TWI455175B - Connection device and connection method, program, component manufacturing processing system, exposure apparatus and exposure method, and measurement and inspection apparatus and measurement inspection method between component manufacturing processing apparatus - Google Patents

Description

Connection device and connection method between component manufacturing processing devices, program, component manufacturing processing system, exposure device and exposure method, and measurement inspection device and measurement inspection method

The present invention relates to a connection device and a connection method, a program, a component manufacturing processing system, an exposure device, and an exposure method, and a measurement inspection device and a measurement inspection method between component manufacturing processing devices for component manufacturing.

In the present application, the priority is claimed in Japanese Patent Application No. 2005-314759, filed on Oct. 28, 2005.

A semiconductor element, a liquid crystal display element, a photographic element (CCD (Charge Coupled Device), a thin film magnetic head, and the like) are manufactured by applying various processes to the substrate using the element manufacturing processing apparatus. The component manufacturing processing apparatus performs processing on the substrate, and is, for example, a film forming process, a lithography process, and a diffusion process of impurities. Further, there is a process of performing measurement inspection on a pattern formed on the substrate by such processing.

In the film formation treatment, for example, a CVD (Chemical Vapor Deposition) apparatus using one of the element manufacturing processing apparatuses is used to form a film formation process on the substrate. The lithography process is a light process in which an exposure device of one of the component manufacturing processing apparatuses transfers a predetermined pattern onto a substrate. Further, the pattern measurement inspection process is a process of measuring a line width of a pattern formed on a substrate or inspecting a defect of a pattern formed on the substrate by using a measurement inspection device of one of the device manufacturing apparatuses.

Generally, a network such as a LAN (Local Area Net) is installed in a component manufacturing factory. The various component manufacturing processing devices and the host computers controlling the above are connected to each other by the above-described network. The host computer transmits a control signal to the component manufacturing processing device through the area network to control the operation of the component manufacturing processing device. Thereby, the above-mentioned substrate is subjected to various processes in a predetermined order, and the components are manufactured accordingly. In addition, since the above is a well-known and common technology, there is no prior technical literature information that needs to be specifically described.

Further, when the component manufacturing processing device performs a certain process, information used by another component manufacturing processing device or information for displaying a processing result obtained by another component manufacturing processing device may be required. For example, when the pattern line width formed on the substrate exposed by the exposure device is measured using the above-described measurement inspection device, it is necessary to display information on the pattern to be formed on the substrate or in which state the substrate is exposed.

The component manufacturing processing device is manufactured by a plurality of manufacturers, and the information format (format) processed by the component manufacturing processing device is not uniform. Further, when information is transmitted between the component manufacturing processing apparatuses, the same communication control information (communication content) and communication procedure (communication protocol) must be used between the component manufacturing processing apparatuses of the communication, but these are also not uniform. Therefore, in the case where a certain component manufacturing processing apparatus is used to perform a certain process, when it is necessary to have information used by another component manufacturing processing apparatus or information obtained by manufacturing a processing apparatus by another component, the worker must manually work. The required information is obtained individually from other component manufacturing processing devices, and the acquired information is converted by manual operation. Therefore, there is a problem that information cannot be effectively utilized between the component manufacturing processing apparatuses.

An object of the present invention is to provide a connection device and a connection method, a program, a device manufacturing processing system, an exposure device, an exposure method, and a measurement inspection device and a measurement device between a component manufacturing processing device capable of effectively utilizing information between component manufacturing processing devices. Inspection Method.

In the present invention, the following configurations corresponding to the respective drawings attached to the embodiment are employed. However, the bracketed symbols attached to the respective elements are merely examples of the elements, and are not limited to the elements.

The connection device (20, 21) between the component manufacturing processing apparatuses of the present invention is configured to connect between two or more component manufacturing processing devices (13 to 18), and is characterized in that it includes a receiving portion (51). And connected to the first component manufacturing processing device for receiving transmission information from the first component manufacturing processing device in a method suitable for receiving transmission information of the first component manufacturing processing device; and converting portion (53, 56) And connecting to the receiving unit, the information received by the receiving unit is converted into information suitable for receiving by the second component manufacturing processing device different from the first component manufacturing processing device; and the transmitting portion ( 52) is connected to the conversion unit and the second element manufacturing processing device, and converts the conversion unit into information suitable for reception by the second element manufacturing processing device, and transmits the information to the second element manufacturing processing device.

According to the invention, when the information is transmitted from the first component manufacturing processing device, the transmission information is received by the receiving portion of the connecting device in a manner suitable for receiving the information. The received information is converted into information suitable for reception by the second component manufacturing processing device by the conversion unit, and the converted information is transmitted to the second component manufacturing processing device via the transmitting unit.

The method of connecting the component manufacturing processing apparatuses of the present invention is for connecting between two or more component manufacturing processing apparatuses (13 to 18), and is characterized in that any one of the two or more component manufacturing processing apparatuses is manufactured. The information transmitted by the device is adapted to be received by the component manufacturing processing device of the source of the information, and the received information is adapted to be sent to the component manufacturing processing device of the transmitting object.

The recording medium on which the program is recorded in the present invention is a computer that executes at least a part of information communication processing between two or more component manufacturing processing devices (13 to 18), wherein the program causes the computer to perform the following processing. Even if the information transmitted from any one of the two or more component manufacturing processing devices is adapted to be received by the first component manufacturing processing device of the source of the information, and the received information is suitable for signaling. The component of the object is manufactured and processed by the processing device.

The component manufacturing processing system of the present invention includes: a first component manufacturing processing device; a second component manufacturing processing device; and a connecting device (20, 21) connecting the first component manufacturing processing device and the second component manufacturing processing device The connection device includes a receiving unit (51) connected to the first component manufacturing processing device for transmitting information from the first component manufacturing processing device to receive the first The component manufacturing processing device transmits the information by receiving the information; the converting unit (53, 56) is connected to the receiving portion for converting the information received by the receiving portion into being different from the first component. Information received by the second component manufacturing processing device of the manufacturing processing device; and a transmitting unit (52) connected to the conversion unit and the second component manufacturing processing device for converting the conversion portion into the first The information received by the component manufacturing processing device is transmitted to the second component manufacturing processing device. An exposure apparatus according to the present invention is characterized in that it is connected to a connection device (20, 21) between the component manufacturing processing devices, and exposes a predetermined pattern to a substrate; the connection device between the component manufacturing processing devices includes: The signal unit (51) is connected to the first component manufacturing processing device for receiving the transmission information from the first component manufacturing processing device in a manner suitable for receiving the transmission information of the first component manufacturing processing device; The conversion unit (53, 56) is connected to the receiving unit for converting the information received by the receiving unit into a second component manufacturing processing device different from the first component manufacturing processing device. And a communication unit (52) connected to the conversion unit and the second component manufacturing processing device for converting the conversion unit into information suitable for reception by the second component manufacturing processing device, and transmitting the information to the The second element manufacturing processing apparatus.

The exposure method of the present invention is characterized in that exposure transfer of a predetermined pattern (DP) to a substrate (W) is performed using the above-described exposure apparatus.

The measurement inspection apparatus according to the present invention is characterized in that it is connected to a connection device (20, 21) between the component manufacturing processing devices, and performs at least one of predetermined measurement and inspection on the substrate (W); and connection between the component manufacturing processing devices The device includes: a receiving unit (51) connected to the first component manufacturing processing device for transmitting information from the first component manufacturing processing device to receive the transmission information of the first component manufacturing processing device The method of receiving the conversion unit (53, 56) is connected to the receiving unit for converting the information received by the receiving unit into a second component different from the first component manufacturing processing device. And the information received by the processing device; and the transmitting unit (52) is connected to the converting unit and the second element manufacturing processing device for converting the converting unit to be suitable for receiving by the second component manufacturing processing device. The information is transmitted to the second component manufacturing processing device.

In the measurement inspection method of the present invention, at least one of the predetermined measurement and inspection is applied to the substrate (W) by using the above-described measurement inspection device.

According to the invention, the information transmitted from the component manufacturing processing device is received in a manner suitable for the component manufacturing processing device of the information transmitting source, and the received information is processed by the component manufacturing processing device suitable for the transmitting object. The method is transmitted, and therefore, information can be effectively utilized between the component manufacturing processing apparatuses.

Hereinafter, a connection device, a connection method, a program, a component manufacturing processing system, an exposure device, an exposure method, a measurement inspection device, and a measurement inspection method between the component manufacturing processing apparatuses according to the embodiment of the present invention will be described in detail with reference to the drawings. Hereinafter, the overall configuration of the component manufacturing processing system, the configuration of the device constituting the component manufacturing processing system, and the component manufacturing method using the component manufacturing processing system will be described in order.

[Component Manufacturing Processing System]

Fig. 1 is a block diagram showing a schematic configuration of a component manufacturing processing system according to an embodiment of the present invention. As shown in FIG. 1, the component manufacturing processing system 10 of the present embodiment includes an in-plant production management main system 11 as a host computer, an exposure step management controller 12, an exposure device 13, an on-line measurement inspection device 14, and a transfer device 15. The off-line measurement inspection device 16, the analysis system 17, the substrate processing device 18, and the communication server 20. The component manufacturing processing system 10 is disposed in a component manufacturing factory.

The in-plant production management main system 11 to the substrate processing apparatus 18 are connected to each other via a local area network (connection network) such as a LAN (Local Area Network) installed in the component manufacturing factory. The exposure device 13, the line measurement inspection device 14, the transport device 15, the offline measurement inspection device 16, the analysis system 17, and the substrate processing device 18 that constitute the component manufacturing processing system 10 are connected to the communication server 20.

The in-plant production management main system 11 manages various component manufacturing processing devices (exposure devices 13, on-line measurement inspection devices 14, and transportation devices 15) installed in the component manufacturing factory through a regional network installed in the component manufacturing plant. The offline measurement inspection device 16, the analysis system 17, and the substrate processing device 18). The exposure step management controller 12 controls the exposure device 13 under the management of the production management main system 11 in the factory. Although simplified in Fig. 1, a plurality of exposure devices 13 are provided in the component manufacturing factory, and the exposure step management controller 12 controls the respective exposure devices 13.

The exposure device 13 exposes a predetermined pattern to a substrate such as a wafer or a glass substrate on which a photosensitive agent such as a photoresist is applied. The exposure apparatus 13 is, for example, a single exposure type projection exposure apparatus (stationary exposure apparatus) such as a stepping machine, which is a photomask stage (a mask for holding a predetermined pattern) and a substrate. The stage (to hold the substrate) is positioned to be exposed in a predetermined positional relationship; or a scanning exposure type projection exposure apparatus (scanning type exposure apparatus) such as a scanner, which synchronizes the mask stage with the substrate stage Exposure is performed while moving (scanning). Further, the details of the exposure device 13 will be described later.

