TWI390658B - Substrate lifting device and substrate processing device - Google Patents

Substrate lifting device and substrate processing device Download PDF

Info

Publication number
TWI390658B
TWI390658B TW095127801A TW95127801A TWI390658B TW I390658 B TWI390658 B TW I390658B TW 095127801 A TW095127801 A TW 095127801A TW 95127801 A TW95127801 A TW 95127801A TW I390658 B TWI390658 B TW I390658B
Authority
TW
Taiwan
Prior art keywords
substrate
lifting
processing apparatus
lift pin
base end
Prior art date
Application number
TW095127801A
Other languages
English (en)
Chinese (zh)
Other versions
TW200721359A (en
Inventor
Takeshi Ito
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200721359A publication Critical patent/TW200721359A/zh
Application granted granted Critical
Publication of TWI390658B publication Critical patent/TWI390658B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW095127801A 2005-07-29 2006-07-28 Substrate lifting device and substrate processing device TWI390658B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005219808A JP4836512B2 (ja) 2005-07-29 2005-07-29 基板昇降装置および基板処理装置

Publications (2)

Publication Number Publication Date
TW200721359A TW200721359A (en) 2007-06-01
TWI390658B true TWI390658B (zh) 2013-03-21

Family

ID=37674367

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095127801A TWI390658B (zh) 2005-07-29 2006-07-28 Substrate lifting device and substrate processing device

Country Status (4)

Country Link
JP (1) JP4836512B2 (ja)
KR (1) KR100780115B1 (ja)
CN (1) CN100407398C (ja)
TW (1) TWI390658B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771738B (zh) * 2019-09-04 2022-07-21 大陸商中微半導體設備（上海）股份有限公司 一種電漿處理器、晶片頂升裝置及其頂升方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101358742B1 (ko) * 2007-02-16 2014-02-07 엘아이지에이디피 주식회사 배플 승강장치 및 이를 갖춘 평판표시소자 제조장치
KR100833315B1 (ko) 2007-04-06 2008-05-28 우범제 리프트 핀 홀더
TWI349720B (en) * 2007-05-30 2011-10-01 Ind Tech Res Inst A power-delivery mechanism and apparatus of plasma-enhanced chemical vapor deposition using the same
JP5036614B2 (ja) * 2008-04-08 2012-09-26 東京応化工業株式会社 基板用ステージ
JP5155790B2 (ja) * 2008-09-16 2013-03-06 東京エレクトロン株式会社 基板載置台およびそれを用いた基板処理装置
CN101882590B (zh) * 2010-07-15 2013-01-09 南通富士通微电子股份有限公司 一种加热块装置
KR101287831B1 (ko) * 2010-10-26 2013-07-18 주성엔지니어링(주) 기판 승강 장치
KR101432152B1 (ko) * 2012-11-13 2014-08-22 삼성디스플레이 주식회사 기판 지지 모듈
CN103887221B (zh) * 2012-12-20 2016-09-28 上海华虹宏力半导体制造有限公司 一种晶片升降销装置
JP6535206B2 (ja) * 2014-05-08 2019-06-26 株式会社ブイ・テクノロジー 露光方法及び露光装置
CN105575873B (zh) * 2014-10-15 2020-02-14 北京北方华创微电子装备有限公司 压环机构及半导体加工设备
CN109314034B (zh) * 2016-06-15 2021-11-16 瑞士艾发科技 真空处理室及制造真空处理的板形基底的方法
JP6650841B2 (ja) * 2016-06-27 2020-02-19 東京エレクトロン株式会社 基板昇降機構、基板載置台および基板処理装置
WO2018119959A1 (zh) * 2016-12-29 2018-07-05 深圳市柔宇科技有限公司 干蚀刻设备
KR102451031B1 (ko) * 2018-07-30 2022-10-06 아루박 테크노 가부시키가이샤 기판 리프트 장치 및 기판 반송 방법
CN109192696B (zh) * 2018-08-10 2021-06-08 北京北方华创微电子装备有限公司 升降针系统、真空反应腔室以及半导体加工设备
JP7198694B2 (ja) * 2019-03-18 2023-01-04 東京エレクトロン株式会社 基板リフト機構、基板支持器、及び基板処理装置
CN110610895A (zh) * 2019-09-29 2019-12-24 江苏鲁汶仪器有限公司 一种用于平台的弹簧顶针机构及真空等离子处理腔体
CN111508805B (zh) * 2020-04-07 2023-12-22 北京北方华创微电子装备有限公司 半导体设备中的晶片升降结构及半导体设备
US20220028720A1 (en) * 2020-07-22 2022-01-27 Applied Materials, Inc. Lift pin interface in a substrate support
CN118280804A (zh) * 2022-12-31 2024-07-02 江苏鲁汶仪器股份有限公司 一种聚焦环置换装置及等离子刻蚀机
CN117637608B (zh) * 2024-01-25 2024-05-14 中国科学院长春光学精密机械与物理研究所 一种硅通孔的制作方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249765B2 (ja) * 1997-05-07 2002-01-21 東京エレクトロン株式会社 基板処理装置
JP3028462B2 (ja) * 1995-05-12 2000-04-04 東京エレクトロン株式会社 熱処理装置
US6177023B1 (en) * 1997-07-11 2001-01-23 Applied Komatsu Technology, Inc. Method and apparatus for electrostatically maintaining substrate flatness
JP3456890B2 (ja) * 1998-01-16 2003-10-14 東京エレクトロン株式会社 基板処理装置
US6572708B2 (en) * 2000-02-28 2003-06-03 Applied Materials Inc. Semiconductor wafer support lift-pin assembly
US6544340B2 (en) * 2000-12-08 2003-04-08 Applied Materials, Inc. Heater with detachable ceramic top plate
US6403322B1 (en) * 2001-03-27 2002-06-11 Lam Research Corporation Acoustic detection of dechucking and apparatus therefor
KR20020094509A (ko) * 2001-06-12 2002-12-18 삼성전자 주식회사 반도체 제조 공정에서 사용되는 정전척 어셈블리
JP2003332193A (ja) * 2003-03-20 2003-11-21 Tokyo Electron Ltd 基板処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI771738B (zh) * 2019-09-04 2022-07-21 大陸商中微半導體設備（上海）股份有限公司 一種電漿處理器、晶片頂升裝置及其頂升方法

