TW200907332A - Optical measurement apparatus and substrate holding apparatus - Google Patents

Optical measurement apparatus and substrate holding apparatus Download PDF

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Publication number
TW200907332A
TW200907332A TW097113757A TW97113757A TW200907332A TW 200907332 A TW200907332 A TW 200907332A TW 097113757 A TW097113757 A TW 097113757A TW 97113757 A TW97113757 A TW 97113757A TW 200907332 A TW200907332 A TW 200907332A
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Taiwan
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sample
adsorption
support member
stage
substrate
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TW097113757A
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Chinese (zh)
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TWI387748B (en
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Koji Machida
Tomohiro Suzuki
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Lasertec Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile

Abstract

The present invention provides an optical measurement apparatus using transmitted light transmitted through a sample to perform a measurement, which includes a mounting stage 12 mounted with end portions of a sample 50, a sucking stage 18 provided in a lower side of the sample 50 so as to be moveable in a Y direction and having sucking ports sucking the sample, an illumination light source 41 provided in the sucking stage 18 and irradiating illumination light from the lower side of the sample, a measurement head 22 receiving the transmission light transmitted through the sample from the illumination light source 41 at an upper side of the sample 50, a plurality of supporting members 16 provided in the lower side of the sample 50 and supporting the sample 50 in an inner side of the mounting stage 12, and an abutting portion 48 provided in the sucking stage 18 and separating an upper end of parts of the supporting members 16 from the sample 50 by abutment with the supporting member 16. Thereby, the present invention provides an optical measurement apparatus capable of simply performing stable measurement, and a substrate holding apparatus.

Description

200907332 九、發明說明： 【發明所屬之技術領域】 本發明是關於光學測定裝置、及基板保持裝置，更詳 言之，是關於一種使用穿透試料的穿透光來進行測定的光 學測定裝置、及吸附基板並加以保持的基板保持裝置。 【先前技術】 在液晶顯示裝置等的製程中，是將照明光照射在透明 基板來進行檢查。這種檢查步驟有使用穿透過試料的穿透 光的情況、以及使用由試料反射的反射光的情況。透明的 基板例如有彩色濾光片基板、液晶面板、TFT陣列基板等。 近年來，這些基板的基板尺寸正朝大型化發展。 利用穿透光的穿透型檢查裝置是將作為檢查對象的基 板載置於載台上，藉此，能以穩定的狀態加以保持。在將 基板載置於載台的狀態下，從基板的表面側、或背面側照 射來自光源的光。接著，利甩CCD或光電二極體的檢測器 來檢測出穿透過基板及載台的光。因此，穿透型的缺陷檢 查裝置所使用的載台是使用可讓來自光源的光穿透的透明 載台（專利文獻1)。 、例如，在基板的上部配置檢測器，並將照明光源配置 ，透=载台的下部。藉此，可拍攝基板的穿透像。這種透 月載口通吊可使用玻璃板等。為了正確檢測出基板上微細 的缺陷基板最好不要振動。亦即，一旦基板振動，就無 法進行穩疋的測定。隨著基板的大型化，會造成用來載置 土板的透明載台也大型化。因此’制振對策就變得更為重 5 320004 200907332 • 要。然而’透明的破璃載台之屋痒 .^ 戰。之；度有其限制，難以將其形 成一定以上的厚度。 制据不一種具有制振桿的裁台裝置（專利文獻2)。 制振;f干尺没在載台的下側。 66 ^ ^ V- ^ 揭不一種將用來吸附基板 的早7G S又在基板下方的檢杳裝晋 曰, 一衮置（專利文獻3)。該檢查裝置 Τ在玻璃基板的下方設有單元。在單元設有吸附口、及嘴 板吸附口來吸附基板’即可降低振動。要使基 之間配置有受光部。 喷出工乳。而且在兩個單元 [專利文獻如本特開2001_148625號公報（段落〇〇 [專利文獻2]日本特開2006-337542號公報 [專利文獻3]日本特開2003-279495號公報 【發明内容】 (發明所欲解決之課題） 然而’在專利文獻2的載台裝置中，必須因應測定 、移動而使制振桿升降。因此，必須控制用以使制振 降之驅動機構。再者，在專利文獻3之檢查裝置中，Χ = 進行基板整體之檢查而使基板務動。當使基板移動萨7 I 查裝置會大型化。如上所述’該等裝置為了進行穿透^明檢 裝置會變得複雜。因此，使用穿透照明的裝置 便地進行穩定之測定的問題點。 〜法簡 本發明是為了解決這種問題點而研創者，其目的在於 提供一種可簡便地進行穩定之測定的光學測定裝置、； 板保持裝置。 ^ 、及基 32〇〇〇4 6 200907332 (用以解決課題之手段） 的穿ί:::第1樣態的光學挪定裝置是使用穿透過試剩 的f透先來進行敎的光學敎裝置，其特徵為具備： 二二：：置剧述試料之端部;吸附台，係在前述試料的 方向移動，並且具有用來吸附前述試 、· ' …月光源，係设在前述吸附台，並且對前述 試料從下侧射出照明光；測定頭’係在前述試料的上側接 = 料的穿透光^ 處支持前述試並且在前述載置台之内側 ,.^;+, ，及抵接邛，係設在前述吸附台，並夢 由/、刖述支持構件之抵接八义 9 端從前述試料離開。μ此，遑支持構件的上 以 藉此即使疋使用穿透照明的裝置， 也可間便地進行穩定的測定。 穿置J:=之第2樣_的光學測定裝置是上述的光學測定 力:以連結的轴復述複數個支持構件中的兩個以上 藉由令丽述抵接部抵接於前述支持構件， 八構件以前述轴為旋轉軸而旋轉，而使前述一部 料離開。藉此，即使在增加 里的If況下，也可形成簡便的構成。 裝置本：：之第3樣態的光學測定裝置是上述的光學測定 第2方:以線:::!=著述第1方向不同的 朝第1方向移動Γ 猎只要使吸附台僅 本發明4Γ，因此可簡便地測定整個試料。 昂4樣態的光學測定裝置是上述的光學測定 7 320004 200907332 =配置前述第1方向中，設於前述吸附台的吸附 區域的振明光源的兩侧。藉此，可降低所照明之 次的振動，因此可實現穩定的測定。 本月之第5樣態的光學測定裝置是上述的光學測定 :二:中，前述抵接部之與前述支持構件抵接的抵接面 ::备斜面形狀。藉此’可緩和衝擊’且可使吸附台快速 地移動。 本發明之第6樣態的光學測定裝置是上述的光學測定 、置4 /、中，剛述吸附台具有對前述試料嘴出氣體的喷出 口。藉此，可快速地進行吸附台的移動。 本發明之第7樣態的光學測定裝置是上述的光學測定 裝置/、中，藉由則述抵接部而從前述試料離開的前述支 f構件之回復到支持前述試料之狀態的回復速度，是依據 前述支持構件的位置而不同。藉此’可緩和支持構件及試. 料所受的衝擊。 本發明之第8樣態的光學測定裝置是上述的光學測定、 裝置，其中，沿著前述第丨方向設置的前述载置台是分別 配置在前述試料的兩側，前述複數個支持構件中，設在前 述第1方向之端部的前述支持構件的回復速度比其他支持 構件的回復速度快。藉此，可缓和試料在中央的衝擊。 本發明之第9樣態的光學測定裝置是上述的光學測定 裝置，其中，設有使前述支持構件回復到原來角度的彈箬， 藉由改變前述彈簧的強度，來改變前述支持構件的回復速 度。藉此，可簡便地缓和衝擊。 320004 200907332 本發明之第10樣態的光學測定裝置是上述的光學測 疋裝置其中’復具有藉由與前述支持構件之碰撞而吸收 則述支持構件回復原狀時之衝擊的減震器（shock absorber) ’藉由改變前述減震器的強度，來改變前述支持 構件的回復速度。藉此，可簡便地緩和衝擊。 本發明之第11樣態的光學測定裝置是上述的光學測 疋裝置，其中，藉由改變前述抵接部與前述支持構件接觸 之。卩刀的形狀，來改變前述支持構件的回復速度。藉此， 可簡便地緩和衝擊。 本發明之第12樣態的基板保持裝置的特徵為具備：載 置台，係載置基板之端部；第1及第2吸附部，係設在前 述載置台，用來吸附前述基板；以及可動台，係在前述基 板的下側設置成可移動的狀態，並且具有對前述基板喷出 氣體之喷出口；並且具備用來切換前述第1及第2吸附部 之開啟/關閉（ON/0FF )的切換部，前述切換部是依據前述可 動台相對於前述基板的位置，將前述第、及第2吸附部的 一方設為ON(開啟）’將另一方設為〇FF(關閉）。藉此，在 可動台移動時，可使該部分的基板確實地浮起。由於可使 載置台與可動台的高度接近，因此可提升基板的平面度。 藉此，便可實現穩定的測定、加工等。 本發明之第13樣態的基板保持裝置是上述的基板保 f裝置，其中，前述載置台是載置前述基板之兩側的端部，' 前述可動台是以通過兩侧的前述載置台之間的方式，沿著 第1方向移動，在設於前述基板之兩側的前述載置台之各 320004 9 200907332 r :者中，在前述第！方向的兩端設有 兩端的前述第】吸附部之間設有在設 動台移動至對應於前述第1吸附部2 = 』这第1吸附部設為卿，並且將前述 置匕將 ◦N ’當前述可動a穸备$ 及附部设為 口私動至對應於前述第1吸附邱w番 時，將前述第卜及附部設為⑽ =㈣位置 實地淳柄ί 時，可使該部分的基板確 二^起。由於可使载置台與可動台的高度接近，因此可 基板的平面度。藉此，便可實現狀的敎、加工等。 ^發明之第14樣態的基板保持裝置是上述的基板保 :裝置’其中’在對應於前述第i吸附部的位置與對應於 前述第2吸附部的位置的交界區域，前述第i及第2吸附 部係形成ON狀態。藉此，即使通過交界區域時，基板也 不會移動，因此可實現穩定的測定。 (發明之效果） 根據本發明，可提供一種可簡便進行穩定之測定的光 學測定裝置、及基板保持裝置。 【實施方式】 (實施形態1) 本實施形態的測定裝置是使用穿透過試料的穿透光來 進行測定的光學測定裝置。測定裝置是用來測定設在試料 的圖案或缺陷。具體而言，是用來測定圖案形狀、圖案寬 度、缺陷的位置、缺陷的大小、缺陷的形狀等。因此，可 將使用穿透光的顯微鏡或檢查裝置作為本實施形態的測定 10 320004 200907332 ， 裝置。 針對本發明之測定裝置’使 從用弟1圖及第2圖加以說 第1圖是示意性顯示測定裝置之構成的俯視圖。第2 =是不意性顯示測定裝置所使用㈣台裝置之構成的斜視 圖。如第1圖所示，測定裝置1〇〇具有固定機座u、載置 ^2、導軌14、支持構件16、吸附台ΐ8、χ軌道η、測 定頭22、γ執道23、及抵接部48。測定裝置ι〇〇是用來 檢查試料50的檢查裝置。又，如第2圖所示，用來保持試 料50的载台裝置10具有固定機座u、載置台12、導軌 14、支持構件16、及吸附台18。 在此，將試料50作為液晶顯示裝置等顯示裝置所使用 的形色濾光片基板來加以說明。彩色濾光片基板具備r、 G、B三種顏色的著色層與設在著色層之間的遮光層。本 實施形態的測定裝置100是在試料5〇下設有吸附台18。 而且，是利用設在吸附台18的照明光源41，從背面側照 明試料50。在試料50上配置有測定頭22。由設在該測^ 頭22的光檢測器接受穿透過試料5〇的穿透光。檢測器是 例如CCD相機等。藉此可拍攝試料5〇的像。因此，可= 定試料50的圖案形狀、圖案寬度等。再者，可藉由與正常 的圖案比較，來測定缺陷的大小及位置。並且可進行試料 5〇是否正常的檢查。 如第1圖及第2圖所示，將水平面設為χγ平面。又， X方向與γ方向是彼此正父。试料5 〇是大致水平地配置. 在XY平面。再者，將錯直方向设為Z方向。此外，固定 320004 11 200907332 $座π的上表面是與χγ面平行。固定機座11是例如被 f裝並固疋在地面。又，亦可經由用來吸收振動的阻尼器 荨來安裝固定機座。 在口定機座11的兩端分別配設有Y軌道23。Y軌道 23、是沿著Y方向。亦即，Y執道23的長度方向是與Y方 向平行在該兩條γ執道23上方設有X執道η。該X執 C 21疋以過試料5〇的方式沿著X方向而設置。χ軌道 21的長度方向疋與χ方向平行。在χ執道安裝有測定 頭22。測定頭22是被設置成可相對於X軌道21移動。因 此測疋頭22會沿著χ方向移動。在測定頭設有相機 等光檢測器或鏡頭等。測定頭22會接受來自後述吸附台 8之…、月光源41的光。再者，亦可將落射照明光學系統 配置在測定頭22。蕤舲，^,丨_ • ' 糟此可利用穿透照明及落射照明（epi illumination)兩者。又’亦可將雷射加1用的雷射光源配設 在測定頭22。藉此，便可修正缺陷部位。 再者’X軌道21是被設置成可相對於γ軌道23移動。 因此X軌道會朝Υ方向移動。因此，測 料5。上朝，向移動。亦即，藉由使測定頭以 向移動，並使絲有測定頭U的X軌道2WY方向移動， 即可使測定帛22纟ΧΥ平面上移動。藉此，可對試料50 全面地進行測定。又，由於可縮小測定裝置U)。的設置， 間，因此可提升生產性。測定頭22及乂執道21的驅動; 使用AC伺服馬達等眾所周知的方法來進行。200907332 IX. The present invention relates to an optical measuring device and a substrate holding device, and more particularly to an optical measuring device for performing measurement using transmitted light penetrating a sample. And a substrate holding device that adsorbs and holds the substrate. [Prior Art] In the manufacturing process of a liquid crystal display device or the like, illumination light is irradiated onto a transparent substrate for inspection. This inspection step has a case where the transmitted light penetrating the sample is used, and a case where the reflected light reflected by the sample is used. The transparent substrate is, for example, a color filter substrate, a liquid crystal panel, a TFT array substrate, or the like. In recent years, the substrate size of these substrates has been increasing. In the penetrating type inspection apparatus using the transmitted light, the substrate to be inspected is placed on the stage, whereby the substrate can be held in a stable state. The light from the light source is irradiated from the surface side or the back side of the substrate in a state where the substrate is placed on the stage. Next, the detector of the CCD or the photodiode detects the light that has passed through the substrate and the stage. Therefore, the stage used in the penetration type defect inspection device is a transparent stage that allows light from the light source to pass through (Patent Document 1). For example, a detector is disposed on the upper portion of the substrate, and the illumination source is disposed to pass through the lower portion of the stage. Thereby, a penetrating image of the substrate can be taken. This type of through-the-moon port can be used for glass hanging. It is preferable not to vibrate in order to correctly detect a fine defect substrate on the substrate. That is, once the substrate is vibrated, stable measurement cannot be performed. As the size of the substrate increases, the transparent stage for mounting the earth plate is also increased in size. Therefore, the countermeasures for damping become even heavier. 5 320004 200907332 • Yes. However, the house of the transparent broken glass platform is itchy. There is a limit to the degree, and it is difficult to form it to a certain thickness or more. There is no cutting device having a damper rod (Patent Document 2). Vibration; f dry ruler is not on the underside of the stage. 66 ^ ^ V- ^ Uncovering an early 7G S that will be used to adsorb the substrate and a mounting device under the substrate (Patent Document 3). The inspection device is provided with a unit below the glass substrate. The unit is provided with a suction port and a nozzle adsorption port to adsorb the substrate to reduce vibration. A light receiving portion is disposed between the bases. Spray the working milk. In addition, in the case of the two-parts [Patent Document No. 2001-148625 (Patent Document 2), JP-A-2006-337542 (Patent Document 3), JP-A-2003-279495 (Invention) However, in the stage device of Patent Document 2, the damper must be moved up and down in response to measurement and movement. Therefore, it is necessary to control the drive mechanism for damping the vibration. In the inspection apparatus of Document 3, Χ = inspection of the entire substrate is performed to move the substrate. When the substrate is moved, the device is enlarged. As described above, the devices will change in order to perform the penetration. Therefore, it is a problem to perform stable measurement using a device that penetrates illumination. The present invention has been made in order to solve such a problem, and an object thereof is to provide a measurement that can be easily and stably performed. Optical measuring device, plate holding device, ^, and base 32〇〇〇4 6 200907332 (means for solving the problem) ί::: The first optical optical device is used to penetrate the test The optical enthalpy device is characterized in that: the second part is: the end of the sample; the adsorption stage is moved in the direction of the sample, and has a ... The moon light source is provided on the adsorption stage, and emits illumination light from the lower side to the sample; the measurement head is supported by the penetration light of the upper side of the sample, and is supported on the inside of the mounting table. .