TWI387748B - Optical measuring device - Google Patents

Optical measuring device Download PDF

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TWI387748B
TWI387748B TW097113757A TW97113757A TWI387748B TW I387748 B TWI387748 B TW I387748B TW 097113757 A TW097113757 A TW 097113757A TW 97113757 A TW97113757 A TW 97113757A TW I387748 B TWI387748 B TW I387748B
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sample
support member
adsorption
optical measuring
stage
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TW097113757A
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TW200907332A (en
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Koji Machida
Tomohiro Suzuki
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Lasertec Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303Apparatus specially adapted to the manufacture of LCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Optical Filters (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Description

光學測定裝置Optical measuring device

本發明是關於光學測定裝置、及基板保持裝置,更詳言之,是關於一種使用穿透試料的穿透光來進行測定的光學測定裝置、及吸附基板並加以保持的基板保持裝置。The present invention relates to an optical measuring device and a substrate holding device. More specifically, the present invention relates to an optical measuring device that performs measurement using transmitted light that penetrates a sample, and a substrate holding device that adsorbs and holds the substrate.

在液晶顯示裝置等的製程中,是將照明光照射在透明基板來進行檢查。這種檢查步驟有使用穿透過試料的穿透光的情況、以及使用由試料反射的反射光的情況。透明的基板例如有彩色濾光片基板、液晶面板、TFT陣列基板等。近年來,這些基板的基板尺寸正朝大型化發展。In the manufacturing process of a liquid crystal display device or the like, illumination light is irradiated on a transparent substrate for inspection. This inspection step includes the case of using the transmitted light penetrating the sample and the case of using the reflected light reflected by the sample. The transparent substrate is, for example, a color filter substrate, a liquid crystal panel, a TFT array substrate, or the like. In recent years, the substrate size of these substrates has been increasing.

利用穿透光的穿透型檢查裝置是將作為檢查對象的基板載置於載台上。藉此,能以穩定的狀態加以保持。在將基板載置於載台的狀態下,從基板的表面側、或背面側照射來自光源的光。接著,利用CCD或光電二極體的檢測器來檢測出穿透過基板及載台的光。因此,穿透型的缺陷檢查裝置所使用的載台是使用可讓來自光源的光穿透的透明載台(專利文獻1)。A penetration type inspection device that uses transmitted light mounts a substrate to be inspected on a stage. Thereby, it can be maintained in a stable state. The light from the light source is irradiated from the front side or the back side of the substrate in a state where the substrate is placed on the stage. Next, a detector that passes through the substrate and the stage is detected by a detector of a CCD or a photodiode. Therefore, the stage used for the penetration type defect inspection apparatus is a transparent stage which can penetrate the light from a light source (patent document 1).

例如,在基板的上部配置檢測器,並將照明光源配置在透明載台的下部。藉此,可拍攝基板的穿透像。這種透明載台通常可使用玻璃板等。為了正確檢測出基板上微細的缺陷,基板最好不要振動。亦即,一旦基板振動,就無法進行穩定的測定。隨著基板的大型化,會造成用來載置基板的透明載台也大型化。因此,制振對策就變得更為重 要。然而,透明的玻璃載台之厚度有其限制,難以將其形成一定以上的厚度。For example, a detector is disposed on an upper portion of the substrate, and the illumination source is disposed at a lower portion of the transparent stage. Thereby, a penetrating image of the substrate can be taken. A glass plate or the like can be usually used for such a transparent stage. In order to correctly detect fine defects on the substrate, it is preferable that the substrate does not vibrate. That is, once the substrate is vibrated, stable measurement cannot be performed. As the size of the substrate increases, the transparent stage on which the substrate is placed is also increased in size. Therefore, the vibration suppression strategy becomes heavier Want. However, the thickness of the transparent glass stage is limited, and it is difficult to form it to a certain thickness or more.

並且,揭示一種具有制振桿的載台裝置(專利文獻2)。制振桿是設在載台的下側。又,揭示一種將用來吸附基板的單元設在基板下方的檢查裝置(專利文獻3)。該檢查裝置是在玻璃基板的下方設有單元。在單元設有吸附口、及噴出口。藉由以吸附口來吸附基板,即可降低振動。要使基板移動時,是從單元的噴出口噴出空氣。而且在兩個單元之間配置有受光部。Further, a stage device having a damper is disclosed (Patent Document 2). The damper rod is located on the lower side of the stage. Further, an inspection apparatus in which a unit for adsorbing a substrate is provided under a substrate is disclosed (Patent Document 3). This inspection apparatus is provided with a unit below the glass substrate. The unit is provided with a suction port and a discharge port. The vibration can be reduced by adsorbing the substrate with the adsorption port. When the substrate is moved, air is ejected from the discharge port of the unit. Further, a light receiving portion is disposed between the two units.

[專利文獻1]日本特開2001-148625號公報(段落0011)[Patent Document 1] Japanese Laid-Open Patent Publication No. 2001-148625 (paragraph 0011)

[專利文獻2]日本特開2006-337542號公報[Patent Document 2] Japanese Patent Laid-Open Publication No. 2006-337542

[專利文獻3]日本特開2003-279495號公報[Patent Document 3] Japanese Patent Laid-Open Publication No. 2003-279495

然而,在專利文獻2的載台裝置中,必須因應測定頭的移動而使制振桿升降。因此,必須控制用以使制振桿升降之驅動機構。再者,在專利文獻3之檢查裝置中,為了進行基板整體之檢查而使基板移動。當使基板移動時,檢查裝置會大型化。如上所述,該等裝置為了進行穿透照明,裝置會變得複雜。因此,使用穿透照明的裝置會有無法簡便地進行穩定之測定的問題點。However, in the stage device of Patent Document 2, it is necessary to raise and lower the damper rod in response to the movement of the measuring head. Therefore, it is necessary to control the drive mechanism for lifting the damper rod. Further, in the inspection apparatus of Patent Document 3, the substrate is moved in order to perform inspection of the entire substrate. When the substrate is moved, the inspection device is enlarged. As mentioned above, the devices can become complicated for penetrating illumination. Therefore, there is a problem that a device that penetrates illumination cannot be easily and stably measured.

本發明是為了解決這種問題點而研創者,其目的在於提供一種可簡便地進行穩定之測定的光學測定裝置、及基板保持裝置。The present invention has been made in order to solve such a problem, and an object of the invention is to provide an optical measuring apparatus and a substrate holding apparatus which can easily perform stable measurement.

本發明之第1樣態的光學測定裝置是使用穿透過試料的穿透光來進行測定的光學測定裝置,其特徵為具備:載置台,係載置前述試料之端部;吸附台,係在前述試料的下側設置成可朝第1方向移動,並且具有用來吸附前述試料之吸附口;照明光源,係設在前述吸附台,並且對前述試料從下側射出照明光;測定頭,係在前述試料的上側接受從前述照明光源穿透過前述試料的穿透光;複數個支持構件,係設在前述試料的下側,並且在前述載置台之內側處支持前述試料;以及抵接部,係設在前述吸附台,並藉由與前述支持構件之抵接,使一部分之前述支持構件的上端從前述試料離開。藉此,即使是使用穿透照明的裝置,也可簡便地進行穩定的測定。An optical measuring apparatus according to a first aspect of the present invention is an optical measuring apparatus that performs measurement using transmitted light that has passed through a sample, and is characterized in that the mounting table is provided with an end portion on which the sample is placed, and the adsorption stage is attached thereto. The lower side of the sample is provided to be movable in the first direction, and has a suction port for adsorbing the sample; the illumination source is provided on the adsorption stage, and the illumination light is emitted from the lower side to the sample; The upper side of the sample receives the transmitted light that has penetrated the sample from the illumination source; the plurality of support members are disposed on the lower side of the sample, and support the sample at the inner side of the mounting table; and the abutting portion, The adsorption stage is provided on the adsorption stage, and a part of the support member is separated from the sample by abutment with the support member. Thereby, even if a device that penetrates illumination is used, stable measurement can be easily performed.

本發明之第2樣態的光學測定裝置是上述的光學測定裝置,其中,復具備將前述複數個支持構件中的兩個以上加以連結的軸,藉由令前述抵接部抵接於前述支持構件,使前述支持構件以前述軸為旋轉軸而旋轉,而使前述一部分之支持構件的上端從前述試料離開。藉此,即使在增加支持構件之數量的情況下,也可形成簡便的構成。An optical measuring apparatus according to a second aspect of the present invention is the optical measuring apparatus described above, further comprising: a shaft that connects two or more of the plurality of supporting members, wherein the abutting portion is brought into contact with the support The member rotates the support member with the shaft as a rotation axis, and the upper end of the part of the support member is separated from the sample. Thereby, even when the number of support members is increased, a simple configuration can be formed.

本發明之第3樣態的光學測定裝置是上述的光學測定裝置,其中,前述照明光源是沿著與前述第1方向不同的第2方向以線狀照明前述試料者。藉此,只要使吸附台僅朝第1方向移動即可,因此可簡便地測定整個試料。An optical measuring apparatus according to a third aspect of the present invention is the optical measuring apparatus described above, wherein the illumination light source illuminates the sample in a line shape in a second direction different from the first direction. Thereby, the adsorption stage can be moved only in the first direction, so that the entire sample can be easily measured.

本發明之第4樣態的光學測定裝置是上述的光學測定 裝置,其中,在前述第1方向中,設於前述吸附台的吸附口是配置在前述照明光源的兩側。藉此,可降低所照明之區域的振動,因此可實現穩定的測定。An optical measuring apparatus according to a fourth aspect of the present invention is the optical measuring described above In the apparatus, in the first direction, the adsorption ports provided in the adsorption stage are disposed on both sides of the illumination light source. Thereby, the vibration of the illuminated area can be reduced, so that stable measurement can be achieved.

本發明之第5樣態的光學測定裝置是上述的光學測定裝置,其中,前述抵接部之與前述支持構件抵接的抵接面是形成斜面形狀。藉此,可緩和衝擊,且可使吸附台快速地移動。An optical measuring apparatus according to a fifth aspect of the present invention is the optical measuring apparatus described above, wherein the abutting surface of the abutting portion that abuts against the support member has a sloped shape. Thereby, the impact can be alleviated and the adsorption stage can be moved quickly.

本發明之第6樣態的光學測定裝置是上述的光學測定裝置,其中,前述吸附台具有對前述試料噴出氣體的噴出口。藉此,可快速地進行吸附台的移動。An optical measuring apparatus according to a sixth aspect of the present invention is the optical measuring apparatus described above, wherein the adsorption stage has a discharge port for discharging a gas to the sample. Thereby, the movement of the adsorption stage can be performed quickly.

本發明之第7樣態的光學測定裝置是上述的光學測定裝置,其中,藉由前述抵接部而從前述試料離開的前述支持構件之回復到支持前述試料之狀態的回復速度,是依據前述支持構件的位置而不同。藉此,可緩和支持構件及試料所受的衝擊。According to a seventh aspect of the present invention, in the optical measuring apparatus of the present invention, the optical measuring device according to the above aspect of the present invention, wherein the returning speed of the supporting member that is separated from the sample by the abutting portion to the state in which the sample is supported is based on the The position of the support member is different. Thereby, the impact of the support member and the sample can be alleviated.

本發明之第8樣態的光學測定裝置是上述的光學測定裝置,其中,沿著前述第1方向設置的前述載置台是分別配置在前述試料的兩側,前述複數個支持構件中,設在前述第1方向之端部的前述支持構件的回復速度比其他支持構件的回復速度快。藉此,可緩和試料在中央的衝擊。In the optical measuring apparatus according to the eighth aspect of the present invention, the optical measuring device according to the first aspect, wherein the mounting table provided along the first direction is disposed on each side of the sample, and the plurality of supporting members are provided in the plurality of supporting members. The recovery speed of the support member at the end portion in the first direction is faster than the recovery speed of the other support members. Thereby, the impact of the sample in the center can be alleviated.

本發明之第9樣態的光學測定裝置是上述的光學測定裝置,其中,設有使前述支持構件回復到原來角度的彈簧,藉由改變前述彈簧的強度,來改變前述支持構件的回復速度。藉此,可簡便地緩和衝擊。An optical measuring apparatus according to a ninth aspect of the present invention is the optical measuring apparatus described above, wherein the spring is provided with a spring that restores the support member to an original angle, and the return speed of the support member is changed by changing the strength of the spring. Thereby, the impact can be easily alleviated.

本發明之第10樣態的光學測定裝置是上述的光學測定裝置,其中,復具有藉由與前述支持構件之碰撞而吸收前述支持構件回復原狀時之衝擊的減震器(shock absorber),藉由改變前述減震器的強度,來改變前述支持構件的回復速度。藉此,可簡便地緩和衝擊。According to a tenth aspect of the present invention, in the optical measuring device of the present invention, the optical measuring device further includes a shock absorber that absorbs an impact when the supporting member returns to the original state by collision with the supporting member. The recovery speed of the aforementioned support member is changed by changing the strength of the aforementioned damper. Thereby, the impact can be easily alleviated.

本發明之第11樣態的光學測定裝置是上述的光學測定裝置,其中,藉由改變前述抵接部與前述支持構件接觸之部分的形狀,來改變前述支持構件的回復速度。藉此,可簡便地緩和衝擊。An optical measuring apparatus according to an eleventh aspect of the present invention is the optical measuring apparatus described above, wherein the recovery speed of the support member is changed by changing a shape of a portion of the contact portion that is in contact with the support member. Thereby, the impact can be easily alleviated.

根據本發明,可提供一種可簡便進行穩定之測定的光學測定裝置、及基板保持裝置。According to the present invention, it is possible to provide an optical measuring apparatus and a substrate holding apparatus which can easily perform stable measurement.