The on-line measurement inspection device 14 and the transfer device 15 are provided on the line for each exposure device 13. The on-line measurement inspection device 14 includes an online pre-measurement inspection device 14a and an online post-measurement inspection device 14b. The online pre-measurement inspection device 14a measures the surface state of the substrate to be exposed (for example, the step of the pattern formed on the substrate) before the exposure processing by the exposure device 13, or measures the alignment formed on the substrate beforehand. Mark (alignment measurement). The measurement result of the online pre-measurement inspection device 14a is transmitted to the exposure device 13 via the communication server 20 for optimizing the exposure conditions of the substrate to be exposed. That is, the measurement inspection result of the online pre-measurement inspection device 14a is fed forward to the exposure device 13 to optimize the exposure conditions of the exposure device 13.

The on-line measurement inspection device 14b is, for example, an inspection of the overlapping state or line width of the pattern formed on the substrate by the exposure processing by the exposure device 13. The measurement result of the online post-test measuring device 14b is also transmitted to the exposure device 13 via the communication server 20 for optimizing the exposure conditions of the substrate to be exposed later. That is, the measurement inspection result of the online after-measurement inspection device 14b is fed back to the exposure device 13 to optimize the exposure conditions of the exposure device 13.

The conveying device 15 is a device that carries the substrate into/out of the exposure device 13. In the present embodiment, the coating and developing device 15a is provided in the conveying device 15. The coating and developing machine 15a applies a photosensitive agent such as a photoresist to a substrate to be subjected to exposure processing by the exposure device 13, and performs development of a substrate which has been subjected to exposure processing by the exposure device 13. That is, the substrate to be exposed is first coated with the sensitizer by the coating and developing machine 15a, and then transferred to the exposure device 13 by the transfer device 15. The exposed substrate is carried out from the exposure device 13 by the transfer device 15, and subjected to development processing by the coating and developing machine 15a.

The off-line measurement inspection device 16 is an off-line device that is separately provided from the exposure device 13 for performing, for example, superimposing accuracy measurement, line width measurement, or the like on the pattern formed by the exposure processing of the exposure device 13. Further, in the offline measurement inspection device 16, there are cases where only various types of measurements or various types of inspections are performed, and various types of measurements and various types of inspections are simultaneously performed. Hereinafter, in the present specification, measurement and inspection are collectively referred to as "measurement inspection". The case of "measurement inspection" referred to in the present specification includes a case where only measurement is performed or only inspection is performed. The analysis system 17 performs various analyses or simulations using various materials acquired by the exposure device 13 or various measurement inspection results obtained by the offline measurement inspection device 16. For example, the imaginary line width of the pattern formed on the substrate is obtained by simulation using various materials of the exposure conditions obtained by the exposure device 13.

The substrate processing apparatus 18 performs predetermined processing on the substrate. In Fig. 1, as a substrate processing apparatus 18, a CVD (Chemical Vapor Deposition) device 18a, a CMP (Chemical Mechanical Polishing) device 18b, an etching device 18c, and an oxidation/ion are shown. Implant device 18d. The CVD apparatus 18a is a film forming apparatus in which a film is formed on a substrate. The CMP device 18b is a polishing device that planarizes the surface of the substrate by chemical mechanical polishing. The etching device 18c performs etching of the substrate. The oxidation/ion implantation device 18d forms an oxide film on the surface of the substrate or implants impurities at a predetermined position on the substrate.

The communication server 20 is used to connect the component manufacturing processing devices (the exposure device 13, the line measurement inspection device 14, the transport device 15, the offline measurement inspection device 16, the analysis system 17, and the substrate processing device 18). As described above, these component manufacturing processing apparatuses are connected to each other via a regional network laid in the component manufacturing factory, but in the present embodiment, they are further connected to each other via the communication server 20.

The communication server 20 is used to connect the component manufacturing processing devices outside the regional network placed in the component manufacturing factory. The component manufacturing processing device is manufactured by many manufacturers and processed by the component manufacturing processing device. The form (format) of information, communication control information (communication content), and communication sequence (communication agreement) are not uniform. Moreover, when the amount of data obtained by each component manufacturing processing device is relatively large, and the data is communicated only through the regional network, the load on the regional network is excessively large, and the component manufacturing process is stagnant.

The communication server 20 absorbs the difference in format, communication content, and communication protocol of information processed by each component manufacturing processing device, so that the component manufacturing processing devices can be connected to each other. In addition, the details of the communication server 20 will be described later. The overall configuration of the component manufacturing processing system according to the embodiment of the present invention has been described above. Next, the exposure device 13 and the communication server 20 constituting the component manufacturing processing system will be described in detail.

[Exposure device]

Fig. 2 is a side view showing a schematic configuration of an exposure apparatus of a component manufacturing apparatus according to an embodiment of the present invention. 2 is an exposure apparatus for manufacturing a semiconductor element, which is an example of a step-and-scan type projection type exposure apparatus which moves a reticle R (as a mask) and a wafer W (as a substrate) in synchronization. And the pattern DP formed on the reticle R is sequentially transferred onto the wafer W. In addition, in the following description, an XYZ orthogonal coordinate system is set in figure, and the positional relationship of each member is demonstrated with reference to this XYZ orthogonal coordinate system. In the XYZ orthogonal coordinate system, the XY plane is set to be parallel to the horizontal plane, and the Z axis is set to the vertical direction. The synchronous moving direction (scanning direction) of the reticle R and the wafer W at the time of exposure is set in the Y direction.

The exposure apparatus 13 shown in FIG. 2 includes an illumination optical system ILS that illuminates a slit shape (rectangular shape) extending in the X direction (second direction) on the reticle R by exposure light EL having uniform illuminance. Or arc-shaped illumination area; reticle stage RST for holding reticle R; projection optical system PL for projecting image of pattern DP of reticle R onto wafer coated with photoresist The wafer stage WST is used to hold the wafer W; and the main control system MC is used to control the above components.

The illumination optical system ILS includes an illumination uniformization optical system having a light source unit, an optical integrator, a beam splitter, a condenser lens system, a reticle blind, and an imaging lens system (all not shown). The configuration of the illumination optical system described above is disclosed, for example, in Japanese Laid-Open Patent Publication No. Hei 9-320956. Here, as the light source unit described above, it is possible to use a KrF excimer laser (wavelength 248 nm), an ArF excimer laser (wavelength 193 nm), or an F ₂ laser light source (wavelength 157 nm), Kr ₂ Ray. An ultraviolet laser source such as a light source (wavelength 146 nm), an Ar ₂ laser source (wavelength 126 nm), a copper vapor laser source, a harmonic generating light source of a YAG laser, and a solid-state laser (semiconductor laser, etc.) A wave generating device or a mercury lamp (g line, h line, i line, etc.).

The reticle stage RST holds the reticle stage R by vacuum adsorption or electrostatic adsorption, and can be horizontally disposed on the reticle support table (platform) 31 below the illumination optical system (-Z direction). On the upper side, it moves in the scanning direction (Y direction) with a predetermined stroke. Further, the reticle stage RST can be slightly driven in the X direction, the Y direction, and the direction around the Z axis (the θ Z direction) with respect to the reticle support table 31.

A moving mirror 32 is provided at one end of the reticle stage RST. A laser interferometer (hereinafter referred to as a reticle interferometer) 33 is disposed on the reticle support table 31. The reticle interferometer 33 detects the reticle stage RST in the X direction, the Y direction, and the rotation direction around the Z axis by irradiating the laser light to the mirror surface of the moving mirror 32 and receiving the reflected light thereof ( The position of the θ Z direction). The position information of the reticle stage RST detected by the reticle interferometer 33 is supplied to the main control system MC for coordinating the overall operation of the control device. The main control system MC controls the operation of the reticle stage RST through the reticle stage driving device 34 for driving the reticle stage RST.

The projection optical system PL includes a plurality of refracting optical elements (lens elements) which are used at both sides of the object plane (the reticle R) side and the image plane (wafer W) side and have a predetermined reduction ratio β (β is For example, 1/4, 1/5, etc.) refractive optical systems. The direction of the optical axis AX of the projection optical system PL is set in the Z direction orthogonal to the XY plane. Further, the glass material of the plurality of lens elements included in the projection optical system PL is, for example, quartz or fluorite, depending on the wavelength of the exposure light EL. In the present embodiment, the projection optical system PL that projects the inverted image formed on the pattern DP of the reticle R onto the wafer W is described as an example. However, the erect image of the projection pattern DP may be used.

The projection optical system PL is provided with a lens control unit 35 that can measure the optical characteristics (imaging characteristics, etc.) of the projection optical system PL in accordance with environmental changes such as temperature and air pressure, in addition to temperature and air pressure. Control is fixed. The measurement result of the temperature or the air pressure of the lens control unit 35 is output to the main control system MC. The main control system MC controls the optical characteristics such as the imaging characteristics of the projection optical system PL through the lens control unit 35 based on the measurement result of the temperature or the air pressure output from the lens control unit 35.

The wafer stage WST is disposed under the projection optical system PL (in the -Z direction), and holds the wafer W by vacuum adsorption or electrostatic adsorption. The wafer stage WST can move in the X direction and the Y direction in steps, in addition to being able to move in the scanning direction (Y direction) on the upper surface of the wafer support table (platform) 36 with a predetermined stroke, and can move in the Z direction in steps. Micro-motion (including rotation about the X axis and rotation about the Y axis). With the wafer stage WST, the wafer W can be moved in the X direction and the Y direction, and the position and angle of the wafer W in the Z direction (rotation around the X axis and rotation about the Y axis) can be adjusted.

A moving mirror 37 is provided at one end of the wafer stage WST. A laser interferometer (hereinafter referred to as a wafer interferometer) 38 for irradiating laser light onto the mirror surface (reflecting surface) of the moving mirror 37 is provided outside the wafer stage WST. The wafer interferometer 38 irradiates the mirror surface of the moving mirror 37 with the reflected light, thereby detecting the position and posture of the wafer stage WST in the X direction and the Y direction (around the X axis, the Y axis, and the Z axis). The rotation θ X, θ Y, θ Z). The detection result of the wafer interferometer 38 is supplied to the main control system MC. The main control system MC controls the position and posture of the wafer stage WST by the wafer driving device 39 based on the detection result of the wafer interferometer 38.