^;+, , and the abutting 邛 are set in the aforementioned adsorption stage, and the dream is separated from the aforesaid sample by the abutting support member. The μ is supported by the support member. Even if the device that penetrates the illumination is used, it is possible to perform stable measurement with ease. The optical measurement device of the second sample of the J:= is the above-described optical measurement force: a plurality of support members are repeatedly described by the coupled axes Two or more of the above-mentioned support members are abutted by the reference abutting portion, and the eight members are rotated by the aforesaid axis as a rotation axis, thereby leaving the aforementioned one material away. Thereby, even in the case of the increase of If, It can also form a simple structure. The optical measuring apparatus of the three aspects is the second side of the above-described optical measurement: moving in the first direction with the line:::!=the first direction is different, so that the adsorption stage can be easily measured only by the present invention. The entire sample is an optical measurement device as described above. The optical measurement is performed as described above. 7 320004 200907332 = arranging the first direction, both sides of the illuminating light source provided in the adsorption region of the adsorption stage, thereby reducing the illumination The second vibration mode of the fifth aspect of the present invention is the above-described optical measurement: in the second aspect, the contact surface of the abutting portion abutting on the support member: The shape of the bevel is used to "slow the impact" and allow the adsorption stage to move quickly. An optical measuring apparatus according to a sixth aspect of the present invention is the optical measuring device described above, wherein the adsorption stage has a discharge port for discharging gas to the sample nozzle. Thereby, the movement of the adsorption stage can be performed quickly. The optical measuring device according to the seventh aspect of the present invention is the above-described optical measuring device, wherein the recovery speed of the state in which the sample member is separated from the sample by the abutting portion is returned to the state in which the sample is supported. It differs depending on the position of the aforementioned support member. This can alleviate the impact on the support member and the test material. The optical measuring device according to the eighth aspect of the present invention is the optical measuring device, wherein the mounting table provided along the second direction is disposed on each side of the sample, and the plurality of supporting members are provided. The recovery speed of the support member at the end portion in the first direction is faster than the recovery speed of the other support members. Thereby, the impact of the sample in the center can be alleviated. According to a ninth aspect of the present invention, in the optical measuring apparatus of the present invention, the optical measuring device is provided with a magazine for returning the supporting member to an original angle, and the returning speed of the supporting member is changed by changing the strength of the spring. . Thereby, the impact can be easily alleviated. 320004 200907332 The optical measuring device according to the tenth aspect of the present invention is the above-described optical measuring device, wherein the shock absorber is absorbing a shock when the supporting member returns to the original state by collision with the supporting member. 'Change the recovery speed of the aforementioned support member by changing the strength of the aforementioned shock absorber. Thereby, the impact can be easily alleviated. An optical measuring apparatus according to an eleventh aspect of the invention is the optical measuring apparatus described above, wherein the abutting portion is in contact with the supporting member by changing the abutting portion. The shape of the file is used to change the recovery speed of the aforementioned support member. Thereby, the impact can be easily alleviated. A substrate holding device according to a twelfth aspect of the present invention includes: a mounting table on which an end portion of the substrate is placed; and first and second adsorption portions are provided on the mounting table for adsorbing the substrate; and movable The stage is provided in a movable state on the lower side of the substrate, and has a discharge port for discharging the gas to the substrate, and is provided with an opening/closing (ON/OFF) for switching the first and second adsorption portions. In the switching unit, the switching unit turns ON one of the first and second adsorption units from the position of the movable table with respect to the substrate, and sets the other to 〇FF (closed). Thereby, the substrate of the portion can be surely floated when the movable table moves. Since the height of the mounting table and the movable table can be made close, the flatness of the substrate can be improved. Thereby, stable measurement, processing, and the like can be achieved. A substrate holding device according to a thirteenth aspect of the present invention is the substrate holding device, wherein the mounting table is an end portion on both sides of the substrate, and the movable table passes through the mounting table on both sides The mode is moved in the first direction, and each of the above-described mounting stages provided on both sides of the substrate is 320004 9 200907332 r : The first adsorption portion is provided between the two ends of the direction in which both ends of the direction are provided, and the first adsorption portion is set to correspond to the first adsorption portion 2 = 』, and the first adsorption portion is set to be 卿'When the movable unit and the attachment are set to correspond to the first adsorption step, and the aforementioned portion and the attachment are set to (10) = (four) position, the position can be made. Part of the substrate is indeed two. Since the height of the mounting table and the movable table can be made close to each other, the flatness of the substrate can be achieved. Thereby, the shape, processing, and the like can be realized. The substrate holding device according to the fourteenth aspect of the invention is the above-described substrate protection device: a device in which a position corresponding to the position of the i-th adsorption portion and a position corresponding to the position of the second adsorption portion are the i-th and the 2 The adsorption unit is in an ON state. Thereby, even when passing through the boundary region, the substrate does not move, so that stable measurement can be realized. (Effects of the Invention) According to the present invention, it is possible to provide an optical measuring apparatus and a substrate holding apparatus which can easily perform stable measurement. [Embodiment] (Embodiment 1) The measuring device of the present embodiment is an optical measuring device that performs measurement using transmitted light that has passed through a sample. The measuring device is used to measure the pattern or defect provided in the sample. Specifically, it is used to measure the shape of the pattern, the width of the pattern, the position of the defect, the size of the defect, the shape of the defect, and the like. Therefore, a microscope or an inspection apparatus using transmitted light can be used as the apparatus of the measurement 10 320004 200907332 of the present embodiment. The measuring device of the present invention is described in the first and second drawings. Fig. 1 is a plan view schematically showing the configuration of the measuring device. The second = is a squint showing the configuration of the (four) device used by the measuring device. As shown in Fig. 1, the measuring device 1A has a fixed base u, a mounting 2, a guide rail 14, a support member 16, a suction table 8, a χ rail η, a measuring head 22, a γ way 23, and abutting. Part 48. The measuring device ι is an inspection device for inspecting the sample 50. Further, as shown in Fig. 2, the stage device 10 for holding the sample 50 has a fixed base u, a mounting table 12, a guide rail 14, a support member 16, and a suction stage 18. Here, the sample 50 will be described as a color filter substrate used in a display device such as a liquid crystal display device. The color filter substrate is provided with a coloring layer of three colors of r, G, and B and a light shielding layer provided between the colored layers. In the measuring device 100 of the present embodiment, the adsorption stage 18 is provided under the sample 5 。. Further, the sample 50 is illuminated from the back side by the illumination source 41 provided on the adsorption stage 18. The measuring head 22 is placed on the sample 50. The light passing through the sample 5 is received by the photodetector provided in the measuring head 22. The detector is, for example, a CCD camera or the like. This allows you to take an image of 5 试 of the sample. Therefore, the pattern shape, the pattern width, and the like of the sample 50 can be determined. Furthermore, the size and position of the defect can be determined by comparison with a normal pattern. And it is possible to check whether the sample is normal. As shown in Fig. 1 and Fig. 2, the horizontal plane is set to the χγ plane. Also, the X direction and the γ direction are the fathers of each other. The sample 5 〇 is arranged roughly horizontally. In the XY plane. Furthermore, the direction of the straight line is set to the Z direction. In addition, the upper surface of the fixed 320004 11 200907332 $ π is parallel to the χ γ plane. The fixed base 11 is, for example, mounted by f and fixed to the ground. Alternatively, the fixed base can be mounted via a damper 用来 for absorbing vibration. Y rails 23 are respectively disposed at both ends of the mouthpiece base 11. The Y track 23 is along the Y direction. That is, the length direction of the Y lane 23 is parallel to the Y direction, and the X lane η is provided above the two gamma lanes 23. The X implementation C 21疋 is set along the X direction in such a manner that the sample is 5 过. The length direction 疋 of the χ track 21 is parallel to the χ direction. The measuring head 22 is mounted on the squatting road. The measuring head 22 is arranged to be movable relative to the X-track 21. Therefore, the boring head 22 moves in the χ direction. A photodetector such as a camera or a lens is provided on the measuring head. The measuring head 22 receives light from the light source 41 of the adsorption stage 8 to be described later. Further, the epi-illumination optical system may be disposed in the measuring head 22.蕤舲,^,丨_ • 'Well, both penetration illumination and epi illumination can be used. Further, a laser light source for laser addition 1 can be disposed in the measuring head 22. Thereby, the defective part can be corrected. Further, the 'X track 21 is set to be movable relative to the gamma track 23. Therefore the X orbit will move in the direction of the 。. Therefore, measure 5. Go up and move. That is, by moving the measuring head in the direction of movement and moving the wire in the X-track 2WY direction of the measuring head U, the measurement 帛 22纟ΧΥ can be moved. Thereby, the sample 50 can be measured comprehensively. Moreover, since the measuring device U) can be reduced. The settings, between, can improve productivity. The driving of the measuring head 22 and the command path 21 is performed by a well-known method such as an AC servo motor.