(實施形態1)(Embodiment 1)

本實施形態的測定裝置是使用穿透過試料的穿透光來進行測定的光學測定裝置。測定裝置是用來測定設在試料的圖案或缺陷。具體而言,是用來測定圖案形狀、圖案寬度、缺陷的位置、缺陷的大小、缺陷的形狀等。因此,可將使用穿透光的顯微鏡或檢查裝置作為本實施形態的測定裝置。The measuring device of the present embodiment is an optical measuring device that performs measurement using transmitted light that has passed through the sample. The measuring device is used to measure the pattern or defect provided in the sample. Specifically, it is used to measure the shape of the pattern, the width of the pattern, the position of the defect, the size of the defect, the shape of the defect, and the like. Therefore, a microscope or an inspection apparatus using transmitted light can be used as the measuring apparatus of the present embodiment.

針對本發明之測定裝置,使用第1圖及第2圖加以說明。第1圖是示意性顯示測定裝置之構成的俯視圖。第2圖是示意性顯示測定裝置所使用的載台裝置之構成的斜視圖。如第1圖所示,測定裝置100具有固定機座11、載置 台12、導軌14、支持構件16、吸附台18、X軌道21、測定頭22、Y軌道23、及抵接部48。測定裝置100是用來檢查試料50的檢查裝置。又,如第2圖所示,用來保持試料50的載台裝置10具有固定機座11、載置台12、導軌14、支持構件16、及吸附台18。The measurement apparatus of the present invention will be described with reference to Figs. 1 and 2 . Fig. 1 is a plan view schematically showing the configuration of a measuring device. Fig. 2 is a perspective view schematically showing the configuration of a stage device used in the measuring device. As shown in Fig. 1, the measuring device 100 has a fixed base 11 and is placed The table 12, the guide rail 14, the support member 16, the adsorption stage 18, the X rail 21, the measuring head 22, the Y rail 23, and the abutting portion 48. The measuring device 100 is an inspection device for inspecting the sample 50. Further, as shown in FIG. 2, the stage device 10 for holding the sample 50 has a fixed base 11, a mounting table 12, a guide rail 14, a support member 16, and a suction stage 18.

在此,將試料50作為液晶顯示裝置等顯示裝置所使用的彩色濾光片基板來加以說明。彩色濾光片基板具備R、G、B三種顏色的著色層與設在著色層之間的遮光層。本實施形態的測定裝置100是在試料50下設有吸附台18。而且,是利用設在吸附台18的照明光源41,從背面側照明試料50。在試料50上配置有測定頭22。由設在該測定頭22的光檢測器接受穿透過試料50的穿透光。檢測器是例如CCD相機等。藉此可拍攝試料50的像。因此,可測定試料50的圖案形狀、圖案寬度等。再者,可藉由與正常的圖案比較,來測定缺陷的大小及位置。並且可進行試料50是否正常的檢查。Here, the sample 50 will be described as a color filter substrate used in a display device such as a liquid crystal display device. The color filter substrate includes a coloring layer of three colors of R, G, and B and a light shielding layer provided between the colored layers. In the measuring device 100 of the present embodiment, the adsorption stage 18 is provided under the sample 50. Further, the sample 50 is illuminated from the back side by the illumination light source 41 provided on the adsorption stage 18. The measuring head 22 is placed on the sample 50. The light passing through the sample 50 is received by the photodetector provided in the measuring head 22. The detector is, for example, a CCD camera or the like. Thereby, the image of the sample 50 can be taken. Therefore, the pattern shape, the pattern width, and the like of the sample 50 can be measured. Furthermore, the size and position of the defect can be determined by comparison with a normal pattern. Further, it is possible to check whether the sample 50 is normal or not.

如第1圖及第2圖所示,將水平面設為XY平面。又,X方向與Y方向是彼此正交。試料50是大致水平地配置在XY平面。再者,將鉛直方向設為Z方向。此外,固定機座11的上表面是與XY面平行。固定機座11是例如被安裝並固定在地面。又,亦可經由用來吸收振動的阻尼器等來安裝固定機座11。As shown in Fig. 1 and Fig. 2, the horizontal plane is set to the XY plane. Further, the X direction and the Y direction are orthogonal to each other. The sample 50 is arranged substantially horizontally on the XY plane. Furthermore, the vertical direction is set to the Z direction. Further, the upper surface of the fixed base 11 is parallel to the XY plane. The fixed base 11 is, for example, mounted and fixed to the ground. Further, the fixed base 11 may be attached via a damper or the like for absorbing vibration.

在固定機座11的兩端分別配設有Y軌道23。Y軌道23是沿著Y方向。亦即,Y軌道23的長度方向是與Y方 向平行。在該兩條Y軌道23上方設有X軌道21。該X軌道21是以跨過試料50的方式沿著X方向而設置。X軌道21的長度方向是與X方向平行。在X軌道21安裝有測定頭22。測定頭22是被設置成可相對於X軌道21移動。因此,測定頭22會沿著X方向移動。在測定頭22設有相機等光檢測器或鏡頭等。測定頭22會接受來自後述吸附台18之照明光源41的光。再者,亦可將落射照明光學系統配置在測定頭22。藉此,可利用穿透照明及落射照明(epi illumination)兩者。又,亦可將雷射加工用的雷射光源配設在測定頭22。藉此,便可修正缺陷部位。Y rails 23 are respectively disposed at both ends of the fixed base 11. The Y track 23 is along the Y direction. That is, the length direction of the Y track 23 is the Y side. Parallel. An X-track 21 is provided above the two Y-tracks 23. The X rail 21 is provided along the X direction so as to straddle the sample 50. The length direction of the X track 21 is parallel to the X direction. A measuring head 22 is attached to the X rail 21. The measuring head 22 is arranged to be movable relative to the X-track 21. Therefore, the measuring head 22 moves in the X direction. A photodetector such as a camera, a lens, or the like is provided on the measuring head 22. The measuring head 22 receives light from the illumination light source 41 of the adsorption stage 18 which will be described later. Further, the epi-illumination optical system may be disposed in the measuring head 22. Thereby, both penetrating illumination and epi illumination can be utilized. Further, a laser light source for laser processing may be disposed in the measuring head 22. Thereby, the defective part can be corrected.

再者,X軌道21是被設置成可相對於Y軌道23移動。因此X軌道21會朝Y方向移動。因此,測定頭22會在試料50上朝XY方向移動。亦即,藉由使測定頭22朝X方向移動,並使安裝有測定頭22的X軌道21朝Y方向移動,即可使測定頭22在XY平面上移動。藉此,可對試料50全面地進行測定。又,由於可縮小測定裝置100的設置空間,因此可提升生產性。測定頭22及X軌道21的驅動可使用AC伺服馬達等眾所周知的方法來進行。Furthermore, the X track 21 is arranged to be movable relative to the Y track 23. Therefore, the X track 21 moves in the Y direction. Therefore, the measuring head 22 moves in the XY direction on the sample 50. In other words, by moving the measuring head 22 in the X direction and moving the X-track 21 to which the measuring head 22 is attached in the Y direction, the measuring head 22 can be moved in the XY plane. Thereby, the sample 50 can be measured comprehensively. Moreover, since the installation space of the measuring apparatus 100 can be reduced, productivity can be improved. The driving of the measuring head 22 and the X rail 21 can be performed by a well-known method such as an AC servo motor.

再者,在固定機座11上方固定有兩條載置台12。試料50係被載置於該載置台12上。載置台12是沿著Y方向設置。亦即,載置台12的長度方向是與Y方向平行。而且,載置台12是配置在兩條Y軌道23之間。載置台12是離開達對應於試料50大小的距離。因此,試料50的兩端會被載置於載置台12上。亦即,載置台12的上表面係 形成用來載置試料50的載置面。Furthermore, two mounting tables 12 are fixed above the fixed base 11. The sample 50 is placed on the mounting table 12. The mounting table 12 is disposed along the Y direction. That is, the longitudinal direction of the mounting table 12 is parallel to the Y direction. Further, the mounting table 12 is disposed between the two Y rails 23. The stage 12 is separated by a distance corresponding to the size of the sample 50. Therefore, both ends of the sample 50 are placed on the mounting table 12. That is, the upper surface of the mounting table 12 is A mounting surface on which the sample 50 is placed is formed.

在固定機座11上是如第1圖所示,固定有兩條導軌14。此外,第2圖省略了一條導軌14的圖示。導軌14是沿著Y方向設置。亦即,導軌14的長度方向是與Y方向平行。導軌14是配置在兩個載置台12之間。在導軌14上配設有試料50。因此,導軌14比載置台12低。亦即,導軌14的上表面比載置台12的載置面還低。因此,在導軌14與試料50之間設有間隙。On the fixed base 11, as shown in Fig. 1, two guide rails 14 are fixed. Further, Fig. 2 omits illustration of a guide rail 14. The guide rails 14 are disposed along the Y direction. That is, the longitudinal direction of the guide rail 14 is parallel to the Y direction. The guide rail 14 is disposed between the two mounting bases 12. A sample 50 is placed on the guide rail 14. Therefore, the guide rail 14 is lower than the mounting table 12. That is, the upper surface of the guide rail 14 is lower than the mounting surface of the mounting table 12. Therefore, a gap is provided between the guide rail 14 and the sample 50.

在該導軌14上以可移動之方式支持有吸附台18。例如,吸附台18是藉由線性導件等被安裝在導軌14上。在此,藉由兩條導軌14,將吸附台18支持成可滑動移動的狀態。因此,可水平地支持吸附台18。吸附台18會沿著導軌14朝Y方向移動。藉此,可使吸附台18移動至要進行照明的位置。An adsorption stage 18 is movably supported on the guide rail 14. For example, the suction stage 18 is mounted on the guide rail 14 by a linear guide or the like. Here, the adsorption stage 18 is supported in a slidable state by the two guide rails 14. Therefore, the adsorption stage 18 can be supported horizontally. The suction stage 18 moves in the Y direction along the guide rail 14. Thereby, the adsorption stage 18 can be moved to the position to be illuminated.

吸附台18是例如矩形的平板狀構件。吸附台18是沿著X方向設置。亦即,吸附台18的長度方向是與X方向平行。吸附台18是配置在兩個載置台12之間。吸附台18是形成大致與兩個載置台12的間隔相同的長度。因此,吸附台18是從一方載置台12的內側附近延伸到另一方載置台12的內側附近。亦即,吸附台18包含X方向的整個檢查範圍。吸附台18會沿著導軌14朝Y方向滑動。亦即,導軌14係形成為使吸附台18移動的滑軌。吸附台18的驅動可使用AC伺服馬達等眾所周知的方法來進行。The adsorption stage 18 is, for example, a rectangular flat member. The adsorption stage 18 is disposed along the X direction. That is, the longitudinal direction of the adsorption stage 18 is parallel to the X direction. The adsorption stage 18 is disposed between the two mounting stages 12. The adsorption stage 18 is formed to have the same length as the interval between the two mounting stages 12. Therefore, the adsorption stage 18 extends from the vicinity of the inner side of one of the mounting stages 12 to the inner side of the other of the other mounting stages 12. That is, the adsorption stage 18 includes the entire inspection range in the X direction. The suction stage 18 slides along the guide rail 14 in the Y direction. That is, the guide rail 14 is formed as a slide rail that moves the suction stage 18. The driving of the adsorption stage 18 can be performed using a well-known method such as an AC servo motor.

在吸附台18設有照明光源41。照明光源41是例如射 出線狀光的線狀光源。在此,具有與X方向平行之線狀光點的照明光會從照明光源41射出。藉此,可在X方向照明整個檢查範圍。在該吸附台18上載置有試料50。而且,在吸附台18設有用來吸附試料50的吸附口。可在吸附試料50的狀態下進行測定。藉此,可降低振動,並進行穩定的測定。An illumination source 41 is provided on the adsorption stage 18. The illumination source 41 is for example shot A linear light source that emits linear light. Here, illumination light having a linear spot parallel to the X direction is emitted from the illumination light source 41. Thereby, the entire inspection range can be illuminated in the X direction. The sample 50 is placed on the adsorption stage 18. Further, the adsorption stage 18 is provided with an adsorption port for adsorbing the sample 50. The measurement can be carried out in the state in which the sample 50 is adsorbed. Thereby, vibration can be reduced and stable measurement can be performed.

針對該吸附台18的構成,參照第3圖加以說明。第3圖是吸附台18之構成的側視圖。第3圖(a)顯示吸附台18正在移動的狀態,第3圖(b)顯示吸附台18停止的狀態。The configuration of the adsorption stage 18 will be described with reference to Fig. 3 . Fig. 3 is a side view showing the configuration of the adsorption stage 18. Fig. 3(a) shows a state in which the adsorption stage 18 is moving, and Fig. 3(b) shows a state in which the adsorption stage 18 is stopped.

