TWI384579B - Substrate processing device - Google Patents

Substrate processing device Download PDF

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Publication number
TWI384579B
TWI384579B TW099103527A TW99103527A TWI384579B TW I384579 B TWI384579 B TW I384579B TW 099103527 A TW099103527 A TW 099103527A TW 99103527 A TW99103527 A TW 99103527A TW I384579 B TWI384579 B TW I384579B
Authority
TW
Taiwan
Prior art keywords
carrier
substrate
wafer
receiving
transfer
Prior art date
Application number
TW099103527A
Other languages
English (en)
Chinese (zh)
Other versions
TW201101409A (en
Inventor
Wataru Tsukinoki
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW201101409A publication Critical patent/TW201101409A/zh
Application granted granted Critical
Publication of TWI384579B publication Critical patent/TWI384579B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67363—Closed carriers specially adapted for containing substrates other than wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
TW099103527A 2009-02-10 2010-02-05 Substrate processing device TWI384579B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009028647A JP4770938B2 (ja) 2009-02-10 2009-02-10 基板処理装置

Publications (2)

Publication Number Publication Date
TW201101409A TW201101409A (en) 2011-01-01
TWI384579B true TWI384579B (zh) 2013-02-01

Family

ID=42541069

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099103527A TWI384579B (zh) 2009-02-10 2010-02-05 Substrate processing device

Country Status (5)

Country Link
US (1) US8219233B2 (ko)
JP (1) JP4770938B2 (ko)
KR (1) KR101215712B1 (ko)
CN (1) CN101800163B (ko)
TW (1) TWI384579B (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103439893B (zh) * 2013-08-16 2016-04-27 上海华力微电子有限公司 设备装载端口的预约使用控制方法
TWI549217B (zh) * 2014-01-10 2016-09-11 華亞科技股份有限公司 載具重組系統以及載具重組方法
CN107481963B (zh) * 2016-06-07 2020-01-03 中芯国际集成电路制造(上海)有限公司 一种控制晶圆排队等待时间的方法和系统
CN106449488A (zh) * 2016-11-23 2017-02-22 上海华力微电子有限公司 槽式湿法清洗设备的控制方法
TW202137380A (zh) * 2019-12-13 2021-10-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
CN111276429B (zh) * 2020-01-19 2021-07-20 长江存储科技有限责任公司 半导体机台控制方法、装置及存储介质
KR20220063853A (ko) 2020-11-10 2022-05-18 삼성전자주식회사 반송물 보관 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200849369A (en) * 2002-11-15 2008-12-16 Ebara Corp Apparatus and method for substrate processing
TW200901353A (en) * 2007-03-27 2009-01-01 Dainippon Screen Mfg Substrate treating apparatus
TW200903624A (en) * 2007-04-16 2009-01-16 Shibaura Mechatronics Corp Apparatus for treating substrates
TW200905736A (en) * 2007-03-29 2009-02-01 Tokyo Electron Ltd Substrate processing system and substrate cleaning apparatus

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04326509A (ja) * 1991-04-26 1992-11-16 Hitachi Ltd ホトレジスト処理方法および装置ならびに基板保管装置
JP2004015019A (ja) * 2002-06-11 2004-01-15 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4087328B2 (ja) 2002-11-28 2008-05-21 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法
JP4705753B2 (ja) * 2003-12-05 2011-06-22 村田機械株式会社 搬送システム
JP4342921B2 (ja) * 2003-12-09 2009-10-14 東京エレクトロン株式会社 基板処理装置の制御方法及び基板処理装置
JP4577886B2 (ja) * 2005-01-21 2010-11-10 東京エレクトロン株式会社 基板搬送処理装置及び基板搬送処理装置における障害対策方法並びに基板搬送処理装置における障害対策用プログラム
JP4845553B2 (ja) * 2006-03-27 2011-12-28 大日本スクリーン製造株式会社 基板処理装置のスケジュール実行方法及びそのプログラム
JP4893425B2 (ja) * 2007-03-30 2012-03-07 東京エレクトロン株式会社 枚葉式の基板処理装置、枚葉式の基板処理装置の運転方法及び記憶媒体
JP4877075B2 (ja) * 2007-05-29 2012-02-15 東京エレクトロン株式会社 塗布、現像装置及び塗布、現像装置の運転方法並びに記憶媒体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200849369A (en) * 2002-11-15 2008-12-16 Ebara Corp Apparatus and method for substrate processing
TW200901353A (en) * 2007-03-27 2009-01-01 Dainippon Screen Mfg Substrate treating apparatus
TW200905736A (en) * 2007-03-29 2009-02-01 Tokyo Electron Ltd Substrate processing system and substrate cleaning apparatus
TW200903624A (en) * 2007-04-16 2009-01-16 Shibaura Mechatronics Corp Apparatus for treating substrates

Also Published As

Publication number Publication date
KR20100091902A (ko) 2010-08-19
KR101215712B1 (ko) 2012-12-26
US8219233B2 (en) 2012-07-10
TW201101409A (en) 2011-01-01
JP2010186812A (ja) 2010-08-26
CN101800163B (zh) 2012-10-31
US20100204821A1 (en) 2010-08-12
CN101800163A (zh) 2010-08-11
JP4770938B2 (ja) 2011-09-14

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