再者，在固定機座U上方固定有兩條载置台U 320004 12 200907332 '料50係被載置於該載置台12上。載置二19 θ 向設置。亦即，載置台置;1 12疋沿著Υ方 而反，恭番σ 12的長度方向是與Υ方向平行。 載置口 12疋配置在兩條γ執道23之 是離開達對應於試料50大小的距離 :置口 12 端會被載置於載置台12上。| 忒枓50的兩 口 ·^上。亦即’載置台12 形成用來載置試料50的載置面。 的上表面係 在固定機座11上是如第1圖所 14。此外，第2 II龙政7 ’、 口疋有兩條導執 此外第2圖角略了一條導軌14 >VL ^ Y ^ m . 圓不 ％•執 14 是 /口者Y方向投置。亦即，導執M 疋 平行。導軌14#咿要+ 長度方向疋與Y方向 卞灯等軌14疋配置在兩個載置台12之門 上配垮右蚪粗ςΛ m 之間。在導執14 上配叹有忒科50。因此，導執14 導軌14的上表面比载置M2… 低。亦即’ 戰罝口 12的載置面還低。因此，在導 執14與試料50之間設有間隙。 導 在該導軌14上以可移動之方式支持 如，吸附A 1 8 3銶丄A 丁 π叹町口 18。例 ㈣。〜藉由線性導件等被安裝在導軌 此，藉由兩條導執14，將吸 主 狀態。因此，可水平8支持成可滑動移動的 導轨14朝丫方向務動旅士 及附口】8會沿者 行照明的位置。動藉此，可使吸附台】8移動至要進 著Χ 是:如矩形的平板狀構件。吸附台18是沿 平彳f '、即，吸附台18的長度方向是與X方向 及附台U是配置在兩個载置纟12之間。吸附台^ 疋形成大致與兩個载置厶12 口 附n從+戟置σ 12的間隔相同的長度。因此，吸 疋從一方载置纟12的内侧附近延伸到另一方载置 320004 13 200907332 c ’台12的内側附近。亦即，吸附台i 8包含x方向的整個产 查範圍。吸附台18會沿著導軌14朝γ方向滑動。亦即欢 導軌14係形成為使吸附台18移動的滑執。吸附台18的驅 動可使用AC伺服馬達等眾所周知的方法來進行。 在吸附台18設有照明光源41。照明光源41是例如射 出線狀光的線狀光源。在此，具有與x方向平行之線狀光 點的照明光會從照明光源41射出。藉此’可在χ方向照 明整個檢查範圍。在該吸附台18上載置有試料5〇。而且， 在吸附台18設有用來吸附試料5〇的吸附口。可在吸附試 料50的狀態下進行測定。藉此，可降低振動，並進行穩定 的測定。 " 針對該吸附台18的構成，參照第3圖加以說明。第3 圖是吸附台18之構成的側視圖。第3圖（a)顯示吸附台18 正在移動的狀態，第3圖（b)顯示吸附台18停止的狀態。 在吸附台18設有作為線狀光源的照明光源41。照明 光源41是配置在γ方向中的吸附台is的大致中央。照明 光源 41 具有 LED(Light Emitting Diode)42 及擴散板 43。 LED42及擴散板43是埋設在設於吸附台18的凹部。具體 而言’是在Y方向中的吸附台18的大致中央形成凹部。 凹部是沿著X方向形成。該凹部係為在χ方向中設於吸附 台18之大致整體的凹槽。並且在該凹部中配設作為點光源 的LED42。在此’複數個LED42是沿著X方向排列。以 等間隔沿著X方向將複數個LED42配置成一行。例如， 將LED42每隔2cm配置。並且在複數個LED42上覆蓋擴 14 320004 200907332 疋以X方向為長度方向的矩形平板狀Furthermore, two mounting tables U 320004 12 200907332 are fixed above the fixed base U. The material 50 is placed on the mounting table 12. Place the two 19 θ direction settings. That is, the mounting table is placed; 1 12 疋 is reversed along the Υ, and the length direction of the 番 12 is parallel to the Υ direction. The loading port 12疋 is disposed on the two γ lanes 23 to be separated by a distance corresponding to the size of the sample 50: the port 12 end is placed on the mounting table 12. | 忒枓50 two mouths · ^ on. That is, the mounting table 12 forms a mounting surface on which the sample 50 is placed. The upper surface is attached to the fixed base 11 as shown in Fig. 1. In addition, the 2nd II Longzheng 7 ‘, the mouth has two guides. In addition, the second figure has a guide rail 14 > VL ^ Y ^ m. The circle is not the same as the 14 is / mouth is placed in the Y direction. That is, the guide M 疋 is parallel. Guide rail 14# main + length direction 疋 and Y direction The rails 14 such as xenon lamps are arranged on the doors of the two mounting tables 12 between the right and the bottom. On the guide 14, there is a sigh of 50. Therefore, the upper surface of the guide rail 14 is lower than the mounting M2. That is, the mounting surface of the Warhead 12 is still low. Therefore, a gap is provided between the guide 14 and the sample 50. The guide rail 14 is movably supported, for example, to adsorb A 1 8 3 銶丄 A 叹 町 町 mouth 18 . Example (4). ~ Mounted on the guide rail by linear guides etc. With the two guides 14, the main state will be sucked. Therefore, the level 8 can be supported as a position where the slidably movable guide rail 14 is moved toward the squatting direction and the accommodating side 8 is illuminated. By this, the adsorption stage 8 can be moved to enter the Χ: a rectangular flat member. The adsorption stage 18 is disposed along the horizontal axis f', that is, the longitudinal direction of the adsorption stage 18 is between the X direction and the attachment stage U is disposed between the two placement cassettes 12. The adsorption stage is formed to have substantially the same length as the interval between the two mounting ports 12 and n from the +戟 σ 12 . Therefore, the suction is extended from the vicinity of the inner side of one of the mounting pockets 12 to the vicinity of the inner side of the other mounting surface 320004 13 200907332 c '. That is, the adsorption stage i 8 contains the entire inspection range in the x direction. The suction stage 18 slides along the guide rail 14 in the γ direction. That is, the joy rail 14 is formed as a slipper that moves the suction stage 18. The driving of the adsorption stage 18 can be carried out using a well-known method such as an AC servo motor. An illumination source 41 is provided on the adsorption stage 18. The illumination light source 41 is, for example, a linear light source that emits linear light. Here, illumination light having a linear spot parallel to the x direction is emitted from the illumination light source 41. This can be used to illuminate the entire inspection area in the direction of the 。. A sample 5〇 was placed on the adsorption stage 18. Further, the adsorption stage 18 is provided with an adsorption port for adsorbing the sample 5〇. The measurement can be carried out in the state in which the sample 50 is adsorbed. Thereby, the vibration can be reduced and a stable measurement can be performed. " The configuration of the adsorption stage 18 will be described with reference to Fig. 3 . Fig. 3 is a side view showing the configuration of the adsorption stage 18. Fig. 3(a) shows a state in which the adsorption stage 18 is moving, and Fig. 3(b) shows a state in which the adsorption stage 18 is stopped. An illumination source 41 as a linear light source is provided on the adsorption stage 18. The illumination light source 41 is substantially at the center of the adsorption stage is disposed in the γ direction. The illumination light source 41 has an LED (Light Emitting Diode) 42 and a diffusion plate 43. The LED 42 and the diffusion plate 43 are embedded in a recess provided in the adsorption stage 18. Specifically, the concave portion is formed substantially at the center of the adsorption stage 18 in the Y direction. The recess is formed along the X direction. The concave portion is a groove provided in a substantially entire portion of the adsorption stage 18 in the weir direction. Further, an LED 42 as a point light source is disposed in the recess. Here, the plurality of LEDs 42 are arranged along the X direction. A plurality of LEDs 42 are arranged in a row along the X direction at equal intervals. For example, the LEDs 42 are arranged every 2 cm. And covering a plurality of LEDs 42 with a rectangular plate shape extending in the direction of the X direction 14 320004 200907332

保持試料50。 散板43。擴散板43是以： 構件。因此，配置成一行的 擴散板43是配設在吸附台 LED42係朝上方射出照明光。照明光會朝向擴散板^ 射出。接著，從LED42射出的光會在擴散板43擴散。亦Keep the sample 50. Dispersion plate 43. The diffusion plate 43 is a member. Therefore, the diffusion plates 43 arranged in a row are disposed on the adsorption stage LED 42 to emit illumination light upward. The illumination light is emitted toward the diffusion plate ^. Then, the light emitted from the LED 42 is diffused on the diffusion plate 43. also

光源。藉由使用線狀光源，可照明χ方向的整個檢查範圍。 因此，只要使照明光源僅朝γ方向移動，便可檢查整個試 料50。亦即，只要在吸附台丨8有單向的驅動機構，便可 在試料50的任意位置進行測定。 又，可取代擴散板43而使用折射率高的導光板。在此 情況下’在導光板的側面或下面射入光時，該光會在導光 板内反覆全反射並傳播。接著，光會從導光板的上面射出。 藉此，即使減少LED42的數量，也可均勻地照明線狀的區 域。再者，照明光源41例如可使用燈光源等。當然，照明 光源41並不限定於該等構成。而且，照明光源41並不限 於線狀光源。亦可僅照明由測定頭22所測定的區域。亦 即，只要使設在測定頭22的光檢測器的視野均勻地被照明 即可。具體而言’可以僅使複數個LED42中的一部分發 光’並均勻地照明視野。在該情況下’當測定頭22朝χ 15 320004 r 200907332 w 方=移動時’係依序掃描進行發光的L£；D42。亦即，係依 測定頭22的位置來切換LED42的〇N/〇FFe如此，最好 使用可照明線狀之照明區域的照明光源4】。亦即，即使不 使其朝Υ方向移動，照明光源41也會照明沿著χ方向的 線狀區域。亦可使其照明帶狀的區域。 吸附台18設有用來吸附試料50的吸附口 45。因此， 從吸附π 45吸㈣體時，試料則—部分就會被吸附在 吸附口 18。具體而言，以χ方向為長度方向的帶狀區域會 如第3圖⑻所示被吸附。藉此，可在對應於吸附台18的 區域保持試料5G。如此，吸附台18會吸附並保持試料5〇 的-部分。進行測定的期間，試料5G是由吸附台18所吸 附。藉此，可降低在測定中產生的振動，且可進行更穩定 的測定。 _ 吸附口 45疋配置在以χ方向為長度方向的照明光源 的兩側。亦即，將兩個吸附口 45在γ方向分開配置。 而且’在兩個吸附口 45之間配置有照明光源41。吸附口 45是朝X方向延伸的溝槽狀。或是，亦可沿* χ方向排 列複數個吸附口 45。藉由在照明光源41的兩侧設置吸附 口 45，可確實地吸附正被照明的照明區域。藉此，可正確 地進行測定。 再者，在吸附台18設有噴出氣體的噴出口 46。在吸 附口 45的外側配置有嘴出口 46。因此，吸附口 45是在γ 方向設在照明光源41的兩側。從噴出口 46噴出氣體時， 在試料5〇與吸附台18之間會產生間隙（空氣間隙）。如第3 320004 16 200907332 圖⑷所示，在從喷出口 46嘴出有氣體㈣分，試料％會 汁起。亦即，試料50之對應於吸附台18的部分會向上鼓 起。因此，在吸附台18與試料5〇之間會產生間隙。因此， 要移動時，係使吸附停止，再從喷出口 “喷出氣體。藉此， :可使吸附台18不與試料50干擾地移動。可使吸附台18 个、速地移動。喷出π 46是朝X方向延伸的溝槽狀。或是， 亦可沿著Χ方向排列複數個嘴出口 46。藉由在吸附口 45 的外側設置喷出π 46,可使試料5()與吸附台18確實分 開噴出口 46最好是設在γ方向中的吸附台18的端部附 近。可使吸附台18更快速地移動。 實際要進行檢查時，是將測定頭22配置在吸附台18 上二亦即’在吸附台18與測定頭22之間配置有試料5〇。 ，著’吸附並保持試料50。藉由吸附台18的照明光源4卜 义下側…、明δ式料5〇。由設在測定頭22的光檢測器接受穿 透過試料50的穿透光。光檢測器典型為CCD相機。藉由 該CCD相機來拍攝試料5〇的像。藉此，可測定試料％ 的圖案形狀等。結束該位置的測定之後，使測定頭2 2及吸 附台18同步移動。要使其移動時，首先停止吸附，再從喷 出口牝噴出氣體。藉此，在試料5〇與吸附台以之間會產 生間隙。接著’移動至下一個測定位置之後，停止噴出， 再從吸附口 45吸附。藉此便可保持試料5〇。以上述 對於整個或一部分試料50進行檢查。 二 要檢查大致整個試料50時，會使吸附台18移動至試 料50的端。並且使測定頭22移動至吸附台18的正上 17 320004 200907332 ’方。在此，先使測定頭22移動至x方向之 吸附口 45歿弓丨*盗工π 接者’從 的狀能 二〃吸附試料50。在吸附並保持試料50 二，使線狀的照明光從照明光源41射出。由 22檢測出該昭明并中空 疋頭 先中牙透過試料50的穿透光。測定頭22 ΓΛΙΓΓ上側接受穿透過試料5G的穿透光。測定頭 曰拍攝線狀照明區域中的一部分。藉此，拍 的像，並觀察試料5〇的一部 ’light source. By using a linear light source, the entire inspection range in the x-direction can be illuminated. Therefore, the entire sample 50 can be inspected as long as the illumination source is moved only in the gamma direction. That is, as long as the adsorption table 8 has a one-way drive mechanism, the measurement can be performed at any position of the sample 50. Further, a light guide plate having a high refractive index can be used instead of the diffusion plate 43. In this case, when light is incident on the side or the lower side of the light guide plate, the light is totally reflected and propagated in the light guide plate. Then, light is emitted from the upper surface of the light guide plate. Thereby, even if the number of the LEDs 42 is reduced, the linear region can be uniformly illuminated. Further, as the illumination light source 41, for example, a lamp light source or the like can be used. Of course, the illumination light source 41 is not limited to these configurations. Moreover, the illumination source 41 is not limited to a linear light source. It is also possible to illuminate only the area measured by the measuring head 22. In other words, the field of view of the photodetector provided in the measuring head 22 may be uniformly illuminated. Specifically, only a portion of the plurality of LEDs 42 can be illuminated and the field of view is uniformly illuminated. In this case, when the measuring head 22 is facing χ 15 320004 r 200907332 w square = moving, the system is sequentially scanned to emit L £; D42. That is, the 〇N/〇FFe of the LED 42 is switched depending on the position of the measuring head 22. Thus, it is preferable to use an illumination source 4 that illuminates a linear illumination region. That is, the illumination source 41 illuminates the linear region along the x-direction even if it is not moved in the direction of the pupil. It can also be used to illuminate the banded area. The adsorption stage 18 is provided with a suction port 45 for adsorbing the sample 50. Therefore, when the π 45 suction (four) body is adsorbed, the sample is partially adsorbed to the adsorption port 18. Specifically, the strip-shaped region having the χ direction as the longitudinal direction is adsorbed as shown in Fig. 3 (8). Thereby, the sample 5G can be held in the region corresponding to the adsorption stage 18. Thus, the adsorption stage 18 adsorbs and holds the - portion of the sample 5〇. During the measurement, the sample 5G was adsorbed by the adsorption stage 18. Thereby, the vibration generated in the measurement can be reduced, and a more stable measurement can be performed. _ The suction port 45疋 is placed on both sides of the illumination source in the χ direction. That is, the two adsorption ports 45 are disposed separately in the γ direction. Further, an illumination light source 41 is disposed between the two adsorption ports 45. The adsorption port 45 has a groove shape extending in the X direction. Alternatively, a plurality of adsorption ports 45 may be arranged in the * χ direction. By providing the adsorption ports 45 on both sides of the illumination light source 41, the illumination area being illuminated can be reliably absorbed. Thereby, the measurement can be performed correctly. Further, the adsorption stage 18 is provided with a discharge port 46 for discharging a gas. A nozzle outlet 46 is disposed outside the suction port 45. Therefore, the adsorption ports 45 are provided on both sides of the illumination light source 41 in the γ direction. When gas is ejected from