In the exposure apparatus 13 of the present embodiment, a multi-point AF sensor 40 is disposed at the side end of the projection optical system PL. The AF sensor 40 is configured by a light-transmitting system 40a, a light-receiving system 40b, and the like, and detects a position of the surface of the wafer W in the Z direction (optical axis AX direction) at a plurality of detection points to detect that the wafer W is The surface position and posture of the projection optical system PL in the optical axis AX direction (rotation θ X, θ Y around the X-axis and the Y-axis: leveling). A plurality of detection points are set in the projection optical system PL and in the vicinity of the exposure slit region on the wafer W conjugated with the illumination region on the reticle R.

The detection result of the AF sensor 40 is supplied to the main control system MC. The main control system MC controls the position and posture of the wafer stage WST by the wafer driving device 39 based on the detection result of the AF sensor 40. Specifically, a reference plane (hereinafter referred to as an AF plane) is set in advance in the main control system MC, and this reference plane serves as a registration reference of the surface of the wafer W. The main control system MC controls the position and posture of the wafer stage WST based on the detection result of the AF sensor 40 so that the surface of the wafer W matches the AF surface.

In the exposure apparatus 13 of the present embodiment, the off-axis alignment sensor 41 of the image processing method is disposed on the side surface of the projection optical system PL in the Y direction. The alignment sensor 41 is for observing an alignment mark attached to an illumination area set on the wafer W. The observation result (measurement result) of the alignment sensor 41 is supplied to the main control system MC. The optical axis of the optical system of the alignment sensor 41 is parallel to the optical axis AX of the projection optical system PL. The detailed configuration of the alignment sensor 41 is disclosed, for example, in Japanese Laid-Open Patent Publication No. Hei 9-219354, and the corresponding U.S. Patent No. 5,859,707. The main control system MC performs EGA measurement using the measurement results of the alignment sensor 41. The EGA measurement is a measurement method that performs a predetermined statistical operation (EGA operation) using the measurement results of a plurality of representative alignment marks formed on the wafer W to obtain all the illuminations set on the wafer W. The arrangement of the areas.

The main control system MC is connected to the exposure step management controller 12 shown in FIG. 1 through the area network N1, and the exposure processing program (exposure control information) sent from the exposure step management controller 12 and transmitted through the area network N1. To perform exposure processing. Further, the main control system MC is connected to the communication server 20 shown in FIG. 1 via the connection line N2, and when the measurement result of the online pre-measurement inspection device 14a or the on-line measurement inspection device 14b is transmitted through the communication server 20, That is, the control for optimizing the exposure conditions using the measurement inspection results is performed.

[Communication Server]

Fig. 3 is a block diagram showing the configuration of a communication server as a connection device between component manufacturing processing apparatuses according to an embodiment of the present invention. As shown in FIG. 3, an exposure device 13, an online pre-measurement inspection device 14a, an online post-measurement inspection device 14b, and an off-line measurement inspection device 16 are connected to the communication server 20. As described above, in addition to the exposure device 13, the on-line measurement inspection device 14 (the online measurement measurement device 14a, the online measurement measurement device 14b), and the offline measurement inspection device 16, the communication server 20 is also connected to the transfer device 15 The analysis system 17 and the substrate processing apparatus 18 are omitted from the drawings in FIG. Hereinafter, the description of the connection of the conveying device 15, the analysis system 17, and the substrate processing device 18 will be omitted for simplification of the description.

The communication server 20 includes a receiving and transmitting unit 51, 52, a converting unit 53, a conversion definition file registration unit 54, and a conversion recipe registration unit 55. The receiving and transmitting unit 51 is connected to the exposing device 13 via the connecting line N2 shown in FIG. 2, except for receiving the information transmitted by the main control system MC of the exposing device 13 through the connecting line N2, and also through the connecting line N2. Send information to be sent to the main control system MC. Here, the receiving and dispatching unit 51 is provided with a connection interface suitable for connection to the exposure device 13. For example, if the connector to which the exposure device 13 is connected (see FIG. 2) is provided with a connector of RJ-45, a connection interface into which the connector is inserted is provided. Therefore, when receiving the various information transmitted from the main control system MC of the exposure device 13, the receiving and transmitting unit 51 receives the data in a manner suitable for the receiving.

The receiving and transmitting unit 52 is connected to the online pre-measurement inspection device 14a, the online post-measurement inspection device 14b, and the offline measurement inspection device 16. In addition to receiving the information transmitted by the device, the information is sent to and received. Information sent. Here, the receiving and dispatching unit 52 is provided with a connection interface suitable for connection to the online pre-measurement inspection device 14a, the online post-measurement inspection device 14b, and the offline measurement inspection device 16. For example, when the online pre-measurement inspection device 14a, the online post-test measurement device 14b, and the offline measurement inspection device 16 are provided with a connection interface of the RS-232C standard, the connection and reception portion 52 also includes such a connection interface. Therefore, the receiving and transmitting unit 52 receives the various information transmitted from the online pre-measurement inspection device 14a, the online post-measurement inspection device 14b, and the offline measurement inspection device 16, and receives the information in a manner suitable for the reception. In addition, in FIG. 3, for the sake of simplicity, the transmission and reception unit 51 connected to the exposure device 13 and the online pre-measurement inspection device 14a, the online post-measurement inspection device 14b, and the offline measurement inspection device 16 are connected. The two receiving and transmitting sections of the receiving and transmitting section 52, but it is to be noted that the receiving and transmitting section is provided in each component manufacturing processing device connected to the communication server 20, and each receiving and transmitting section is connected to Conversion unit 53.

The conversion unit 53 is connected to the receiving and transmitting units 51 and 52, and converts the information received by the receiving and transmitting unit 51 into predetermined information and outputs the information to the receiving and transmitting unit 52. Conversely, the information received by the transmitting and receiving unit 52 is also received. After being converted into the predetermined information, it is output to the receiving and transmitting section 51. Here, the information received by the receiving and receiving unit 51 or the information received by the receiving and transmitting unit 52 is converted into information depending on the target of the information. For example, when the information sent by the exposure device 13 is to be transmitted to the online pre-measurement inspection device 14a, the conversion unit 53 converts the information received by the transmission/reception unit 51 into information suitable for reception by the online pre-measurement inspection device 14a. On the other hand, when the same information is transmitted by the exposure device 13 and the information is transmitted to the online post-measurement inspection device 14b, the conversion unit 53 converts the information received by the transmission and reception unit 51 into an online post-event measurement inspection device. 14b received information.

As shown in FIG. 3, the conversion unit 53 includes a file format conversion unit 53a, a communication content conversion unit 53b, and a communication protocol conversion unit 53c. The file format conversion unit 53a converts the format of the information received by the receiving and transmitting sections 51, 52 into a format suitable for processing by the component manufacturing processing apparatus of the information transmitting target. The communication content conversion unit 53b converts the communication content used by the component manufacturing processing device of the information transmission source into the communication content that can be recognized by the component manufacturing processing device of the transmission target of the information.

Further, the communication protocol conversion unit 53c converts the information received by the communication protocol used by the component manufacturing processing device of the information transmission source into a communication protocol received by the component manufacturing processing device suitable for the information transmission target. News. For example, the communication protocol used in the exposure device 13 is the HSMS specified by the SEMI semiconductor manufacturing device standard. When the online pre-measurement inspection device 14a, the online post-measurement inspection device 14b, and the offline measurement inspection device 16 use the SECS-I defined by the same standard as the communication protocol, the conversion of these communication protocols is performed. Further, the above-mentioned HSMS uses the communication protocol of Ethernet (registered trademark), and the SECS-I uses the communication protocol of the RS-232 standard.

As described above, the conversion processing performed by the conversion unit 53 differs depending on the combination of the component manufacturing processing device of the information transmission source and the component manufacturing processing device of the information transmission target. Therefore, in the present embodiment, the conversion rule is defined by the conversion definition file, when the information is transmitted between any two component manufacturing processing devices in the plurality of component manufacturing processing devices connected to the communication server 20. In the conversion definition file registration unit 54, a plurality of the above-described conversion definition files are registered in the file format.

As shown in FIG. 3, the conversion definition file registration unit 54 registers a file format conversion definition file F1, which defines a conversion rule used by the file format conversion unit 53a, and a communication content conversion definition file F2, which defines a communication content conversion unit. The conversion rule used by 53b; and the communication protocol conversion definition file F3 define the conversion rule used by the communication protocol conversion unit 53c. The file format conversion definition file F1, the communication content conversion definition file F2, and the communication protocol conversion definition file F3 are registered in the conversion definition file registration unit 54 using the file names set to the same meaning.

For example, the file format conversion definition file F1 is registered with the file name "A1.txt", "A2.txt", "A3.txt"......; the communication content conversion definition file F2 is "B1.txt", "B2.txt", "B3.txt"...... file name to log in; communication protocol conversion definition file F3 is "C1.txt", "C2.txt", "C3.txt"... log in. The file format conversion definition file F1, the communication content conversion definition file F2, and the communication protocol conversion definition file F3 are files in the form of text, and the user can freely change the content thereof.

Fig. 4 is a view showing an example of the contents of the file format conversion definition file F1. The file format conversion definition file F1 shown in Fig. 4 converts the alignment measurement result of the online pre-measurement inspection device 14a into a part of the conversion rule of the format usable by the exposure device 13. As shown in FIG. 4, in the file format conversion definition file F1, the information processed by the online pre-measurement inspection device 14a of the transmission source and the information processed by the exposure device 13 of the transmission target are associated with each other. The contents of each column include fields f11~f13 separated by a colon ":" and field f14 separated by a semicolon ";".

In the field f11, the tag name assigned to the information processed by the source (the online pre-measurement checking device 14a) is described. In the field f12, the tag name assigned to the information processed by the target (exposure device 13) is described. The information processed by the source (the online pre-measurement inspection device 14a) and the information processed by the transmission target (exposure device 13) correspond to each other by the contents of the fields f11 and f12. Further, the conversion formula of the information is described in the field f13. When there is no need to convert information, the field f13 is omitted. An annotation of the content described in the column is described in the field f14.

For example, in the field f11 of the first column shown in FIG. 4, "L1" is described as the tag name, and in the field f12, "MEAS_DATE" is described as the tag name, and the field f13 is omitted. In addition, in the field f14, "day of measurement" is described as an annotation. In other words, in the content described in the first column, the information indicating the measurement date is processed by the online pre-measurement inspection device 14a of the transmission source, and the label "L1" is given to the exposure device 13 of the transmission target. The information displayed on the measurement measurement date is given the label "MEAS_DATE", and when the online pre-measurement inspection device 14a transmits the measurement date information to the exposure device 13, the value is not changed, but only the conversion label name is sent. .