在吸附台18設有作為線狀光源的照明光源41。照明光源41是配置在Y方向中的吸附台18的大致中央。照明光源41具有LED(Light Emitting Diode)42及擴散板43。LED42及擴散板43是埋設在設於吸附台18的凹部。具體而言,是在Y方向中的吸附台18的大致中央形成凹部。凹部是沿著X方向形成。該凹部係為在X方向中設於吸附台18之大致整體的凹槽。並且在該凹部中配設作為點光源的LED42。在此,複數個LED42是沿著X方向排列。以等間隔沿著X方向將複數個LED42配置成一行。例如,將LED42每隔2cm配置。並且在複數個LED42上覆蓋擴散板43。擴散板43是以X方向為長度方向的矩形平板狀構件。因此,配置成一行的LED42係由擴散板43所覆蓋。擴散板43是配設在吸附台18的凹部中。因此,擴散板43、及LED42並不會突出於凹部的上側。在由吸附台18吸附的試料50與照明光源41之間會產生間隙。藉此可水平地 保持試料50。An illumination source 41 as a linear light source is provided on the adsorption stage 18. The illumination light source 41 is substantially at the center of the adsorption stage 18 disposed in the Y direction. The illumination light source 41 has an LED (Light Emitting Diode) 42 and a diffusion plate 43. The LED 42 and the diffusion plate 43 are embedded in a recess provided in the adsorption stage 18. Specifically, a concave portion is formed substantially at the center of the adsorption stage 18 in the Y direction. The recess is formed along the X direction. The concave portion is a groove provided in a substantially entire entirety of the adsorption stage 18 in the X direction. Further, an LED 42 as a point light source is disposed in the recess. Here, the plurality of LEDs 42 are arranged along the X direction. The plurality of LEDs 42 are arranged in a row along the X direction at equal intervals. For example, the LEDs 42 are arranged every 2 cm. And the diffusion plate 43 is covered on the plurality of LEDs 42. The diffusion plate 43 is a rectangular flat member having a longitudinal direction in the X direction. Therefore, the LEDs 42 arranged in a row are covered by the diffusion plate 43. The diffusion plate 43 is disposed in a recess of the adsorption stage 18. Therefore, the diffusion plate 43 and the LED 42 do not protrude above the upper side of the concave portion. A gap is generated between the sample 50 adsorbed by the adsorption stage 18 and the illumination source 41. Horizontally Keep the sample 50.

LED42係朝上方射出照明光。照明光會朝向擴散板43射出。接著,從LED42射出的光會在擴散板43擴散。亦即,來自LED42的光會經由擴散板43射入試料50。藉此,可均勻地照明線狀的區域。此外,照明光源41最好是線狀光源。藉由使用線狀光源,可照明X方向的整個檢查範圍。因此,只要使照明光源僅朝Y方向移動,便可檢查整個試料50。亦即,只要在吸附台18有單向的驅動機構,便可在試料50的任意位置進行測定。The LED 42 emits illumination light upward. The illumination light is emitted toward the diffusion plate 43. Then, the light emitted from the LED 42 is diffused on the diffusion plate 43. That is, light from the LED 42 is incident on the sample 50 via the diffusion plate 43. Thereby, the linear region can be uniformly illuminated. Further, the illumination source 41 is preferably a linear light source. By using a linear light source, the entire inspection range in the X direction can be illuminated. Therefore, the entire sample 50 can be inspected as long as the illumination source is moved only in the Y direction. That is, as long as the adsorption stage 18 has a one-way drive mechanism, the measurement can be performed at any position of the sample 50.

又,可取代擴散板43而使用折射率高的導光板。在此情況下,在導光板的側面或下面射入光時,該光會在導光板內反覆全反射並傳播。接著,光會從導光板的上面射出。藉此,即使減少LED42的數量,也可均勻地照明線狀的區域。再者,照明光源41例如可使用燈光源等。當然,照明光源41並不限定於該等構成。而且,照明光源41並不限於線狀光源。亦可僅照明由測定頭22所測定的區域。亦即,只要使設在測定頭22的光檢測器的視野均勻地被照明即可。具體而言,可以僅使複數個LED42中的一部分發光,並均勻地照明視野。在該情況下,當測定頭22朝X方向移動時,係依序掃描進行發光的LED42。亦即,係依測定頭22的位置來切換LED42的ON/OFF。如此,最好使用可照明線狀之照明區域的照明光源41。亦即,即使不使其朝Y方向移動,照明光源41也會照明沿著X方向的線狀區域。亦可使其照明帶狀的區域。Further, a light guide plate having a high refractive index can be used instead of the diffusion plate 43. In this case, when light is incident on the side or the lower side of the light guide plate, the light is totally reflected and propagated in the light guide plate. Then, light is emitted from the upper surface of the light guide plate. Thereby, even if the number of the LEDs 42 is reduced, the linear region can be uniformly illuminated. Further, as the illumination light source 41, for example, a lamp light source or the like can be used. Of course, the illumination source 41 is not limited to these configurations. Moreover, the illumination light source 41 is not limited to a linear light source. It is also possible to illuminate only the area measured by the measuring head 22. In other words, the field of view of the photodetector provided in the measuring head 22 may be uniformly illuminated. Specifically, only a part of the plurality of LEDs 42 can be illuminated, and the field of view can be uniformly illuminated. In this case, when the measuring head 22 moves in the X direction, the LEDs 42 that emit light are sequentially scanned. That is, the ON/OFF of the LED 42 is switched depending on the position of the measuring head 22. Thus, it is preferred to use an illumination source 41 that illuminates a linear illumination area. That is, the illumination light source 41 illuminates the linear region along the X direction even if it is not moved in the Y direction. It can also be used to illuminate the banded area.

吸附台18設有用來吸附試料50的吸附口45。因此,從吸附口45吸引氣體時,試料50的一部分就會被吸附在吸附台18。具體而言,以X方向為長度方向的帶狀區域會如第3圖(b)所示被吸附。藉此,可在對應於吸附台18的區域保持試料50。如此,吸附台18會吸附並保持試料50的一部分。進行測定的期間,試料50是由吸附台18所吸附。藉此,可降低在測定中產生的振動,且可進行更穩定的測定。The adsorption stage 18 is provided with an adsorption port 45 for adsorbing the sample 50. Therefore, when the gas is sucked from the adsorption port 45, a part of the sample 50 is adsorbed to the adsorption stage 18. Specifically, the strip-shaped region having the longitudinal direction in the X direction is adsorbed as shown in Fig. 3(b). Thereby, the sample 50 can be held in a region corresponding to the adsorption stage 18. As such, the adsorption stage 18 adsorbs and holds a portion of the sample 50. During the measurement, the sample 50 is adsorbed by the adsorption stage 18. Thereby, the vibration generated in the measurement can be reduced, and a more stable measurement can be performed.

吸附口45是配置在以X方向為長度方向的照明光源41的兩側。亦即,將兩個吸附口45在Y方向分開配置。而且,在兩個吸附口45之間配置有照明光源41。吸附口45是朝X方向延伸的溝槽狀。或是,亦可沿著X方向排列複數個吸附口45。藉由在照明光源41的兩側設置吸附口45,可確實地吸附正被照明的照明區域。藉此,可正確地進行測定。The adsorption port 45 is disposed on both sides of the illumination light source 41 having the longitudinal direction in the X direction. That is, the two adsorption ports 45 are disposed separately in the Y direction. Further, an illumination light source 41 is disposed between the two adsorption ports 45. The adsorption port 45 is a groove shape extending in the X direction. Alternatively, a plurality of adsorption ports 45 may be arranged along the X direction. By providing the adsorption ports 45 on both sides of the illumination light source 41, the illumination area being illuminated can be reliably absorbed. Thereby, the measurement can be performed correctly.

再者,在吸附台18設有噴出氣體的噴出口46。在吸附口45的外側配置有噴出口46。因此,吸附口45是在Y方向設在照明光源41的兩側。從噴出口46噴出氣體時,在試料50與吸附台18之間會產生間隙(空氣間隙)。如第3圖(a)所示,在從噴出口46噴出有氣體的部分,試料50會浮起。亦即,試料50之對應於吸附台18的部分會向上鼓起。因此,在吸附台18與試料50之間會產生間隙。因此,要移動時,係使吸附停止,再從噴出口46噴出氣體。藉此,便可使吸附台18不與試料50干擾地移動。可使吸附台18 快速地移動。噴出口46是朝X方向延伸的溝槽狀。或是,亦可沿著X方向排列複數個噴出口46。藉由在吸附口45的外側設置噴出口46,可使試料50與吸附台18確實分開。噴出口46最好是設在Y方向中的吸附台18的端部附近。可使吸附台18更快速地移動。Further, the adsorption stage 18 is provided with a discharge port 46 for discharging a gas. A discharge port 46 is disposed outside the adsorption port 45. Therefore, the adsorption ports 45 are provided on both sides of the illumination light source 41 in the Y direction. When gas is ejected from the discharge port 46, a gap (air gap) is generated between the sample 50 and the adsorption stage 18. As shown in Fig. 3(a), the sample 50 floats in a portion where gas is ejected from the discharge port 46. That is, the portion of the sample 50 corresponding to the adsorption stage 18 will bulge upward. Therefore, a gap is generated between the adsorption stage 18 and the sample 50. Therefore, when moving, the adsorption is stopped, and the gas is ejected from the discharge port 46. Thereby, the adsorption stage 18 can be moved without interfering with the sample 50. Adsorption station 18 Move quickly. The discharge port 46 has a groove shape extending in the X direction. Alternatively, a plurality of discharge ports 46 may be arranged in the X direction. By providing the discharge port 46 on the outer side of the adsorption port 45, the sample 50 and the adsorption stage 18 can be surely separated. The discharge port 46 is preferably provided in the vicinity of the end of the adsorption stage 18 in the Y direction. The adsorption stage 18 can be moved more quickly.

實際要進行檢查時,是將測定頭22配置在吸附台18上。亦即,在吸附台18與測定頭22之間配置有試料50。接著,吸附並保持試料50。藉由吸附台18的照明光源41,從下側照明試料50。由設在測定頭22的光檢測器接受穿透過試料50的穿透光。光檢測器典型為CCD相機。藉由該CCD相機來拍攝試料50的像。藉此,可測定試料50的圖案形狀等。結束該位置的測定之後,使測定頭22及吸附台18同步移動。要使其移動時,首先停止吸附,再從噴出口46噴出氣體。藉此,在試料50與吸附台18之間會產生間隙。接著,移動至下一個測定位置之後,停止噴出,再從吸附口45吸附。藉此便可保持試料50。以上述方式對於整個或一部分試料50進行檢查。When the inspection is actually performed, the measurement head 22 is placed on the adsorption stage 18. That is, the sample 50 is disposed between the adsorption stage 18 and the measurement head 22. Next, the sample 50 is adsorbed and held. The sample 50 is illuminated from the lower side by the illumination source 41 of the adsorption stage 18. The transmitted light penetrating through the sample 50 is received by a photodetector provided in the measuring head 22. The photodetector is typically a CCD camera. The image of the sample 50 is taken by the CCD camera. Thereby, the pattern shape and the like of the sample 50 can be measured. After the measurement of the position is completed, the measuring head 22 and the adsorption stage 18 are moved in synchronization. To move it, the adsorption is first stopped, and the gas is ejected from the discharge port 46. Thereby, a gap is generated between the sample 50 and the adsorption stage 18. Then, after moving to the next measurement position, the discharge is stopped and the adsorption is performed from the adsorption port 45. Thereby, the sample 50 can be held. All or a portion of the sample 50 is inspected in the manner described above.

要檢查大致整個試料50時,會使吸附台18移動至試料50的一端。並且使測定頭22移動至吸附台18的正上方。在此,先使測定頭22移動至X方向之端。接著,從吸附口45吸引空氣而吸附試料50。在吸附並保持試料50的狀態下,使線狀的照明光從照明光源41射出。由測定頭22檢測出該照明光中穿透過試料50的穿透光。測定頭22是在試料50的上側接受穿透過試料50的穿透光。測定頭 22會拍攝線狀照明區域中的一部分。藉此,拍攝試料50的像,並觀察試料50的一部分。接著,使測定頭22朝X方向逐漸移動,並進行一條線的檢查。亦即,使測定頭22從一端逐漸移動至另一端。在移動中,依序拍攝由照明光源41所照明的線狀的照明區域。以此方式對線狀的照明區域整體逐漸進行測定。When the entire sample 50 is to be inspected, the adsorption stage 18 is moved to one end of the sample 50. Further, the measuring head 22 is moved right above the adsorption stage 18. Here, the measuring head 22 is first moved to the end in the X direction. Next, air is sucked from the adsorption port 45 to adsorb the sample 50. In a state where the sample 50 is adsorbed and held, linear illumination light is emitted from the illumination light source 41. The penetrating light that has passed through the sample 50 in the illumination light is detected by the measuring head 22. The measuring head 22 receives the transmitted light that has passed through the sample 50 on the upper side of the sample 50. Measuring head 22 will take part of the linear illumination area. Thereby, the image of the sample 50 is taken, and a part of the sample 50 is observed. Next, the measuring head 22 is gradually moved in the X direction, and a line inspection is performed. That is, the measuring head 22 is gradually moved from one end to the other end. During the movement, a linear illumination area illuminated by the illumination source 41 is sequentially photographed. In this way, the entire line-shaped illumination area is gradually measured.

結束一條線的檢查之後,將利用吸附台18進行的吸附予以解除,而從噴出口46噴出氣體。藉此,會形成試料50與吸附台18分開的狀態。接著,在使其噴出氣體之狀態下,使吸附台18與測定頭22在Y方向錯開。亦即,僅以一條線的量使吸附台18及測定頭22移動。接著,同樣使測定頭22朝X方向移動,然後進行第二條線的測定。反覆該步驟,進行測定直到試料50的另一端。以此方式可對試料50測定。亦即,朝Y方向掃描吸附台18,並且循序掃描(raster scan)測定頭22。藉此,可檢查整個試料50。After the inspection of one line is completed, the adsorption by the adsorption stage 18 is released, and the gas is ejected from the discharge port 46. Thereby, a state in which the sample 50 is separated from the adsorption stage 18 is formed. Next, in a state where the gas is ejected, the adsorption stage 18 and the measuring head 22 are shifted in the Y direction. That is, the adsorption stage 18 and the measuring head 22 are moved by the amount of one line. Next, the measuring head 22 is also moved in the X direction, and then the measurement of the second line is performed. This step is repeated and the measurement is performed until the other end of the sample 50. Sample 50 can be measured in this manner. That is, the adsorption stage 18 is scanned in the Y direction, and the measurement head 22 is scanned by a raster scan. Thereby, the entire sample 50 can be inspected.

