JP4310622B2 - Substrate surface inspection method and inspection apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate surface inspection method and an inspection apparatus for inspecting the surface state of a substrate such as a liquid crystal substrate, a substrate used for a plasma display, and a mask substrate.
[0002]
[Prior art]
For example, if foreign matter is attached to the surface of a substrate such as a glass substrate that constitutes a liquid crystal display, or whether there are scratches, irregularities, etc., and if a film is formed on the surface of the glass substrate, An optical detection means is used to inspect the surface defect such as the presence or absence of the film defect. That is, the substrate is placed in a horizontal state, the surface of the substrate is irradiated with light, and the reflected light or reflected scattered light is received. The presence or absence of is detected.
[0003]
The substrate constituting the liquid crystal display has a large area and is thin, and in some cases, a large substrate is cut out from the viewpoint of production efficiency. Therefore, when performing surface inspection of a thin and large-sized substrate, it is extremely difficult to hold the substrate in a horizontal state. If the peripheral portion is held only, a large amount of bending occurs due to its own weight, and the surface state is not satisfactory. In order to be uniform, the inspection cannot be performed as it is. In view of this, there has been conventionally known a technique in which the peripheral portion of the substrate is held and the substrate is held in a horizontal state by a push-up pin (see, for example, Patent Document 1).
[0004]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-59894 (page 3, FIGS. 1 and 2)
[0005]
[Problems to be solved by the invention]
In the above-described prior art, since the push-up pin is in contact with the back side of the substrate, the substrate can be held in a substantially horizontal state. However, since the surface state is inspected by the inspection optical system, the reflected light from the surface of the substrate is greatly different between the portion that is in contact with the push-up pin and the portion that is not, and noise is generated. There is a problem in that it is impossible to accurately inspect whether there is a defect such as a foreign object or a scratch on the entire surface of the substrate. Further, if the central portion of the substrate is greatly bent during the transportation of the substrate, it may be damaged by sliding against or colliding with other members.
[0006]
The present invention has been made in view of the above points, and an object of the present invention is to reliably perform surface inspection on the entire surface of the substrate with high accuracy, and to damage the substrate during the inspection. It is to prevent it from occurring.
[0007]
[Means for Solving the Problems]
In order to achieve the above-described object, in the present invention, a plurality of inspection zones having a predetermined width for scanning the inspection optical system on the substrate are set parallel to one direction, and the surface of the substrate is set as the inspection optical system. As a method of sequentially performing surface defect inspection for each inspection zone, the predetermined inspection zone is positioned at a position facing the inspection optical system in a state where the substrate is floated by pressurized air, The inspection optical system is configured such that a substrate supporting means is brought into contact with a surface opposite to a surface for inspecting a substrate at a position adjacent to the inspection zone where the inspection is performed, and the flatness of the inspection zone is obtained. After the defect inspection of the inspection zone is completed, the edge of the substrate is held and air is levitated by an air levitating means, and the inspection optical is moved by the substrate moving means. System Thus, the inspection execution zones are pitch-fed and the inspection of each inspection zone is continued successively.
[0008]
According to a second aspect of the present invention, the surface of the substrate is scanned with the inspection optical system, so that the surface defect inspection is sequentially performed for each inspection zone. The inspection zone is set in parallel in one direction and the inspection is performed for each inspection zone, the air floating means for floating the substrate, and the substrate floating by the air floating means Substrate positioning means for positioning , substrate support means for abutting against a surface opposite to the surface for inspecting the substrate adjacent to the inspection zone where the inspection is performed, and for providing flatness of the inspection zone; and A substrate pitch feeding means for holding the edge of the substrate and separating the substrate from the substrate support means by the air levitation means to pitch-feed the substrate for each width of the inspection zone; That was formed is set to its features.
[0009]
Here, the inspection of the substrate using the inspection optical system is performed on the substrate using optical means such as sampling scattered light (foreign matter inspection) or inspection using interference fringes (surface unevenness inspection). The inspection is performed without contact, and there is no particular limitation on the configuration. Further, the present invention is not limited to detecting reflected light from the substrate, and may be one that detects transmitted light. In the case of detecting with transmitted light, for example, when a film is formed on the surface of the substrate, it is possible to inspect whether the film thickness is constant or there is no chipped portion. The substrate to be inspected includes transparent and opaque members, and the surface of the substrate to be inspected does not mean only the front side surface, but includes the back side surface, and further includes both the front and back sides. It can also be applied to inspection.