In addition, in the column f11 of the seventh column of FIG. 4, the tag name "W4" is described, the tag name "MAP_OFFSET (1)" is described in the field f12, and the conversion formula "W4+1" is described in the field f13. In the field f14, "pattern offset X" is described as an annotation. That is, in the content described in the seventh column, the information indicating the "pattern offset X" processed by the online pre-measurement inspection device 14a of the source is assigned the label "W4". The information of the display "pattern offset X" processed by the exposure device 13 of the target is assigned the label "MAP_OFFSET (1)", and the display of the pattern offset is transmitted to the exposure device 13 by the online pre-measurement inspection device 14a. When the information of X is added, the value is accumulated (add "1" to the value of the information with the label W4), and the label name is converted and sent.

In addition, the conversion formula of the field f13 does not simply add up the transmitted information values, and can also describe the number of functions used. For example, when the alignment mark formed on the wafer W is measured by the alignment sensor 41 (refer to FIG. 2), the waveform image data whose signal intensity is changed with the X-direction position or the Y-direction position is obtained, but Use the function of changing the offset of the waveform image data with the position in the X direction or the position in the Y direction. This function can use multiple polynomials, trigonometric functions, etc. related to X or Y. Further, an arithmetic expression for obtaining one information value from a plurality of pieces of information may be used.

FIG. 5 shows an example of the content of the communication content conversion definition file F2. The communication content conversion definition file F2 shown in FIG. 5 converts the communication content used by the online pre-measurement inspection device 14a into a part of the conversion rule of the communication content used by the exposure device 13. As shown in FIG. 5, in the communication content conversion definition file F2, the communication content used by the online pre-measurement inspection device 14a of the transmission source and the communication content used by the exposure device 13 of the transmission target correspond to each other. . The contents of each column contain fields f21, f22 separated by a colon ":", and a field f23 separated by a semicolon ";".

The communication content used by the online pre-measurement inspection device 14a of the transmission source is described in the field f21, and the communication content used by the exposure device 13 to be transmitted is described in the field f22. An annotation of the content described in the column is described in the field f23. Further, as shown in FIG. 5, in the respective columns of the communication content conversion definition file F2, the communication content used by the online pre-measurement inspection device 14a of the transmission source and the communication used by the exposure device 13 of the transmission target are used. The contents correspond to each other, but it is not necessary to describe the correspondence between all the communication contents used by the online pre-measurement inspection device 14a and the exposure device 13, and it is only necessary to describe the communication content that needs to be converted.

The communication content "S6, F1" is described in the field f21 of the first column shown in FIG. 5, and the communication contents "S6, F11" are described in the field f22. Further, "Trace Data Send" is described as a comment in the field f23. That is, the contents described in the first column are for the communication content for collecting data (ie, Trace Data Send), and the online pre-measurement inspection device 14a uses the stream number "6" and functions. The (Function) code is "1", but it is required to convert it into the stream number "6" and the function number "11" in the exposure device 13.

Fig. 6 is a view showing an example of the contents of the protocol conversion definition file F3. The communication protocol conversion definition file F3 shown in FIG. 6 converts the communication protocol used by the online pre-measurement inspection device 14a into a part of the conversion rule of the communication protocol used by the exposure device 13. As shown in FIG. 6, in the communication protocol conversion definition file F3, the communication protocol used by the online pre-measurement inspection device 14a of the transmission source and the communication protocol used by the exposure device 13 of the transmission target are associated with each other. Each column is composed of a field f31, which is separated by a colon ":", and a field f33 separated by a semicolon ";".

The communication protocol used by the online pre-measurement inspection device 14a of the transmission source is described in the field f31, and the communication protocol used by the exposure device 13 to be transmitted is described in the field f32. An annotation of the content described in the column is described in the field f33. The communication protocol "SECS-I" is described in the field f31 in the first column shown in Fig. 6, and the communication protocol "HSMS" is described in the field f32. Further, a "communication agreement" is described in the field f33 as an annotation. In other words, the content described in the first column means that the communication protocol "SECS-I" is used for communication with the online pre-measurement inspection device 14a, and the communication protocol "HSMS" is used for communication with the exposure device 13.

In the conversion recipe registration unit 55, a conversion recipe is registered in the form of a file, and the conversion recipe describes information for specifying which one of the plurality of conversion definition files registered in the conversion definition file registration unit 54 is used. The conversion recipe is registered in accordance with each combination of any two component manufacturing processing apparatuses among a plurality of component manufacturing processing apparatuses connected to the communication server 20. For example, in the example shown in FIG. 3, three conversion recipe files R1 to R3 are registered in the conversion recipe registration unit 55, and the conversion recipe file R1 is set in order to connect the exposure device 13 and the online pre-measurement inspection device 14a. The conversion recipe file R2 is set in order to connect the exposure device 13 and the online post-measurement inspection device 14b, and the conversion recipe file R3 is set between the exposure device 13 and the offline measurement inspection device 16. The conversion recipe file is a file in text form, and the user is free to change the content.

Fig. 7 is an example of the contents of the conversion recipe file. As shown in FIG. 7, in the conversion recipe file R1, the conversion recipe file number set to the same meaning between the conversion recipe files is described in the first column, and the connection device name is described in the second column. In the example shown in Fig. 7, the exposure device 13 and the online pre-measurement inspection device 14a are described as the connection device names. Further, the file format conversion definition file name is described in the third column, the communication content conversion definition file name is described in the fourth column, and the communication protocol conversion definition file name is described in the fifth column.

The file name conversion file F1 file name (for example, "A1.txt") is described as the name of the file format conversion definition file. The file name of the communication content conversion definition file F2 (for example, "A2.txt") is also described as the name of the communication content conversion definition file. Further, the file name (for example, "C1.txt") of the communication protocol conversion definition file F3 is described as the name of the communication protocol conversion definition file.

In other words, each of the plurality of component manufacturing processing devices connected to the communication server 20 and each of the two component manufacturing processing devices are assigned to the conversion definition file registration unit 54 by the conversion recipe file. The file format conversion definition file F1, the communication content conversion definition file F2, and the communication protocol conversion definition file F3.

Furthermore, in the conversion recipe file, a plurality of file format conversion definition file names, communication content conversion definition file names, and communication protocol conversion definition file names may be respectively described, and may be described as plural numbers. When a plurality of file format conversion definition file names, communication content conversion definition file names, or communication protocol conversion definition file names are described in the conversion recipe file, the conversion unit 53 performs conversion processing according to the conversion rule, and the conversion rule is A conversion rule in which the conversion rules defined by the plurality of conversion definition files described in the description are combined.

Assume that there is currently a protocol conversion definition file named "C11.txt" and a protocol conversion definition file with the file name "C12.txt". The communication protocol conversion definition file of the file name "C11.txt" defines the conversion rule of the communication protocol between the exposure device 13 and the online pre-measurement inspection device 14a, and defines the communication protocol conversion definition file for the file name "C12.txt". The conversion rule of the communication protocol between the exposure device 13 and the online post-measurement inspection device 14b.

When both of the above-mentioned "C11.txt" and "C12.txt" are described as the communication protocol conversion definition file name for connecting the conversion recipe file between the online pre-measurement inspection device 14a and the online post-measurement inspection device 14b, The protocol conversion unit 53c of the conversion unit 53 synthesizes the conversion rules, and performs the communication protocol and the online after-measurement inspection device used by the online pre-measurement inspection device 14a without using the communication protocol of the exposure device 13. Conversion processing of the communication protocol used by 14b. By using the above description method, the steps and labor for the user to create the conversion recipe file and the conversion definition file can be saved.

When the communication server 20 having the above configuration is used, the user first uses the connection cable to manufacture the device (the exposure device 13, the line measurement inspection device 14, the transfer device 15, the offline measurement inspection device 16, the analysis system 17, and the substrate). The processing device 18) is connected to the communication server 20. At this time, the component manufacturing processing apparatus and the communication server 20 are connected by using a cable suitable for the connection interface provided in the component manufacturing processing apparatus. Specifically, when the exposure device 13 is connected, an Insernet (registered trademark) cable having, for example, an RJ-45 connector is used, and when the inspection device 14 is measured on the connection line, an RS-232 cable is used for connection.

Next, the user cooperates with the component manufacturing processing device connected to the communication server 20 to create a file format conversion definition file F1, a communication content conversion definition file F2, and a communication protocol conversion definition file F3, and registers them in the conversion definition file registration portion 54. At the same time, the user cooperates with each group of the component manufacturing processing apparatus connected to the communication server 20 to convert the recipe file, and registers it in the conversion recipe registration unit 55.

In addition, if the user wants to create all the file format conversion definition files F1, the communication content conversion definition file F2, and the communication protocol conversion definition file F3, it is necessary to have communication-related knowledge and the steps are extremely complicated. Therefore, a preferred method can be downloaded from the server device that provides the conversion definition file via the Internet. Since the download definition file can be downloaded, the user only has to perform the editing of the minimum conversion definition file.

When the power of the communication server 20 is input after the above operation, the conversion recipe file registered in the conversion recipe registration unit 55 is sequentially read by the conversion unit 53. When the conversion recipe file is read by the conversion unit 53, the conversion definition file described in the file name of the conversion recipe file is read out from the conversion definition file registration unit 54, and the conversion rules defined by the conversion definition file are sequentially applied. At the conversion unit 53. Further, since the conversion rule differs depending on the combination of the component manufacturing processing apparatuses, a plurality of conversion rules are applied to the conversion section 53. After the above processing is completed, communication can be performed via the communication server 20 between the component manufacturing processing devices connected to the communication server 20. Although the above description has been made by taking the case where the communication server 20 is newly connected as an example, it is also possible to add a component manufacturing processing device connected to the existing communication server 20.

Next, a specific operation when the waveform pre-measurement inspection device 14a shown in FIGS. 1 and 3 transmits the waveform image data to the exposure device 13 will be described. The waveform image data is a measurement result of the alignment of the online pre-measurement inspection device 14a, and the signal intensity changes depending on the position (X position) in the X direction. When the online pre-measurement inspection device 14a transmits the waveform image data to the exposure device 13, the communication protocol "SECS-I" is used with the communication server 20, and the communication content of the pre-existing online pre-measurement inspection device 14a is used. Send out waveform image data by communication. The waveform image data sent from the online pre-measurement inspection device 14a is received by the receiving and transmitting unit 52 of the communication server 20.

The waveform image data received by the receiving and transmitting unit 52 is output to the conversion unit 53. When the waveform image data is input to the conversion unit 53, the file format conversion unit 53a of the conversion unit 53 converts the file format definition file F1 specified by the conversion recipe (which is used to define the connection between the online measurement measuring device 14a and the exposure device 13). The content of the converted waveform image data. The conversion rule defined by the file format conversion definition file F1 is previously applied to the file format conversion unit 53a when the power of the communication server 20 is turned on or reset.