如此,進行測定之區域係配置在吸附台18之正上方。而且,僅對吸附台18之一部分所對應的區域進行照明。亦即,僅吸附台18之對應照明光源41的線狀區域被照明。僅由該照明光所照明之照明區域的一部分成為測定頭22之視野。藉由進行吸附,可減低產生在進行攝像之區域的振動。Thus, the area to be measured is placed directly above the adsorption stage 18. Moreover, only the area corresponding to one portion of the adsorption stage 18 is illuminated. That is, only the linear regions of the corresponding illumination source 41 of the adsorption stage 18 are illuminated. Only a part of the illumination area illuminated by the illumination light becomes the field of view of the measurement head 22. By performing the adsorption, the vibration generated in the region where the image is taken can be reduced.

再者,如第1圖及第2圖所示,在固定機座11上設有複數個支持構件16。支持構件16是配置在載置台12的內側。支持構件16是支持試料50的針狀構件。各個支持構 件16是沿著Z方向設置。而且,試料50是藉由令支持構件16的上端抵接於試料50而受到支持。亦即,可利用支持構件16支持吸附台18以外的部分。藉此,可更為降低相對於試料50的振動。而且可降低試料50的撓曲。Further, as shown in FIGS. 1 and 2, a plurality of support members 16 are provided on the fixed base 11. The support member 16 is disposed inside the mounting table 12. The support member 16 is a needle-shaped member that supports the sample 50. Support structure The piece 16 is arranged along the Z direction. Further, the sample 50 is supported by bringing the upper end of the support member 16 into contact with the sample 50. That is, the support member 16 can be used to support a portion other than the adsorption stage 18. Thereby, the vibration with respect to the sample 50 can be further reduced. Moreover, the deflection of the sample 50 can be reduced.

複數個支持構件16是排列成矩陣狀。亦可等間隔地排列複數個支持構件16。第1圖及第2圖是在X方向排列有四個支持構件16,在Y方向排列有七個支持構件16。因此,設有28個支持構件16。當然,支持構件16的數量及排列並不限於上述例子。在此,支持構件16的排列是以X方向為橫列,以Y方向為縱列。在X方向,支持構件16是配置在導軌14的兩側。亦即,在支持構件16的縱列與縱列之間配置有導軌14。更具體而言,在從第1圖右方算來第1列的支持構件16與第2列支持構件16之間配置有一個導軌14。另外,在從第1圖右方算來第3列的支持構件16與第4列支持構件16之間配置有一個導軌14。A plurality of support members 16 are arranged in a matrix. A plurality of support members 16 may also be arranged at equal intervals. In the first and second figures, four support members 16 are arranged in the X direction, and seven support members 16 are arranged in the Y direction. Therefore, 28 support members 16 are provided. Of course, the number and arrangement of the support members 16 are not limited to the above examples. Here, the arrangement of the support members 16 is a course in the X direction and a column in the Y direction. In the X direction, the support members 16 are disposed on both sides of the guide rail 14. That is, the guide rail 14 is disposed between the column and the column of the support member 16. More specifically, one guide rail 14 is disposed between the support member 16 of the first row and the second row of support members 16 from the right in the first figure. Further, one guide rail 14 is disposed between the support member 16 and the fourth row of support members 16 in the third row from the right in the first figure.

支持構件16是配置在試料50的下側。因此,比起載置台12的載置面,支持構件16的上端是形成大致相同的高度。另外,亦可考慮試料50的撓曲性,使支持構件16的上端比載置面稍低。關於支持構件16的詳細構成容後敘述。The support member 16 is disposed on the lower side of the sample 50. Therefore, the upper ends of the support members 16 are formed at substantially the same height as compared with the mounting surface of the mounting table 12. Further, the flexibility of the sample 50 may be considered so that the upper end of the support member 16 is slightly lower than the mounting surface. The detailed configuration of the support member 16 will be described later.

再者,在吸附台18設有抵接部48。抵接部48會與吸附台18一同移動。由於該抵接部48會與支持構件16抵接,因此使支持構件16旋轉。藉此,支持構件16會倒下,而在支持構件16與試料50之間產生間隙。吸附台18係通 過該間隙。可防止吸附台18與支持構件16碰撞。亦即,避免吸附台18移動時與支持構件16干擾。例如,吸附台18移動後之位置的支持構件16會旋轉。因此,朝Z方向延伸設置的支持構件16會倒下,支持構件16會從Z方向傾斜。藉此,支持構件16的上端會離開試料50的下表面。形成有供吸附台18通過試料50正下方之空間,而使吸附台18通過試料50與支持構件16之間。Further, the adsorption stage 18 is provided with an abutting portion 48. The abutting portion 48 moves together with the adsorption stage 18. Since the abutting portion 48 abuts against the support member 16, the support member 16 is rotated. Thereby, the support member 16 is dropped, and a gap is generated between the support member 16 and the sample 50. Adsorption station 18 is connected Pass the gap. The suction table 18 can be prevented from colliding with the support member 16. That is, the interference with the support member 16 is prevented when the adsorption stage 18 moves. For example, the support member 16 at the position after the adsorption stage 18 is moved will rotate. Therefore, the support member 16 extending in the Z direction will fall down, and the support member 16 will be inclined from the Z direction. Thereby, the upper end of the support member 16 will leave the lower surface of the sample 50. The space for the adsorption stage 18 to pass directly under the sample 50 is formed, and the adsorption stage 18 is passed between the sample 50 and the support member 16.

接著,利用第4圖及第5圖,針對支持構件16的旋轉動作加以說明。第4圖是示意性顯示載台裝置10之構成的側視圖。更具體而言,第4圖(a)是顯示支持構件16支持著試料50之狀態的側視圖,第4圖(b)是顯示未支持著試料50之狀態的側視圖。亦即,第4圖(a)顯示支持構件16並未與抵接部48抵接的狀態。第4圖(b)顯示支持構件16與抵接部48抵接,且支持構件16正在旋轉的狀態。第5圖是支持構件16之動作的說明圖。Next, the rotation operation of the support member 16 will be described using Figs. 4 and 5 . Fig. 4 is a side view schematically showing the configuration of the stage device 10. More specifically, Fig. 4(a) is a side view showing a state in which the supporting member 16 supports the sample 50, and Fig. 4(b) is a side view showing a state in which the sample 50 is not supported. That is, FIG. 4(a) shows a state in which the support member 16 is not in contact with the abutting portion 48. Fig. 4(b) shows a state in which the support member 16 abuts against the abutting portion 48, and the support member 16 is rotating. FIG. 5 is an explanatory diagram of the operation of the support member 16.

如第4圖(a)所示,複數個支持構件16是由軸35所連結。軸35是形成為使支持構件16旋轉的旋轉軸。軸35是沿著X方向設置。軸35是與設在支持構件16下部的連接部32連接。藉此,在X方向鄰接的支持構件16係藉由軸35而連接。在連接部32的上方延伸設有支持銷34。在支持構件16與抵接部48未接觸的狀態下,支持銷34的上端是與試料50接觸。As shown in Fig. 4(a), a plurality of support members 16 are connected by a shaft 35. The shaft 35 is a rotating shaft formed to rotate the support member 16. The shaft 35 is disposed along the X direction. The shaft 35 is connected to a connecting portion 32 provided at a lower portion of the support member 16. Thereby, the support members 16 adjacent in the X direction are connected by the shaft 35. A support pin 34 is provided above the connecting portion 32. In a state where the support member 16 and the abutting portion 48 are not in contact, the upper end of the support pin 34 is in contact with the sample 50.

再者,X方向的兩端之連接於支持構件16的軸35是安裝在載置台12。載置台12是將軸35支持成可旋轉的狀 態。軸35是被插入設於導軌14的貫穿孔。如上所述,在X方向排列的四個支持構件16係藉由軸35而連結。亦即,橫一列所有的支持構件16係藉由軸35而連結。藉此,在Y方向位於相同位置的複數個支持構件16會同時旋轉。例如,一個支持構件16以軸35為旋轉軸而旋轉時,其他三個支持構件16也會旋轉。此時,四個支持構件16會以相同的角度旋轉。橫一列的支持構件16會同時旋轉。Further, the shaft 35 connected to the support member 16 at both ends in the X direction is attached to the mounting table 12. The mounting table 12 supports the shaft 35 in a rotatable shape. state. The shaft 35 is inserted into a through hole provided in the guide rail 14. As described above, the four support members 16 arranged in the X direction are coupled by the shaft 35. That is, all of the support members 16 in the horizontal row are connected by the shaft 35. Thereby, a plurality of support members 16 located at the same position in the Y direction are simultaneously rotated. For example, when one support member 16 rotates with the shaft 35 as a rotation axis, the other three support members 16 also rotate. At this time, the four support members 16 will rotate at the same angle. The support members 16 of the horizontal row will rotate simultaneously.

再者,在四個支持構件16的一個設有凸輪滾輪(cam roller)31。第4圖中是在從右邊算來第2個的支持構件16設有凸輪滾輪31。當吸附台18移動至支持構件16附近時,抵接部48會抵接於凸輪滾輪31。抵接部48及凸輪滾輪31構成凸輪機構。因此,當抵接部48與凸輪滾輪31接觸時,如第5圖所示,支持構件16會旋轉。亦即,抵接部48之Y方向的直進運動會轉換成以軸35為旋轉軸的旋轉運動。藉此,安裝有凸輪滾輪31的支持構件16會旋轉。因此,原本支持著試料50的支持銷34的上端37會從試料50分開。亦即,旋轉的支持構件16不再支持試料50。Further, a cam roller 31 is provided at one of the four support members 16. In Fig. 4, the second support member 16 from the right side is provided with a cam roller 31. When the suction stage 18 is moved to the vicinity of the support member 16, the abutment portion 48 abuts against the cam roller 31. The abutting portion 48 and the cam roller 31 constitute a cam mechanism. Therefore, when the abutting portion 48 comes into contact with the cam roller 31, as shown in Fig. 5, the support member 16 rotates. That is, the straight motion of the abutting portion 48 in the Y direction is converted into a rotational motion with the shaft 35 as the rotational axis. Thereby, the support member 16 to which the cam roller 31 is attached is rotated. Therefore, the upper end 37 of the support pin 34 which originally supports the sample 50 is separated from the sample 50. That is, the rotating support member 16 no longer supports the sample 50.

並且,設有凸輪滾輪31的支持構件16與其他支持構件16是藉由軸35而連結。因此,橫一列的支持構件16會同時旋轉。如第4圖(b)所示,試料50與支持構件16會分開。亦即,在試料50下方會形成可供吸附台18通過的空間。而可使吸附台18通過旋轉後的橫一列的支持構件16。如上所述,能藉由簡便的機構來防止吸附台18與支持構件16之干擾。Further, the support member 16 provided with the cam roller 31 and the other support members 16 are coupled by the shaft 35. Therefore, the support members 16 of the horizontal row will rotate simultaneously. As shown in Fig. 4(b), the sample 50 is separated from the support member 16. That is, a space through which the adsorption stage 18 can pass is formed below the sample 50. The suction stage 18 can be passed through the rotating support member 16 in a row. As described above, interference between the adsorption stage 18 and the support member 16 can be prevented by a simple mechanism.

如第5圖所示,抵接部48是在Y方向形成比吸附台18之吸附面寬的寬度。因此,配置在吸附台18正下方的支持構件16會旋轉。可確保可供吸附台18通過的空間。在支持構件16的正上方也可進行測定。再者,如第5圖所示,形成凸輪的抵接部48的兩端是形成斜面形狀。亦即,抵接部48之與凸輪滾輪31抵接的抵接面是形成從水平面傾斜的斜面。在此,抵接部48的抵接面是形成曲面。因此,抵接部48的抵接面會緩和地變化。藉此,支持構件16會緩緩地逐漸旋轉。因此可緩和衝擊。藉此,可提升吸附台18的移動速度,且可使吸附台18快速地移動。As shown in Fig. 5, the abutting portion 48 has a width wider than the adsorption surface of the adsorption stage 18 in the Y direction. Therefore, the support member 16 disposed directly below the adsorption stage 18 is rotated. The space available for the adsorption stage 18 can be ensured. The measurement can also be performed directly above the support member 16. Further, as shown in Fig. 5, both ends of the abutting portion 48 forming the cam are formed in a bevel shape. That is, the abutting surface of the abutting portion 48 that abuts against the cam roller 31 is formed as a slope that is inclined from the horizontal plane. Here, the abutting surface of the abutting portion 48 is a curved surface. Therefore, the abutting surface of the abutting portion 48 gently changes. Thereby, the support member 16 gradually rotates gradually. Therefore, the impact can be alleviated. Thereby, the moving speed of the adsorption stage 18 can be increased, and the adsorption stage 18 can be moved quickly.

當吸附台18更進一步移動,完全地通過旋轉的支持構件16時,抵接部48會從凸輪滾輪31離開。藉此,支持構件16會回復原狀,並與試料50抵接。亦即,支持構件16的上端37會與試料50的下面接觸。又,由於抵接部48的兩端是形成斜面形狀,因此支持構件16會緩緩旋轉而回復到原來的角度。因此,可緩和試料50與支持構件16接觸時的衝擊。此外,亦可在凸輪滾輪31與抵接部48未接觸的狀態下加以彈壓,使支持構件16回復原狀。藉此,當抵接部48從凸輪滾輪31離開時,支持構件16會回到原來的旋轉角度。支持構件16的上端會與試料50接觸,並支持試料50。藉此,會回到第4圖的狀態。此外,支持構件16是以軸35為旋轉軸朝兩方向轉動。藉此,無論在吸附台18朝±Y方向任一方向移動的情況下,都會在試料50與支持構件16之間產生間隙。When the suction stage 18 moves further and passes completely through the rotating support member 16, the abutment portion 48 will move away from the cam roller 31. Thereby, the support member 16 returns to the original state and abuts against the sample 50. That is, the upper end 37 of the support member 16 comes into contact with the lower surface of the sample 50. Further, since both ends of the abutting portion 48 are formed in a bevel shape, the support member 16 is slowly rotated to return to the original angle. Therefore, the impact when the sample 50 comes into contact with the support member 16 can be alleviated. Further, the cam roller 31 may be biased in a state where the cam roller 31 and the abutting portion 48 are not in contact with each other, and the support member 16 may be returned to the original shape. Thereby, when the abutting portion 48 is separated from the cam roller 31, the support member 16 returns to the original rotation angle. The upper end of the support member 16 is in contact with the sample 50 and supports the sample 50. Thereby, it will return to the state of Fig. 4. Further, the support member 16 is rotated in two directions with the shaft 35 as a rotation axis. Thereby, a gap is generated between the sample 50 and the support member 16 regardless of whether the adsorption stage 18 is moved in either of the ±Y directions.