[0010]
In this case, in order to perform an accurate inspection, it is necessary to align the inspection optical system and the substrate. Although the position of the inspection optical system may be adjusted with respect to the substrate, it is desirable to position the substrate side. For this purpose, the substrate positioning means is provided. However, in the case where only the initial positioning of the substrate is performed, the positioning means capable of moving in the diagonal direction of the substrate may be used. However, as will be described later, when a part of the configuration of the substrate positioning unit is configured to also serve as the substrate pitch feeding unit, the substrate positioning unit is in contact with and separated from both end surfaces orthogonal to the length direction of the inspection zone on the substrate. The first and second positioning members and third and fourth positioning members contacting and separating at both ends in the length direction of the inspection zone. And in order to pitch-feed a board | substrate, the function which hold | maintains a board | substrate is given to a 3rd positioning member. For example, vacuum suction or clamping is performed. During the pitch feeding of the substrate, the first positioning member can be kept in contact with the substrate together with the third positioning member. However, when the positioning of the fourth positioning member is finished, It can be set as the structure spaced apart from. As the positioning member, it is necessary to prevent the end face of the substrate from being damaged, and the positioning member can be formed of a roller, a pin, a wall surface, or the like.
[0011]
At the time of positioning and pitch feeding of the substrate, the substrate can be floated with pressurized air to be in a floating state. Therefore, the air levitation means is disposed at the lower position of the substrate. As the configuration of the air levitation means, an air ejection plate having a large number of air ejection holes on the surface can be used. The air ejection plate is preferably a first air ejection in which a large number of air ejection holes for ejecting pressurized air are formed on the surface of the substrate at a lower portion of a portion where the inspection zone where the inspection is performed is located. It can be comprised from the board and the 2nd, 3rd air ejection plate which is located in the both sides of this test | inspection zone, and in which many air ejection holes which many pressurized air ejects on the surface were formed. Further, if the fourth air ejection plate is disposed at the extended line position of the first air ejection plate, the inspection can be performed in the forward path and the return path of the substrate. The first air ejection plate is configured to be able to move up and down (if the fourth air ejection plate is provided), the position in the horizontal direction is fixedly held. be able to.
[0012]
The inspection of the substrate is performed by causing the inspection optical system to scan along the surface of the substrate. At this time, at least the inspection zone where the inspection is performed is bent or curved. Hold to not. Therefore, the rear surface of the inspection zone other than the inspection execution zone where the inspection is actually being performed is supported. The inspection board support means is provided at a lower position of the second and third air ejection plates, and has a large number of support pins that can be projected and retracted in pin insertion holes formed in the second and third air ejection plates. The pin support plate is provided, and these pin support plates can be moved up and down. Since the position corresponding to the first air ejection plate is the zone where the inspection is being performed, the inspection substrate support means is not provided. For example, a bar-shaped member or a roller-shaped member may be used in contact with the substrate other than the pins.
[0013]
After the surface defect inspection in one inspection zone is completed, the next inspection zone is moved to a position facing the inspection optical system. As the substrate pitch feeding means for this purpose, the third positioning member holding the substrate and the first and second positioning members holding both ends are mounted on the moving block, and this moving block is mounted. Pitch feed is performed for each width dimension of the inspection zone on the substrate by the driving means. The width of the inspection zone should be as wide as possible on the condition that the inspection zone does not deform when the surface opposite to the inspection surface of the substrate is supported by the inspection substrate support means. Is desirable.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. First, FIG. 1 shows the appearance of the substrate 1 to be inspected. The illustrated substrate 1 has a thin rectangular shape, and is made of a transparent member such as glass or synthetic resin. Divided into a plurality of inspection zones Z having the same width in a direction parallel to the long side of the substrate 1 (in the drawing, the boundary portion of the inspection zone Z is indicated by a virtual line). Note that, as indicated by the phantom line, the substrate 1 has a certain margin in the periphery thereof, as in the inspection zone Z.
