TWI396246B - 被檢查基板的對準裝置 - Google Patents

被檢查基板的對準裝置 Download PDF

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Publication number
TWI396246B
TWI396246B TW098133718A TW98133718A TWI396246B TW I396246 B TWI396246 B TW I396246B TW 098133718 A TW098133718 A TW 098133718A TW 98133718 A TW98133718 A TW 98133718A TW I396246 B TWI396246 B TW I396246B
Authority
TW
Taiwan
Prior art keywords
axis
substrate
inspected
platform
alignment
Prior art date
Application number
TW098133718A
Other languages
English (en)
Chinese (zh)
Other versions
TW201025477A (en
Inventor
Takayoshi Kudo
Takayuki Komori
Satoru Imamura
Jun Shirato
Original Assignee
Nihon Micronics Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Micronics Kk filed Critical Nihon Micronics Kk
Publication of TW201025477A publication Critical patent/TW201025477A/zh
Application granted granted Critical
Publication of TWI396246B publication Critical patent/TWI396246B/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Optics & Photonics (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Automatic Assembly (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW098133718A 2008-11-17 2009-10-05 被檢查基板的對準裝置 TWI396246B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008293669A JP5300431B2 (ja) 2008-11-17 2008-11-17 被検査基板のアライメント装置

Publications (2)

Publication Number Publication Date
TW201025477A TW201025477A (en) 2010-07-01
TWI396246B true TWI396246B (zh) 2013-05-11

Family

ID=42279817

Family Applications (1)

Application Number Title Priority Date Filing Date
TW098133718A TWI396246B (zh) 2008-11-17 2009-10-05 被檢查基板的對準裝置

Country Status (4)

Country Link
JP (1) JP5300431B2 (enrdf_load_stackoverflow)
KR (1) KR101013110B1 (enrdf_load_stackoverflow)
CN (1) CN101739923B (enrdf_load_stackoverflow)
TW (1) TWI396246B (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561827B (en) * 2013-11-14 2016-12-11 Nihon Micronics Kk Inspection apparatus
CN110596435A (zh) * 2015-12-28 2019-12-20 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
TWI739093B (zh) * 2018-04-24 2021-09-11 美商賽博光學股份有限公司 用於半導體加工的無線基板狀教學感測器

Families Citing this family (16)

* Cited by examiner, † Cited by third party
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TWI416144B (zh) * 2011-05-06 2013-11-21 Fu Lai Yao The method and device for detecting the touch point of the substrate line with the probe
KR101155961B1 (ko) * 2011-11-17 2012-06-18 에스엔티코리아 주식회사 컨베이어가 1축을 대체한 2축 구동 검사장치
KR101616564B1 (ko) * 2014-09-24 2016-04-29 주식회사 디이엔티 프로브 이동장치
CN104459439B (zh) * 2014-12-08 2019-02-19 昆山精讯电子技术有限公司 触摸屏的自动检测设备
CN106370656B (zh) * 2015-07-23 2019-03-05 旭东机械工业股份有限公司 自动化显微取像设备及取像方法
US10324112B2 (en) * 2016-08-11 2019-06-18 Intel Corporation Package testing system and method with contact alignment
CN106249449B (zh) * 2016-08-29 2019-07-23 武汉华星光电技术有限公司 防夹碎基板对位装置
CN108242410B (zh) * 2018-01-04 2020-05-19 苏州德睿联自动化科技有限公司 电池串检测校正装置及方法
CN111742233B (zh) * 2018-02-26 2023-06-09 雅马哈精密科技株式会社 定位装置及定位方法
JP6956030B2 (ja) * 2018-02-28 2021-10-27 東京エレクトロン株式会社 検査システム
IT201800010440A1 (it) * 2018-11-20 2020-05-20 Nuova Sima Spa Dispositivo di raddrizzamento per raddrizzare un articolo lastriforme rispetto ad una direzione di movimentazione
CN110320686B (zh) * 2019-07-15 2023-07-25 中导光电设备股份有限公司 Uled屏幕基板检测/测量设备的预对位装置及其使用方法
CN111999919B (zh) * 2020-08-31 2023-05-05 晟光科技股份有限公司 一种lcd显示屏定位检测机构
CN112720384B (zh) * 2020-12-21 2022-08-26 苏州科韵激光科技有限公司 显示面板对准装置和显示面板对准方法
KR102591202B1 (ko) * 2021-03-26 2023-10-19 (주)지엠더블유 자동 위치설정 기능을 구비한 무선기기 검사장치
CN114536480B (zh) * 2022-03-02 2023-05-23 重庆天荣日盛家居科技有限公司 多工位木质家居板材切割设备

