TW200721259A - Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method - Google Patents

Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method

Info

Publication number
TW200721259A
TW200721259A TW095140005A TW95140005A TW200721259A TW 200721259 A TW200721259 A TW 200721259A TW 095140005 A TW095140005 A TW 095140005A TW 95140005 A TW95140005 A TW 95140005A TW 200721259 A TW200721259 A TW 200721259A
Authority
TW
Taiwan
Prior art keywords
device manufacturing
exposing
determining
testing
communication
Prior art date
Application number
TW095140005A
Other languages
Chinese (zh)
Other versions
TWI455175B (en
Inventor
Shinichi Okita
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of TW200721259A publication Critical patent/TW200721259A/en
Application granted granted Critical
Publication of TWI455175B publication Critical patent/TWI455175B/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70991—Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70508—Data handling in all parts of the microlithographic apparatus, e.g. handling pattern data for addressable masks or data transfer to or from different components within the exposure apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/70525—Controlling normal operating mode, e.g. matching different apparatus, remote control or prediction of failure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Computer And Data Communications (AREA)
  • General Factory Administration (AREA)
  • Communication Control (AREA)

Abstract

A communication server (20) connects device manufacturing apparatuses such as an exposing apparatus (13) and various testing apparatuses (14a,14b,16). The communication server (20) comprises a file format converting part (53a) that converts the formats of data transmitted/received between the device manufacturing apparatuses; a communication message converting part (53b) that converts communication messages; and a communication protocol converting part (53c) that converts communication protocols. The communication server (20) receives information transmitted from a transmission source in compliance with the transmission source that is a device manufacturing apparatus, and the communication server (20) then transmits the received information to a transmission destination in compliance with the transmission destination that is another device manufacturing apparatus.
TW095140005A 2005-10-28 2006-10-30 Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus TWI455175B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005314759 2005-10-28

Publications (2)

Publication Number Publication Date
TW200721259A true TW200721259A (en) 2007-06-01
TWI455175B TWI455175B (en) 2014-10-01

Family

ID=37967814

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095140005A TWI455175B (en) 2005-10-28 2006-10-30 Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus

Country Status (3)

Country Link
JP (1) JP5061904B2 (en)
TW (1) TWI455175B (en)
WO (1) WO2007049704A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI396246B (en) * 2008-11-17 2013-05-11 Nihon Micronics Kk Alignment apparatus for inspection substrate
CN103649836A (en) * 2011-04-22 2014-03-19 迈普尔平版印刷Ip有限公司 Network architecture and protocol for cluster of lithography machines
TWI448826B (en) * 2007-06-21 2014-08-11 Asml Netherlands Bv Method of loading a substrate on a substrate table, device manufacturing method, computer program, data carrier and apparatus

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014026041A (en) * 2012-07-25 2014-02-06 Ulvac Japan Ltd Exposure device and exposure method
JP5945211B2 (en) * 2012-10-26 2016-07-05 株式会社アルバック Exposure equipment
US10386827B2 (en) * 2013-03-04 2019-08-20 Fisher-Rosemount Systems, Inc. Distributed industrial performance monitoring and analytics platform
WO2016136691A1 (en) * 2015-02-23 2016-09-01 株式会社ニコン Substrate processing system and substrate processing method, and device manufacturing method
WO2016199288A1 (en) * 2015-06-12 2016-12-15 富士機械製造株式会社 Relay device and manufacturing system
JPWO2018061945A1 (en) * 2016-09-30 2019-07-11 株式会社ニコン Measurement system, substrate processing system, and device manufacturing method
DE102017202360A1 (en) 2017-02-14 2018-08-16 Deckel Maho Pfronten Gmbh DATA INTERFACE DEVICE FOR USE IN A NUMERICALLY CONTROLLED TOOL MACHINE