如上所述,吸附台18正下方以外的支持構件16會支持試料50。亦即,只有對應於吸附台18的橫一列的支持構件16會旋轉。因此,是以令與抵接部48所抵接之支持構件16相同橫列的支持構件16旋轉,與抵接部48所抵接之支持構件16不同橫列的支持構件16不會旋轉的方式,支持著試料50。旋轉的支持構件16以外的支持構件16是與試料50抵接。如上所述,吸附台18以外的部位是由支持構件16所支持。藉此可降低振動。又,亦可依據吸附台18的寬度及位置,同時使橫兩列以上的支持構件16旋轉。當然,在吸附台18位於在Y方向鄰接的支持構件16之間的情況下,亦可使所有支持構件16與試料50抵接。As described above, the support member 16 other than the suction table 18 supports the sample 50. That is, only the support members 16 corresponding to the horizontal rows of the adsorption stage 18 are rotated. Therefore, the support member 16 that is in the same course as the support member 16 that the contact portion 48 abuts is rotated, and the support member 16 that is different from the support member 16 that the contact portion 48 abuts does not rotate. Supporting sample 50. The support member 16 other than the rotating support member 16 is in contact with the sample 50. As described above, the portion other than the adsorption stage 18 is supported by the support member 16. This reduces vibration. Further, depending on the width and position of the suction stage 18, the support members 16 of the two or more rows may be rotated at the same time. Of course, in a case where the adsorption stage 18 is located between the support members 16 adjacent in the Y direction, all of the support members 16 may be brought into contact with the sample 50.

如上所述,抵接部48會與吸附台18一起移動。由於該抵接部48會與支持構件16抵接,因此支持構件16會離開試料50。因此,即使是為了降低振動而設置支持構件16的構成,也可使吸附台18自由地移動。而且,由於不需要使支持構件16升降,因此可形成簡便的構成。亦即,不需要支持構件的升降機構及其控制。由於測定裝置100是形成單純的構造,因此可大幅縮短組裝步驟。因而可提升生產性。As described above, the abutment portion 48 moves together with the adsorption stage 18. Since the abutting portion 48 abuts against the support member 16, the support member 16 will leave the sample 50. Therefore, even if the support member 16 is provided in order to reduce vibration, the adsorption stage 18 can be freely moved. Moreover, since it is not necessary to raise and lower the support member 16, a simple configuration can be formed. That is, the lifting mechanism of the supporting member and its control are not required. Since the measuring device 100 is formed in a simple structure, the assembly process can be greatly shortened. Therefore, productivity can be improved.

再者,要搬運試料50時,不需要支持構件16的升降。藉此可縮短產出時間(tact time)。例如,要進行試料50的搬運、搬出時,係使X軌道21及吸附台18移動至固定機座11之端。藉此,測定頭22及吸附台18係退避至比載置台12更外側處。接著,驅動保持有試料50的搬運機器人 將試料50搬運至載置台12上。接著,使搬運機器人下降,將試料50交付至載置台12。此時,搬運機器人的手臂會移動至不會與支持構件16及導軌14干擾的位置。例如,使搬運機器人的手臂移動至導軌14與支持構件16之間。亦可使手臂移動至支持構件16與支持構件16之間。藉此,可在短時間進行試料50的裝載、卸載。因而可縮短產出時間,並提升生產性。Further, when the sample 50 is to be transported, the lifting and lowering of the support member 16 is not required. This can shorten the tact time. For example, when the sample 50 is transported or carried out, the X rail 21 and the suction stage 18 are moved to the end of the fixed base 11. Thereby, the measuring head 22 and the adsorption stage 18 are retracted to the outside of the mounting table 12. Next, drive the transport robot holding the sample 50 The sample 50 is transported to the mounting table 12. Next, the transport robot is lowered, and the sample 50 is delivered to the mounting table 12. At this time, the arm of the transport robot moves to a position that does not interfere with the support member 16 and the guide rail 14. For example, the arm of the transport robot is moved between the guide rail 14 and the support member 16. The arm can also be moved between the support member 16 and the support member 16. Thereby, the loading and unloading of the sample 50 can be performed in a short time. This reduces production time and increases productivity.

此外,亦可在並排成橫一列的兩個以上的支持構件16設置凸輪滾輪31。並且,亦可使抵接部48抵接於各個凸輪滾輪31。此外,可藉由減少要設置凸輪滾輪31的支持構件16的數量,來削減凸輪機構的零件數目。再者,可藉由以軸35來連結兩個以上的支持構件16,來削減凸輪機構的數量。因此,即使在為了檢查大型基板而增加支持構件16之數量的情況下,也可形成簡便的構成。Further, the cam roller 31 may be provided in two or more support members 16 arranged side by side in a row. Further, the abutting portion 48 may be brought into contact with each of the cam rollers 31. Further, the number of parts of the cam mechanism can be reduced by reducing the number of the support members 16 on which the cam roller 31 is to be provided. Furthermore, the number of cam mechanisms can be reduced by connecting two or more support members 16 with the shaft 35. Therefore, even in the case where the number of the support members 16 is increased in order to inspect a large substrate, a simple configuration can be formed.

再者,並不限於使支持構件16旋轉的構成,亦可為使其朝上下方向移動的構成。只要設有將水平方向的運動轉換為垂直方向之運動的凸輪機構即可。又,吸附台18的移動方向及照明光源之照明區域的方向並不限於正交。亦即,只要是吸附台18的移動方向與照明光源之照明區域的方向為不同的方向即可。Further, the configuration is not limited to the configuration in which the support member 16 is rotated, and the configuration may be configured to move in the vertical direction. It suffices to provide a cam mechanism that converts the motion in the horizontal direction into the motion in the vertical direction. Further, the moving direction of the adsorption stage 18 and the direction of the illumination area of the illumination source are not limited to being orthogonal. That is, it suffices that the direction of movement of the adsorption stage 18 is different from the direction of the illumination area of the illumination source.

此外,上述說明是以液晶顯示裝置等顯示裝置的彩色濾光片基板加以說明,但是亦可利用在CCD相機等固態攝像元件用的彩色濾光片基板。當然,可利用在彩色濾光片基板以外的圖案基板。例如,亦可利用在PDP或陰極射線 管等螢光體的修正。再者,亦可利用在液晶顯示裝置的薄膜電晶體陣列基板。又,亦可為液晶顯示面板或光罩等。Further, the above description has been made on a color filter substrate of a display device such as a liquid crystal display device, but a color filter substrate for a solid-state image sensor such as a CCD camera may be used. Of course, a pattern substrate other than the color filter substrate can be used. For example, it can also be used in PDP or cathode ray Correction of phosphors such as tubes. Further, a thin film transistor array substrate of a liquid crystal display device can also be used. Further, it may be a liquid crystal display panel, a photomask, or the like.

(變形例)(Modification)

針對本變形例的光學測定裝置,使用第6圖來加以說明。第6圖是示意性顯示設在載台裝置10的支持構件16之配置的俯視圖。此外,與實施形態1相同的構成則省略其說明。又,第6圖是為了說明的簡化,省略了一部分的構成。The optical measuring apparatus according to the present modification will be described using FIG. Fig. 6 is a plan view schematically showing the arrangement of the support members 16 provided in the stage device 10. In addition, the description of the same configuration as that of the first embodiment will be omitted. Further, Fig. 6 is a simplification of the description, and a part of the configuration is omitted.

在此,如第6圖所示,在Y方向,以兩端所配置的支持構件16為端側支持構件16a,以其他支持構件16為內側支持構件16b。因此,從上面算來第一列及從上面算來第7列(從下面算來第一列)的支持構件16為端側支持構件16a。從上面算來第2列至第6列的支持銷為內側支持構件16b。在Y方向的兩個端側支持構件16a之間配置有內側支持構件16b。又,在載置台12真空吸附有試料50。Here, as shown in Fig. 6, in the Y direction, the support members 16 disposed at both ends are the end side support members 16a, and the other support members 16 are the inner support members 16b. Therefore, the support member 16 of the first column and the seventh column from the above (the first column is counted from below) is the end side support member 16a. The support pins of the second to sixth columns from the above are the inner support members 16b. An inner support member 16b is disposed between the two end side support members 16a in the Y direction. Further, the sample 50 is vacuum-adsorbed on the mounting table 12.

在本變形例中,係使藉由抵接部48而從試料50離開的支持構件16之回復原來狀態的速度改變。亦即,改變從支持構件16與試料50分開的狀態回復到支持著試料50之狀態的速度。具體而言,是依據支持構件16的位置來改變支持構件16的回復速度。藉由端側支持構件16a及內側支持構件16b,使以軸35為旋轉軸而旋轉的旋轉速度產生變化。因此,從抵接部48與支持構件16分開的不支持狀態,轉變成支持構件16與試料50接觸的支持狀態為止的時間是依支持構件16而不同。在此,是使端側支持構件 16a的回復速度比內側支持構件16b的回復速度快。In the present modification, the speed at which the support member 16 separated from the sample 50 by the abutting portion 48 is returned to the original state is changed. That is, the speed from the state in which the support member 16 is separated from the sample 50 to the state in which the sample 50 is supported is changed. Specifically, the recovery speed of the support member 16 is changed in accordance with the position of the support member 16. The rotation speed at which the shaft 35 rotates as a rotation axis is changed by the end side support member 16a and the inner side support member 16b. Therefore, the time from the unsupported state in which the abutting portion 48 is separated from the support member 16 to the support state in which the support member 16 is in contact with the sample 50 differs depending on the support member 16. End support member The recovery speed of 16a is faster than the recovery speed of the inner support member 16b.

載置台12係支持著矩形狀之試料50的兩側。在此,是將試料50的長邊載置於載置台12。亦即,試料50之長邊側的端部是由載置台12所支持。因此,矩形狀之試料50的短邊側的端部並未由載置台12所支持。亦即,試料50的短邊側是開放的狀態。試料50之短邊附近在不支持狀態下的撓曲量會變大。因此,是使端側支持構件16a的回復速度比內側支持構件16b快。The mounting table 12 supports both sides of the rectangular sample 50. Here, the long side of the sample 50 is placed on the mounting table 12. That is, the end portion on the long side of the sample 50 is supported by the mounting table 12. Therefore, the end portion on the short side of the rectangular sample 50 is not supported by the mounting table 12. That is, the short side of the sample 50 is in an open state. The amount of deflection in the unsupported state near the short side of the sample 50 becomes large. Therefore, the recovery speed of the end side support member 16a is made faster than that of the inner support member 16b.

另一方面,在內側支持構件16b,可減緩回復速度。在對應於內側支持構件16b的部分,係在Y方向的兩側配置有支持構件16。例如,在第3列之內側支持構件16b的兩側配置有第2列及第4列的內側支持構件16b。因此,即使一列內側支持構件16b形成不支持狀態,兩側的支持構件16也會支持試料50。因此,在對應於內側支持構件16b的部分,試料50的撓曲量會變得比對應於端側支持構件16a的部分小。亦即,在端側支持構件16a的附近,在不支持狀態下的試料50的撓曲量會變大。因此,使內側支持構件16b的回復速度比端側支持構件16a的回復速度慢。藉此,可抑制作為試料50的玻璃基板之衝擊以及對於吸附台18的負荷。因此可提升耐久性。又,可抑制作為試料50的玻璃基板之過大變形。因此可防止載置台12之真空吸附脫離。On the other hand, in the inner side support member 16b, the recovery speed can be slowed down. In the portion corresponding to the inner side support member 16b, the support member 16 is disposed on both sides in the Y direction. For example, the inner side support members 16b of the second row and the fourth row are disposed on both sides of the inner side support member 16b in the third row. Therefore, even if one row of the inner side support members 16b is formed in an unsupported state, the support members 16 on both sides support the sample 50. Therefore, at the portion corresponding to the inner side support member 16b, the amount of deflection of the sample 50 becomes smaller than the portion corresponding to the end side support member 16a. That is, in the vicinity of the end side support member 16a, the amount of deflection of the sample 50 in the unsupported state becomes large. Therefore, the recovery speed of the inner side support member 16b is made slower than the recovery speed of the end side support member 16a. Thereby, the impact of the glass substrate as the sample 50 and the load on the adsorption stage 18 can be suppressed. Therefore, durability can be improved. Moreover, excessive deformation of the glass substrate as the sample 50 can be suppressed. Therefore, the vacuum adsorption of the mounting table 12 can be prevented from coming off.

