TWI385226B - 用於移除聚合物阻障之研磨漿液 - Google Patents

用於移除聚合物阻障之研磨漿液 Download PDF

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Publication number
TWI385226B
TWI385226B TW095129492A TW95129492A TWI385226B TW I385226 B TWI385226 B TW I385226B TW 095129492 A TW095129492 A TW 095129492A TW 95129492 A TW95129492 A TW 95129492A TW I385226 B TWI385226 B TW I385226B
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Taiwan
Prior art keywords
aqueous slurry
phosphate
slurry
copper
weight
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TW095129492A
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English (en)
Chinese (zh)
Other versions
TW200718763A (en
Inventor
泰瑞斯Ｍ 湯瑪士
葉倩萩
Original Assignee
羅門哈斯電子材料Ｃｍｐ控股公司
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Application filed by 羅門哈斯電子材料Ｃｍｐ控股公司 filed Critical 羅門哈斯電子材料Ｃｍｐ控股公司
Publication of TW200718763A publication Critical patent/TW200718763A/zh
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Publication of TWI385226B publication Critical patent/TWI385226B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H10P95/062—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H10P52/403—

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW095129492A 2005-09-08 2006-08-11 用於移除聚合物阻障之研磨漿液 TWI385226B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US71591805P 2005-09-08 2005-09-08

Publications (2)

Publication Number Publication Date
TW200718763A TW200718763A (en) 2007-05-16
TWI385226B true TWI385226B (zh) 2013-02-11

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Family Applications (1)

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TW095129492A TWI385226B (zh) 2005-09-08 2006-08-11 用於移除聚合物阻障之研磨漿液

Country Status (7)

Country Link
US (1) US7785487B2 (enExample)
JP (1) JP5161448B2 (enExample)
KR (1) KR101257115B1 (enExample)
CN (1) CN1927975B (enExample)
DE (1) DE102006041805B4 (enExample)
FR (1) FR2890393B1 (enExample)
TW (1) TWI385226B (enExample)

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EP3444309A1 (en) 2017-08-17 2019-02-20 Versum Materials US, LLC Chemical mechanical planarization (cmp) composition and methods therefore for copper and through silica via (tsv) applications
EP3447100A1 (en) 2017-08-24 2019-02-27 Versum Materials US, LLC Metal chemical mechanical planarization (cmp) composition and methods therefore
EP3702425A1 (en) 2019-02-28 2020-09-02 Versum Materials US, LLC Chemical mechanical polishing for copper and through silicon via applications

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US20100159807A1 (en) * 2008-12-22 2010-06-24 Jinru Bian Polymeric barrier removal polishing slurry
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US20110318928A1 (en) 2010-06-24 2011-12-29 Jinru Bian Polymeric Barrier Removal Polishing Slurry
CN102358825B (zh) * 2011-08-05 2013-08-21 清华大学 一种用于蓝宝石晶片的抛光组合物
US20130045599A1 (en) * 2011-08-15 2013-02-21 Rohm and Electronic Materials CMP Holdings, Inc. Method for chemical mechanical polishing copper
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US8545715B1 (en) * 2012-10-09 2013-10-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method
CN103773244B (zh) * 2012-10-17 2017-08-11 安集微电子（上海）有限公司 一种碱性化学机械抛光液
CN103965788B (zh) * 2013-01-24 2017-10-13 安集微电子（上海）有限公司 一种碱性抛光液及抛光方法
JP2014216464A (ja) 2013-04-25 2014-11-17 日本キャボット・マイクロエレクトロニクス株式会社 スラリー組成物および基板研磨方法
CN104745086A (zh) * 2013-12-25 2015-07-01 安集微电子（上海）有限公司 一种用于阻挡层平坦化的化学机械抛光液及其使用方法
CN104745089A (zh) * 2013-12-25 2015-07-01 安集微电子（上海）有限公司 一种用于阻挡层平坦化的化学机械抛光液及其使用方法
CN106661431B (zh) * 2014-06-25 2019-06-28 嘉柏微电子材料股份公司 铜阻挡物的化学机械抛光组合物
CN107075345B (zh) * 2014-10-14 2019-03-12 花王株式会社 蓝宝石板用研磨液组合物
CN106916536B (zh) * 2015-12-25 2021-04-20 安集微电子（上海）有限公司 一种碱性化学机械抛光液
KR102422952B1 (ko) 2017-06-12 2022-07-19 삼성전자주식회사 금속막 연마용 슬러리 조성물 및 이를 이용하는 반도체 장치의 제조 방법
EP3700990B1 (en) * 2017-10-25 2023-03-29 Saint-Gobain Ceramics & Plastics, Inc. Composition for conducting material removal operations and method for forming same
KR102343435B1 (ko) * 2018-08-08 2021-12-24 삼성에스디아이 주식회사 구리 막 연마용 ｃｍｐ 슬러리 조성물 및 이를 이용한 구리 막 연마 방법

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Cited By (4)

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Publication number Priority date Publication date Assignee Title
EP3444309A1 (en) 2017-08-17 2019-02-20 Versum Materials US, LLC Chemical mechanical planarization (cmp) composition and methods therefore for copper and through silica via (tsv) applications
EP3447100A1 (en) 2017-08-24 2019-02-27 Versum Materials US, LLC Metal chemical mechanical planarization (cmp) composition and methods therefore
US10465096B2 (en) 2017-08-24 2019-11-05 Versum Materials Us, Llc Metal chemical mechanical planarization (CMP) composition and methods therefore
EP3702425A1 (en) 2019-02-28 2020-09-02 Versum Materials US, LLC Chemical mechanical polishing for copper and through silicon via applications

Also Published As

Publication number Publication date
KR20070029079A (ko) 2007-03-13
KR101257115B1 (ko) 2013-04-22
CN1927975B (zh) 2010-06-16
US7785487B2 (en) 2010-08-31
FR2890393B1 (fr) 2011-06-03
JP2007116105A (ja) 2007-05-10
US20070051917A1 (en) 2007-03-08
FR2890393A1 (fr) 2007-03-09
CN1927975A (zh) 2007-03-14
TW200718763A (en) 2007-05-16
DE102006041805B4 (de) 2017-05-11
DE102006041805A1 (de) 2007-03-15
JP5161448B2 (ja) 2013-03-13

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