Here, it is assumed that the measurement result of the alignment sensor included in the online pre-measurement inspection device 14a is different from the measurement result of the alignment sensor 41 (see FIG. 2) provided in the exposure device 13. 8, the system shows that the measurement result of the alignment sensor provided in the online pre-measurement inspection device 14a is different from the measurement result of the alignment sensor 41 provided in the exposure device 13. In Fig. 8, the waveform image data assigned to the symbol K1 is obtained by measuring an alignment mark by an alignment sensor provided in the online measurement measuring device 14a, and the waveform image data of the symbol K2 is exposed. The alignment sensor 41 provided in the device 13 measures the same alignment mark.

When the measurement results are different as shown in FIG. 8, it is difficult to directly use the waveform image data acquired by the online pre-measurement inspection device 14a by the exposure device 13. Therefore, the conversion rule for absorbing the difference in the measurement result is defined in advance by the file format conversion definition file F1, and the file format conversion unit 53a uses the conversion rule to convert the waveform image data from the online pre-measurement inspection device 14a. That is, the converted waveform image data can be used for the exposure device 13.

The waveform image data K1 can be converted into the waveform image data K2 by performing a conversion process in which the waveform image data K1 shown in FIG. 8 is accumulated, for example, by an offset different from each X position. Therefore, if the conversion rule of the above-mentioned accumulated offset is defined in advance by the file format conversion definition file F1, the file format conversion definition file is specified by converting the recipe file (the connection between the online measurement measuring device 14a and the exposure device 13 is specified). F1, that is, can absorb the difference of the above measurement results and convert it into waveform image data suitable for processing by the exposure device 13. In addition, although the waveform image data whose signal intensity changes with the X position is taken as an example, the waveform image data whose signal intensity changes with the Y position, or the waveform image data whose signal intensity changes with time position, It can also be converted in the same way. Moreover, waveform image data can be converted in the same way whether it is one-dimensional data, two-dimensional data, or three-dimensional data.

Further, the communication content conversion unit 53b of the conversion unit 53 adjusts the content of the communication content conversion definition file F2 specified by the conversion recipe (the connection between the online pre-measurement inspection device 14a and the exposure device 13). The waveform image data of the communication content between the devices 14a is inspected and converted into waveform image data conforming to the communication content identifiable by the exposure device 13. Further, the protocol conversion unit 53c of the conversion unit 53 converts the content of the definition file F3 specified by the conversion protocol (the connection between the online pre-measurement inspection device 14a and the exposure device 13), and the communication protocol SECS- The information received by I (communication with the online pre-measurement inspection device 14a) is converted into information transmitted by the communication protocol HSMS (a communication protocol suitable for communication with the exposure device 13). In addition, the conversion rule specified by the communication content conversion definition file F2 and the conversion rule specified by the communication protocol conversion definition file F3 are respectively applied in advance when the power supply of the communication server 20 is input or when the reset is performed. The communication content conversion unit 53b and the communication protocol conversion unit 53c.

The waveform image data subjected to the above-described conversion processing is output from the conversion unit 53 to the receiving and transmitting unit 51, and then sent from the receiving and transmitting unit 51 to the exposure unit 13. By the above processing, the communication server 20 causes the waveform image data of the online pre-measurement inspection device 14a from the transmission source to be received by the online pre-measurement inspection device 14a, and the received information is suitable for transmission. The object is exposed by means of the exposure device 13. Further, when a plurality of conversion definition files are described in the conversion recipe file, in addition to the process of synthesizing the conversion rules, the same processing as the above-described processing is performed to perform transmission and reception of data between the two component manufacturing processing devices. As described above, in the present embodiment, the component manufacturing processing devices connected to the communication server 20 are not changed, and the component manufacturing processing devices can be connected to each other via the communication server 20.

Next, a modification of the communication server will be described. Fig. 9 is a block diagram showing a modification of the communication server. In the configuration of Fig. 9, the same components as those shown in Fig. 3 are assigned the same reference numerals. The communication server 21 shown in FIG. 9 has a conversion unit instead of the conversion unit 53, the conversion definition file registration unit 54, and the conversion recipe registration unit 55 included in the communication server 20 shown in FIG. 56. The conversion program registration unit 57 and the conversion recipe registration unit 58.

The conversion unit 56 includes a file format conversion unit 56a, a communication content conversion unit 56b, and a communication protocol conversion unit 56c that performs the file format conversion unit 53a, the communication content conversion unit 53b, and the communication provided in the conversion unit 53 shown in Fig. 3 . The protocol conversion unit 53c performs the same conversion processing. The file format conversion unit 53a, the communication content conversion unit 53b, and the communication protocol conversion unit 53c shown in FIG. 3 perform conversion processing based on the contents of the conversion definition file specified by the conversion recipe, but the conversion unit 56 is provided. The file format conversion unit 56a, the communication content conversion unit 56b, and the communication protocol conversion unit 56c call the conversion program specified by the conversion recipe and execute it, thereby performing conversion processing based on the conversion program. The difference is.

In the conversion program registration unit 57, the file format conversion unit 56a, the communication content conversion unit 56b, and the communication format conversion unit 56c, respectively, which are provided by the conversion unit 56, are registered in the file format, and the file format conversion program P1 called by the conversion unit 56 is registered. The content conversion program P2 and the communication protocol conversion program P3. The various conversion definition files shown in FIG. 3 describe the conversion rules in the form of characters. However, the various conversion programs shown in FIG. 9 are called from the conversion unit 56 to actually perform the conversion processing.

The file format conversion program P1, the communication content conversion program P2, and the communication protocol conversion program P3 are preferably created in the form of, for example, a DLL (Dynamic Link Library). These conversion programs are also registered in the conversion program registration unit 57 by using the file names set to the same meaning. In addition, since these are programs, basically the user cannot change the content, but the error in operation can be reduced.

In the conversion recipe registration unit 58, a conversion recipe is registered in the file format, and the conversion recipe describes information for specifying which of the plurality of conversion programs registered in the conversion program registration unit 57 is used. The conversion recipe files R11 to R13, ... are registered in accordance with each combination of any two component manufacturing processing devices among a plurality of component manufacturing processing devices connected to the communication server 21. The conversion formula R11~R13,... is a text file, and the user can freely change the content.

FIG. 10 is an example of the contents of the conversion recipe file used by the communication server 21. As shown in FIG. 10, the conversion recipe files R11 to R13, ... used by the communication server 21 have substantially the same contents as the conversion recipes R1 to R3, ... used by the communication server 20. That is, in the first column, the number of the conversion recipe file set to the same meaning between the conversion recipe files is described, and in the second column, the connection device name is described. In the example shown in Fig. 10, the exposure device 13 and the online pre-measurement inspection device 14a are described as the connection device names. However, the difference is that in the third to fifth columns, the file format conversion program name, the communication content conversion program name, and the communication protocol conversion program name are described separately. In addition, the conversion recipe files R11~R13, ... used by the communication server 21 can also describe a plurality of file format conversion program names, communication content conversion program names, and communication protocol conversion program names.

The communication server 21 having the above configuration also performs substantially the same conversion processing as the communication server 20 shown in FIG. Therefore, in the case of using the communication server 21, the component manufacturing processing device connected to the communication server 21 is also not changed, and the component manufacturing processing devices can be connected to each other through the communication server 21. Further, in the present embodiment, it is not impossible to create a conversion program by the user, but it takes a lot of labor. Therefore, a preferred method can be downloaded, for example, from a server device that provides such a conversion program over the Internet. Since the downloadable program can be downloaded, the user only needs to create and edit the conversion definition file.

The communication servers 20, 21 described above can also be achieved using a computer. Figure 11 is a front elevational view showing the appearance of the communication server 20, 21 achieved by a computer. As shown in FIG. 11, the computer for realizing the communication servers 20, 21 includes an input device such as a keyboard 61 and a mouse 62, a display device 63 such as a CRT (Cathode Ray Tube) or a liquid crystal display device, and a body. Department 64.

An internal memory device such as a CPU (Central Processing Unit), a RAM (Random Access Memory), and a ROM (Read Only Memory) is provided in the main body 64, and an external memory such as a hard disk is provided. Devices (all not shown). Further, a drive unit 65 such as a CD-ROM drive or a DVD (registered trademark)-ROM drive is provided in the main body unit 64. Further, a plurality of connection interfaces for connecting an element manufacturing processing device such as an exposure device 13, an online measurement measuring device 14a, and an online post-measurement inspection device 14b are provided on the back surface of the main body portion 64 (for example, an RJ-45 connector or RS-232C connector connection interface).

Further, a program for realizing the functions of the conversion unit 53 (the file format conversion unit 53a, the communication content conversion unit 53b, and the communication protocol conversion unit 53c) shown in FIG. 2 is attached to the main body unit 64, or a map for mounting the map is provided. The program of the function of the conversion unit 56 (the file format conversion unit 56a, the communication content conversion unit 56b, and the communication protocol conversion unit 56c) shown in FIG. This program is stored in a computer-readable recording medium 66 such as a CD-ROM or a DVD (registered trademark)-ROM, and the program recorded on the recording medium 66 is read by the drive device 65 to be attached to the main body portion 64.

In addition, the server device capable of transmitting the above program can be connected to a regional network laid in the component manufacturing factory, and the communication servers 20, 21 can also be connected to the same regional network to be installed on the line. Alternatively, the communication servers 20, 21 can be connected to the Internet to download and install the programs via the Internet.

The conversion definition file registration unit 54 for logging in the file format conversion definition file F1, the communication content conversion definition file F2, and the communication protocol conversion definition file F3 shown in FIG. 3 is used to log in the conversion recipe conversion file registration unit 55 of the conversion recipe. Or the conversion program registration unit 57 for registering the file format conversion program P1, the communication content conversion program P2, and the communication protocol conversion program P3, and the conversion recipe registration unit 58 for registering the conversion recipe file, as shown in FIG. For example, an external memory device such as a hard disk provided inside the main body portion 64 or an internal memory device is achieved. In particular, almost all OSs (operating systems) record information on a hard disk in the form of a file, so it is extremely suitable when logging in to the above various conversion definition files and converting recipe files.

In the above description, one communication server 20, 21 and a plurality of component manufacturing processing devices (exposure device 13, on-line measurement inspection device 14, transport device 15, offline measurement inspection device 16, analysis) The system 17 and the substrate processing apparatus 18) are connected. However, it should be noted that various component manufacturing processing devices are provided in the component manufacturing factory, and one communication server is provided in the component manufacturing factory and is in an abnormal state.