接著,針對改變支持構件16之回復速度的構成例,利用第7圖加以說明。第7圖是顯示支持構件16正在進行旋 轉動作之樣態的側視圖。如第7圖所示,由於抵接部48的抵接面會與凸輪滾輪31接觸,因此支持銷34會旋轉。在此,與上述同樣地,支持銷34係以軸35為旋轉軸而旋轉。此外,關於與上述實施形態相同的構成則適當省略說明。又,第7圖中,三個支持構件16是朝Y方向排列。而且,抵接部48是從右側朝左側逐漸移動,支持銷34的角度會從第7圖(a)所示的狀態,經由第7圖(b)及第7圖(c)所示的狀態,變化成第7圖(d)的狀態。Next, a configuration example of changing the recovery speed of the support member 16 will be described with reference to FIG. Figure 7 is a view showing that the support member 16 is spinning Side view of the turning motion. As shown in Fig. 7, since the abutting surface of the abutting portion 48 comes into contact with the cam roller 31, the support pin 34 rotates. Here, similarly to the above, the support pin 34 rotates with the shaft 35 as a rotation axis. In addition, the description of the same configuration as that of the above embodiment will be appropriately omitted. Further, in Fig. 7, the three support members 16 are arranged in the Y direction. Further, the abutting portion 48 gradually moves from the right side toward the left side, and the angle of the support pin 34 is from the state shown in Fig. 7(a) to the state shown in Figs. 7(b) and 7(c). , changes to the state of Figure 7 (d).

如第7圖所示,在抵接部48設有與凸輪滾輪31接觸的斜面。亦即,抵接部48之與凸輪滾輪31抵接的抵接面是形成斜面形狀。在Y方向中,斜面是設在抵接部48的兩側。左側斜面的形狀是與右側斜面的形狀對稱。藉此,即使在朝±Y方向移動的情況下,也可同樣地驅動支持構件16。在抵接部48中設於兩端的斜面之間形成有水平面。As shown in FIG. 7, the abutting portion 48 is provided with a slope which is in contact with the cam roller 31. That is, the abutting surface of the abutting portion 48 that abuts against the cam roller 31 is formed in a bevel shape. In the Y direction, the slopes are provided on both sides of the abutting portion 48. The shape of the left bevel is symmetrical with the shape of the right bevel. Thereby, even when moving in the ±Y direction, the support member 16 can be driven in the same manner. A horizontal plane is formed between the inclined surfaces provided at both ends of the abutting portion 48.

當抵接部48與設在正中央的支持構件16的凸輪滾輪31接觸時,支持構件16會旋轉。亦即,支持著凸輪滾輪31的連接部32會傾斜。在此,如第7圖(a)所示,抵接部48之左側的斜面與凸輪滾輪31會接觸。藉此,支持銷34會朝抵接部48的反進行方向傾斜。因此,支持銷34的上端會從試料50(未圖示)逐漸離開。並且形成未支持有試料50的非支持狀態。在此,斜面與凸輪滾輪31彼此接觸。因此,隨著抵接部48朝左側行進,支持銷34的倒角會逐漸變大。When the abutting portion 48 comes into contact with the cam roller 31 of the support member 16 provided at the center, the support member 16 rotates. That is, the connecting portion 32 supporting the cam roller 31 is inclined. Here, as shown in Fig. 7(a), the inclined surface on the left side of the abutting portion 48 comes into contact with the cam roller 31. Thereby, the support pin 34 is inclined toward the reverse direction of the abutment portion 48. Therefore, the upper end of the support pin 34 is gradually separated from the sample 50 (not shown). And an unsupported state in which the sample 50 is not supported is formed. Here, the inclined surface and the cam roller 31 are in contact with each other. Therefore, as the abutting portion 48 travels to the left side, the chamfering of the support pin 34 gradually becomes larger.

當抵接部48從第7圖(a)的狀態朝左側前進時,如第7 圖(b)所示,凸輪滾輪31會與抵接部48的下面接觸。在此,抵接部48的水平面與凸輪滾輪31會相接觸。在第7圖(b)所示的狀態下,比起第7圖(a)所示的狀態,支持銷34會更進一步朝右側傾倒。因此,支持銷34的倒角會變大。此外,在凸輪滾輪31與水平面接觸的期間,支持銷34的倒角不會有所變化。When the abutting portion 48 advances from the state of Fig. 7(a) to the left side, as in the seventh As shown in (b), the cam roller 31 comes into contact with the lower surface of the abutting portion 48. Here, the horizontal plane of the abutting portion 48 comes into contact with the cam roller 31. In the state shown in Fig. 7(b), the support pin 34 is further tilted to the right side than the state shown in Fig. 7(a). Therefore, the chamfering of the support pin 34 becomes large. Further, the chamfer of the support pin 34 does not change during the contact of the cam roller 31 with the horizontal plane.

再者,當抵接部48前進時,在抵接部48的水平面中,凸輪滾輪31的接觸位置會朝右側逐漸移動。接著,如第7圖(c)所示,抵接部48之右側的斜面與凸輪滾輪31會相互接觸。支持銷34會逐漸旋轉,支持銷34的倒角會變小。隨著抵接部48朝左方移動,倒角會逐漸變小。當抵接部48的斜面從凸輪滾輪31離開時,如第7圖(d)所示,支持銷34會回復原來的角度。亦即,支持銷34會直立,使上端37與試料50接觸。藉此,支持構件16會形成支持試料50的狀態。Further, when the abutting portion 48 advances, in the horizontal plane of the abutting portion 48, the contact position of the cam roller 31 gradually moves toward the right side. Next, as shown in Fig. 7(c), the inclined surface on the right side of the abutting portion 48 and the cam roller 31 come into contact with each other. The support pin 34 will gradually rotate and the chamfer of the support pin 34 will become smaller. As the abutment portion 48 moves to the left, the chamfer will gradually become smaller. When the slope of the abutting portion 48 is separated from the cam roller 31, as shown in Fig. 7(d), the support pin 34 returns to the original angle. That is, the support pin 34 will stand upright, bringing the upper end 37 into contact with the sample 50. Thereby, the support member 16 is formed in a state of supporting the sample 50.

本變形例中,為了使支持銷34返回原狀,設有彈簧38。彈簧38的一端是安裝在連接部32,另一端是固定在固定機座11(第7圖中未圖示)等。例如,當抵接部48與凸輪滾輪31接觸,使支持銷34傾斜時,彈簧38會伸長。接著,藉由該彈簧38的彈力,使支持銷34回復原狀。亦即,當抵接部48之與凸輪滾輪31接觸的部分從水平面逐漸前進至斜面時,彈簧38會逐漸縮短。亦即,在第7圖(c)所示的狀態下,彈簧38會變得比第7圖(b)所示的狀態短。藉由彈簧38的彈力,使支持銷34朝直立的方向逐漸旋轉。 接著,當抵接部48的斜面超過凸輪滾輪31時,藉由彈簧38的彈力,支持銷34會回到原來的角度並形成直立狀態。亦即,支持構件16會從不支持狀態回復到支持狀態。In the present modification, in order to return the support pin 34 to its original shape, a spring 38 is provided. One end of the spring 38 is attached to the connecting portion 32, and the other end is fixed to the fixed base 11 (not shown in Fig. 7). For example, when the abutment portion 48 comes into contact with the cam roller 31 to tilt the support pin 34, the spring 38 is elongated. Then, the support pin 34 is returned to its original shape by the elastic force of the spring 38. That is, when the portion of the abutting portion 48 that is in contact with the cam roller 31 gradually advances from the horizontal plane to the inclined surface, the spring 38 is gradually shortened. That is, in the state shown in Fig. 7(c), the spring 38 becomes shorter than the state shown in Fig. 7(b). The support pin 34 is gradually rotated in the upright direction by the elastic force of the spring 38. Next, when the inclined surface of the abutting portion 48 exceeds the cam roller 31, the support pin 34 returns to the original angle and is formed in an upright state by the elastic force of the spring 38. That is, the support member 16 will return from the unsupported state to the support state.

再者,復設有用來吸收支持構件16回復原狀時之衝擊的減震器39。減震器39是固定在固定機座11等。而且,減震器39會與回復原狀時的支持構件16碰撞。例如,從第7圖(b)所示的狀態變成第7圖(c)的途中,減震器39與支持構件16會抵接。在此,減震器39會與支持構件16之從連接部32朝下方延伸的部分接觸。藉此,可緩和施加於支持構件16的衝擊。Further, a damper 39 for absorbing the impact when the support member 16 returns to the original state is provided. The damper 39 is fixed to the fixed base 11 and the like. Moreover, the damper 39 collides with the support member 16 when it is restored to its original state. For example, from the state shown in Fig. 7(b) to the middle of Fig. 7(c), the damper 39 and the support member 16 abut. Here, the damper 39 comes into contact with a portion of the support member 16 that extends downward from the connecting portion 32. Thereby, the impact applied to the support member 16 can be alleviated.

例如,可藉由改變彈簧38或減震器39的強度來調整回復速度。藉由彈簧38之強度來調整回復速度時,係提高設在欲使其快速回復的支持構件16的彈簧38之彈簧強度(彈簧常數)。因此,使端側支持構件16a之彈簧38的彈簧強度比內側支持構件16b之彈簧38的彈簧強度強。藉此,可縮短端側支持構件16a的回復時間。For example, the recovery speed can be adjusted by changing the strength of the spring 38 or the damper 39. When the recovery speed is adjusted by the strength of the spring 38, the spring strength (spring constant) of the spring 38 provided to the support member 16 to be quickly restored is increased. Therefore, the spring strength of the spring 38 of the end side support member 16a is made stronger than the spring strength of the spring 38 of the inner side support member 16b. Thereby, the recovery time of the end side support member 16a can be shortened.

要利用減震器39調整回復速度時,係加強設在欲使其慢一點回復的支持構件16的減震器39之強度。因此,係使端側支持構件16a之減震器39的強度比內側支持構件16b之減震器39的強度強。藉此,可減緩內側支持構件16b的回復速度。因此可抑制內側支持構件16b與試料50碰撞時的衝擊。When the damper 39 is used to adjust the recovery speed, the strength of the damper 39 provided to the support member 16 to be restored a little slower is reinforced. Therefore, the strength of the damper 39 of the end side support member 16a is made stronger than that of the damper 39 of the inner side support member 16b. Thereby, the recovery speed of the inner support member 16b can be slowed down. Therefore, the impact when the inner support member 16b collides with the sample 50 can be suppressed.

再者,亦可利用不同的凸輪來驅動內側支持構件16b及端側支持構件16a,以改變回復速度。例如,在內側支 持構件16b及端側支持構件16a改變凸輪滾輪31的位置。亦即,使X方向的凸輪滾輪31的位置錯開。藉此,在端側支持構件16a及內側支持構件16b,使X方向的抵接面的位置產生變化。再者,在內側支持構件16b及端側支持構件16a,使與凸輪滾輪31抵接的抵接面的形狀改變。例如,使設在緩慢回復的支持構件16的抵接面的斜面角度緩和。亦即,使設在內側支持構件16b的抵接面的傾斜緩和,並加長Y方向的抵接面的長度。如上所述,藉由改變凸輪滾輪31的位置,可使抵接面的形狀產生變化。因此,可依據列來改變支持構件16所回復的速度及回復的時間。Further, different cams may be used to drive the inner side support member 16b and the end side support member 16a to change the recovery speed. For example, in the medial branch The holding member 16b and the end side support member 16a change the position of the cam roller 31. That is, the position of the cam roller 31 in the X direction is shifted. Thereby, the position of the contact surface in the X direction is changed in the end side support member 16a and the inner side support member 16b. Further, the inner support member 16b and the end side support member 16a change the shape of the abutting surface that abuts against the cam roller 31. For example, the angle of the slope of the abutting surface of the support member 16 that is slowly recovered is relaxed. In other words, the inclination of the abutting surface provided on the inner side support member 16b is relaxed, and the length of the abutting surface in the Y direction is lengthened. As described above, by changing the position of the cam roller 31, the shape of the abutting surface can be changed. Therefore, the speed at which the support member 16 is replied and the time of recovery can be changed depending on the column.

或是,亦可不是抵接面,而是使凸輪滾輪31的形狀不同。當然,亦可使凸輪滾輪31與抵接面兩者皆不同。藉由改變抵接部48與支持構件16接觸之部分的形狀,可調整回復速度。如上所述,由不同的凸輪來驅動內側支持構件16b及端側支持構件16a。亦即,藉由在內側支持構件16b及端側支持構件16a設置不同形狀的凸輪,即可調整回復速度。Alternatively, instead of the abutting surface, the shape of the cam roller 31 may be different. Of course, the cam roller 31 and the abutting surface can also be made different. The speed of recovery can be adjusted by changing the shape of the portion of the abutment portion 48 that is in contact with the support member 16. As described above, the inner side support member 16b and the end side support member 16a are driven by different cams. That is, the recovery speed can be adjusted by providing cams of different shapes on the inner side support member 16b and the end side support member 16a.

藉此,可抑制內側支持構件16b與試料50碰撞時的衝擊。又,在載置台12中吸附試料50的情況下,可防止支持構件16與試料50之吸附因碰撞時的衝擊而脫離。當然,亦可組合彈簧38、減震器39及凸輪形狀中的兩個以上,來改變回復速度。再者,亦可利用除此以外的方法來改變回復速度。Thereby, the impact at the time of collision of the inner side support member 16b with the sample 50 can be suppressed. Moreover, when the sample 50 is adsorbed on the mounting table 12, it is possible to prevent the adsorption of the support member 16 and the sample 50 from being detached by the impact at the time of collision. Of course, two or more of the spring 38, the damper 39, and the cam shape may be combined to change the recovery speed. Furthermore, other methods can be used to change the recovery speed.

