TWI382074B - 切割用黏著片 - Google Patents

切割用黏著片 Download PDF

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Publication number
TWI382074B
TWI382074B TW095112613A TW95112613A TWI382074B TW I382074 B TWI382074 B TW I382074B TW 095112613 A TW095112613 A TW 095112613A TW 95112613 A TW95112613 A TW 95112613A TW I382074 B TWI382074 B TW I382074B
Authority
TW
Taiwan
Prior art keywords
base material
cut
adhesive sheet
dicing
adhesive
Prior art date
Application number
TW095112613A
Other languages
English (en)
Chinese (zh)
Other versions
TW200700527A (en
Inventor
Syouji Yamamoto
Kouichi Hashimoto
Toshio Shintani
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of TW200700527A publication Critical patent/TW200700527A/zh
Application granted granted Critical
Publication of TWI382074B publication Critical patent/TWI382074B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
TW095112613A 2005-06-22 2006-04-10 切割用黏著片 TWI382074B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005181744A JP4549239B2 (ja) 2005-06-22 2005-06-22 ダイシング用粘着シート

Publications (2)

Publication Number Publication Date
TW200700527A TW200700527A (en) 2007-01-01
TWI382074B true TWI382074B (zh) 2013-01-11

Family

ID=37582719

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112613A TWI382074B (zh) 2005-06-22 2006-04-10 切割用黏著片

Country Status (4)

Country Link
JP (1) JP4549239B2 (ko)
KR (1) KR101169479B1 (ko)
CN (1) CN1884412B (ko)
TW (1) TWI382074B (ko)