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3174863B2 (en) * 1991-07-15 2001-06-11 株式会社ニコン Exposure method and lithography system
JP3275968B2 (en) * 1991-08-05 2002-04-22 日本電信電話株式会社 Equipment control method in production line
JPH0766096A (en) * 1993-08-26 1995-03-10 Toshiba Corp Apparatus for managing manufacture of semiconductor
JP3367201B2 (en) * 1994-05-06 2003-01-14 株式会社日立製作所 Manufacturing method of electronic circuit device
US6421733B1 (en) * 1997-03-25 2002-07-16 Intel Corporation System for dynamically transcoding data transmitted between computers
JPH11274252A (en) * 1998-03-19 1999-10-08 Mitsubishi Electric Corp Device and method for checking semiconductor device
TW406507B (en) * 1998-10-30 2000-09-21 Kim Man Ki SECS-I and HSMS converting method
JP2000150594A (en) * 1998-11-05 2000-05-30 Hitachi Ltd Connecting apparatus, manufacture of wiring film with biasing member and manufacture of inspection system and semiconductor element
JP2001135658A (en) * 1999-11-08 2001-05-18 Towa Corp Method and system for assembling electronic device
JP2001184324A (en) * 1999-12-22 2001-07-06 Toshiba Eng Co Ltd Device and method for supporting communication and recording medium with stored program for supporting communication
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
JP4018438B2 (en) * 2002-04-30 2007-12-05 キヤノン株式会社 Management system for managing semiconductor exposure equipment
JP4414690B2 (en) * 2003-07-14 2010-02-10 株式会社日立ハイテクノロジーズ Semiconductor manufacturing system
US20050091311A1 (en) * 2003-07-29 2005-04-28 Lund Christopher D. Method and apparatus for distributing multimedia to remote clients

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI448826B (en) * 2007-06-21 2014-08-11 Asml Netherlands Bv Method of loading a substrate on a substrate table, device manufacturing method, computer program, data carrier and apparatus
TWI396246B (en) * 2008-11-17 2013-05-11 Nihon Micronics Kk Alignment apparatus for inspection substrate
CN103649836A (en) * 2011-04-22 2014-03-19 迈普尔平版印刷Ip有限公司 Network architecture and protocol for cluster of lithography machines
CN103649836B (en) * 2011-04-22 2016-09-28 迈普尔平版印刷Ip有限公司 The network architecture and agreement for lithography machines cluster

Also Published As

Publication number Publication date
TWI455175B (en) 2014-10-01
JPWO2007049704A1 (en) 2009-04-30
WO2007049704A1 (en) 2007-05-03
JP5061904B2 (en) 2012-10-31

Similar Documents

Publication Publication Date Title
TW200721259A (en) Device manufacturing apparatus connecting apparatus and connecting method, program, device manufacturing system, exposing apparatus, exposing method, determining/testing apparatus and determining/testing method
JP2005311773A5 (en)
EP1507363A3 (en) Apparatus and method for managing home-devices remotely
TW200632869A (en) Method for discontinuous transmission and accurate reproduction of background noise information
EP1755274A3 (en) Method and apparatus for providing notification message in a broadcasting system
NO20080737L (en) Wireless communication system and method for implementing a developed system connection procedure
WO2007117626A3 (en) Hosted voice recognition system for wireless devices
TW200726166A (en) Method for transmitting real-time streaming data and apparatus using the same
EP1124360A3 (en) Data conversion system and data conversion method thereof
WO2005109182A3 (en) Methods and apparatus for gifting over a data network
WO2006133764A8 (en) A method for establishing a paired connection between media devices
EP1724971A4 (en) Server system, server device, and method therefor
TWI315641B (en) Integrated method and apparatus to manage mobile devices and services
EP1975775A3 (en) Image forming device, and method and computer program applicable to the same
WO2002030173A3 (en) Method and apparatus for communicating images, data, or other information in a defect source identifier
WO2008151887A3 (en) Optimize web service interactions via a downloadable custom parser
BR0316604A (en) Method and apparatus for providing sms message consistency that formats mobile communication devices
WO2003032581A1 (en) Information processing apparatus and information processing method
TW200616380A (en) Message transfer system and message transfer method
FR2905809B1 (en) METHOD AND DEVICE FOR TRANSMITTING DATA FILE
WO2002065682A3 (en) Method and system for providing data applications for a mobile device
TWI256795B (en) A method and apparatus for transmitting data over a network
EP1465375A3 (en) Network management method for wireless transmission/reception of data streams and network system and apparatus employing the same
ATE278220T1 (en) METHOD AND SYSTEM FOR PUSHING INFORMATION
EP1624642A3 (en) Apparatus, method and system for providing information in accordance with one of a plurality of protocols