要使支持構件16全部以相同的速度回復原狀時,必須 使其配合快速回復的支持構件16的回復速度。亦即,為了使撓曲量大的部分的支持構件16快速復原,必須配合該支持構件16的回復速度。因此,關於撓曲量小且不需要快速回復的支持構件16,回復速度也會變快。因此,難以抑制支持構件16與試料50碰撞時之衝擊。本變形例由於是依據支持構件16的位置,使支持構件16的回復速度產生變化,因此可減緩一部分支持構件16的回復速度。藉此,可抑制支持構件16與試料50碰撞時所施加的衝擊。當然,要減緩回復速度的支持構件16並不限於內側支持構件16b。例如,加快在與支持構件16分開之狀態下的撓曲量會變大的支持構件16的回復速度,並減緩其他支持構件16的回復速度。藉此,亦可復準備三種以上的彈簧38等,使回復速度形成三個階段以上。例如,可每列地調整支持構件16的回復速度。In order for the support member 16 to return to its original state at the same speed, it is necessary to It is adapted to match the recovery speed of the quick-recovering support member 16. That is, in order to quickly restore the support member 16 of the portion having a large amount of deflection, it is necessary to match the recovery speed of the support member 16. Therefore, with respect to the support member 16 having a small amount of deflection and requiring no quick recovery, the recovery speed is also increased. Therefore, it is difficult to suppress the impact when the support member 16 collides with the sample 50. In the present modification, since the recovery speed of the support member 16 is changed in accordance with the position of the support member 16, the recovery speed of a part of the support member 16 can be reduced. Thereby, the impact applied when the support member 16 collides with the sample 50 can be suppressed. Of course, the support member 16 to slow the recovery speed is not limited to the inner support member 16b. For example, the recovery speed of the support member 16 in which the amount of deflection in the state separated from the support member 16 is increased, and the recovery speed of the other support members 16 is slowed down. Thereby, three or more types of springs 38 and the like can be prepared to form the recovery speed in three or more stages. For example, the recovery speed of the support member 16 can be adjusted per column.

(實施形態2)(Embodiment 2)

針對本實施形態之載台裝置10的構成,利用第8圖加以說明。第8圖是示意性顯示實施形態2的載台裝置10之構成的俯視圖。此外,關於與實施形態1相同的構成則適當省略說明。例如,支持構件16等的動作、構成與實施形態1相同,因此省略圖示及其說明。本實施形態是以作為基板保持裝置的載台裝置10的構成為中心進行說明。The configuration of the stage device 10 of the present embodiment will be described with reference to Fig. 8. Fig. 8 is a plan view schematically showing the configuration of the stage device 10 of the second embodiment. In addition, about the same structure as Embodiment 1, the description is abbreviate|omitted suitably. For example, the operation and configuration of the support member 16 and the like are the same as those of the first embodiment, and thus the illustration and description thereof are omitted. In the present embodiment, the configuration of the stage device 10 as the substrate holding device will be mainly described.

實施形態2的載台裝置10是在載置台12設有吸附部13。吸附部13具有吸附孔及吸附凹槽等。亦即,在載置台12的上表面形成有吸附孔及吸附凹槽等。而且,可從吸附 部13的吸附孔等吸引大氣。在將試料50載置於載置台12上的狀態下進行吸引時,吸附孔內會減壓。藉此,可真空吸附試料50。再者,本實施形態是將吸附部13分成兩個系統。亦即,在載置台12形成有第1吸附部13a及第2吸附部13b。In the stage device 10 of the second embodiment, the adsorption unit 13 is provided on the mounting table 12. The adsorption unit 13 has an adsorption hole, an adsorption groove, and the like. That is, an adsorption hole, an adsorption groove, and the like are formed on the upper surface of the mounting table 12. Moreover, it can be adsorbed The adsorption holes of the portion 13 and the like attract the atmosphere. When suction is performed in a state where the sample 50 is placed on the mounting table 12, the inside of the adsorption hole is depressurized. Thereby, the sample 50 can be vacuum-adsorbed. Further, in the present embodiment, the adsorption unit 13 is divided into two systems. In other words, the first adsorption unit 13a and the second adsorption unit 13b are formed on the mounting table 12.

如第8圖所示,載置台12是配置在試料50的兩側。亦即,在試料50的右側及左側分別配置有載置台12。因此,兩個載置台12是分開配置。亦即,兩個載置台12在X方向是分開配置,吸附台18係在其間移動。As shown in Fig. 8, the mounting table 12 is disposed on both sides of the sample 50. That is, the mounting table 12 is disposed on the right side and the left side of the sample 50, respectively. Therefore, the two mounting tables 12 are separately arranged. That is, the two mounting stages 12 are disposed separately in the X direction, and the adsorption stage 18 is moved therebetween.

各個載置台12是沿著Y方向設置。在各個載置台12設有第1吸附部13a及第2吸附部13b。在此,在一個載置台12設有七個吸附孔。七個吸附孔是沿著Y方向排列。而且,兩端的吸附孔為第1吸附部13a,其間的吸附孔為第2吸附部13b。因此,在Y方向的載置台12的端部設有第1吸附部13a,在載置台12的中央部設有第2吸附部13b。在一方的載置台12中,第1吸附部13a具有兩個吸附孔,第2吸附部13b具有五個吸附孔。Each of the mounting stages 12 is disposed along the Y direction. The first adsorption unit 13a and the second adsorption unit 13b are provided in each of the mounting stages 12. Here, seven adsorption holes are provided in one mounting table 12. The seven adsorption holes are arranged along the Y direction. Further, the adsorption holes at both ends are the first adsorption portions 13a, and the adsorption holes therebetween are the second adsorption portions 13b. Therefore, the first adsorption portion 13a is provided at the end of the mounting table 12 in the Y direction, and the second adsorption portion 13b is provided at the center portion of the mounting table 12. In one of the mounting stages 12, the first adsorption unit 13a has two adsorption holes, and the second adsorption unit 13b has five adsorption holes.

在第1吸附部13a經由配管連接有第1切換部15a。第1切換部15a係控制第1吸附部13a的動作。具體而言,可藉由第1切換部15a來切換第1吸附部13a的開啟/關閉(ON/OFF)。例如,第1切換部15a具有真空泵、及設在其配管中的閥等。而且,藉由使閥開閉,以控制第1吸附部13a的ON/OFF動作。當第1切換部15a使第1吸附部13a形成ON時,試料50的四個角落會被吸附。又,當第1切 換部15a使第1吸附部13a形成OFF時,試料50的四個角落的吸附會被釋放。The first switching unit 15a is connected to the first adsorption unit 13a via a pipe. The first switching unit 15a controls the operation of the first adsorption unit 13a. Specifically, the first switching unit 15a can be switched on/off (ON/OFF) by the first switching unit 15a. For example, the first switching unit 15a includes a vacuum pump, a valve provided in the piping, and the like. Further, the ON/OFF operation of the first adsorption unit 13a is controlled by opening and closing the valve. When the first switching unit 15a turns on the first adsorption unit 13a, the four corners of the sample 50 are adsorbed. Also, when the first cut When the changing portion 15a turns off the first adsorption portion 13a, the adsorption of the four corners of the sample 50 is released.

同樣地,在第2吸附部13b經由配管連接有第2切換部15b。第2切換部15b係與第1切換部15a同樣地控制第2吸附部13b的動作。藉此,可切換第2吸附部13b的ON/OFF動作。當第2切換部15b使第2吸附部13b形成ON時,試料50的長邊中央部會被吸附。又,當第2切換部15b使第2吸附部13b形成OFF時,試料50之長邊中央部的吸附會被釋放。如上所述,由於第1切換部15a及第2切換部15b,因此要進行吸附之切換的區域並不相同。In the same manner, the second switching unit 15b is connected to the second adsorption unit 13b via a pipe. The second switching unit 15b controls the operation of the second adsorption unit 13b in the same manner as the first switching unit 15a. Thereby, the ON/OFF operation of the second adsorption unit 13b can be switched. When the second switching unit 15b turns on the second adsorption unit 13b, the central portion of the long side of the sample 50 is adsorbed. When the second switching unit 15b turns off the second adsorption unit 13b, the adsorption of the central portion of the long side of the sample 50 is released. As described above, the first switching unit 15a and the second switching unit 15b are different in the area in which the switching is to be performed.

第1切換部15a及第2切換部15b是獨立的。因此,可使第1吸附部13a及第2吸附部13b的一方為ON,使另一方為OFF。當然,亦可使第1吸附部13a及第2吸附部13b雙方皆為ON。第1切換部15a及第2切換部15b係依據吸附台18的位置來切換ON/OFF。此外,第8圖中,關於連接於左側載置台12的第1切換部15a及第2切換部15b,由於與連接於右側載置台12的第1切換部15a及第2切換部15b相同,因此加以省略。The first switching unit 15a and the second switching unit 15b are independent. Therefore, one of the first adsorption unit 13a and the second adsorption unit 13b can be turned ON, and the other can be turned OFF. Of course, both the first adsorption unit 13a and the second adsorption unit 13b may be turned ON. The first switching unit 15a and the second switching unit 15b are switched ON/OFF depending on the position of the suction stage 18. In addition, in the eighth diagram, the first switching unit 15a and the second switching unit 15b connected to the left side mounting table 12 are the same as the first switching unit 15a and the second switching unit 15b connected to the right side mounting table 12, Omitted.

例如,在吸附台18位於對應於第1吸附部13a的A區域的情況下,將第1吸附部13a設為OFF,將第2吸附部13b設為ON。亦即,在Y方向中,當吸附台18位於試料50的端部時,將位於載置台12之端的第1吸附部13a從ON切換成OFF。另一方面,當吸附台18位於對應於第2吸附部13b之C區域的情況下,將第1吸附部13a設為 ON,將第2吸附部13b設為OFF。亦即,當吸附台18位於試料50的中央部時,將位於載置台12之中央的第2吸附部13b從ON切換成OFF。又,當吸附台18位於對應於第1吸附部13a與第2吸附部13b之交界的B區域的情況下,將第1吸附部13a及第2吸附部13b的吸附設為ON。For example, when the adsorption stage 18 is located in the A region corresponding to the first adsorption unit 13a, the first adsorption unit 13a is turned OFF, and the second adsorption unit 13b is turned ON. That is, in the Y direction, when the adsorption stage 18 is located at the end of the sample 50, the first adsorption portion 13a located at the end of the mounting table 12 is switched from ON to OFF. On the other hand, when the adsorption stage 18 is located in the C area corresponding to the second adsorption unit 13b, the first adsorption unit 13a is set to ON, the second adsorption unit 13b is turned OFF. That is, when the adsorption stage 18 is located at the center of the sample 50, the second adsorption unit 13b located at the center of the stage 12 is switched from ON to OFF. In addition, when the adsorption stage 18 is located in the B area corresponding to the boundary between the first adsorption unit 13a and the second adsorption unit 13b, the adsorption of the first adsorption unit 13a and the second adsorption unit 13b is turned ON.

如上所述,將位於吸附台18附近的吸附部13設為OFF。藉此,可使試料50相對於吸附台18確實浮起。例如,藉由來自吸附台18之噴出口46的空氣,使試料50從吸附台18浮起。因此,會產生供吸附台18通過的間隙。接著,在試料50浮起的狀態下,使吸附台18移動。此時,在X方向的吸附台18的兩外側,試料50並未由載置台12所吸附。因此,藉由來自吸附台18的空氣,可使試料50浮起足夠的量。而可確實地設置供吸附台18通過的間隙。即使在縮小吸附台18與載置台12之高度差的情況下,也可防止吸附台18與試料50碰撞。藉此,試料50與吸附台18將不會接觸,因此可防止試料50或吸附台18受損。且可縮小吸附台18與載置台12的高度差。As described above, the adsorption portion 13 located in the vicinity of the adsorption stage 18 is turned OFF. Thereby, the sample 50 can be surely floated with respect to the adsorption stage 18. For example, the sample 50 is floated from the adsorption stage 18 by the air from the discharge port 46 of the adsorption stage 18. Therefore, a gap for the adsorption stage 18 to pass is generated. Next, the adsorption stage 18 is moved while the sample 50 is floating. At this time, the sample 50 is not adsorbed by the mounting table 12 on both outer sides of the adsorption stage 18 in the X direction. Therefore, the sample 50 can be floated by a sufficient amount by the air from the adsorption stage 18. The gap through which the adsorption stage 18 passes can be surely set. Even when the height difference between the adsorption stage 18 and the mounting table 12 is reduced, the adsorption stage 18 can be prevented from colliding with the sample 50. Thereby, the sample 50 and the adsorption stage 18 are not in contact with each other, so that the sample 50 or the adsorption stage 18 can be prevented from being damaged. Moreover, the height difference between the adsorption stage 18 and the mounting table 12 can be reduced.

如上所述,即使不使吸附台18低於載置台12以確保吸附台18與試料50的間隙亦可。因此,可提高試料50的平面度。例如,可用μm單位來調整吸附台18與載置台12的高度差。藉此,即使在載置台12與吸附台18之間,也可穩定地進行測定。又,即使在吸附台18位於A、C區域的情況下,第1吸附部13a及第2吸附部13b的一方也會吸附著試料50。因此,可防止試料50的位置偏移。As described above, even if the adsorption stage 18 is not made lower than the mounting table 12, the gap between the adsorption stage 18 and the sample 50 can be ensured. Therefore, the flatness of the sample 50 can be improved. For example, the height difference between the adsorption stage 18 and the stage 12 can be adjusted in units of μm. Thereby, even between the mounting table 12 and the adsorption stage 18, measurement can be performed stably. In addition, even when the adsorption stage 18 is located in the A and C regions, the sample 50 is adsorbed to one of the first adsorption unit 13a and the second adsorption unit 13b. Therefore, the positional deviation of the sample 50 can be prevented.

再者,在形成A、C之交界的B區域中,將第1吸附部13a及第2吸附部13b雙方設為ON。藉此,第1吸附部13a及第2吸附部13b雙方皆OFF的瞬間會消失。亦即,在第1吸附部13a及第2吸附部13b的動作切換時,第1吸附部13a及第2吸附部13b雙方會ON。藉此,試料50會經常由一個以上的吸附部13所吸附,因此可防止試料50移動。藉此可進行穩定的測定。Further, in the B region where the boundary between A and C is formed, both the first adsorption portion 13a and the second adsorption portion 13b are turned ON. As a result, the moment when both the first adsorption unit 13a and the second adsorption unit 13b are turned off will disappear. In other words, when the operations of the first adsorption unit 13a and the second adsorption unit 13b are switched, both the first adsorption unit 13a and the second adsorption unit 13b are turned on. Thereby, the sample 50 is often adsorbed by one or more adsorption sections 13, so that the sample 50 can be prevented from moving. Thereby, a stable measurement can be performed.