Further, although the communication server can be connected to various component manufacturing processing devices, it is often used for connection between a specific component manufacturing processing device (for example, between the exposure device 13 and the linear measurement inspection device 14). Therefore, it is possible to configure a plurality of communication servers having similar connection configurations in the component manufacturing factory. The user creates a file format conversion definition file F1, a communication content conversion definition file F2, and a communication protocol conversion definition file F3 and a conversion recipe file R1~R3, ... shown in FIG. 3 for all communication servers in the component manufacturing factory. Or when the conversion formula file R11~R13, ... shown in Fig. 9 is created, it takes a lot of labor and time.

Therefore, a preferred method is, for example, connecting each communication server provided in the component manufacturing factory to a local area network connection placed in the component manufacturing factory, and obtaining a map registered in the communication server from another communication server. The file format conversion definition file F1, the communication content conversion definition file F2, the communication protocol conversion definition file F3, and the conversion recipe file R1~R3, ..., or the conversion recipe file R11~R13 shown in FIG. And the file format conversion program P1, the communication content conversion program P2, and the communication protocol conversion program P3. By using one communication server in the component manufacturing factory to create the above-mentioned various files and acquiring these files by other communication servers in the component manufacturing factory, it is possible to connect components by using multiple communication servers. The processing device can reduce the labor burden of the user.

[Component manufacturing method]

Fig. 12 is a flow chart showing a method of manufacturing a component using the component manufacturing processing system in an embodiment of the present invention. The device manufacturing method shown in FIG. 12 can be applied to any of a semiconductor wafer such as an IC or an LSI, a liquid crystal panel, a CCD, a thin film magnetic head, or a micro device. However, a case where a semiconductor wafer is manufactured will be described as an example. . The white arrow in Fig. 12 indicates the flow of processing for the wafer W, and the solid arrow indicates the progress of the information between the processes. The following component manufacturing process is performed in units of a plurality of wafers (for example, 25 wafers) (bulk units). Moreover, in the following description, an example of manufacturing an element using the component manufacturing processing system provided with the communication server 20 shown in FIG.

At the start of the process, the wafer W of one batch is first transferred to the CVD apparatus 18a shown in FIG. 1 to perform a film formation process for forming a semiconductor thin film on the wafer W. In this process, the same semiconductor film is formed on all of the wafers W in one batch (step S11). After the film forming process is completed, the wafer W of one batch is transferred to the coating and developing machine 15a provided in the conveying device 15. Next, the photoresist is sequentially applied onto the wafer W by the coating developing machine 15a. The wafer W to which the photoresist has been applied is transported to the online pre-measurement inspection device 14a to perform the pre-measurement inspection process (step S12).

The pre-measurement inspection process performs measurement of alignment marks formed on the wafer W, measurement of the difference in the surface of the wafer W, defects on the wafer W, foreign matter inspection, and the like. Further, based on the results of the measurement and the inspection, the parameters of the alignment process when the exposure device 13 performs the exposure are optimized, and the parameters for the automatic focus control performed when the exposure device 13 performs the exposure are optimized.

That is, as described above, the exposure device 13 performs EGA measurement, and obtains an arrangement of all the irradiation regions set on the wafer W based on the measurement results of a plurality of representative alignment marks formed on the wafer W. Here, when the EGA measurement is performed by the exposure device 13, if the alignment mark to be measured is deformed or foreign matter adheres, the alignment of the irradiation region cannot be accurately obtained, and as a result, the alignment error at the time of exposure is caused. In order to prevent this, the alignment mark 14a is used to measure the alignment mark and inspect the defects and foreign matter on the wafer W in advance to select the alignment mark to be used in the EGA measurement, and the parameters for the alignment process. The optimization process, which determines the measurement algorithm used when measuring the alignment mark with the alignment sensor 41.

Further, when the exposure apparatus 13 is a step-and-scan type reduction projection type exposure apparatus shown in FIG. 2, the exposure process is performed while moving the wafer W. At the time of exposure, the autofocus control is performed according to the detection result of the AF sensor 40 so that the surface of the wafer W is aligned with the image plane of the projection optical system PL, however, depending on the surface state of the wafer W, There are different ways to control the difference. Therefore, the step difference of the surface of the wafer W is measured in advance by the online pre-measurement inspection device 14a to optimize the parameters for focus control.

When the pre-measurement inspection device 14a performs the pre-measurement inspection process, the formation position of the alignment mark on the wafer W, various parameters used by the exposure device 13 during the EGA measurement, and the like are transmitted from the exposure device 13 to the communication server 20 It is sent to the online pre-measurement inspection device 14a. In addition, the various parameters and various measurement results obtained by the pre-measurement inspection process of the online pre-measurement inspection device 14a are transmitted from the online pre-measurement inspection device 14a to the exposure device 13 via the communication server 20 (step SC1). Thereby, various parameters for optimizing the exposure conditions of the exposure device 13 are fed forward to the exposure device 13.

After the above processing is completed, the exposure processing of the wafer W is performed by the exposure device 13 (step S13). After the exposure process is started, the reticle R is held on the reticle stage RST according to the exposure manufacturing method, and the wafer W that has been subjected to the prior measurement inspection process by the prior measurement inspection device 14a is transported to the exposure device 13, and It is held on the wafer stage WST. Next, the main control system MC of the exposure device 13 moves the wafer stage WST in the XY plane, and arranges the alignment mark indicated by the parameter transmitted from the online measurement measuring apparatus 14a on the measurement field of the alignment sensor 41. Inside to measure the alignment mark. After the measurement of the alignment mark indicated by the above parameters is completed, the main control system MC performs an EGA operation to determine the arrangement of all the irradiation areas on the wafer W.

After the EGA measurement is completed, each of the irradiation regions provided on the wafer W is exposed. When the irradiation area is exposed, the main control system MC drives the wafer driving device 39 to move the wafer stage WST in the XY plane to arrange the irradiation area to be exposed first at the movement start position. At the same time, the reticle drive unit 34 is also driven by the main control system MC so that the reticle stage RST is also placed at the movement start position. After the above configuration is completed, the main control system MC starts the movement of the reticle stage RST and the wafer stage WST, and the set time elapses from the start of the reticle stage RST and the wafer stage WST to the predetermined speed (for After slowing down the time set by the reticle stage RST and the wafer stage WST due to the vibration generated by the acceleration, the control signal is output to the illumination optical system ILS to emit the exposure light EL. Thereby, the exposure light EL is irradiated onto the reticle R to start exposure of the irradiation region.

During the exposure of the irradiation area, the main control system MC moves the reticle stage RST and the wafer stage WST at a constant speed in the Y direction. Further, during the exposure of the irradiation region, the main control system MC performs autofocus control based on the parameters sent from the online pre-measurement inspection device 14a and the detection result of the AF sensor 40 to align the surface of the wafer W. The image plane of the projection optical system PL. After the exposure of one irradiation area is ended, the main control system MC moves the wafer stage WST in the XY plane, and arranges the next area to be exposed to the movement start position. All of the illumination areas on the wafer W are also exposed in the same manner below.

After the exposure of all the irradiation areas on the wafer W is completed, the wafer W held on the wafer stage WST is carried out, and the other wafer W that has been subjected to the pre-measurement inspection processing of the online pre-measurement inspection apparatus 14a is transferred to the exposure. The device 13 is held on the wafer stage WST. After the exposure of each irradiation area, the exposure processing of each wafer W, or the exposure processing of each batch, the main control system MC temporarily records various tracking data (for example, the implementation parameters used in the exposure processing, Various measurement results such as quasi-measurement results and exposure results are temporarily recorded. The tracking data here has the synchronization precision tracking data for indicating the synchronization precision of the wafer stage WST and the reticle stage RST during exposure, and the wafer W facing the image of the projection optical system PL during exposure. The surface position and posture control error is based on the position of the wafer W to display the focus tracking data.

The wafer W carried out from the exposure device 13 after the exposure processing is completed is transported to the coating and developing machine 15a provided in the transport device 15 to perform development processing (step S14). The wafer W that has been subjected to development processing is transported to the online post-event measurement inspection device 14b to perform post-measurement inspection processing (step S15). This post-measurement inspection process is performed by overlapping measurement, line width measurement, and the like. Further, the post-measurement processing may be performed after the etching treatment described later as necessary.

Further, the online post-test measuring device 14b transmits parameters for alignment measurement, alignment measurement results, and autofocus, synchronization accuracy, and exposure amount to the exposure device 13 or the online pre-measurement inspection device 14a via the communication server 20. Various control data are acquired to obtain such data through the communication server 20 (step SC2). In addition, the main control system MC can also quickly delete the temporarily recorded data when the online post-mortem inspection device 14b sends the above-mentioned data.

The online post-mortem measurement inspection device 14b analyzes the measurement results obtained by the above-described overlap measurement, line width measurement, and the like using the data acquired from the exposure device 13 or the like. When the analysis result, the overlap, or the line width is abnormal, that is, the change of the processing parameters of the exposure device 13 or the online after-measurement inspection device 14a is notified via the communication server 20 (step SC3). Thereby, various parameters for optimizing the exposure conditions of the exposure device 13 are fed back to the exposure device 13. Further, the online post-test measuring device 14b records the abnormality of the overlap or the line width.

The photoresist coating process S11, the pre-measurement inspection process S12, the exposure process S13, the development process S14, and the post-measurement inspection process S15 are not performed in the order of the wafer W of one batch, but by the wafer W. Units are carried out in order. After the above-described respective processes of the wafer W of one batch are completed, the batch is transferred to the substrate processing apparatus 18 shown in FIG. 1, and is etched by the etching apparatus 18c, and is performed by the oxidation and ion implantation apparatus 18d. In the impurity diffusion treatment, aluminum vapor deposition wiring processing is performed by a vapor deposition device (not shown) (step S16). Further, in this step, the chemical mechanical polishing treatment using the CMP apparatus 18b is performed as necessary.

By performing the above-described processing of steps S11 to S16, a layer pattern of one layer is formed on the wafer W. That is, steps S11 to S16 can be summarized into the film formation step S1. The batch that has completed the above step S16 is again transported to the CVD apparatus 18a or the coating and developing machine 15b. Next, the film formation step S1 described above is repeated in accordance with the number of film layers to be formed on the wafer W.

Thereafter, the batch that has passed through the above steps is transferred to a probe processing device (not shown) to perform probe (inspection) processing (step S17). At this time, since the abnormality of the overlap or the line width is known in advance by the post-measurement inspection process performed in step S15, if the inspection of the wafer having the abnormality is omitted, the component manufacturing efficiency can be improved, which is a preferred method. . In order to use the information of the abnormality obtained by the online post-measurement inspection device 14b in the probe processing device, it is preferable to connect the probe processing device to the communication server 20 to take the abnormal information obtained by the online post-measurement inspection device 14b. It is transmitted to the probe processing device via the communication server 20 (step SC4).

