TWI379373B - Substrate processing apparatus and manufacturing method for a semiconductor device - Google Patents
Substrate processing apparatus and manufacturing method for a semiconductor device Download PDFInfo
- Publication number
- TWI379373B TWI379373B TW096143938A TW96143938A TWI379373B TW I379373 B TWI379373 B TW I379373B TW 096143938 A TW096143938 A TW 096143938A TW 96143938 A TW96143938 A TW 96143938A TW I379373 B TWI379373 B TW I379373B
- Authority
- TW
- Taiwan
- Prior art keywords
- opening
- storage container
- loading
- box
- substrate
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims description 112
- 238000012545 processing Methods 0.000 title claims description 87
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000003860 storage Methods 0.000 claims description 210
- 238000011068 loading method Methods 0.000 claims description 178
- 230000007246 mechanism Effects 0.000 claims description 90
- 238000012546 transfer Methods 0.000 claims description 68
- 230000032258 transport Effects 0.000 claims description 53
- 239000007789 gas Substances 0.000 claims description 34
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000005192 partition Methods 0.000 claims description 12
- 239000011261 inert gas Substances 0.000 claims description 10
- 238000002360 preparation method Methods 0.000 claims description 7
- 238000000638 solvent extraction Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 162
- 238000013507 mapping Methods 0.000 description 36
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 32
- 230000007723 transport mechanism Effects 0.000 description 31
- 229910001873 dinitrogen Inorganic materials 0.000 description 26
- 238000000034 method Methods 0.000 description 20
- 230000036316 preload Effects 0.000 description 17
- 230000000694 effects Effects 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 9
- 238000007789 sealing Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000002245 particle Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 5
- 238000009792 diffusion process Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000009471 action Effects 0.000 description 4
- 239000003779 heat-resistant material Substances 0.000 description 4
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 description 4
- 230000009467 reduction Effects 0.000 description 4
- 229910003468 tantalcarbide Inorganic materials 0.000 description 4
- 239000000428 dust Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 238000004904 shortening Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 208000003251 Pruritus Diseases 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67389—Closed carriers characterised by atmosphere control
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006318343 | 2006-11-27 | ||
| JP2007291866A JP4891199B2 (ja) | 2006-11-27 | 2007-11-09 | 基板処理装置および半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200832592A TW200832592A (en) | 2008-08-01 |
| TWI379373B true TWI379373B (en) | 2012-12-11 |
Family
ID=39660614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096143938A TWI379373B (en) | 2006-11-27 | 2007-11-20 | Substrate processing apparatus and manufacturing method for a semiconductor device |
Country Status (3)
| Country | Link |
|---|---|
| JP (2) | JP4891199B2 (ja) |
| KR (1) | KR100932961B1 (ja) |
| TW (1) | TWI379373B (ja) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4309935B2 (ja) | 2007-07-31 | 2009-08-05 | Ｔｄｋ株式会社 | 密閉容器の蓋開閉システム及び当該システムを用いた基板処理方法 |