the discharge port 46, a gap (air gap) is generated between the sample 5〇 and the adsorption stage 18. As shown in Fig. 3 (32), 200907332, there is a gas (four) at the mouth of the discharge port 46, and the sample % will rise. That is, the portion of the sample 50 corresponding to the adsorption stage 18 will bulge upward. Therefore, a gap is generated between the adsorption stage 18 and the sample 5〇. Therefore, when moving, the adsorption is stopped, and the gas is ejected from the discharge port. Thereby, the adsorption stage 18 can be moved without interfering with the sample 50. The adsorption stage can be moved 18 times. π 46 is a groove shape extending in the X direction, or a plurality of nozzle outlets 46 may be arranged along the Χ direction. By placing π 46 on the outer side of the adsorption port 45, the sample 5() and the adsorption can be made. It is preferable that the stage 18 is separated from the discharge port 46 in the vicinity of the end of the adsorption stage 18 in the γ direction. The adsorption stage 18 can be moved more quickly. When the inspection is actually performed, the measurement head 22 is placed on the adsorption stage 18. In the second embodiment, the sample 5 is placed between the adsorption stage 18 and the measuring head 22. The sample 50 is adsorbed and held. The illumination source 4 of the adsorption stage 18 is the lower side of the light source. The light detector provided in the measuring head 22 receives the transmitted light penetrating the sample 50. The photodetector is typically a CCD camera. The image of the sample 5 拍摄 is taken by the CCD camera. Pattern shape, etc. After the measurement of the position is completed, the measuring head 2 2 and the adsorption stage 18 are synchronized. When moving, first stop the adsorption, and then eject the gas from the discharge port. This causes a gap between the sample 5〇 and the adsorption stage. Then, after moving to the next measurement position, the discharge is stopped. Further, it is adsorbed from the adsorption port 45. Thereby, the sample 5〇 can be held. The whole or a part of the sample 50 is inspected as described above. 2. When substantially the entire sample 50 is to be inspected, the adsorption stage 18 is moved to the end of the sample 50. The measuring head 22 is moved to the upper side of the adsorption stage 18 at 17 320004 200907332 ' square. Here, the measuring head 22 is first moved to the x-direction adsorption port 45 殁 丨 盗 盗 盗 π π ' ' 从 从 从 从 从Sample 50. The sample 50 is adsorbed and held, and linear illumination light is emitted from the illumination source 41. The transmitted light of the first and second hollow teeth passing through the sample 50 is detected by 22, and the measurement head 22 is received by the upper side. Passing through the sample 5G of the transmitted light. The head is photographed as part of the linear illumination area. By taking the image and observing a part of the sample 5'

方向逐漸移動，並進行—條匕檢接測定頭22朝X 從-端逐漸移動至另一端=ΐ。亦即，使測定頭22 ㈣所照明的線狀的照明區域。=方=由照明光 域整體逐新進行測定。 方式對線狀的照明區 結束一條線的檢查之後’將利用吸附台18進行的吸附 予以解除’而從喷出口 46噴出氣體。藉此，會形成試料 附台 的狀態。接著，在使其^㈣之狀 心下，使吸附台18與測定頭22在¥方向錯開。亦即，僅 以一條線的量使吸附台18及測定頭22移動。接著，同檨 ::定頭22朝X方向移動，然後進行第二條線的測定。’ 反覆該步驟，進行測定直到試料5 Q的另_端。以 對試料5〇測定。亦即’朝Y方向掃描吸附台18，並1循 序掃描(崎^ _)敎頭22。藉此，可檢查整個試料50。 如此，進行測定之區域係配置在吸附台18之正上方。 而且禮僅對吸附台！ 8之一部分所對應的區域進行照明。亦 即，僅吸附台！ 8之對應照明光源41的線狀區域被昭明。 僅由該照明光所照明之照明區域的一部分成定頭 320004 18 200907332 •之視野。藉由進行吸附，可減侦$ & + 振動。 了減低產生在進行攝像之區域的 複數::二I1圖及第2圖所示，在固定機座11上設有 複數個支持構件16。支持構件 又有 侧。支持構件16是支持 疋配置在载置台12的内 件μ是沿著z方針狀構件。各個支持構 件16的上端叔f 而且’試料5〇是藉由令支持構 仵16的上鳊抵接於試料 才再 持構件16支持吸附纟支持。亦心可利用支 相對於試料50的振動而卜々°卩分。藉此，可更為降低 i請：士 且可降低試料50的撓曲。 支持構件16是排列成矩 列複數個支持構件16。第i圖及第：；= = 7_件16，“方向排列 ：向列: 排列並不限於上述例子。在此，支持的數量及 方向為樺列，以γ古“支持構件16的排列是以χ 日 向為縱列。在Χ方向，支梏禮杜Μ 疋配置在導執1 14的兩側。亦 、 縱列之間配置有導轨14。更具體而在f持構件的縱列與 弟歹J的支持構件16與第2列支持構件^ 固導執14。另外，在從第 ㈣與第4列支持構件16之門配:：來第3列的支持構 支持構“是:有一個導轨14。 置台u的載置面If 下側。因此，比起載 高度。另外，亦可/*持構件16的上端是形成大致相同的 的上端比載 考慮试枓5〇的撓曲性，使支持構件16 載置面稍低。關於支持構件Μ的詳細構成容後敘 320004 19 200907332 • 述0 冉者’在吸附台18設有抵接部4S。抵接部4s會 :台因二Γ動。由於該抵接部48會與支持構件^抵 而在支持槿择持構件16》疋轉。藉此，支持構件16會倒下， ==6與試料5。之間產生間隙。吸附 過該間隙。可防止吸附台18與支持構件 k 避免吸附台18移動時與支持構件 /、P， Μ移動後之位置的支持如…：擾。例如，吸附台 延伸設置的支持構件16會倒下：疋因二朝Z方向 傾斜。藉此，支持構件16的上端會支離=二6會從2方向 形成有供吸附台18通過試料的下表面。 。18通過4料5〇與支持構件16之間。 接著’利用第4圖及第$園.,^ 動作加以t 圖，針對支持構件16的旋轉 側視圖。更具體而言 m 10之構成的 著試料50之狀㈣相、圖⑷疋顯示支持構件16支持 料50之壯咋/硯圖，第4圖⑻是顯示未支持著試 並未與抵接部48抵接的狀能^ 4圖⑷⑹示支持構件b 與抵接部48抵接，4圖⑻顯示支持構件Μ 圖是支持構件16之動作的說日^6。正在旋轉的狀態。第5 結。構件16是—所連 是沿著X方向設置。輪35 f: 16旋轉的旋轉軸。轴35 接部32連接。藉此 广设在支持構件16下部的連 X方向鄰接的支持構件16係藉由 320004 20 200907332 轴35而連接。在連接部32的 支持構件16與抵接部48未接 端是與試料50接觸。 上方延伸設有支持銷34。在 觸的狀態下，支持銷34的上 — X方向的兩端之連接於支持構件16的軸35 3 女裝在載置台12。載置台12是將軸％ 卜 態。軸35是被插入設於導軌14的貫穿孔。如的: 巧列的四個支持構…藉由轴35而連I:即' =二所有的支持構件16係藉由軸35而連結連2即 如===复广_件16會同時旋轉。例 個支持構件i“合“ 35為旋轉轴而旋轉時，其他三 同的角轉。此時’四個支持構件〗一 列的支持構件Μ會同時旋轉。 ·Γ)31。第：:支f:件16的-個設有凸輪滾輪(_ 設有凸輪滾第2個的支持構件16 時，抵接部48會抵接於持構件16附近 輪冓成凸輪機構。因此=:抵她^ 華觸時，如第5S 一 田-邛48與凸輪滾輪31 部…方:的二:=^ 轉運動。藉此，安運動;：換成以㈣為旋轉轴的旋 文裝有凸輪滾輪31的岁拉错杜& 因此，原本支持著試料5支：構们6會旋轉。 50分開。亦即，旋轉 、 的上端37會從試料 並且，二3支持構件16不再支持試料50。 件心輔35 :3:=件16舆其他支持構 、，口此，杈一列的支持構件16 320004 21 200907332 ^同時旋轉。如第4圖⑻所示’試料5〇與支持構件w會 :開。亦即，在試料50下方會形成可供吸附台18通過的 空間。而可使吸附台18通過旋轉後的横一列的支持構件 16。如上所述，能藉由簡便的機構來防止吸附台18與 構件16之干擾。 、 如第5圖所示，抵接部48是在γ方向形成比吸附台 18之吸附面寬的寬度。因此，配置在吸附台18正下方： 支持構件16會旋轉。可確保可供吸附台18通過的空間。 在支持構件16的正上方也可進行測定。再者，如第$圖所 不’形成凸輪的抵接部48的兩端是形成斜面形狀。， 抵接部48之與凸輪滾輪31抵接的抵接面是形成從水平面 傾斜的斜面。在此，抵接部48的抵接面是形成曲面。因此， 抵接部48的抵接面會缓和地變化。藉此，纟持構件 緩緩地逐漸旋轉。因此可緩和衝擊。藉此，可提升吸 18的移動速度’且可使吸附台18快速地移動。 ’ σ 田、σ I8更進—少秒勒万足轉的支持 件16時，抵接部48會從凸輪滾輪31離開。藉此，掊4 件16會回復原狀，並與試料5〇抵接。亦即，支持 的上端37會與試料5G的下面接觸。又，由於抵接^ 的兩端是形成斜φ形狀，因此支㈣件16會緩緩 復到原來的角度。因此，可緩和試料5〇盥 1 觸時的衝^此外’料心輪滾輪31舆抵 觸的狀態下加以彈麗，使支持構件16回復原狀 ^ 抵接部48從凸輪滾輪31離開時，支持構件^會回到原^ 320004 22 200907332 持構件16的上端會與試料5。接觸，並支 16是以轴35曰^會回到第4圖的狀態。此外，支持構件 -、凝轉軸朝兩方向轉動。藉此，盔 台18朝±γ方向任一 川、 附 ^ ^ 方向移動的情況下，都會在試料50 ，、支持構件16之間產生間隙。 拉钟:上所述’吸附台18正下方以外的支持構件W會支 …；:5〇。亦即，只有對應於吸附纟18的棒一列的支持 構件16舍旌鏟。B 夕J的克持 疋以令與抵接部48所抵接之支持 構件16相同橫歹(f合合古姓:士塞# , , t ' 之去旋轉’與抵接部48所抵接 支持構件16不同橫列的支持構件16不會旋轉的方式， =試料50。旋轉的支持構件16以外的支持構件“是 持=5〇抵接。如上所述，吸附台18以外的部位是由支 rr宽=支Γ藉此可降低振動。又’亦可依據吸附台 、寬又及位置，同時使橫兩列以上的支持構件“旋 ^然，在吸附台18位於在Y方向鄰接的支持構件Μ之間 的情況下，亦可使所有支持構件16與試料5〇抵接。 如上所述，抵接部48會與吸附台18 一起移動。由於 該抵接部48會與支持構件16抵接，因此支持構件μ會離 開試料50。因此匕’即使是為了降低振動而設置支持構件Μ 的構成，也可使吸附台18自由地移動。而且，由於不需 使支持構件16升降，因此可形成簡便的構成。亦即， 要支持構件的升降機構及其控制。由於測定装置是2 成單純的構造，因此可大幅縮短組裝步驟。因而可提=味 產性。 开生 320004 23 200907332 • 再者’要搬運試才4 50時，不需要支持構件16 褚此可縮短產出時間（iactiime) : =、搬㈣，'使一及吸附台== 座 之端。藉此，測定頭22及吸附A丨8 #、g 台12更外側處。接著，驅動伴持右附二18係退避至比载置 將試料50搬運至載置么的搬運機器人， 將試料5〇交付至载置^此使搬運機器人下降， 秒μ八 戟置D 12。此訏，搬運機器人的手臂會 ^動至不g與支持構件16及導執14干擾 :搬運機器人的手臂移動至導執14與支持構件16之^。 臂移動至支持構件16與支持構件16之間。藉此， :在::：進行試料50的裝载、卸载。因而可 間’並提升生產性。 ^ 1=#亦可在並排成橫—列的兩個以上的支持構件16 °並且’亦可使抵接部48抵接於各個凸 輪/袞輪31。此外，可藉由減今i 摄从 」猎由减少要设置凸輪滾輪31的支持 構件16的數量，來削減凸輪機構的零件數目。再者，可藉 ::35來連結兩個以上的支持構件Μ，來削減凸“ 。曰因此’即使在為了檢查大型基板而增加支持構 牛16之數量的情況下’也可形成簡便的構成。 再者，並不限於使支持構件10 _的構成，亦可為使 ”朝上下方向移動的構成。只要設有將水平方向的運動轉 換為垂直方向之運動的凸輪機構即可。又，吸附台Μ的移 動方向及照明光源之照明區域的方向並不限於正交。亦 即’只要是吸附台18的移動方向與照明光源之照明區域的 320004 24 200907332 . 方向為不同的方向即可。 此外，上述說明是以液晶龜_ Ψ ^ U ^ 4不裝置等顯示裝置的彩色 ^ a- ^ ^ A ^ , 」利用在CCD相機等固態攝 像兀件用的彩色濾光片基板。者 基板以外的圖案基板。例如，亦田二可利用在彩色遽光片 管等螢光體的修正。再者，亦可/用在卿或陰極射線 膜電晶體陣列基板。又，亦可為液=液晶顯示裝置的薄 j j馬液晶顯示面板或弁置 (變形例） 回微A元卓寺 針對本變形例的光學測定# 明。第6圖是干…置，使用第6圖來加以說 〇又在載台裝置〗〇的支持構件16 此!，與實施形態1相同的構成則省略 槿6圖疋為了說明的簡化’省略了一部分的 稱戚。 持構件16 6圖所不’在Υ方向，以兩端所配置的支 =為知側支持構件16a，以其他支持構件Μ為内 牛⑽。因此，從上面算來第—列及從上面算來The direction is gradually moved, and the strip-measurement measurement head 22 is gradually moved toward the X-end to the other end = ΐ. That is, the linear illumination area illuminated by the measuring head 22 (four) is made. = square = measured by the illumination field as a whole. In the case of the line-shaped illumination area, after the inspection of one line is completed, the adsorption by the adsorption stage 18 is released, and the gas is ejected from the discharge port 46. Thereby, the state of the sample attached table is formed. Next, under the condition of (4), the adsorption stage 18 and the measuring head 22 are shifted in the direction of the ¥. That is, the adsorption stage 18 and the measuring head 22 are moved by only one line. Next, the same 檨 :: fixed head 22 moves in the X direction, and then the second line is measured. This step is repeated and the measurement is carried out until the other end of the sample 5 Q. The sample was measured at 5 Torr. That is, the scanning stage 18 is scanned in the Y direction, and the scanning head 22 is sequentially scanned (sand _). Thereby, the entire sample 50 can be inspected. Thus, the area to be measured is placed directly above the adsorption stage 18. And the ceremony is only for the adsorption station! The area corresponding to one of the 8 parts is illuminated. That is, only the adsorption station! The linear region of the corresponding illumination source 41 of 8 is shown. Only a part of the illumination area illuminated by the illumination light is fixed. 320004 18 200907332 • The field of view. By performing adsorption, the $ & + vibration can be detected. The plural number generated in the area where imaging is performed is reduced: two I1 views and two figures are shown, and a plurality of supporting members 16 are provided on the fixed base 11. The support member has a side. The support member 16 is a support member. The inner member μ disposed on the mounting table 12 is along the z-guide member. The upper end f of each of the support members 16 and the sample 5 are supported by the holding member 16 by the upper member of the supporting member 16 abutting the sample. It is also possible to use the vibration of the sample 50 with respect to the vibration of the sample 50. In this way, it is possible to reduce the i: please and reduce the deflection of the sample 50. The support members 16 are arranged in a matrix of a plurality of support members 16. Figure i and paragraph:; = = 7_piece 16, "Orientation: Neighbor: The arrangement is not limited to the above example. Here, the number and direction of support are birch columns, and the arrangement of support members 16 is Take the χ day as a column. In the Χ direction, the 梏 梏 梏 疋 疋 is placed on both sides of the guide 1 14 . Also, guide rails 14 are disposed between the columns. More specifically, the support member 16 and the second column support member 14 of the column of the holding member and the second column support member 14 are fixed. In addition, in the support of the fourth (fourth) and fourth column support members 16, the support structure of the third row is: "There is one guide rail 14. The lower surface of the mounting surface If is placed on the bottom u. Therefore, compared with In addition, the upper end of the holding member 16 may have substantially the same upper end than the load-receiving test, and the supporting member 16 may have a slightly lower mounting surface. The detailed configuration of the supporting member Μ容后叙320004 19 200907332 • 0 0 ' 'There is a contact portion 4S on the adsorption table 18. The abutment portion 4s will be: the two are swayed. Since the abutment portion 48 will be supported by the support member The support member 16 is twisted. Thereby, the support member 16 is lowered, and a gap is formed between the ==6 and the sample 5. The gap is absorbed. The adsorption stage 18 and the support member k can be prevented from moving the adsorption stage 18. The support of the position with the support member /, P, Μ is as follows: For example, the support member 16 which is extended by the suction stage will fall down: 疋 because the two are inclined in the Z direction. Thereby, the upper end of the support member 16 Will be separated = two 6 will form from the 2 direction for the adsorption table 18 to pass the lower surface of the sample. 