上述構成尤其在研磨修正試料50之缺陷時特別有效。例如,假設在測定頭22設有研磨帶等。接著,使測定頭22移動至吸附台18之正上方。亦即,在測定頭22與吸附台18之間配置有試料50。在該狀態下,使用設在測定頭22的研磨帶來修正試料50的缺陷。亦即,在研磨帶與試料50的表面接觸的狀態下,送出研磨帶。藉此,可藉由研磨帶來研磨本身為缺陷的突起。去除試料50上的突起,並修正缺陷。如上述控制吸附部13,而可提高試料50的平面度。因此,可進行穩定的研磨、修正。The above configuration is particularly effective when the defect of the polishing sample 50 is polished. For example, it is assumed that a polishing belt or the like is provided on the measuring head 22. Next, the measuring head 22 is moved right above the adsorption stage 18. That is, the sample 50 is disposed between the measuring head 22 and the adsorption stage 18. In this state, the defect of the sample 50 is corrected using the polishing belt provided on the measuring head 22. That is, the polishing tape is fed in a state where the polishing tape is in contact with the surface of the sample 50. Thereby, the protrusion which is itself defective can be ground by the grinding belt. The protrusion on the sample 50 is removed and the defect is corrected. By controlling the adsorption unit 13 as described above, the flatness of the sample 50 can be improved. Therefore, stable polishing and correction can be performed.

又,亦可使用在要進行研磨以外之加工的加工裝置。亦即,本實施形態的基板保持裝置適合用在設有在試料50上移動的加工用頭的加工裝置。再者,亦可設有與測定頭22不同的加工頭。此外,亦可將吸附部13分成三個系統以上。Further, a processing apparatus for processing other than polishing may be used. That is, the substrate holding device of the present embodiment is suitably used in a processing device provided with a processing head that moves on the sample 50. Further, a processing head different from the measuring head 22 may be provided. Further, the adsorption unit 13 may be divided into three or more systems.

依據吸附台18的位置,切換第1吸附部13a及第2吸附部13b的ON/OFF。亦即,當吸附台18移動至第1吸附部13a附近時,將第1吸附部13a設為OFF,僅藉由第 2吸附部13b吸附。另一方面,當吸附台18移動至第2吸附部13b附近時,將第2吸附部13b設為OFF,僅藉由第1吸附部13a吸附。藉此,可確保吸附台18通過的間隙。再者,通過第1吸附部13a與第2吸附部13b的交界時,將第1吸附部13a及第2吸附部13b設為ON。藉此,由於任一個吸附部13會吸附,因此可確實地進行保持。The ON/OFF of the first adsorption unit 13a and the second adsorption unit 13b is switched in accordance with the position of the adsorption stage 18. In other words, when the adsorption stage 18 moves to the vicinity of the first adsorption unit 13a, the first adsorption unit 13a is turned OFF, only by the first 2 The adsorption portion 13b is adsorbed. On the other hand, when the adsorption stage 18 moves to the vicinity of the second adsorption unit 13b, the second adsorption unit 13b is turned OFF, and is adsorbed only by the first adsorption unit 13a. Thereby, the gap through which the adsorption stage 18 passes can be ensured. In addition, when the first adsorption unit 13a and the second adsorption unit 13b are in contact with each other, the first adsorption unit 13a and the second adsorption unit 13b are turned ON. Thereby, since any one of the adsorption portions 13 is adsorbed, it can be reliably held.

以無關吸附台18的位置之方式,將第1吸附部13a及第2吸附部13b雙方恆常地設為ON時,會有無法確保間隙之情形。因此,必須使吸附台18比載置台12更降低。如此,試料50的平坦度會劣化,因此無法進行穩定的測定、加工。藉此,利用本實施形態的載台裝置10可實現穩定的測定、加工。When both the first adsorption unit 13a and the second adsorption unit 13b are constantly turned on, regardless of the position of the adsorption stage 18, the gap may not be secured. Therefore, it is necessary to make the adsorption stage 18 lower than the mounting table 12. As a result, the flatness of the sample 50 is deteriorated, so that stable measurement and processing cannot be performed. Thereby, stable measurement and processing can be realized by the stage device 10 of the present embodiment.

此外,亦可適當組合上述實施形態1、2及變形例來使用。Further, the above-described first, second, and modified examples can be used as appropriate.

10‧‧‧載台裝置10‧‧‧Terminal device

11‧‧‧固定機座11‧‧‧Fixed base

12‧‧‧載置台12‧‧‧ mounting table

13‧‧‧吸附部13‧‧‧Adsorption Department

13a‧‧‧第1吸附部13a‧‧‧1st adsorption department

13b‧‧‧第2吸附部13b‧‧‧2nd adsorption department

14‧‧‧導軌14‧‧‧ rails

15a‧‧‧第1切換部15a‧‧‧1st switching department

15b‧‧‧第2切換部15b‧‧‧2nd Switching Department

16‧‧‧支持構件16‧‧‧Support components

16a‧‧‧端側支持構件16a‧‧‧Endside support members

16b‧‧‧內側支持構件16b‧‧‧Inner support member

18‧‧‧吸附台18‧‧‧Adsorption station

21‧‧‧X軌道21‧‧‧X track

22‧‧‧測定頭22‧‧‧Measurement head

23‧‧‧Y軌道23‧‧‧Y track

31‧‧‧凸輪滾輪31‧‧‧Cam Roller

32‧‧‧連接部32‧‧‧Connecting Department

34‧‧‧支持銷34‧‧‧Support pins

35‧‧‧軸35‧‧‧Axis

37‧‧‧上端37‧‧‧Upper

38‧‧‧彈簧38‧‧‧ Spring

39‧‧‧減震器39‧‧‧ Shock absorbers

41‧‧‧照明光源41‧‧‧Light source

42‧‧‧LED42‧‧‧LED

43‧‧‧擴散板43‧‧‧Diffuser

45‧‧‧吸附口45‧‧‧ adsorption port

46‧‧‧噴出口46‧‧‧Spray outlet

48‧‧‧抵接部48‧‧‧Apartment

50‧‧‧試料50‧‧‧ samples

100‧‧‧測定裝置100‧‧‧Measurement device

第1圖是示意性顯示本實施形態之光學測定裝置之構成的俯視圖。Fig. 1 is a plan view schematically showing the configuration of an optical measuring apparatus according to the present embodiment.

第2圖是示意性顯示本實施形態之光學測定裝置所使用的載台裝置之構成的斜視圖。Fig. 2 is a perspective view schematically showing a configuration of a stage device used in the optical measuring device of the embodiment.

第3圖(a)及(b)是示意性顯示本實施形態之光學測定裝置所使用的吸附台之構成的側面剖視圖。Fig. 3 (a) and (b) are side cross-sectional views schematically showing the configuration of a suction stage used in the optical measuring apparatus of the embodiment.

第4圖(a)及(b)是示意性顯示本實施形態之光學測定裝置所使用的載台裝置之構成的側視圖。4(a) and 4(b) are side views schematically showing the configuration of a stage device used in the optical measuring device of the embodiment.

第5圖是本實施形態的支持構件之動作的說明圖。Fig. 5 is an explanatory view showing the operation of the supporting member of the embodiment.

第6圖是示意性顯示變形例的支持構件之配置的俯視圖。Fig. 6 is a plan view schematically showing the arrangement of support members of a modification.

第7圖(a)至(d)是顯示支持構件正在進行旋轉動作之樣態的側視圖。Fig. 7 (a) to (d) are side views showing a state in which the supporting member is rotating.

第8圖是示意性顯示實施形態2之載台裝置之構成的俯視圖。Fig. 8 is a plan view schematically showing the configuration of the stage device of the second embodiment.

11‧‧‧固定機座11‧‧‧Fixed base

12‧‧‧載置台12‧‧‧ mounting table

14‧‧‧導軌14‧‧‧ rails

16‧‧‧支持構件16‧‧‧Support components

18‧‧‧吸附台18‧‧‧Adsorption station

21‧‧‧X軌道21‧‧‧X track

22‧‧‧測定頭22‧‧‧Measurement head

23‧‧‧Y軌道23‧‧‧Y track

41‧‧‧照明光源41‧‧‧Light source

48‧‧‧抵接部48‧‧‧Apartment

50‧‧‧試料50‧‧‧ samples

100‧‧‧測定裝置100‧‧‧Measurement device

Claims (11)

一種光學測定裝置,係使用穿透過試料的穿透光來進行測定的光學測定裝置,其特徵為具備:載置台,係載置前述試料之端部;吸附台,係在前述試料的下側設置成可朝第1方向移動,並且具有用來吸附前述試料之吸附口;照明光源,係設在前述吸附台,並且對前述試料從下側射出照明光;測定頭,係在前述試料的上側接受從前述照明光源穿透過前述試料的穿透光;複數個支持構件,係設在前述試料的下側,並且在前述載置台之內側處支持前述試料;以及抵接部,係設在前述吸附台,並藉由與前述支持構件之抵接,使一部分之前述支持構件的上端從前述試料離開。 An optical measuring apparatus that uses a penetrating light that has passed through a sample to perform measurement, and is characterized in that it includes a mounting table on which an end portion of the sample is placed, and an adsorption stage that is disposed on a lower side of the sample. The movable body is movable in the first direction and has a suction port for adsorbing the sample; the illumination light source is provided on the adsorption stage, and the illumination light is emitted from the lower side to the sample; and the measurement head is received on the upper side of the sample. a light that penetrates the sample from the illumination light source; a plurality of support members are disposed on a lower side of the sample, and support the sample at an inner side of the mounting table; and an abutting portion is disposed on the adsorption stage And a part of the upper end of the support member is separated from the sample by abutment with the support member. 如申請專利範圍第1項之光學測定裝置,其中,復具備將前述複數個支持構件中的兩個以上加以連結的軸,藉由令前述抵接部抵接於前述支持構件,使前述支持構件以前述軸為旋轉軸而旋轉,而使前述一部分之支持構件的上端從前述試料離開。 The optical measuring device according to claim 1, further comprising: a shaft that connects two or more of the plurality of support members, wherein the abutting portion abuts against the supporting member to cause the supporting member The shaft is rotated about the rotation axis, and the upper end of the part of the support member is separated from the sample. 如申請專利範圍第1或第2項之光學測定裝置,其中,前述照明光源係沿著與前述第1方向不同的第2方向以線狀照明前述試料。 The optical measuring apparatus according to claim 1 or 2, wherein the illumination source illuminates the sample in a line shape in a second direction different from the first direction. 如申請專利範圍第1或第2項之光學測定裝置,其中,在前述第1方向中,設於前述吸附台的吸附口係配置在前述照明光源的兩側。 The optical measuring apparatus according to claim 1 or 2, wherein in the first direction, the adsorption ports provided in the adsorption stage are disposed on both sides of the illumination light source. 如申請專利範圍第1或第2項之光學測定裝置,其中,前述抵接部之與前述支持構件抵接的抵接面係形成斜面形狀。 The optical measuring device according to claim 1 or 2, wherein the abutting surface of the abutting portion that abuts against the support member has a sloped shape. 如申請專利範圍第1或第2項之光學測定裝置,其中,前述吸附台具有對前述試料噴出氣體的噴出口。 The optical measuring apparatus according to claim 1 or 2, wherein the adsorption stage has a discharge port for ejecting gas to the sample. 如申請專利範圍第1或第2項之光學測定裝置,其中,藉由前述抵接部而從前述試料離開的前述支持構件之回復到支持前述試料之狀態的回復速度,係依據前述支持構件的位置而不同。 The optical measuring device according to the first or second aspect of the invention, wherein the returning speed of the support member that is separated from the sample by the abutting portion to the state in which the sample is supported is based on the support member The location is different. 如申請專利範圍第7項之光學測定裝置,其中,沿著前述第1方向設置的前述載置台係分別配置在前述試料的兩側,前述複數個支持構件中,設在前述第1方向之端部的前述支持構件的回復速度比其他支持構件之回復速度。 The optical measuring device according to claim 7, wherein the mounting stages provided along the first direction are disposed on both sides of the sample, and the plurality of supporting members are provided at the end of the first direction The recovery speed of the aforementioned support member is higher than the recovery speed of the other support members. 如申請專利範圍第7項之光學測定裝置,其中,設有使前述支持構件回復到原來角度的彈簧,藉由改變前述彈簧的強度,來改變前述支持構件的回復速度。 An optical measuring apparatus according to claim 7, wherein a spring for returning the supporting member to an original angle is provided, and a return speed of the supporting member is changed by changing a strength of the spring. 如申請專利範圍第7項之光學測定裝置,其中,復具有藉由與前述支持構件之碰撞而吸收前述支 持構件回復原狀時之衝擊的減震器,藉由改變前述減震器的強度,來改變前述支持構件的回復速度。 An optical measuring device according to claim 7, wherein the absorbing member absorbs the aforementioned branch by collision with the support member The shock absorber that impacts the member when returning to the original state changes the recovery speed of the support member by changing the strength of the shock absorber. 如申請專利範圍第7項之光學測定裝置,其中,藉由改變前述抵接部與前述支持構件接觸之部分的形狀,來改變前述支持構件的回復速度。 The optical measuring apparatus according to claim 7, wherein the recovery speed of the support member is changed by changing a shape of a portion of the abutting portion that contacts the support member.
TW097113757A 2007-05-23 2008-04-16 Optical measuring device TWI387748B (en)

Applications Claiming Priority (2)

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