[0015]
FIG. 2 shows a schematic configuration of the surface defect inspection apparatus for the substrate 1. In the figure, reference numeral 10 denotes a base, and a base 11 is installed on the base 10. The base 11 is reciprocated in one direction along a guide rail 13 by a ball screw feeding means 12. It has become. The moving direction of the base 11 is the length direction of the inspection zone Z on the substrate 1, and this direction is referred to as the Y-axis direction. A direction perpendicular to the length direction of the inspection zone Z of the substrate 1 is referred to as an X-axis direction. In the following, the inspection is performed by inspecting the surface on the front side of the substrate 1, and in this case, the surface opposite to the inspection surface is the back surface. However, for example, when inspecting both front and back surfaces, the substrate 1 is reversed, and when the opposite surface becomes the inspection surface, the front and back surfaces are reversed.
[0016]
Air levitation means 20 and substrate support means 30 are provided on the base 11. The air levitation means 20 is composed of air ejection plates 21 to 24. As shown in FIG. 3, the air ejection plates 21 to 24 are provided with air ejection holes 25 composed of a large number of pores over the entire surface. It has been. Of the air ejection plates 21 to 24, the first air ejection plate 21 and the fourth air ejection plate 24 have substantially the same width as the width dimension of the inspection zone Z, and are separated by a predetermined interval in the Y-axis direction. It is provided at a position and is supported by the base 10 so as to be movable up and down. The second and third air ejection plates 22 and 23 are disposed on both sides of the first and fourth air ejection plates 21 and 24 and are fixedly supported on the base 11.
[0017]
A support plate 30 constituting a substrate support means is provided at a lower position of the second and third air ejection plates 22 and 23 so as to be movable up and down. These support plates 30 are provided with a large number of support pins 31 for supporting the back surface of the substrate 1. Among these support pins 31, an inclined pin 31 </ b> T inclined at a predetermined angle is disposed at the end facing the first and fourth air ejection plates 21, 24 of the support plate 30. The second and third air ejection plates 22 and 23 are provided with pin insertion holes 26 at the upper positions of the respective support pins 31. Further, at the end portions of the second and third air ejection plates 22 and 23, a notch portion 27 is formed at an upper position of the position where the inclined pin 31T is disposed. In the following description, the support pin 31 may mean the one including the inclined pin 31T.
[0018]
As shown in FIG. 4, as the lifting mechanism of the support plate 30, a plurality of sliders 32 are provided on the lower surface of the support plate 30, and these sliders 32 are engaged with the inclined guides 33. The operating plate 34 is slidable along a guide 36 provided on the base 11 by driving means 35 such as a cylinder. Therefore, the slider 32 connected to the support plate 30 is guided along the slope of the inclined guide 33 by reciprocating the operation plate 34 in the direction of the arrow in FIG. The pins 31 can be made to appear and disappear from the surfaces of the second and third air ejection plates 22 and 23.
[0019]
The positions where the first and fourth air ejection plates 21 and 24 are arranged are positions where the substrate 1 is transferred or the inspection zone Z is shifted. The first and fourth air ejection plates 21 and 24 are spaced apart from each other, and a portion having the spacing is an inspection position of the substrate 1. Therefore, a reflection type inspection optical system 40 is provided at an upper position of the interval portion. The inspection optical system 40 includes, for example, a light emitting means and a light receiving means, and a laser beam is emitted from the light emitting means to the substrate. 1 is used in which the illumination light is irradiated obliquely from above and the reflected light is received by the light receiving means, thereby checking whether foreign matter is adhered to the surface of the substrate 1 or not. It can be carried out. In addition to this, if an interferometer is used, surface irregularities can be inspected, and if a light-transmitting inspection optical system is formed by providing a light receiving means at a lower position of the substrate 1, the substrate 1 is contaminated. When the film is formed on the substrate 1, detection of the film accuracy can be performed. The inspection optical system 40 can scan the width of the inspection zone Z on the substrate 1 in the X-axis direction.
[0020]
In order to inspect the presence or absence of defects on the surface of the substrate 1 by the inspection optical system 40, it is necessary to position and hold the substrate 1. As the positioning means for the substrate 1, as shown in FIG. 5, first and second positioning members 50 and 51 for positioning both ends in the X-axis direction, and a third for positioning both ends in the Y-axis direction of the substrate 1 are used. , Fourth positioning members 52, 53. Each of these positioning members 50 to 53 includes rollers 50a to 53a.