After the end of the probe processing, the repair process is performed (step S18). The repair process refers to forming an unnecessary portion of the original component portion when the circuit is formed on the substrate. When the original component portion has a defect, the laser repair device or the like is used to burn the component portion with laser light. And use the excess to replace the defective component part to repair the circuit. Here, since the abnormality of the overlap or the line width is known in advance by the post-measurement inspection process performed in step S15, if the repair process of the wafer having the abnormality is omitted, the manufacturing efficiency of the device can be improved. A preferred practice (step SC4).

In order to achieve the above-described repair processing, it is preferable to connect a repair device (not shown) to the communication server 20, and send the abnormal information obtained by the online post-test measuring device 14b to the repair device via the communication server 20. . Next, the wafer W is subjected to a dicing process (step S19), and each of the wafers that have been separated by dicing is subjected to a packaging process or a bonding process (step S20).

The components are manufactured through the above steps.

As described above, in the present embodiment, various information is transmitted and received between the exposure device 13, the online pre-measurement inspection device 14a, and the online post-measurement inspection device 14b via the communication server 20, so as to enable Various parameters optimized for the exposure conditions of the exposure device 13 are fed forward or fed back to the exposure device 13. Thereby, the information obtained by each component manufacturing processing apparatus can be effectively utilized between the component manufacturing processing apparatuses.

Furthermore, in the above-described embodiment, the various types of information are mainly transmitted and received between the exposure device 13 connected to the communication server 20, the online pre-measurement inspection device 14a, and the online post-measurement inspection device 14b. It can also be used for transmitting and receiving information between other component manufacturing processing devices (transporting device 15, analysis system 17, and substrate processing device 18) connected to the communication server 20. Therefore, information can be effectively utilized between these.

For example, the alignment result obtained by the exposure device 13 or the like is transmitted to the analysis system 17 via the communication server 20, thereby obtaining a simulation result of the pattern superimposed on the wafer W. Further, the simulation result is transmitted to the exposure device 13 via the communication server 20, whereby the main control system MC of the exposure device 13 selects the alignment mark to be used for measurement at the time of alignment, which is also a usable range.

The embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments, and can be freely changed within the scope of the present invention. For example, in the above-described embodiment, the conversion unit 53 of the communication server 20 shown in FIG. 3 includes the file format conversion unit 53a, the communication content conversion unit 53b, and the communication protocol conversion unit 53c. The conversion unit 56 of the communication server 21 includes a file format conversion unit 56a, a communication content conversion unit 56b, and a communication protocol conversion unit 56c. However, if the communication server only needs to convert the format of the received information, the communication content, and the 1 or 2 items in the communication protocol, the conversion units 53 and 56 only need to have the necessary conversion functions. Moreover, each conversion unit can use the conversion definition file mode and the conversion program mode in combination.

Further, the file format conversion definition file F1, the communication content conversion definition file F2, the communication protocol conversion definition file F3, and the conversion recipes R1 to R3, ..., or the conversion recipes R11 to R13, ... shown in FIG. The file format conversion definition program P1, the communication content conversion program P2, and the communication protocol conversion program P3 can also be provided with a deduction system that can be deducted according to the number of downloads if it is provided through the Internet.

Further, the exposure apparatus 13 of the above-described embodiment may be an exposure apparatus using a liquid immersion method disclosed in International Publication No. 99/49504, or an exposure apparatus which does not use a liquid immersion method. The exposure apparatus using the liquid immersion method may be any one of the following: a liquid immersion exposure apparatus partially filled with a liquid between the projection optical system PL and the wafer W; as disclosed in Japanese Laid-Open Patent Publication No. Hei 6-124873, A liquid immersion exposure apparatus in which a stage (exposure target) is moved in a liquid tank; and a liquid in which a predetermined deep liquid tank is formed and a substrate is held in the stage as disclosed in Japanese Laid-Open Patent Publication No. Hei 10-303114 Immersion exposure device.

Further, the exposure device 13 described above may be any one of: an exposure device that transfers an element pattern used in the manufacture of a semiconductor element to a semiconductor wafer; and a display element (including a liquid crystal display element (LCD), etc.) The exposure device used for transferring the component pattern used to the glass plate; the exposure device for transferring the component pattern used in the manufacture of the thin film magnetic head to the ceramic wafer; and the exposure device used for manufacturing the photographic element such as a CCD. Alternatively, in order to manufacture a reticle or a photomask used in a photo-exposure device, an EUV exposure device, an X-ray exposure device, and an electron beam exposure device, the circuit pattern is transferred to a glass substrate or a germanium wafer. Exposure device. Further, an exposure apparatus that transfers a predetermined pattern by a maskless method (not a pattern formed by transferring a reticle or a reticle) may be used.

11. . . In-plant production management main system

13. . . Exposure device

14. . . Online measurement inspection device

14a. . . Online pre-measurement inspection device

14b. . . Online post-testing inspection device

15. . . Transport device

15a. . . Coating processor

16. . . Off-line measurement and inspection device

17. . . analysis system

18. . . Substrate processing device

20,21. . . Communication server

51,52. . . Receiving and dispatching department

53. . . Conversion department

53a. . . File format conversion department

53b. . . Communication content conversion department

53c. . . Protocol conversion department

54. . . Conversion definition file registration department

55. . . Conversion recipe registration department

56. . . Conversion program registration department

57. . . Conversion recipe registration department

56a. . . File format conversion department

56b. . . Communication content conversion department

56c. . . Protocol conversion department

DP. . . pattern

W. . . Wafer

Fig. 1 is a block diagram showing a schematic configuration of a component manufacturing processing system according to an embodiment.

Fig. 2 is a side view showing a schematic configuration of an exposure apparatus which is one of the component manufacturing processing apparatuses of the embodiment.

Fig. 3 is a block diagram showing the configuration of a communication server (as a connecting means) between the component manufacturing processing apparatuses of the embodiment.

Fig. 4 is a view showing an example of contents of a file format conversion definition file.

Fig. 5 is a view showing an example of contents of a communication content conversion definition file.

Fig. 6 is a view showing an example of contents of a protocol conversion definition file.

Fig. 7 is a view showing an example of the contents of a conversion recipe file.

Fig. 8 is a view showing an example of the difference between the measurement result of the alignment sensor included in the online pre-measurement inspection device and the measurement result of the alignment sensor provided in the exposure device.

Fig. 9 is a block diagram showing a modification of the communication server.

Fig. 10 is a view showing an example of the contents of the conversion recipe file used by the communication server.

Figure 11 is a front elevational view showing the appearance of a communication server executed by a computer.

Fig. 12 is a flow chart showing a method of manufacturing a component using a component manufacturing processing system of an embodiment.

13. . . Exposure device

14a. . . Online pre-measurement inspection device

14b. . . Online post-testing inspection device

16. . . Off-line measurement and inspection device

20. . . Communication server

51. . . Receiving and dispatching department

53. . . Conversion department

53a. . . File format conversion department

53b. . . Communication content conversion department

53c. . . Protocol conversion department

55. . . Conversion recipe registration department

R1~R3. . . Convert recipe file

54. . . Conversion definition file registration department

54F1. . . File format conversion definition file

54F2. . . Communication content conversion definition file

54F3. . . Protocol conversion definition file

52. . . Receiving and dispatching department

Claims (39)