5〇 and the support member 16. Next, the rotation view of the support member 16 is performed by using the FIG. 4 and the #园., ^ operation, and the t-shaped view, more specifically, the sample 50 of the composition of m 10 (4) Phase, Figure (4) 疋 shows the support member 16 supporting the material 50, and Figure 4 (8) shows the unsupported test and does not abut the abutment portion 48. Figure 4 (4) (6) shows the support member b The abutting portion 48 abuts, and the figure (8) shows that the supporting member 是 is the state of the support member 16. The state is being rotated. The fifth member is connected to the X direction. The wheel 35 f: 16 is rotated by the rotating shaft. The shaft 35 is connected to the connecting portion 32. The supporting member 16 which is adjacent to the lower portion of the supporting member 16 and which is adjacent to the X direction is connected by the shaft 32 of the 320004 20 200907332. The support member 16 and the abutting portion 48 are not in contact with the sample 50. The support pin 34 is extended upwardly. In the contact state, both ends of the support pin 34 in the upper-X direction are connected to the support member 16. The shaft 35 3 is worn on the mounting table 12. The mounting table 12 is in the state of the shaft. The shaft 35 is inserted into the guide rail 14 Perforation. For example: The four support structures of the QC are connected by the axis 35: I = '= Two of the support members 16 are connected by the axis 35, ie, ===复广_件16会Simultaneous rotation. When the support member i "closes" 35 is rotated for the rotation axis, the other three angles are rotated. At this time, the support members of the "four support members" column will rotate at the same time. · Γ) 31. : Support f: One of the members 16 is provided with a cam roller (_ When the second support member 16 of the cam roller is provided, the abutting portion 48 abuts against the rim of the holding member 16 to form a cam mechanism. Therefore =: arrived at her ^ Hua touch, such as the 5S a field - 邛 48 with the cam roller 31 ... square: two: = ^ turn movement. In this way, the movement is replaced with: (4) is the rotation of the axis, and the cam roller 31 is equipped with the cam roller 31. Therefore, the sample 5 is originally supported: the structure 6 will rotate. 50 separate. That is, the upper end 37 of the rotation, from the sample, and the two support members 16 no longer support the sample 50. Auxiliary 35:3:=piece 16舆Other support structure, this port, the support member of the column 16 320004 21 200907332 ^ Simultaneous rotation. As shown in Fig. 4 (8), the sample 5〇 and the support member w will be opened. That is, a space through which the adsorption stage 18 passes is formed below the sample 50. The suction stage 18 can be passed through the rotating support member 16 in a row. As described above, the interference between the adsorption stage 18 and the member 16 can be prevented by a simple mechanism. As shown in Fig. 5, the abutting portion 48 has a width wider than the adsorption surface of the adsorption stage 18 in the γ direction. Therefore, it is disposed directly below the adsorption stage 18: the support member 16 is rotated. The space available for the adsorption stage 18 can be ensured. The measurement can also be performed directly above the support member 16. Further, both ends of the abutting portion 48 forming the cam as shown in Fig. $ are formed in a bevel shape. The abutting surface of the abutting portion 48 that abuts against the cam roller 31 is a slope that is inclined from a horizontal plane. Here, the abutting surface of the abutting portion 48 is a curved surface. Therefore, the abutting surface of the abutting portion 48 gently changes. Thereby, the holding member gradually rotates gradually. Therefore, the impact can be alleviated. Thereby, the moving speed of the suction 18 can be increased and the suction stage 18 can be moved quickly. When the σ field and the σ I8 are further advanced, the contact portion 48 is separated from the cam roller 31 when the support member 16 is rotated. As a result, the 件4 pieces 16 will return to their original state and will abut the sample 5〇. That is, the supported upper end 37 will come into contact with the lower surface of the sample 5G. Further, since both ends of the abutting ^ are formed in an oblique φ shape, the branch (four) member 16 is gradually restored to the original angle. Therefore, it is possible to alleviate the impact of the sample 5〇盥1 contact, and the "the center wheel roller 31" is in a state of being in contact with each other, and the support member 16 is returned to the original shape. When the abutting portion 48 is separated from the cam roller 31, the supporting member ^ will return to the original ^ 320004 22 200907332 The upper end of the holding member 16 will be with the sample 5. The contact and the branch 16 are returned to the state of Fig. 4 with the axis 35 曰^. In addition, the support member - and the condensing shaft rotate in both directions. As a result, when the helmet 18 moves in the direction of the ±γ direction and the direction of the ^^, a gap is formed between the sample 50 and the support member 16. Pulling clock: The supporting member W other than the lower side of the adsorption stage 18 will support: 5〇. That is, only the support member 16 of the row of rods corresponding to the suction crucible 18 is shovel. The yoke of B 夕 J is the same as that of the support member 16 abutting against the abutting portion 48 (f is combined with the ancient surname: 士塞#, , t 'rotate' is abutted against the abutting portion 48 The supporting member 16 of the supporting member 16 in different courses does not rotate, = the sample 50. The supporting member other than the rotating supporting member 16 "holds 5 〇 abuts. As described above, the portion other than the adsorption stage 18 is The support rr width = support can reduce the vibration. In addition, according to the adsorption table, the width and the position, the support members of the two rows or more can be "spinned", and the adsorption table 18 is located adjacent to the support in the Y direction. In the case of between the members, all of the support members 16 may be brought into contact with the sample 5A. As described above, the abutment portion 48 moves together with the suction table 18. Since the abutment portion 48 is in contact with the support member 16, Therefore, the support member μ leaves the sample 50. Therefore, even if the support member Μ is provided to reduce the vibration, the adsorption stage 18 can be freely moved. Moreover, since the support member 16 does not need to be lifted and lowered, Forming a simple structure, that is, supporting the lifting mechanism of the member and Control. Since the measuring device has a simple structure of 2, the assembly procedure can be greatly shortened. Therefore, the taste can be improved. The opening is 320004 23 200907332 • In addition, when the test is required, the support member 16 is not required. This can shorten the output time (iactiime): =, move (four), 'make one and the adsorption stage == the end of the seat. Thereby, the measurement head 22 and the adsorption A丨8 #, g table 12 are further outside. Then, drive With the right attachment 2 18, the transport robot that has been retracted to transport the sample 50 to the load is placed, and the sample 5 is delivered to the mount. The transport robot is lowered, and the second is set to D 12 . The arm of the transport robot will not interfere with the support member 16 and the guide 14: the arm of the transport robot moves to the guide 14 and the support member 16. The arm moves between the support member 16 and the support member 16. Therefore, at:::: loading and unloading of the sample 50. Therefore, it is possible to improve productivity. ^ 1=# can also be arranged side by side in two rows of support members 16 ° and 'also The abutting portion 48 can be abutted against each of the cams/wheels 31. In addition, the subtraction i can be taken from The hunting reduces the number of parts of the cam mechanism by reducing the number of the support members 16 on which the cam roller 31 is to be provided. Further, the two or more support members can be connected by: 35 to reduce the convexity. Even in the case where the number of the support bogies 16 is increased in order to inspect the large-sized substrate, a simple configuration can be formed. Further, the configuration of the support member 10 _ is not limited to the configuration of moving the support member 10 _ in the vertical direction. It suffices to provide a cam mechanism that converts the motion in the horizontal direction into the motion in the vertical direction. Further, the moving direction of the suction stage and the direction of the illumination area of the illumination source are not limited to being orthogonal. That is, as long as the direction of movement of the adsorption stage 18 and the illumination area of the illumination source are 320004 24 200907332. The directions are different. Further, the above description is based on the color filter of a solid-state image pickup device such as a CCD camera, which is a color ^ a- ^ ^ A ^ of a display device such as a liquid crystal turtle _ Ψ ^ U ^ 4. A pattern substrate other than the substrate. For example, Yitian 2 can use the correction of phosphors such as color calender tubes. Furthermore, it can also be used in a crystal or a cathode ray film transistor array substrate. Further, it may be a thin liquid crystal display panel or a liquid crystal display device (variation). The micro-A Yuanzhuo Temple is also described in the optical measurement of the present modification. Fig. 6 is a dry view, and the support member 16 of the stage device is described with reference to Fig. 6, and the same configuration as that of the first embodiment is omitted. FIG. 6 is omitted for simplicity of explanation. Part of the praise. In the Υ direction, the support members 16 are arranged in the Υ direction, the support members 16a disposed at both ends, and the other support members 内 as the inner cows (10). Therefore, counting the first column from above and counting from above

I::二面來算…_支持構件W 〆弟2列至第6列的支持銷為内側支持構件 古姓ΛY方向的兩個端側支持構件16 a之間配置有内侧 支持構件⑽。又’在載置台12真空吸附有試料5〇。 在本變形例中，係使藉由抵接部48而從試料5〇離開 、支持構件16之回復原來狀態的速度改變。亦即，改變從 支持，件16與試料5G分開的狀態回復到支持著試料50 之狀恶的速度。具體而言，是依據支持構件16的位置來改 25 320004 200907332 ，夂又讶稱仟m的回復速度。藉由端側支持構件i6a及内側 支持構件16b，使以軸35為旋轉軸而旋轉的旋轉速度產生 變化。因此’從抵接部48與支持構件16分開的不支持狀 態’轉變成支持構件16與試料5G接觸的支持狀態為止的 時間是依支持構件16而不同。在此，是使端侧支持構件 16a的回復速度比内側支持構件16b的回復速度快。 载置台12係支持著矩形狀之試料50的兩側。在此， 是將試料50的長邊載置於載置台12。亦即，試料5〇之長 邊側的端部是由载置台12 %支持。因此，矩形狀之試料 50的短邊側的端部並未由載置台12所支持。亦即，試料 5〇的短邊側是開放的狀態。試料5〇之短邊附近在不支持 狀態下的撓曲量會變大。因此，是使端側支持構件心的 回復速度比内侧支持構件i 快。 另方面，在内侧支持構件16b ’ .可減緩回復速度。 在對應於内側支持構件16b的部分，係在γ方向的兩側配 置有支持構件16。例如，在第3列之内側支持構件⑽的 兩側配置有第2列及第4列的内侧支持構件⑽。因此， 即使-列内侧支持構件16b形成不支持狀態，兩側•的支持 構件16也會支持試料5Q。因此，在對應於内侧支持構件 16b的部分’試料5〇的撓曲量會變得比對應於端側支持構 件16a的部分小。亦即，在端侧支持構件i6a的附近，在 不支持狀態下的試料50的撓曲量會變大。因此，使内側支 持構件⑽的回復速度比端側支持構件10a的回復速度 慢。藉此，可抑制作為試料5〇的玻璃基板之衝擊以及對於 26 320004 200907332 •吸附台18的負荷。因此可提升耐久性。又，可抑制作為試 料5〇的玻璃基板之過大變形。因此可防止載置台12之直 空吸附脫離。 口 … 接著’針對改變支持構件16之回復速度的構成例，利 用弟7圖加以說明。第7圖是顯示支持構件16正在進行旋 轉動作之樣態的側視圖。如第7圖所示，由於抵接部W 的抵接面會與凸輪滾輪31接觸，因此支持銷34會旋轉。 =此^上述同樣地’支持鎖34係以麵35為旋轉軸而旋 明。又^於與上述實施形態相同的構成則適當省略說 1月：又…圖中，三個支持構件^是朝Υ方向排列。 角产合=部48是從右側朝左側逐漸移動，支持鎖34的 ==ί7Γ所示的狀態，經由第7圖⑻及第7圖⑷ 所不的狀恕’變化成第7圖⑷的狀態。 的钭所示’在抵接部48設有與凸輪滾輪w接觸 :亦即，抵接部48之與凸輪滾 疋形成斜面形狀。在仪J低按面 兩側。左侧屏而Μ , 向申，斜面是設在抵接部48的 即使在朝±丫方向㈣形狀對稱。藉此’ 16°=:r，的斜構件 田抵接部48與設在正中本 31接觸時，支持 、、支持構件16的凸輪滾輪 心連接部ί/Λ斜在亦即，支持著凸輪滾輪 48之左側的斜面舆凸 二二” ’抵接部 會朝抵接部，反進行“傾;接 320004 27 200907332 •端會從試料50(未圖示）逐漸離開。並且形 5〇的非切狀態。在此，斜面與凸輪滾輪3 料 因此，隨著抵接部48朝左側行進，支持 =。 漸變大。 4的倒角會逐 圖(bl抵接？從第7圖⑷的狀態朝左側前進時，如第7 圖⑻所不，凸輪滾輪31會與抵接部㈣ ㉞如弟7 抵接部48的水平面與凸輪滾輪會相接觸。^ °在此， =的狀態下’比起第7圖⑷所示的狀態觸^ 更進—步朝右側傾倒。因此’支持銷34的倒角會=會 外’在凸輪滾輪31與水平面接觸的期 鎖3此 角不會有所變化。 叉持銷34的倒 再者’當抵接部48前進時，在 凸輪滾輪的接觸位置水平面中， _所示，抵接部48j = :移動。接著，如第7 接觸。支持鎖34會逐漸旋轉，支持鱗^輪〆衰輪31會相互 隨著抵接部48朝左方移動，倒 :倒角會變小。 48的斜面從凸輪滾輪31離㈣，如^ U、。當抵接部 鎖34會回復原來的角度。亦即 圖⑷所示，支持 端37與試料5〇接觸。藉此，支件=會直立，使上 50的狀態。 ' θ形成支持試料 本變形例中，為了使支掊 38。彈簧38的一端是安裝在連接部=回輕’設有彈簧 固定機座η(第7圖中未圖示) ’另-端是固定在 輪滾㈣接觸’使支持鎖34傾料如彈=接部48舆凸 坪耳38會伸長。接 320004 28 200907332 •= ’藉由該彈簧38的彈力，使支持鐵34則复 部48之與凸輪滾輪31接觸的部分從水平面了二’ 進至斜面時，彈簧38會逐漸縮短。 面逐新前 示的狀態下，彈簧38會變得比第 7圖（c)所 藉由彈簧38的彈力，使支持们 不的狀態短。 接著’當抵接部48_超過凸輪滾輪漸由凝轉: 38的彈力，支持鎖34會回到原來的角度並讀簧 的減震器39。：哭=!:件16回復原狀時之衝擊 碑展态π疋固疋在固定機 =震器39會與回復原狀時的支持構件ι 例且’ 之從連接C。在此’減震器39會與支持構件μ 之從連接4 32朝下方延伸的部分 於支持構件16的衝擊。 精此了綾和施加 例如’可藉由改變彈箬3 s 回復速度。藉由彈的強度來調整 ^強度來調整喊速度時，係提高 常數π的支持構件16的彈簧38之彈菁強度 強度比内側支持構件16b之彈簧38的彈箬強 = 可縮短端側支持構件16a的回復時間。’、又強藉此 要利用減震器39調整回復速度時，係加強設在欲使盆 ^點回復的支持構件16的減震器39之強度。因此，係 ”而則支持構# 16a之減震器39的強度比内側支持構件 320004 29 200907332 。藉此，可減緩内側支持構件16b 側支持構件16b與試料5〇碰撞 16b之減震器39的強度強 的回使速度。