[0021]
The rollers 50a and 52a of the first and third positioning members 50 and 52 are reference-side positioning members and are held at predetermined positions during positioning. The first positioning member 50 can be separated from the second positioning member 51 when the substrate 1 is carried in and out. The rollers 51a and 53a in the second and fourth positioning members 51 and 53 are positioning members on the adjustment side. Therefore, the roller 51a can move in the direction approaching / separating from the roller 50a, and the roller 53a can be moved in the direction approaching / separating from the roller 52a. Further, the rollers 52a and 53a of the third and fourth positioning members 52 and 53 are configured as a pair. A suction block 54 for sucking and holding the back side of the substrate 1 is disposed between the rollers 52a and 52a in the third positioning member 52. This suction block 54 is also shown in FIG. Thus, it moves up and down by the raising / lowering drive means 55, and is set so that it may become the same as the height position of the front-end | tip of the support pin 31 which comprises the support plate 30 in a raise position.
[0022]
Here, the 1st, 2nd and 3rd positioning members 50-52 are mounted | worn with the X-axis slide member 60 which comprises a pitch feed means. Further, the suction block 54 is also supported on the X-axis slide member 60, and receiving plates 61 and 62 are provided in the vicinity of the joint portion of the first and second positioning members 50 and 51 on the substrate 1. Here, the contact position of the suction block 54 and the receiving plates 61 and 62 with the substrate 1 is the margin. The X-axis slide member 60 is pitch-fed for each width of the inspection zone Z set on the substrate 1 along a guide rail 63 that extends on the base 11 in the X-axis direction. On the other hand, the fourth positioning member 53 is supported by the first air ejection plate 21. Therefore, after the positioning of the substrate 1 is completed, the fourth positioning member 53 is separated from the substrate 1. It has become. Note that the fourth positioning member 53 can be supported by the X-axis slide member 60 in the same manner as the first to third positioning members 50 to 52.
[0023]
A method of performing a defect inspection on the surface of the substrate 1 using the surface inspection apparatus configured as described above will be described.
[0024]
When performing the inspection, the substrate 1 is carried into the surface inspection apparatus by a transfer means such as a robot and positioned at a predetermined position. At this time, the base 11 is placed at the position shown in FIG. 3 and the first air ejection plate 21 is raised so that it is at the same height as the second and third air ejection plates 22 and 23. To do. Further, the support plate 30 is in the lowered position, and the support pins 31 are held so as not to protrude from the surfaces of the second and third air ejection plates 22 and 23. Then, pressurized air is ejected upward from the air ejection holes 25 of the first to third air ejection plates 21 to 23. Further, the four positioning members 50 to 53 are in a released state, and a wide space is secured in the internal position.
[0025]
When the board | substrate 1 is carried in, this board | substrate 1 will be hold | maintained in a floating state by the pressurized air ejected from the 1st-3rd air ejection plates 21-23. In this state, first, as indicated by an arrow S1 in FIG. 5, the first positioning member 50 is operated to move to the reference position. Next, as indicated by the arrow S2, the second positioning member 51 is moved toward the first positioning member 50, and both ends of the substrate 1 in the X-axis direction are sandwiched between the rollers 50a and 51a. Thereby, the substrate 1 is positioned in the X-axis direction. Further, as indicated by the arrow S3, the fourth positioning member 53 moves in the direction approaching the third positioning member 52, and both ends of the substrate 1 in the Y-axis direction are sandwiched between the rollers 52a and 53a. . As a result, the substrate 1 is accurately positioned at the initial position. Here, the initial position is a position where the inspection zone Z1 to be inspected first on the substrate 1 is on the first air ejection plate 21 as shown in FIG.
[0026]
When the positioning of the substrate 1 is completed, the support plates 30 and 30 are lifted, the support pins 31 including the inclined pins 31T are lifted, abut on the back side of the substrate 1, and the suction block 54 is lifted, 1 is held by suction. As a result, the substrate 1 is supported by the suction block 54 and the support pins 31. Therefore, the supply of pressurized air from the air ejection holes 25 is stopped. Further, the roller 53 a of the fourth positioning member 53 is separated from the substrate 1.