A connection device between component manufacturing processing devices for connecting two or more component manufacturing processing devices, comprising: a receiving portion connected to a first component manufacturing processing device for receiving the first component The transmission information of the manufacturing processing device is received by the method for receiving the transmission information of the first component manufacturing processing device; the conversion unit is connected to the receiving portion for converting the information received by the receiving portion The information received by the second component manufacturing processing device different from the first component manufacturing processing device; and the transmitting portion is connected to the converting portion and the second component manufacturing processing device for being used by the converting portion The information converted to the second component manufacturing processing device is converted and transmitted to the second component manufacturing processing device. The connection device between the component manufacturing processing apparatuses according to the first aspect of the invention, wherein the conversion unit includes at least one of: the first conversion unit converts the information format received by the receiving unit into The second conversion unit converts the data conforming to the communication content system used by the first component manufacturing processing device into a communication identifiable by the second component manufacturing processing device. And the third conversion unit converts the information received by the receiving unit with a communication protocol adapted to receive a message transmitted from the first component manufacturing processing device to be adapted to be adapted by the first 2 The information transmitted by the component manufacturing processing device to receive the communication protocol. For example, the connection between the component manufacturing processing devices of claim 2 The connection device includes a registration unit for registering the conversion processing information, and the conversion processing information is a format conversion process performed by the first conversion unit, a conversion process of the corresponding communication content system by the second conversion unit, and the The at least one of the conversion processing of the corresponding communication protocol by the conversion unit is related. The connection device between the component manufacturing processing apparatuses of claim 3, wherein the conversion processing information is registered in the registration unit in a file format. The connection device between the component manufacturing processing apparatuses of the third aspect of the patent application includes a recipe registration unit for registering a conversion recipe, and the conversion recipe is a conversion processing related to the format conversion processing performed by the first conversion unit. At least two of the information, the conversion processing information related to the conversion processing of the corresponding communication content system by the second conversion unit, and the conversion processing information related to the conversion processing of the corresponding communication protocol by the third conversion unit are associated with each other. . The connection device between the component manufacturing processing apparatuses of claim 5, wherein the information registered in the recipe registration unit is registered as a file. A connection device between component manufacturing processing apparatuses according to claim 3 of the patent application, comprising a recipe registration unit for registering at least one of the following conversion recipes, that is, relating to format conversion processing performed by the first conversion unit a conversion recipe in which a plurality of conversion processing information are associated with each other, a conversion recipe in which a plurality of conversion processing information related to a conversion processing of a corresponding communication content system by the second conversion unit are associated with each other, and a third conversion A conversion recipe in which a plurality of conversion processing information related to the conversion processing of the corresponding communication protocol is associated with each other. The connection device between the component manufacturing processing apparatuses of the first aspect of the patent application includes a registration unit for registering conversion processing information related to the conversion processing of the conversion unit, and the first conversion processing information is registered in the registration unit. The information received from the first component manufacturing processing device is converted into information suitable for the second component manufacturing processing device; and the second conversion processing information is information received from the second component manufacturing processing device. Converting into information suitable for reception by the third component manufacturing processing device; synthesizing the first conversion processing information and the second conversion processing information to generate combined conversion processing information, and using the composite conversion processing information from the first component The information received by the manufacturing processing device is converted into information suitable for reception by the third component manufacturing processing device, and is not converted into information suitable for reception by the second component manufacturing processing device. The connection device between the component manufacturing processing devices of claim 3, wherein the conversion processing information is at least a part of a conversion program used by the conversion unit. The connection device between the component manufacturing processing apparatuses according to the first aspect of the invention, wherein the conversion unit converts the waveform image data received by the receiving unit from the first component manufacturing processing device, and then the transmitting portion It is sent to the second component manufacturing processing device. The connection device between the component manufacturing processing devices of claim 10, wherein the conversion portion applies a predetermined offset to the waveform image data from the first component manufacturing processing device, and the transmitting portion The waveform image data of the predetermined offset is sent to the second component manufacturing processing device. The connection device between the component manufacturing processing devices of claim 11, wherein the waveform image data displays data of a predetermined measurement result, and displays position information and an object of the object measured by the predetermined measurement. The relationship between the measurement results at each location, or the relationship between the time information measured by the predetermined measurement and the measurement at each time; the conversion portion applies an offset to the measurement for each location or time result. The connecting device between the component manufacturing processing apparatuses according to any one of the above claims, wherein the component manufacturing processing device includes at least one of: exposure to transfer a predetermined pattern onto the substrate The device, a pre-measurement inspection device that performs at least one of measurement and inspection of the substrate on which the exposure is performed, and a post-measurement inspection device that performs at least one of measurement and inspection of the substrate on which the exposure has been completed. A method of connecting between component manufacturing processing apparatuses for connecting two or more component manufacturing processing apparatuses, wherein information transmitted from any one of the two or more component manufacturing processing apparatuses is suitable for the information The component of the source of the signal is processed by the processing device, and the received information is adapted to be transmitted to the component manufacturing processing device of the transmitting object. A method of connecting between component manufacturing processing apparatuses according to claim 14 of the present invention, wherein the converting step of at least one of the following steps is performed: the first step is to transmit the information from the component manufacturing processing device of the transmitting source. The format is converted into a format suitable for processing by the component manufacturing processing device of the transmitting object; and the second step is to convert the data conforming to the communication content system used between the component manufacturing processes of the transmitting source to conform to the signaling The information of the communication content system identifiable by the component manufacturing processing device of the object; and the third step is to convert the information received by the communication protocol adapted to receive the transmission information of the component manufacturing processing device from the transmission source into Information transmitted by a communication protocol received by a component manufacturing processing device suitable for the transmission source. The method of connecting between the component manufacturing processing apparatuses of claim 15 wherein the method of reading the pre-stored memory device and the format conversion processing performed in the first step and the second step are performed from the memory device. Corresponding to the conversion processing of the communication content system and the conversion processing information related to at least one of the conversion processing of the corresponding communication protocol performed in the third step, the conversion processing is executed based on the read conversion processing information. The method of connecting between the component manufacturing processing apparatuses of claim 16 wherein the conversion processing information relating to the format conversion processing performed in the first step, which is stored in advance in the memory device, is read from the memory device, and Conversion processing information related to conversion processing of the corresponding communication content system performed in the second step, and correspondence with the third step At least two conversion recipes associated with each other in the conversion processing information related to the conversion processing of the communication protocol, and then performing the conversion processing according to the converted conversion recipe. The method of connecting between the component manufacturing processing apparatuses of claim 14, wherein the waveform image data received from the component manufacturing processing device of the transmission source is converted to the component manufacturing processing device of the transmission target. A recording medium on which a program is recorded, wherein the computer executes at least a part of information communication processing between two or more component manufacturing processing devices, wherein the program causes the computer to perform the following processing, even from the two or more The information transmitted by any of the component manufacturing processing devices is adapted to be received by the component manufacturing processing device of the source of the information, and the received information is adapted to be transmitted to the component manufacturing processing device of the transmitting object. The recording medium of the program recorded in claim 19, wherein the program causes the computer to implement at least one of the following conversion functions, that is, the first conversion function is to be transmitted from the component manufacturing processing device of the transmission source The information format is converted into a format suitable for processing by the component manufacturing processing device of the transmitting object; and the second conversion function converts data conforming to the communication content system used between the component manufacturing processes of the transmitting source into a data of a communication content system identifiable by the component manufacturing processing device of the transmitting object; and a third conversion function received by a communication protocol adapted to receive transmission information from the component manufacturing processing device of the transmitting source The information is converted into information transmitted by a communication protocol received by the component manufacturing processing device suitable for the transmitting object. A recording medium on which a program is recorded in the program of claim 20, wherein the program reads a format conversion process and a second conversion function performed in advance by the first conversion function stored in the memory device from the memory device. And performing conversion processing related to at least one of the conversion processing of the communication content system and the conversion processing of the corresponding communication protocol by the third conversion function, and then causing the computer to perform the conversion processing information according to the read conversion processing information Perform conversion processing. A recording medium recording a program recorded in the program of claim 21, wherein the program reads, from the memory device, conversion processing information previously stored in the memory device relating to format conversion processing performed by the first conversion function, At least two of the conversion processing information related to the conversion processing of the corresponding communication content system performed by the second conversion function and the conversion processing information related to the conversion processing of the corresponding communication protocol by the third conversion function are related to each other The conversion recipe is combined with the conversion recipe read out to cause the computer to perform conversion processing. A recording medium having a program recorded in the program of claim 19, wherein the program causes the computer to perform the function of converting waveform image data received from the component manufacturing processing device of the transmission source to the program A component manufacturing processing device for a communication target. A component manufacturing processing system includes: a first component manufacturing processing device; a second component manufacturing processing device; and a connecting device connecting the first component manufacturing processing device and the second component manufacturing processing device; wherein the connection is The device includes a receiving unit that is connected to the first component manufacturing processing device and configured to transmit the information from the first component manufacturing processing device to receive the transmission information of the first component manufacturing processing device. a receiving unit connected to the receiving unit for converting information received by the receiving unit into information suitable for receiving by the second component manufacturing processing device different from the first component manufacturing processing device; And the transmitting unit is connected to the conversion unit and the second component manufacturing processing device for transmitting information converted by the conversion unit to information received by the second component manufacturing processing device, and transmitting the information to the second component Manufacturing a processing device. The component manufacturing processing system of claim 24, wherein the conversion unit of the connection device includes at least one of: the first conversion unit converts the format of the information received by the reception unit into The second conversion unit converts the data conforming to the communication content system used by the first component manufacturing processing device into a communication identifiable by the second component manufacturing processing device. The data of the content system; and the third conversion unit converts the information received by the receiving unit with the communication protocol adapted to receive the message transmitted from the first component manufacturing processing device to be suitable for the second The information transmitted by the component manufacturing processing device to receive the communication protocol. The component manufacturing processing system of claim 25, further comprising: a registration unit for registering conversion processing information, wherein the conversion processing information is performed by a format conversion process performed by the first conversion unit, and the second conversion unit performs Corresponding to at least one of conversion processing of the communication content system and conversion processing of the corresponding communication protocol by the third conversion unit. The component manufacturing processing system of claim 26, comprising: a plurality of the connection devices; and the conversion processing information not registered in the login portion of the specific connection device in the plurality of connection devices can be transparent to the specific The connection device is obtained by other connection devices. The component manufacturing processing system of claim 26, further comprising: a recipe registration unit for registering a conversion recipe, wherein the conversion recipe is conversion processing information related to format conversion processing performed by the first conversion unit, and At least two of the conversion processing information related to the conversion processing of the communication content system and the conversion processing information related to the conversion processing of the corresponding communication protocol by the third conversion unit are associated with each other. The component manufacturing processing system of claim 28, comprising: a plurality of the connecting devices; and the switching recipe not registered in the recipe registration portion of the specific connecting device in the plurality of connecting devices can be accessed through the network Obtained by other connecting devices with different connection devices. The component manufacturing processing system according to any one of claims 24 to 29, wherein the component manufacturing processing apparatus includes at least one of: an exposure device that exposes a predetermined pattern to a substrate, and beforehand At least one of the measurement and inspection device for measuring and inspecting the substrate on which the exposure is performed, and a post-measurement inspection device for performing at least one of measurement and inspection of the substrate on which the exposure has been completed. The component manufacturing processing system according to any one of claims 24 to 29, comprising a host computer for collectively controlling manufacture of a plurality of components including at least the first component manufacturing processing device and the second component manufacturing processing device The processing device is connected to the first component manufacturing processing device and the second component manufacturing processing device via a local area network that is provided separately from the network including the connection device and does not transmit the connection device. An exposure apparatus that is connected to a connection device between component manufacturing processing devices and that exposes a predetermined pattern to a substrate; the connection device between the component manufacturing processing devices includes: a receiving portion, and a first The component manufacturing processing device is connected to receive the transmission information from the first component manufacturing processing device in a manner suitable for receiving the transmission information of the first component manufacturing processing device; and the conversion unit is connected to the receiving portion And the information received by the receiving unit is converted into information suitable for receiving by the second component manufacturing processing device different from the first component manufacturing processing device; and the transmitting portion is coupled to the converting portion and the The second component manufacturing processing device is connected to transmit information to the second component manufacturing processing device by converting the conversion portion into information suitable for the information received by the second component manufacturing processing device. For example, the exposure device of claim 32 of the patent application is issued by the information received by the receiving unit of the connection device. The exposure apparatus of claim 32 or 33, wherein the information transmitted by the transmitting unit of the connecting device is received, and the predetermined pattern is exposed and transferred to the substrate according to the received information. An exposure method characterized by using an exposure apparatus according to any one of claims 32 to 34 to perform exposure transfer of a predetermined pattern to a substrate. A measurement and inspection apparatus is characterized in that it is connected to a connection device between the component manufacturing processing devices, and performs at least one of predetermined measurement and inspection on the substrate; and the connection device between the component manufacturing processing devices includes: a receiving portion; The first component manufacturing processing device is connected to receive the transmission information from the first component manufacturing processing device in a manner suitable for receiving the transmission information of the first component manufacturing processing device; the conversion unit is coupled to the receiving device The unit is connected to convert the information received by the receiving unit into information suitable for receiving by the second component manufacturing processing device different from the first component manufacturing processing device; and the transmitting portion and the converting portion The second component manufacturing processing device is connected to the second component manufacturing processing device for converting the conversion portion into information suitable for the information received by the second component manufacturing processing device. The measuring and inspecting device of claim 36 of the patent application is issued by the information received by the receiving unit of the connecting device. The measurement inspection apparatus of claim 36 or 37, wherein the information transmitted by the communication unit of the connection device is received, and at least one of predetermined measurement and inspection is performed on the substrate based on the received information. A measurement inspection method is characterized in that at least one of a predetermined measurement and inspection is performed on a substrate by using the measurement inspection device according to any one of claims 36 to 38.