因此可抑制内 時的衝擊。 再者，亦可利用不同的凸輪來驅動内側支持 Μ ==構件1以改變回復速度。例如，在内則 持構件⑽及端側支持構件-改變凸輪滾輪31的位置^ 亦：’使X方向的凸輪滾輪31的位置錯開。藉此，在端 :=iT6a及内侧支持構件咐’使χ方向的抵接面 構件16 Λ化。再者’在内側支持構件⑽及端側支持 j牛a，使與凸輪滾輪31抵接的抵接面的形狀改變。例 如’使設在緩慢回制輕構件16的抵接㈣斜面角度緩 Π Ργ使叹在内侧支持構件16b的抵接面的傾斜緩和， =方向的抵接面的長度。如上所述，藉由改變凸輪 =輪的位置，可使抵接㈣形狀產生變化。 據列寺構件16所回復的速度及回復的時間。 n :广’：可不是抵接面’而是使凸輪滾輪31的形狀不 .备然’亦可使凸輪滾輪31與抵接面兩者皆不同。藉由 改變抵接部48與支持構件16接 曰 回復速度。如上所述，…二 ::側支持構…置不同形狀的凸輪，即^ 擊。===== 320004 30 200907332 持構件16與試料50之吸附因碰撞時的衝擊而脫離。當然 亦可組合彈菁38、減震器39及凸輪形狀中的兩個以田上、、、， 來改變回復速度。再者’亦可利用除此以外的方法來改變 回復速度。 要使支持構件16全部以相㈣速度回歸狀時，必須 使其配合快速回復的支持構件16的回復速度。亦即，為了 使撓曲量大的部分的支持構件16快速復原，必須配合該支 持構件16的回復速度，此，關於撓曲量小且不需要快速 回復的支持構件16，回復速度也會變快。因此，難以抑制 支持構件！6與試料5G碰撞時之衝擊。本變形例由於是依 據支持構件16的位置，使支持構件16的回復速度產生變 化’因此可減緩一部分支持構件16 #回復速度。藉此，可 抑制支持構件16與$料5G碰撞時所施加的衝擊。當然， 要減緩回復速度的支持構件16並不限於内側支持構件 16b例如’加快在與支持構件16分開之狀態下的挽曲量 會變大的支持構件16的回復速度，並減緩其他支持構件 16的回设速度。藉此’亦可復準備三種以上的彈簧％等， =復速度形成三個階段以上。例如，可每列地調整支持 構件16的回復速度。 (實施形態2) 以對Ϊ只施形態之載台展置1〇的構成，利用第8圖加 以=。弟8圖是示意性顯示實施形態2的載台裝置ι〇 之構成的俯視圖。此外，關认 適•省…'，貫施形態1相同的構成則 說明。例如，支持構件16等的動作、構成與實施 320004 31 200907332 形態1相同’因此省略圖示及其說明。本實施形態是以 為基板保持裝置的載台裝置ίο的構成為中心進行說明。 實施形態2的載台裝置10是在載置台12設有吸附部 13。吸附部13具有吸附孔及吸附凹槽等。亦即，在载置1 12的上表面形成有吸附孔及吸附凹槽等。而且，可從吸二 部13的吸附孔等吸引大氣。在將試料5〇载置於载^台= 上的狀態下進行吸引時，吸附孔内會減壓。藉此，可真办 吸附試料50。再者，本實施形態是將吸附部13分成兩: 系統。亦即，在載置台12形成有第}吸附部Ua及第1^ 吸附部13b。 如第8圖所示’載置台12是配置在試料％的兩側。 亦即，在試料50的右侧及左側分別配置有載置台12。因 此，兩個載置台12是分開配置。亦即，兩個载置台^在 x方向是分開配置，吸附台18係在其間移動。 各個載置台12是沿著Y方向設置。在各個载置台 設有第1吸附部13a及第2吸附部l3b。在此，在一個载 置台12設有七個吸附孔。七個吸附孔是沿著γ方向排列。 而且，兩端的吸附孔為第1吸附部13a，其間的吸附孔為 第2吸附部13b。因此，在γ方向的載置台12的端部設有 第1吸附部13a，在載置台12的中央部設有第2吸附部 13b。在一方的載置台12中’帛i吸附部13&具有兩個吸 附孔’第2吸附部13b具有五個吸附孔。 在第1吸附部13a經由配管連接有第1切換部15&。 弟1切換部15 a係控制第1吸附部13 a的動作。具體而古， 320004 32 200907332 :='換部15a來切換。吸附部i3a的開敌/關閉 (^ 例如，第1切換部⑸具有真空|、及設在^ 配管中的閥等。而Η，茲+ es 而且猎由使閥開閉，以控制第〗吸附部 \3a的ΟΝ/OFF動作。當第！切換部15&使第i吸附部… 形成ON „式料5〇的四個角落會被吸附。又，當第1切 換部15&使第1吸附部13a形成⑽時，試料50的四個 角落的吸附會被釋放。 同樣地’在第2吸附部13b經由配管連接有第2切換 部15b。第2切換部15b係與第！切換部⑸同樣地控制 第2吸附部i3b的動作。藉此，可切換第2吸附部別的 N/OFF動作。虽第2切換部！ ％使第2吸附部13b形成 ON時’試料50的長邊中央部會被吸附。又，當第2切換 部15b使第2吸附部13b形成〇FF時，試料5〇之長邊中 央部的吸附會被釋放。如上所述，由於第、切換部i5a及 第2切換部15b’因此要進行吸附之切換的區域並不相同。 第1切換部15a及第2切換部15b是獨立的。因此， 可使第1吸附部13a及第2吸附部13b的一方為〇N，使 另一方為OFF。當然，亦可使第2吸附部13a及第2吸附 部13b雙方皆為on。第1切換部15a及第2切換部15b 係依據吸附台18的位置來切換〇n/〇fF。此外，第8圖中， 關於連接於左侧載置台12的第1切換部15a及第2切換部 15b ’由於與連接於右側載置台12的第1切換部15a及第 2切換部15b相同，因此加以省略。I:: Two-sided... _ support member W The support pin of the second row to the sixth row is the inner support member. The inner support member (10) is disposed between the two end support members 16a in the ΛY direction. Further, a sample 5 was vacuum-adsorbed on the mounting table 12. In the present modification, the speed at which the sample member 5 is separated from the sample 5 by the abutting portion 48 and the support member 16 is returned to the original state is changed. That is, the change from the state in which the member 16 is separated from the sample 5G is restored to the speed at which the sample 50 is supported. Specifically, it is based on the position of the support member 16 to change 25 320004 200907332, and is also surprised by the recovery speed of 仟m. The end side support member i6a and the inner side support member 16b change the rotational speed at which the shaft 35 rotates. Therefore, the time from the unsupported state in which the abutting portion 48 is separated from the supporting member 16 to the supporting state in which the supporting member 16 is in contact with the sample 5G differs depending on the supporting member 16. Here, the recovery speed of the end side supporting member 16a is made faster than the recovery speed of the inner side supporting member 16b. The mounting table 12 supports both sides of the rectangular sample 50. Here, the long side of the sample 50 is placed on the mounting table 12. That is, the end portion of the long side of the sample 5 is supported by the mounting table at 12%. Therefore, the end portion on the short side of the rectangular sample 50 is not supported by the mounting table 12. That is, the short side of the sample 5 is open. The amount of deflection in the unsupported state near the short side of the sample 5 。 becomes large. Therefore, the recovery speed of the end side support member core is made faster than that of the inner support member i. On the other hand, the inner support member 16b' can slow down the recovery speed. In the portion corresponding to the inner side support member 16b, the support member 16 is disposed on both sides in the γ direction. For example, the inner side support members (10) of the second row and the fourth row are disposed on both sides of the inner side support member (10) in the third row. Therefore, even if the column inner support member 16b is formed in an unsupported state, the support members 16 on both sides support the sample 5Q. Therefore, the amount of deflection of the sample 5' at the portion 'corresponding to the inner side support member 16b becomes smaller than the portion corresponding to the end side support member 16a. That is, in the vicinity of the end side support member i6a, the amount of deflection of the sample 50 in the unsupported state becomes large. Therefore, the recovery speed of the inner side support member (10) is made slower than the recovery speed of the end side support member 10a. Thereby, the impact of the glass substrate as the sample 5〇 and the load on the adsorption stage 18 of 26 320004 200907332 can be suppressed. Therefore, durability can be improved. Further, excessive deformation of the glass substrate as the sample 5〇 can be suppressed. Therefore, the direct adsorption of the mounting table 12 can be prevented from being detached. The mouth ... next is a description of a configuration example of changing the recovery speed of the support member 16 using the figure of the brother 7 . Fig. 7 is a side view showing a state in which the supporting member 16 is performing a rotating motion. As shown in Fig. 7, since the abutting surface of the abutting portion W comes into contact with the cam roller 31, the support pin 34 rotates. = This is the same as above. The support lock 34 is rotated with the face 35 as a rotation axis. Further, the same configuration as that of the above-described embodiment is omitted as appropriate. January: In the figure, the three supporting members are arranged in the Υ direction. The angle production/conversion portion 48 is gradually moved from the right side to the left side, and the state of the lock 34 is supported by == ί7 ,, and the state of FIG. 7 (4) is changed by the figure of FIG. 7 (8) and FIG. 7 (4). . The abutting portion 48 is provided in contact with the cam roller w: that is, the abutting portion 48 has a bevel shape with the cam roller. In the instrument J low press on both sides. On the left side of the screen, the slanting surface is provided on the abutting portion 48, even in the shape of the 丫 (朝) direction. When the oblique member field abutting portion 48 of '16°=:r' is in contact with the center portion 31, the cam roller core connecting portion of the support member 16 is supported, that is, the cam roller is supported. The bevel on the left side of 48 is convex and two"". The abutting portion will face the abutting portion, and the opposite will be "dip; connect 320004 27 200907332. The end will gradually leave from the sample 50 (not shown). And a 5-inch non-cut state. Here, the bevel and the cam roller 3 are thus supported as the abutment portion 48 travels to the left side. The gradient is large. The chamfer of 4 will be abruptly drawn from the picture (bl abutting? When proceeding from the state of Fig. 7 (4) to the left side, as shown in Fig. 7 (8), the cam roller 31 will be abutted with the abutting portion (four) 34 such as the abutment portion 48 The horizontal plane is in contact with the cam roller. ^ ° Here, the state of = is more advanced than the state shown in Fig. 7 (4) - the step is tilted to the right. Therefore, the chamfer of the support pin 34 will be out of the way. 'The angle of the lock 3 in the period in which the cam roller 31 is in contact with the horizontal surface does not change. The reverse of the fork pin 34 is as shown in the horizontal plane of the contact position of the cam roller when the abutment portion 48 is advanced. The abutting portion 48j = : moves. Then, as the seventh contact, the support lock 34 is gradually rotated, and the support scale wheel rim decay wheel 31 will move to the left along with the abutment portion 48, and the chamfer will become smaller. The inclined surface of 48 is separated from the cam roller 31 by (4), such as ^ U. When the abutment lock 34 returns to the original angle, that is, as shown in Fig. 4, the support end 37 is in contact with the sample 5〇. Thereby, the support member = It will stand upright and make the state of the upper 50. 'θ formation support sample In this modification, in order to make the support 38. One end of the spring 38 is attached to the connection part = light back There is a spring fixed base η (not shown in Fig. 7) 'The other end is fixed to the wheel (four) contact' so that the support lock 34 is tilted like a bullet = the joint 48 舆 the convex ear 38 will elongate. 28 200907332 •= 'With the spring force of the spring 38, the spring 38 will be gradually shortened when the portion of the support portion 34 that is in contact with the cam roller 31 from the horizontal portion of the support iron 34 is moved from the horizontal plane to the inclined surface. In the state of the spring, the spring 38 becomes shorter than the state of the support by the spring force of the spring 38 in Fig. 7(c). Then, when the abutment portion 48_ exceeds the cam roller, it is gradually condensed: 38 Elasticity, support lock 34 will return to the original angle and read the spring shock absorber 39.: Cry =!: When the 16 is restored to the original state, the impact of the monument is π 疋 疋 in the fixed machine = the shocker 39 will be restored with the original The support member ι example and 'from the connection C. Here, the damper 39 will be in contact with the portion of the support member μ extending downward from the connection 4 32 to the impact of the support member 16. It can be improved by changing the speed of the magazine 3 s. By adjusting the intensity of the bullet to adjust the speed of the shout, it is improved. The spring strength of the spring 38 of the support member 16 of the number π is stronger than that of the spring 38 of the inner support member 16b = the recovery time of the end side support member 16a can be shortened. When the recovery speed is adjusted, the strength of the damper 39 provided to the support member 16 to be returned to the basin is strengthened. Therefore, the strength of the damper 39 supporting the structure #16a is stronger than that of the inner support member 320004. 200907332 Thereby, the resilience speed of the strength of the damper 39 of the inner side support member 16b side support member 16b and the sample 5 〇 collision 16b can be reduced. Therefore, the internal shock can be suppressed. Furthermore, different cams can be used to drive the inner support Μ == member 1 to change the recovery speed. For example, the inner holding member (10) and the end side supporting member - changing the position of the cam roller 31 are also: - the position of the cam roller 31 in the X direction is shifted. Thereby, the abutting surface member 16 in the χ direction is degenerated at the end: = iT6a and the inner support member 咐'. Further, the inner support member (10) and the end side support j, and the shape of the abutting surface that abuts against the cam roller 31 is changed. For example, the abutment (four) bevel angle Π γ provided in the slow-returning light member 16 relaxes the inclination of the abutting surface of the inner support member 16b, and the length of the abutting surface in the = direction. As described above, the shape of the abutment (four) can be changed by changing the position of the cam = wheel. According to the speed of the temple component 16 and the time of reply. n : wide ': may not be the abutting surface ‘but the shape of the cam roller 31 is not. It is also possible to make the cam roller 31 and the abutting surface different. The recovery speed is contacted with the support member 16 by changing the abutment portion 48. As mentioned above, ... two :: side support structure ... set the cam of different shapes, that is, ^ hammer. ===== 320004 30 200907332 The adsorption of the holding member 16 and the sample 50 is released by the impact at the time of collision. Of course, it is also possible to combine the two of the elastic cyanine 38, the damper 39 and the cam shape to change the recovery speed in the field, and. Furthermore, other methods can be used to change the recovery speed. In order for the support member 16 to return to the phase (four) speed, it is necessary to match the recovery speed of the quick-recovering support member 16. That is, in order to quickly restore the support member 16 having a large amount of deflection, it is necessary to match the recovery speed of the support member 16, and the recovery speed is also changed with respect to the support member 16 having a small amount of deflection and requiring no quick recovery. fast. Therefore, it is difficult to suppress the support member! 