[0027]
In this state, the substrate 1 is supported from the back side by the support pins 31 and the inclined pins 31T protruding from the second air ejection plate 22 and the inclined pins 31T protruding from the third air ejection plate 23. Therefore, on the substrate 1, at least the part of the inspection zone Z1 to be inspected first is in a planar state, and no deformation such as bending or bending occurs. It should be noted that the contact position of the inclined pin 31T described above is outside the inspection zone Z1, which is an inspection execution zone, and is a boundary portion thereof. Further, the inclined pin 31T on the third air ejection plate 23 side is in contact with the blank portion of the substrate 1.
[0028]
Therefore, the first air ejection plate 21 is lowered and the base 11 is moved in the Y-axis direction. The lowered position of the first air ejection plate 21 is a position where the fourth positioning member 53 supported by the first air ejection plate 21 does not interfere with the base 11. When the substrate 1 moves to a position facing the inspection optical system 40, the surface defect inspection of the substrate 1 is executed. During this movement, the first air ejection plate 21 and the fourth positioning member 53 provided on the first air ejection plate 21 do not move, so that an inspection error is generated at the lower position where the inspection optical system 40 faces in the inspection zone Z1 where the inspection is being performed. Since such a member is not arranged, an accurate defect inspection can be performed.
[0029]
When the base 11 reaches the end of the movement stroke in the Y-axis direction, the inspection in the inspection zone Z1 ends. At this time, the fourth air ejection plate 24 is arranged between the second and third air ejection plates 22 and 23. Therefore, as shown in FIG. 7B, the substrate 1 is pitch-fed by the width of the inspection zone in the X-axis direction in order to inspect the next inspection zone Z2. For this purpose, the second to fourth air ejection plates are maintained while the suction by the suction block 54 to the substrate 1 and the rollers 50a to 52a of the first to third positioning members 50 to 52 are kept in contact with each other. Pressurized air is ejected from the 22 to 24 air ejection holes 25. At the same time, the support plate 30 is lowered to lower all the support pins 31 from the surfaces of the second to fourth air ejection plates 22 to 24. As a result, the substrate 1 is floated by the action of pressurized air. Therefore, the X-axis slide member 60 is moved in the X-axis direction by one pitch along the guide rail 63.
[0030]
When the pitch feed of the substrate 1 is completed, the support plate 30 is raised again, and all the support pins 31 including the inclined pins 31T are projected from the surfaces of the second to fourth air ejection plates 22 to 24, The back surface of the substrate 1 is supported by the support pins 31. As a result, the inspection zone Z2 is supported so as to be in a planar state. Then, the supply of pressurized air from the air ejection holes 25 is stopped, and the fourth air ejection plate 24 is lowered. As a result, the inspection optical system 40 can inspect the inspection zone Z2 of the substrate 1. In this state, the inspection with respect to the inspection zone Z2 is performed while moving the base 11 in the direction in which the first air ejection plate 21 is provided. When this inspection is completed, the second and third air ejection plates 22 and 23 return to the position where the first air ejection plate 21 is disposed therebetween. Therefore, in the same manner as described above, the substrate 1 is pitch-fed along the X axis, and the inspection zones Z3 and Z4 are inspected as shown in FIGS. 7 (c) and 7 (d).
[0031]
When all the inspection zones have been inspected, the substrate 1 is lifted by the action of pressurized air, the support pins 31 are lowered, and the suction by the suction block 54 is released. Then, by separating the first and second positioning members 50 and 51 from the substrate 1, the substrate 1 is unloaded from the surface inspection apparatus by a robot or the like.
[0032]
As described above, since the surface defect inspection is performed while the substrate 1 is moved in the Y-axis direction in a state where the inspection zone adjacent to the inspection execution zone is supported by the support pins 31, the number of inspection execution zones can be reduced. It can be accurately inspected. And since the board | substrate 1 is divided | segmented into a some test | inspection zone and it is made to test | inspect, even if it is a thin board | substrate, it can have a flatness reliably. Further, when the substrate 1 is moved in the Y-axis direction or pitch-fed in the X-axis direction to execute the inspection, the substrate 1 does not slide with any member. Further, the substrate 1 is moved while being kept in a flat state as a whole. Therefore, the surface defect inspection of the substrate 1 can be performed with high accuracy, and the substrate 1 is not damaged or deformed during the inspection.