| JP4264115B2 (ja) | 2007-07-31 | 2009-05-13 | Ｔｄｋ株式会社 | 被収容物の処理方法及び当該方法に用いられる蓋開閉システム |
| JP2009135232A (ja) * | 2007-11-29 | 2009-06-18 | Sinfonia Technology Co Ltd | ロードポート |
| KR101015225B1 (ko) * | 2008-07-07 | 2011-02-18 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
| KR101077566B1 (ko) | 2008-08-20 | 2011-10-28 | 세메스 주식회사 | 기판 처리장치 및 이의 기판 이송 방법 |
| KR101019212B1 (ko) * | 2008-08-21 | 2011-03-04 | 세메스 주식회사 | 기판 처리 설비 및 방법 |
| KR101110621B1 (ko) * | 2008-09-12 | 2012-02-28 | 가부시키가이샤 다이후쿠 | 기판용 수납 용기와 기판용 수납 용기를 위한 기판 반송 설비 |
| WO2010135205A2 (en) * | 2009-05-18 | 2010-11-25 | Crossing Automation, Inc. | Integrated systems for interfacing with substrate container storage systems |
| US8851820B2 (en) | 2009-05-18 | 2014-10-07 | Brooks Automation, Inc. | Substrate container storage system |
| US8882433B2 (en) | 2009-05-18 | 2014-11-11 | Brooks Automation, Inc. | Integrated systems for interfacing with substrate container storage systems |
| JP5768337B2 (ja) * | 2010-07-07 | 2015-08-26 | シンフォニアテクノロジー株式会社 | ロードポート |
| KR101283312B1 (ko) | 2011-12-29 | 2013-07-09 | 로체 시스템즈(주) | Ｆｏｓｂ 오토 로딩 시스템 |
| JP2013143425A (ja) * | 2012-01-10 | 2013-07-22 | Tokyo Electron Ltd | 基板処理システム及び基板位置矯正方法 |
| CN107851594B (zh) * | 2015-08-28 | 2021-06-22 | 株式会社国际电气 | 基板处理装置以及半导体装置的制造方法 |
| JP6562803B2 (ja) * | 2015-09-30 | 2019-08-21 | 株式会社Ｓｃｒｅｅｎホールディングス | 基板処理システム |
| JP7213056B2 (ja) * | 2018-10-18 | 2023-01-26 | 東京エレクトロン株式会社 | 基板処理装置及び基板処理方法 |
| JP7113722B2 (ja) * | 2018-11-05 | 2022-08-05 | 東京エレクトロン株式会社 | 基板処理装置、基板収容容器の蓋を開閉する方法、及びプログラム |
| CN111354667A (zh) * | 2018-12-21 | 2020-06-30 | 沈阳新松机器人自动化股份有限公司 | 一种晶圆盒搬运装置 |
| CN111977290A (zh) * | 2020-08-24 | 2020-11-24 | 台州市老林装饰有限公司 | 一种光刻设备的晶圆储存盒输送小车 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1195807B1 (en) * | 1999-07-14 | 2010-01-13 | Tokyo Electron Limited | Open/close device for open/close lid of untreated object storing box and treating system for untreated object |
| JP3723398B2 (ja) * | 2000-01-28 | 2005-12-07 | 大日本スクリーン製造株式会社 | 基板処理装置および基板処理方法 |
| JP2002208622A (ja) * | 2001-01-12 | 2002-07-26 | Tokyo Electron Ltd | 縦型熱処理装置 |
| JP2002246436A (ja) * | 2001-02-16 | 2002-08-30 | Hitachi Kokusai Electric Inc | 基板処理装置 |
| JP2002246439A (ja) * | 2001-02-20 | 2002-08-30 | Tokyo Electron Ltd | 被処理体の搬出入装置と処理システム |
| JP4255222B2 (ja) * | 2001-06-22 | 2009-04-15 | 株式会社日立国際電気 | 基板処理装置、基板処理方法および半導体装置の製造方法 |
| JP4168724B2 (ja) * | 2002-10-15 | 2008-10-22 | 神鋼電機株式会社 | ロードポート |
| JP4344593B2 (ja) * | 2002-12-02 | 2009-10-14 | ローツェ株式会社 | ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法 |
| JP2004319614A (ja) * | 2003-04-14 | 2004-11-11 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| JP2005026513A (ja) * | 2003-07-03 | 2005-01-27 | Tokyo Electron Ltd | 処理装置 |
| JP4719435B2 (ja) * | 2004-07-26 | 2011-07-06 | 株式会社日立国際電気 | 半導体製造装置、半導体基板の移載方法及び半導体製造方法 |
-
2007
- 2007-11-09 JP JP2007291866A patent/JP4891199B2/ja active Active
- 2007-11-20 TW TW096143938A patent/TWI379373B/zh active
- 2007-11-23 KR KR1020070120211A patent/KR100932961B1/ko active IP Right Grant
-
2009
- 2009-03-23 JP JP2009069650A patent/JP2009177195A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009177195A (ja) | 2009-08-06 |
| KR20080047985A (ko) | 2008-05-30 |
| JP2008160076A (ja) | 2008-07-10 |
| TW200832592A (en) | 2008-08-01 |
| JP4891199B2 (ja) | 2012-03-07 |
| KR100932961B1 (ko) | 2009-12-21 |
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