6 Impact when colliding with sample 5G. In the present modification, the recovery speed of the support member 16 is changed in accordance with the position of the support member 16, so that a part of the support member 16#recovery speed can be alleviated. Thereby, the impact applied when the support member 16 collides with the material 5G can be suppressed. Of course, the support member 16 to slow the recovery speed is not limited to the inner support member 16b such as 'accelerating the recovery speed of the support member 16 which becomes larger in the state of being separated from the support member 16, and slows down the other support members 16 The speed of the setback. In this way, it is also possible to prepare three or more kinds of spring % or the like, and the complex speed is formed in three stages or more. For example, the recovery speed of the support member 16 can be adjusted per column. (Embodiment 2) A configuration in which the stage of the Ϊ-only mode is placed by one , is added by the eighth figure. Fig. 8 is a plan view schematically showing the configuration of the stage device 实施 of the second embodiment. In addition, the description of the appropriate structure, the province, and the same configuration. For example, the operation and configuration of the support member 16 and the like are the same as those of the first embodiment 320004 31 200907332. Therefore, the illustration and the description thereof are omitted. This embodiment will be described focusing on the configuration of the stage device ίο of the substrate holding device. In the stage device 10 of the second embodiment, the adsorption stage 13 is provided on the mounting table 12. The adsorption unit 13 has an adsorption hole, an adsorption groove, and the like. That is, an adsorption hole, an adsorption groove, and the like are formed on the upper surface of the mounting member 12. Further, the atmosphere can be sucked from the adsorption holes or the like of the suction portion 13. When suction is performed in a state where the sample 5 〇 is placed on the carrier table =, the pressure in the adsorption hole is reduced. Thereby, the sample 50 can be adsorbed. Further, in the present embodiment, the adsorption unit 13 is divided into two systems. That is, the first adsorption unit Ua and the first adsorption unit 13b are formed on the mounting table 12. As shown in Fig. 8, the mounting table 12 is disposed on both sides of the sample %. That is, the mounting table 12 is disposed on the right side and the left side of the sample 50, respectively. Therefore, the two mounting tables 12 are separately arranged. That is, the two mounting stages are arranged separately in the x direction, and the adsorption stage 18 is moved therebetween. Each of the mounting stages 12 is disposed along the Y direction. The first adsorption unit 13a and the second adsorption unit 13b are provided in the respective mounting stages. Here, seven adsorption holes are provided in one mounting table 12. The seven adsorption holes are arranged along the γ direction. Further, the adsorption holes at both ends are the first adsorption portions 13a, and the adsorption holes therebetween are the second adsorption portions 13b. Therefore, the first adsorption portion 13a is provided at the end of the mounting table 12 in the γ direction, and the second adsorption portion 13b is provided at the center portion of the mounting table 12. In one of the mounting stages 12, the 帛i adsorption unit 13 & has two adsorption holes. The second adsorption unit 13b has five adsorption holes. The first switching unit 15 & is connected to the first adsorption unit 13 a via a pipe. The first switching unit 15a controls the operation of the first adsorption unit 13a. Specifically, the old, 320004 32 200907332: = 'change part 15a to switch. Enemy/off of the adsorption unit i3a (^ For example, the first switching unit (5) has a vacuum|, a valve provided in the ^ pipe, etc., and +, es + es and the valve is opened and closed to control the absorbing portion ΟΝ/OFF operation of \3a. When the first switching unit 15 & turns the ith adsorption unit to ON, the four corners of the material 5 会 are adsorbed. Further, when the first switching unit 15 & makes the first adsorption unit When the formation of (10), the second switching portion 15b is connected to the second adsorption portion 13b via the pipe. The second switching portion 15b is similar to the first switching portion (5). The operation of the second adsorption unit i3b is controlled, whereby the N/OFF operation of the second adsorption unit can be switched. When the second switching unit is turned on, the second adsorption unit 13b is turned on. When the second switching unit 15b forms the second adsorption unit 13b to form the 〇FF, the adsorption of the central portion of the long side of the sample 5〇 is released. As described above, the first switching unit i5a and the second switching unit are switched. The portion 15b' is therefore not the same in the area where the adsorption is to be switched. The first switching unit 15a and the second switching unit 15b are independent. In addition, one of the first adsorption unit 13a and the second adsorption unit 13b may be 〇N and the other may be turned OFF. Of course, both the second adsorption unit 13a and the second adsorption unit 13b may be on. The portion 15a and the second switching portion 15b switch 〇n/〇fF according to the position of the adsorption stage 18. Further, in Fig. 8, the first switching unit 15a and the second switching unit 15b connected to the left side mounting table 12 'The same as the first switching unit 15a and the second switching unit 15b connected to the right side mounting table 12, it is omitted.

例如’在吸附台18位於對應於第1吸附部13 a的A 33 320004 200907332 區域的情況下，將帛！吸附部13a設為⑽，將第2吸附 設為0N。亦即，在γ方向中，當吸附台18位於試 枓50的端部時，將位於載置台12之端的第工吸附部⑴ 從ON切換成0FF。另一方面，當吸附台18位於對應於第 2吸附部13b之C區域的情況下，將第丄吸附部⑴設為 ON’將第2吸附部13b設為〇FF。亦即，當吸附台⑴立 於試料50的中央部時，將位於載置台12之中央的第2吸 附部13b從ON切換成0FF。又，當吸附台18位於對應於 第1吸附部13a與第2吸附部13b之交界的B區域的情況 下，將第1吸附部13a及第2吸附部13b的吸附設為JN。 如上所述’將位於吸附台18附近的吸附部ι3設為 OFF。藉此，可使試料50相對於吸附台18確實浮起。例 如’藉由來自吸附台18之喷出口 46的空氣，使試料5〇 從吸附台18浮起。因此，會產生供吸附台丨8通過的間隙。 接者’在試料5 0浮起的狀態下’使吸附台18移動。此時 在X方向的吸附台18的兩外侧，試料50並未由載置A 12 所吸附。因此’藉由來自吸附台18的空氣，可使試料5〇 浮起足夠的量。而可確實地設置供吸附台1 8通過的間隙 即使在縮小吸附台18與載置台12之高度差的情况飞，也 可防止吸附台18與試料50碰撞。藉此，試料50與吸附二 18將不會接觸，因此可防止試料50或吸附台18受損。 可縮小吸附台18與載置台12的高度差。 如上所述’即使不使吸附台18低於載置台12以確保 吸附台18與試料50的間隙亦可。因此’可提高執料5〇 34 32〇〇〇4 200907332 的平面度。例如，可用// m單位來調整吸附台18與載置台 12的高度差。藉此，即使在載置台12與吸附台18之間， 也可穩定地進行測定。又’即使在吸附台18位於A、C區 域的情況下，第1吸附部13a及第2吸附部13b的一方也 會吸附著試料50。因此’可防止試料50的位置偏移。 再者’在形成A、C之交界的B區域中，將第1吸附 部13a及第2吸附部13b雙方設為0N。藉此，第i吸附 部13a及第2吸附部13b雙方皆0FF的瞬間會消失。亦即， 在第1吸附部13a及第2吸附部13b的動作切換時，第j 吸附部13a及第2吸附部13b雙方會0N。藉此，試料5〇 會經常由一個以上的吸附部13所吸附，因此可防止試料 5〇移動。藉此可進行穩定的測定。 上述構成尤其在研磨修正試料5〇之缺陷時特別 效。例如，假設在測定頭22設有研磨帶等。接著，使 =動至吸附台18之正上方。亦即，在測定頭。與 之間：置有試料50。在該狀態下，使用 頭22的研磨帶來修正試料5〇的 、 試料5〇的表面接觸的狀態下，送出研磨;即夢:研磨帶與 研磨帶來研磨本身為缺關突起 =T藉由 〇13 ^ 平而疮 Γ-, 而了‘两s式料5〇m 千面度。因此’可進行穩定的研磨、修正。的 .....卜在·兮 上移動的加工用頭的加工裝置。 丹考，亦可設有與測定 0C ^ 又，亦可使用在要進行研磨以 亦即’本實施形態的基板保持裝置適=的加工裳置。 勃的加工用頭的加工奘署。$在设有在試料5〇 m 320004 200907332 =上不同的加卫頭。此外，亦可將吸㈣i3分成三個系統 依據吸附台18的位置，切換第1吸附部13a及第2 吸附部13b的ΟΝ/OFF。亦即，告哄酙厶， ^ 田吸附台18移動至第1吸 附^⑸附近時’將第1吸附部13a設為0FF，僅藉 2吸附部13b吸附。另一方面，者 θ田弟 田及附台18移動至第2吸 附部13b附近時，將第2吸附部13b設為0FF，僅藉由第 1吸附部Ua吸附。藉此，可確保吸附台18通過的^隙。 再者’通過第i吸附部13a與第2吸附部m的交界時， 將第1吸附部Ba及第2吸附部13b設為〇N。藉此，由 於任一個吸附部13會吸附，因此可確實地進行保持。 以無關吸附台18的位置之方式，將帛i吸附部13& 及第2吸附部13b雙方怪常地設為⑽時，會有無法確保 間隙之情形。因此，必須使吸附台18t匕載置纟12更降低七 ^此，試料％的平坦度會劣化，因此無法進行穩定的測 定、加工。藉此，利用本實施形態的載台裝置ι〇 定的測定、加工。 ^ 此外，亦可適當組合上述實施形態卜2及變形例來使 用。 【圖式簡單說明】 第1圖是不意性顯示本實施形態之光學測定裝置之構 成的俯視圖。 第2圖是示意性顯示本實施形態之光學測定裝置所使 用的載台裝置之構成的斜視圖。 36 320004 200907332 第3圖（a)及（b)是示意性顯示本實施形態之光學測定 裝置所使用的吸附台之構成的側面剖視圖。 第4圖⑷及（b)是不意性顯示本實施形態之光學測定 裝置所使用的載台裝置之構成的側視圖。 第5圖是本實施形態的#柱 ^ _ 〜07叉符構件之動作的說明圖。 第6圖是示意性顯示轡报 例的支持構件之配置的俯視 第7圖（a)至（d)是顯示 樣態的側視圖。 支持構件正在進行旋轉動作之 之载台裝置之構成的 第8圖是示意性顯示實施形態2 俯視圖。 【主 要元件符號說明 10 載台裝置 11 固定機座 12 載置台 13 吸附部 13a 第1吸附部 13b 第2吸附部 14 導軌 15a 第1切換部 15b 第2切換部 16 支持構件 16a 端側支持構件 16b 内侧支持構件 320004 37 200907332 18 吸附台 21 X軌道 22 測定頭 23 Y軌道 31 凸輪滾輪 32 連接部 34 支持銷 35 軸 37 上端 38 彈簧 39 減震器 41 照明光源 42 LED 43 擴散板· 45 吸附口 46 喷出口 48 抵接部 50 試料 100 測定裝置For example, in the case where the adsorption stage 18 is located in the area of A 33 320004 200907332 corresponding to the first adsorption unit 13 a, it will be 帛! The adsorption unit 13a is set to (10), and the second adsorption is set to 0N. That is, in the γ direction, when the adsorption stage 18 is located at the end of the test ram 50, the first adsorption unit (1) at the end of the stage 12 is switched from ON to 0FF. On the other hand, when the adsorption stage 18 is located in the C region corresponding to the second adsorption unit 13b, the second adsorption unit (1) is set to ON, and the second adsorption unit 13b is set to 〇FF. That is, when the adsorption stage (1) is positioned at the center of the sample 50, the second adsorption portion 13b located at the center of the mounting table 12 is switched from ON to 0FF. Further, when the adsorption stage 18 is located in the B region corresponding to the boundary between the first adsorption unit 13a and the second adsorption unit 13b, the adsorption of the first adsorption unit 13a and the second adsorption unit 13b is JN. As described above, the adsorption portion ι3 located in the vicinity of the adsorption stage 18 is turned OFF. Thereby, the sample 50 can be surely floated with respect to the adsorption stage 18. For example, the sample 5 is floated from the adsorption stage 18 by the air from the discharge port 46 of the adsorption stage 18. Therefore, a gap for the passage of the adsorption stage 8 is generated. The picker 'moves the adsorption stage 18 while the sample 50 is floating. At this time, the sample 50 was not adsorbed by the mounting A 12 on both outer sides of the adsorption stage 18 in the X direction. Therefore, the sample 5 can be floated by a sufficient amount by the air from the adsorption stage 18. Further, the gap through which the adsorption stage 18 passes can be surely provided. Even if the height difference between the adsorption stage 18 and the stage 12 is reduced, the adsorption stage 18 can be prevented from colliding with the sample 50. Thereby, the sample 50 and the adsorption unit 18 are not in contact with each other, so that the sample 50 or the adsorption stage 18 can be prevented from being damaged. The height difference between the adsorption stage 18 and the mounting table 12 can be reduced. As described above, the suction stage 18 is not lower than the mounting table 12 to ensure the gap between the adsorption stage 18 and the sample 50. Therefore, it can improve the flatness of the 5〇 34 32〇〇〇4 200907332. For example, the height difference between the adsorption stage 18 and the stage 12 can be adjusted in units of / m. Thereby, even between the mounting table 12 and the adsorption stage 18, measurement can be performed stably. Further, even when the adsorption stage 18 is located in the A and C regions, the sample 50 is adsorbed to one of the first adsorption unit 13a and the second adsorption unit 13b. Therefore, the positional deviation of the sample 50 can be prevented. Further, in the B region where the boundary between A and C is formed, both the first adsorption portion 13a and the second adsorption portion 13b are set to 0N. As a result, the moment when both the i-th adsorption portion 13a and the second adsorption portion 13b are 0FF disappears. In other words, when the operations of the first adsorption unit 13a and the second adsorption unit 13b are switched, both the j-th adsorption unit 13a and the second adsorption unit 13b are 0N. As a result, the sample 5〇 is often adsorbed by one or more adsorption units 13, so that the sample 5〇 can be prevented from moving. Thereby, a stable measurement can be performed. The above configuration is particularly effective when the defect of the polishing sample 5 is corrected. For example, it is assumed that a polishing belt or the like is provided on the measuring head 22. Next, move = to directly above the adsorption stage 18. That is, in the measurement head. Between and: Sample 50 is placed. In this state, the surface of the sample 5〇 is corrected by the polishing belt of the head 22, and the surface is in contact with the sample 5, and the polishing is performed; that is, the grinding belt and the grinding belt are themselves grinding the protrusions. 