使用該切割裝置之基板切斷裝置與方法

Country Status (4)

Country Link
JP (1) JP4985996B2 (ko)
KR (1) KR101010310B1 (ko)
CN (1) CN101575166B (ko)
TW (1) TWI400203B (ko)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5156085B2 (ja) * 2010-12-13 2013-03-06 三星ダイヤモンド工業株式会社 貼り合せ基板の分断方法
KR101110321B1 (ko) * 2011-08-11 2012-02-16 (주)큐엠씨 기판분할장치 및 기판분할방법
CN104227570A (zh) * 2013-06-17 2014-12-24 株式会社太星技研 形成单元单位的g2方式触摸传感器的单一的钢化玻璃板加工系统
KR101703026B1 (ko) * 2014-08-29 2017-02-07 주식회사 태성기연 디스플레이용 패널 흡착장치
KR20160123454A (ko) * 2015-04-15 2016-10-26 주식회사 탑 엔지니어링 스크라이브 장치
CN106827260B (zh) * 2017-03-16 2018-12-18 佛山市永盛达机械有限公司 一种水刀切割的方法及装置
JP7075652B2 (ja) * 2017-12-28 2022-05-26 三星ダイヤモンド工業株式会社 スクライブ装置およびスクライブ方法
CN110372196A (zh) * 2018-04-12 2019-10-25 蚌埠市鑫诚玻璃机械有限公司 全自动夹胶玻璃切割机工艺流程
CN113060932A (zh) * 2021-03-24 2021-07-02 深圳市巨艾伦控股有限公司 一种带有主轴间距自动调节机构的玻璃切割机
JP2023074021A (ja) * 2021-11-17 2023-05-29 Ｊｓｗアクティナシステム株式会社 レーザ切断装置、レーザ切断方法、及びディスプレイの製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1678439A (zh) * 2002-07-02 2005-10-05 三星钻石工业股份有限公司 贴合基板的基板截断系统及基板截断方法

Family Cites Families (8)

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Publication number Priority date Publication date Assignee Title
JP2532537Y2 (ja) * 1991-12-06 1997-04-16 三星ダイヤモンド工業株式会社 基板スクライブ用カッターヘッド
JPH1164834A (ja) * 1997-08-11 1999-03-05 Hitachi Ltd 液晶表示基板製造装置
WO2002057192A1 (fr) * 2001-01-17 2002-07-25 Mitsuboshi Diamond Industrial Co., Ltd. Separateur et systeme de separation
JP3991608B2 (ja) * 2001-03-28 2007-10-17 セイコーエプソン株式会社 レーザ切断方法、電気光学装置の製造方法、電気光学装置、電子機器およびレーザ切断装置
KR100817129B1 (ko) * 2002-02-07 2008-03-27 엘지.필립스 엘시디 주식회사 액정 패널의 절단 장치 및 그 방법
CN101596722B (zh) * 2002-11-22 2015-03-25 三星钻石工业股份有限公司 基板划线方法
EP1741527A1 (en) 2004-03-15 2007-01-10 Mitsuboshi Diamond Industrial Co., Ltd. Substrate dividing system, substrate manufacturing equipment, substrate scribing method and substrate dividing method
KR100642902B1 (ko) 2004-12-28 2006-11-08 삼성코닝정밀유리 주식회사 유리기판의 절단장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1678439A (zh) * 2002-07-02 2005-10-05 三星钻石工业股份有限公司 贴合基板的基板截断系统及基板截断方法

Also Published As

Publication number Publication date
CN101575166B (zh) 2012-01-04
JP4985996B2 (ja) 2012-07-25
JP2009269814A (ja) 2009-11-19
CN101575166A (zh) 2009-11-11
KR20090116139A (ko) 2009-11-11
KR101010310B1 (ko) 2011-01-25
TW200948730A (en) 2009-12-01

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