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4979063B2 (ja) * 2006-06-15 2012-07-18 日東電工株式会社 半導体装置の製造方法
JP5122893B2 (ja) * 2007-09-14 2013-01-16 株式会社ディスコ デバイスの製造方法
KR101191121B1 (ko) * 2007-12-03 2012-10-15 주식회사 엘지화학 다이싱 다이본딩 필름 및 다이싱 방법
KR100922226B1 (ko) * 2007-12-10 2009-10-20 주식회사 엘지화학 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP2009277778A (ja) * 2008-05-13 2009-11-26 Disco Abrasive Syst Ltd ウエーハの分割方法
JP2010251727A (ja) * 2009-03-24 2010-11-04 Furukawa Electric Co Ltd:The 半導体ウエハ加工用テープ
JP5253322B2 (ja) * 2009-08-05 2013-07-31 三菱樹脂株式会社 半導体製造工程粘着テープ用フィルム
JP5149888B2 (ja) * 2009-12-04 2013-02-20 リンテック株式会社 ステルスダイシング用粘着シート及び半導体装置の製造方法
JP2012079936A (ja) * 2010-10-01 2012-04-19 Nitto Denko Corp ダイシング・ダイボンドフィルム、及び、半導体装置の製造方法
KR101883648B1 (ko) * 2011-05-17 2018-07-31 린텍 코포레이션 필름 및 점착 시트
JP6084818B2 (ja) * 2012-11-14 2017-02-22 矢崎総業株式会社 発泡体及び発泡体の製造方法
JP6084819B2 (ja) * 2012-11-14 2017-02-22 矢崎総業株式会社 発泡体及び発泡体の製造方法
EP2940717A4 (en) * 2012-12-28 2016-08-10 Lintec Corp CUTTING FOIL SUBSTRATE FILM AND CUTTING FOIL
JP6211771B2 (ja) * 2013-02-08 2017-10-11 日東電工株式会社 粘着テープ
JP6167024B2 (ja) * 2013-11-22 2017-07-19 リンテック株式会社 ダイシングシート用基材フィルムおよびダイシングシート
JP6295135B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP6295132B2 (ja) * 2014-04-24 2018-03-14 日東電工株式会社 ダイシング・ダイボンドフィルム
JP6490459B2 (ja) * 2015-03-13 2019-03-27 古河電気工業株式会社 ウェハ固定テープ、半導体ウェハの処理方法および半導体チップ
TWI692519B (zh) 2015-06-11 2020-05-01 日商三井化學東賽璐股份有限公司 電子零件保護膜、電子零件保護構件、電子零件的製造方法及封裝的製造方法
CN107851602B (zh) 2015-06-29 2021-08-06 三井化学东赛璐株式会社 半导体部件制造用膜
KR102082065B1 (ko) 2016-03-31 2020-02-26 미쓰이 가가쿠 토세로 가부시키가이샤 부품 제조용 필름 및 부품의 제조 방법
JP6196751B1 (ja) 2016-03-31 2017-09-13 三井化学東セロ株式会社 部品製造用フィルム及び部品の製造方法
KR101943705B1 (ko) * 2016-06-27 2019-01-29 삼성에스디아이 주식회사 점착필름, 이를 포함하는 광학부재 및 이를 포함하는 광학표시장치
CN109906504B (zh) * 2016-11-02 2023-04-14 琳得科株式会社 隐形切割用粘着片
KR102352925B1 (ko) 2017-01-30 2022-01-18 미쓰이 가가쿠 토세로 가부시키가이샤 부품 제조용 필름, 부품 제조 용구 및 부품 제조 방법
CN110582839B (zh) * 2017-12-27 2023-06-06 古河电气工业株式会社 辐射固化型切割用粘合带
CN109233659A (zh) * 2018-09-06 2019-01-18 陈裕旺 一种po面材uv胶带及其制备方法
CN109207080A (zh) * 2018-09-06 2019-01-15 陈裕旺 一种聚烯烃面材uv胶带及其制备方法
JP6915675B2 (ja) * 2019-01-22 2021-08-04 住友ベークライト株式会社 粘着テープおよび粘着テープ用基材
JPWO2020158770A1 (ja) * 2019-01-31 2021-12-02 リンテック株式会社 エキスパンド方法及び半導体装置の製造方法
JP7328807B2 (ja) * 2019-06-26 2023-08-17 日東電工株式会社 ダイシングテープ、及び、ダイシングダイボンドフィルム
JP2021077861A (ja) * 2019-11-07 2021-05-20 日東電工株式会社 ダイシングテープ及びダイシングダイボンドフィルム
TW202200684A (zh) * 2020-03-30 2022-01-01 日商琳得科股份有限公司 基材膜及工件加工用片
CN113618840B (zh) * 2020-05-07 2023-06-02 复扬电子(苏州)有限公司 过程膜的成型方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000124169A (ja) * 1998-08-10 2000-04-28 Lintec Corp ダイシングテ―プ及びダイシング方法
US6184109B1 (en) * 1997-07-23 2001-02-06 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2618491B2 (ja) * 1989-08-05 1997-06-11 古河電気工業株式会社 放射線硬化性粘着テープ
JPH04196342A (ja) * 1990-11-28 1992-07-16 Mitsui Toatsu Chem Inc 半導体ウエハダイシング用フィルム
TW311927B (ko) 1995-07-11 1997-08-01 Minnesota Mining & Mfg
JP4545379B2 (ja) * 2003-01-06 2010-09-15 グンゼ株式会社 ダイシング用粘着シート
JP4413499B2 (ja) * 2003-01-24 2010-02-10 古河電気工業株式会社 半導体ウェハー固定用粘着テープ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6184109B1 (en) * 1997-07-23 2001-02-06 Kabushiki Kaisha Toshiba Method of dividing a wafer and method of manufacturing a semiconductor device
JP2000124169A (ja) * 1998-08-10 2000-04-28 Lintec Corp ダイシングテ―プ及びダイシング方法

Also Published As

Publication number Publication date
KR101169479B1 (ko) 2012-07-27
CN1884412B (zh) 2012-01-25
JP4549239B2 (ja) 2010-09-22
CN1884412A (zh) 2006-12-27
TW200700527A (en) 2007-01-01
JP2007005436A (ja) 2007-01-11
KR20060134790A (ko) 2006-12-28

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