Citations (4)

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TW432207B (en) * 1999-08-04 2001-05-01 Micronics Japan Co Ltd An inspection apparatus of a base plate for display panel
TW511146B (en) * 2000-05-31 2002-11-21 Nikon Corp Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
TW200623232A (en) * 2004-08-19 2006-07-01 Nikon Corp Alignment information display method, program thereof, alignment method, exposure method, device manufacturing method, display system, display device, program, and measurement/inspection device
TW200721259A (en) * 2005-10-28 2007-06-01 Nikon Corp Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method

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JPH0817194B2 (ja) * 1987-09-29 1996-02-21 東京エレクトロン株式会社 液晶表示体プローブ装置及び液晶表示体の位置合わせ方法
KR100222614B1 (ko) * 1997-08-20 1999-10-01 윤종용 액정 표시판의 위치 결정 장치
JPH11304884A (ja) * 1998-04-24 1999-11-05 Micronics Japan Co Ltd 大型回路板用プローバ
KR100488535B1 (ko) * 2002-07-20 2005-05-11 엘지.필립스 엘시디 주식회사 액정토출장치 및 토출방법
KR100960472B1 (ko) * 2003-12-16 2010-05-28 엘지디스플레이 주식회사 액정 표시패널의 제조장치 및 그 제조방법
JP4395429B2 (ja) * 2004-10-20 2010-01-06 日本発條株式会社 コンタクトユニットおよびコンタクトユニットを用いた検査システム
JP2006240015A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd パターン形成装置、アライメント装置、基板処理装置、パターン形成方法、基板処理方法
JP2006245174A (ja) * 2005-03-02 2006-09-14 Dainippon Printing Co Ltd 位置決めステージ、パターン形成装置、検査装置、位置補正方法、基板支持部
JP4808135B2 (ja) 2006-11-09 2011-11-02 株式会社日本マイクロニクス プローブ位置合わせ方法及び可動式プローブユニット機構並びに検査装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW432207B (en) * 1999-08-04 2001-05-01 Micronics Japan Co Ltd An inspection apparatus of a base plate for display panel
TW511146B (en) * 2000-05-31 2002-11-21 Nikon Corp Evaluation method, position detection method, exposure method and device manufacturing method, and exposure apparatus
TW200623232A (en) * 2004-08-19 2006-07-01 Nikon Corp Alignment information display method, program thereof, alignment method, exposure method, device manufacturing method, display system, display device, program, and measurement/inspection device
TW200721259A (en) * 2005-10-28 2007-06-01 Nikon Corp Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI561827B (en) * 2013-11-14 2016-12-11 Nihon Micronics Kk Inspection apparatus
CN110596435A (zh) * 2015-12-28 2019-12-20 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
US11313902B2 (en) 2015-12-28 2022-04-26 Celadon Systems, Inc. Modular rail systems, rail systems, mechanisms, and equipment for devices under test
CN110596435B (zh) * 2015-12-28 2022-07-05 塞莱敦系统股份有限公司 用于受测试器件的模块化轨道系统、轨道系统、机构以及设备
TWI739093B (zh) * 2018-04-24 2021-09-11 美商賽博光學股份有限公司 用於半導體加工的無線基板狀教學感測器

Also Published As

Publication number Publication date
CN101739923A (zh) 2010-06-16
CN101739923B (zh) 2012-10-03
JP5300431B2 (ja) 2013-09-25
KR101013110B1 (ko) 2011-02-14
KR20100055321A (ko) 2010-05-26
TW201025477A (en) 2010-07-01
JP2010121969A (ja) 2010-06-03

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