[0033]
【The invention's effect】
As described above, according to the present invention, a defect inspection can be performed reliably and accurately over the entire inspection surface of the substrate by the optical means, and there is a risk that the substrate may be damaged at the time of inspection. There are effects such as not.
[Brief description of the drawings]
FIG. 1 is a plan view of a substrate on which an inspection zone is set.
FIG. 2 is an overall configuration diagram of a substrate surface inspection apparatus according to the present invention.
FIG. 3 is a plan view of FIG. 2;
4 is a cross-sectional view taken along the line AA in FIG. 3;
FIG. 5 is a diagram illustrating the configuration of a substrate positioning mechanism.
FIG. 6 is an explanatory diagram of a configuration of a pitch feeding means for a substrate.
FIG. 7 is an operation explanatory diagram illustrating a state in which a surface inspection of a substrate is performed.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Substrate 10 Base 11 Base 12 Ball screw feeding means 20 Air floating means 21-24 Air ejection plate 25 Air ejection hole 26 Pin insertion hole 30 Support plate 31 Support pin 31T Inclination pin 40 Inspection optical system 50-53 Positioning member 54 Adsorption Block 55 Elevating drive means 60 X-axis slide member

Claims (6)

A plurality of inspection zones having a predetermined width that are scanned by the inspection optical system on the substrate are set in parallel in one direction, and the surface of the substrate is scanned by the inspection optical system to sequentially inspect the surface defect for each inspection zone. A method of performing
In a state where the substrate is floated with pressurized air, the predetermined inspection zone is positioned at a position facing the inspection optical system,
The inspection optical system is configured such that a substrate supporting means is brought into contact with a surface opposite to a surface for inspecting a substrate at a position adjacent to the inspection zone where the inspection is performed, and the flatness of the inspection zone is obtained. Detect defects on the inspection target surface in the relevant inspection zone by
After the defect inspection of the inspection zone is completed, the end portion of the substrate is held and air is floated by the air floating means, and the inspection execution zone by the inspection optical system is pitch-fed by the substrate moving means, and each inspection is sequentially performed. A method for inspecting a substrate, comprising inspecting a zone. By scanning the surface of the substrate with the inspection optical system, a plurality of inspection zones having a predetermined width on which the inspection optical system is scanned are unidirectionally scanned on the substrate in order to perform surface defect inspection for each inspection zone. It is a device that performs inspection for each inspection zone by setting it parallel to
Air levitation means for floating the substrate;
Substrate positioning means for positioning the substrate that has been levitated by the air levitation means;
A substrate support means for abutting against a surface opposite to the surface for inspecting the substrate at a position adjacent to the inspection zone where the inspection is performed, and for obtaining the flatness of the inspection zone;
The substrate is provided with substrate pitch feeding means for holding the end portion of the substrate and separating the substrate from the substrate support means by the air levitation means to pitch-feed the substrate every width of the inspection zone. A substrate inspection apparatus.   The substrate positioning means includes first and second positioning members that are in contact with and away from both end faces orthogonal to the length of the inspection zone of the substrate, and third and fourth that are in contact with and away from both ends in the length direction of the inspection zone. 3. The substrate inspection apparatus according to claim 2, further comprising a positioning member, wherein the first positioning member is separated from the substrate when the positioning of the substrate is completed.   The air levitation means is positioned below a portion of the substrate where the inspection execution zone is located, and a first air ejection plate in which a number of air ejection holes for ejecting pressurized air are formed on the surface, and this inspection The first air ejection plate is located on both sides of the execution zone and has second and third air ejection plates formed with a number of air ejection holes through which a large number of pressurized air is ejected. 3. The substrate inspection apparatus according to claim 2, wherein the substrate inspection apparatus is capable of being configured.   The substrate support means is arranged at a lower position of the second and third air ejection plates, and stands a large number of support pins capable of appearing and retracting in pin insertion holes formed in the second and third air ejection plates. 5. The board inspection apparatus according to claim 4, wherein the board support apparatus comprises a pin support plate provided so that the pin support plate can be moved up and down.   The substrate pitch feeding means includes a moving block to which the second, third and fourth positioning members are attached, and the moving block is pitch-fed for each width dimension of the inspection zone on the substrate. The substrate defect inspection apparatus according to claim 2.

Images