〇 13 ^ flat and sore -, and 'two s type material 5 〇 m thousand degrees. Therefore, stable grinding and correction can be performed. The processing device for the processing head that moves on ..... Dan Kao can also be provided and measured 0C ^. It can also be used in the processing of the substrate holding device to be polished, that is, the substrate holding device of the present embodiment. The processing of the processing head of Bo. $ is set on the different heads of the sample 5 〇 m 320004 200907332 =. Further, the suction (four) i3 may be divided into three systems to switch the ΟΝ/OFF of the first adsorption portion 13a and the second adsorption portion 13b in accordance with the position of the adsorption stage 18. In other words, when the field adsorption stage 18 moves to the vicinity of the first adsorption unit (5), the first adsorption unit 13a is set to 0FF, and is adsorbed only by the adsorption unit 13b. On the other hand, when the θ田田田 and the attached table 18 move to the vicinity of the second absorbing portion 13b, the second adsorption portion 13b is set to 0FF, and is adsorbed only by the first adsorption portion Ua. Thereby, the gap through which the adsorption stage 18 passes can be ensured. When the boundary between the i-th adsorption portion 13a and the second adsorption portion m is reached, the first adsorption portion Ba and the second adsorption portion 13b are set to 〇N. Thereby, since any one of the adsorption portions 13 is adsorbed, it can be reliably held. When both the 帛i adsorption unit 13& and the second adsorption unit 13b are ambiguously set to (10) so as not to correspond to the position of the adsorption stage 18, a gap may not be secured. Therefore, it is necessary to lower the adsorption stage 18t 匕 12, and the flatness of the sample % is deteriorated, so that stable measurement and processing cannot be performed. Thereby, the measurement and processing by the stage device ι of the present embodiment are utilized. Further, the above embodiment 2 and the modifications can be used as appropriate. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing the configuration of an optical measuring apparatus according to the present embodiment. Fig. 2 is a perspective view schematically showing the configuration of a stage device used in the optical measuring apparatus of the embodiment. 36 320004 200907332 Fig. 3 (a) and (b) are side cross-sectional views schematically showing the configuration of an adsorption stage used in the optical measuring apparatus of the embodiment. Fig. 4 (4) and (b) are side views showing the configuration of the stage device used in the optical measuring apparatus of the present embodiment. Fig. 5 is an explanatory view showing the operation of the #柱^_07 fork symbol member of the present embodiment. Fig. 6 is a plan view schematically showing the arrangement of the supporting members of the example of the report. Figs. 7(a) to (d) are side views showing the state of the display. Fig. 8 is a plan view showing a configuration of a stage device in which a supporting member is rotating. [Main component code description 10 Stage device 11 Fixed base 12 Mounting table 13 Adsorption unit 13a First adsorption unit 13b Second adsorption unit 14 Guide rail 15a First switching unit 15b Second switching unit 16 Support member 16a End side support member 16b Inner support member 320004 37 200907332 18 Adsorption station 21 X-track 22 Measuring head 23 Y-track 31 Cam roller 32 Connecting portion 34 Support pin 35 Shaft 37 Upper end 38 Spring 39 Shock absorber 41 Illumination light source 42 LED 43 Diffuser plate 45 Adsorption port 46 Outlet port 48 abutment portion 50 sample 100 measuring device

Claims (1)

200907332 μ、申請專利範圍·· ，一種光學測定I置，係使用穿透 行測定的光學測定裝置，其特徵為具備心來進 载置台，係載置前述試料之端部； 夕吸附台，係在前述試料的下側設置成可朝第1方 向矛夕動，並且具有用來吸附前述試料之吸附口· 從下:：ί源’係設在前述吸附台’並且對前述試料 從下側射出照明光； 係在前述試料的上側接受從前述照明光 /原牙透過别述試料的穿透光； 複數個支持構件，係設在前述試料的下側，並且 在前述載置台之内側處支持前述試料；以及 抵接部，係設在前述吸附台，並藉由與前述支持 構件之抵接，使一部分之前述支持構件的上端從前述 試料離開。 2. 如申請專利範圍第1項之光學測定裝置，其中， 、復具備將前述複數個支持構件中的兩個以上加以 連結的軸， 1々別述抵接部抵接於前述支持構件，使前述 支持構件以前述軸為旋轉軸而旋轉，而使前述一部分 之支持構件的上端從前述試料離開。 3.如申„月專利範圍第J或第2項之光學測定裝置，其中， ㈤述,、、、月光源係沿著與前述第i方向不同的第2方向 以線狀照明前述試料。 39 320004 200907332 4.如申請專利範圍第1或第2項之光學測定裝置，其中， 在前述第1方向中’設於前述吸附台的吸附口係配置 在前述照明光源的兩側。 5·如申請專利範圍第1或第2項之光學測定裝置，其中， 則述抵接部之與前述支持構件抵接的抵接面係形成斜 面形狀。 6. 如申請專利範圍第1或第2項之光學測定裝置，其中， 前述吸附台具有對前述試料噴出氣體的喷出口。 7. 如申切專利範圍第1或第2項之光學測定裝置，其中， 藉由則述抵接部而從前述試料離開的前述支持構件之 回復到支持前述試料之狀態的回復速度，係依據前述 支持構件的位置而不同。 S.如申請專利範圍第7項之光學測定裝置，其中， 沿著前述第1方向設置的前述载置台係分別配置 在前述試料的兩側， 部的 速度 則述複數個支持構件中，設在前述第丨方向之端 前述支持構件的回復速度比其他支持構件之回復 9.如申請專利範圍第7項之光學測定裝置，其中， 設有使前述支持構件回復到原來角度的彈箬， =變前述彈簧的強度，來改變前述支持 的回復速度。 】〇·如申請專利範圍第7項之光學測定裝置，， 復具有藉由與前述支持構件之碰撞而吸收前述支 320004 40 200907332 持構件回復原狀時之衝擊的減震器， 藉由改變刖述減震器的強度，來改變前述支持構 件的回復速度。 11. 如申2專利範圍第7項之光學測定裝置，其中，藉由 改變前述抵接部與前述支持構件接觸之部分的形狀， 來改變前述支持構件的回復速度。 12. —種基板保持裝置，其特徵為具備： 載置台，係載置基板之端部； 第1及第2吸附部，係設在前述載置台，用來吸 附前述基板；以及 係在前述基板的下側設置成可移動的狀 L，並且具有對前述基板喷出氣體之喷出口， — LI備用來切換前述第1及第2吸附部之開啟/ 關閉的切換部， . 前述：換部係依據前述可動台相對於前述基板的 位，將月ϋ述第i及第2吸附部的一方設開啟 一方設為關閉。 另 13.如申=專利範圍第12項之基板保持裝置，其中， =述載置台係載置前述基板之兩側的端部， 刖述可動台係以通過兩側的前 式，沿著第1方向移動， |置。之間的方 在5又於前述基板之兩側的前述载置台之各者中， 在剛述第1方向的兩端設有前述第1吸附部， 在設於前述兩端的前述第i吸附部之°間設有前述 320004 41 200907332 第2吸附部， 置時，將前、” 野應於前述第1 直于將别述第i吸附部設為及咐部的 吸附部設為開啟， 並且將前述第 昌别述可動台移動至對應於前第 置時，蔣益、+.结 疋第2及附部的位 叶將則述第2吸附部設為關閉 j位 吸附部設為開啟。 將則述第1 U. 申明專利範圍第12或第13項之基板保持裝置，其 在對應於則述第1吸附部的位置與對應於前述第2 吸附部的位置的交界區域，前述第1及第2吸附部係 开4成ON狀態。 42 320004200907332 μ, the scope of application for the patent, is an optical measuring device that uses a penetrating line measurement, and is characterized in that the center is placed on the mounting table, and the end portion of the sample is placed; The lower side of the sample is disposed so as to be movable toward the first direction, and has a suction port for adsorbing the sample. The bottom:: source is disposed on the adsorption stage' and the sample is ejected from the lower side. Illumination light; receiving light that passes through the sample from the illumination light/original tooth on the upper side of the sample; a plurality of support members are provided on the lower side of the sample, and support the aforementioned side of the mounting table The sample and the abutting portion are provided on the adsorption stage, and a part of the support member is separated from the sample by abutting against the support member. 2. The optical measuring device according to the first aspect of the invention, further comprising: a shaft that connects two or more of the plurality of supporting members, wherein the abutting portion abuts against the supporting member, The support member rotates with the shaft as a rotation axis, and the upper end of the part of the support member is separated from the sample. 3. The optical measuring device according to the Jth or the second aspect of the patent specification, wherein the (5) month, the light source is configured to illuminate the sample in a line along a second direction different from the i-th direction. The optical measuring device according to claim 1 or 2, wherein the adsorption port provided in the adsorption stage is disposed on both sides of the illumination source in the first direction. The optical measuring device according to the first or second aspect of the invention, wherein the abutting surface of the abutting portion that abuts against the supporting member has a sloped shape. 6. The optical material according to claim 1 or 2 In the measuring apparatus, the adsorption stage has a discharge port for ejecting a gas to the sample. 7. The optical measuring apparatus according to claim 1 or 2, wherein the sample is separated from the sample by the abutting portion. The recovery speed of the support member returned to the state of supporting the sample is different depending on the position of the support member. S. The optical measurement device according to claim 7, wherein, along the foregoing The mounting stages provided in one direction are respectively disposed on both sides of the sample, and the speed of the parts is the plurality of supporting members, and the recovery speed of the supporting member at the end in the second direction is higher than that of the other supporting members. The optical measuring device according to claim 7, wherein the elastic member for returning the supporting member to the original angle is provided, and the strength of the spring is changed to change the recovery speed of the support. The optical measuring device according to Item 7, further comprising a shock absorber that absorbs the impact of the member 320004 40 200907332 when the member returns to the original state by collision with the support member, by changing the strength of the shock absorber The optical measuring device of the seventh aspect of the invention, wherein the recovery speed of the support member is changed by changing a shape of a portion of the abutting portion in contact with the support member. 12. A substrate holding device comprising: a mounting table for mounting an end portion of a substrate; first and second The adsorption unit is provided on the mounting table for adsorbing the substrate, and is provided in a movable shape L on a lower side of the substrate, and has a discharge port for ejecting gas to the substrate, and LI is reserved for switching In the switching unit for opening/closing the first and second adsorption units, the change portion is configured such that one of the i-th and second adsorption units is set to be open according to the position of the movable table with respect to the substrate. The substrate holding device of claim 12, wherein the mounting stage mounts the ends of the two sides of the substrate, and the movable table is passed through the front side of the two sides. Move in the first direction, | set. In each of the mounting stages on both sides of the substrate, the first adsorption unit is provided at both ends in the first direction, and the ith adsorption unit is provided at both ends. In the case of the above-mentioned 320004 41 200907332 second adsorption unit, the first adsorption unit of the first and second adsorption portions and the crotch portion is turned on, and When the movable table is moved to correspond to the front first position, the leaves of the second and the second parts of the Jiang Yi, +. knots are described as the second adsorption unit is turned off, and the j-position adsorption unit is turned on. The substrate holding device according to the 12th or 13th aspect of the invention, wherein the first and second positions of the first adsorption unit and the position corresponding to the second adsorption unit are the first and The second adsorption unit is turned ON by 4%. 42 320004
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