Also Published As

Publication number Publication date
CN100407398C (zh) 2008-07-30
JP2007036070A (ja) 2007-02-08
JP4836512B2 (ja) 2011-12-14
KR20070015035A (ko) 2007-02-01
CN1905152A (zh) 2007-01-31
KR100780115B1 (ko) 2007-11-27
TW200721359A (en) 2007-06-01

Similar Documents

Publication Publication Date Title
TWI390658B (zh) Substrate lifting device and substrate processing device
TWI437659B (zh) A substrate stage and a substrate processing device
JP5219377B2 (ja) 基板載置台および基板処理装置
JP4795899B2 (ja) 基板載置機構および基板受け渡し方法
JP4597894B2 (ja) 基板載置台および基板処理装置
KR101800504B1 (ko) 기판 탑재 장치 및 기판 처리 장치
CN107546171B (zh) 基板升降机构、基板载置台和基板处理装置
KR101035249B1 (ko) 기판 탑재대 및 기판 처리 장치
CN100477147C (zh) 基板载置台及基板处理装置
CN111710641B (zh) 基片升降机构、基片支承器和基片处理装置
TWI421969B (zh) A substrate alignment device and a substrate storage unit
KR100875347B1 (ko) 감압 건조 장치 및 기판 건조 방법
JP2007073833A (ja) 減圧乾燥装置及び基板乾燥方法
JP4957622B2 (ja) 基板支持装置
TWI686885B (zh) 升降銷總成、具有升降銷總成之基板處理裝置及用於將一基板與該基板安放於其上之一基板支撐件分離之方法
KR100596328B1 (ko) 평판표시소자 제조장치의 리프트 핀 모듈
KR101256485B1 (ko) 기판처리장치의 공정챔버
KR101036186B1 (ko) 기판처리장치
KR20220107941A (ko) 기판 배치대 및 기판 처리 방법
KR100553102B1 (ko) 리프트 핀 모듈 및 그것을 구비하는 평판표시소자 제조장치
KR101000330B1 (ko) 기판처리장