TWI371777B - Heat treatment unit, heat treatment method, and computer-readable recording medium - Google Patents

Heat treatment unit, heat treatment method, and computer-readable recording medium

Info

Publication number
TWI371777B
TWI371777B TW095144627A TW95144627A TWI371777B TW I371777 B TWI371777 B TW I371777B TW 095144627 A TW095144627 A TW 095144627A TW 95144627 A TW95144627 A TW 95144627A TW I371777 B TWI371777 B TW I371777B
Authority
TW
Taiwan
Prior art keywords
heat treatment
computer
recording medium
readable recording
treatment method
Prior art date
Application number
TW095144627A
Other languages
English (en)
Chinese (zh)
Other versions
TW200802531A (en
Inventor
Yasutaka Souma
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of TW200802531A publication Critical patent/TW200802531A/zh
Application granted granted Critical
Publication of TWI371777B publication Critical patent/TWI371777B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Tunnel Furnaces (AREA)
  • Photovoltaic Devices (AREA)
TW095144627A 2005-12-06 2006-12-01 Heat treatment unit, heat treatment method, and computer-readable recording medium TWI371777B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005352131A JP4672538B2 (ja) 2005-12-06 2005-12-06 加熱処理装置

Publications (2)

Publication Number Publication Date
TW200802531A TW200802531A (en) 2008-01-01
TWI371777B true TWI371777B (en) 2012-09-01

Family

ID=38130874

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095144627A TWI371777B (en) 2005-12-06 2006-12-01 Heat treatment unit, heat treatment method, and computer-readable recording medium

Country Status (4)

Country Link
JP (1) JP4672538B2 (ja)
KR (1) KR101332120B1 (ja)
CN (1) CN100454482C (ja)
TW (1) TWI371777B (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464207B1 (ko) * 2008-05-30 2014-11-24 세메스 주식회사 평판 디스플레이 제조 장치 및 평판 디스플레이 제조에 사용되는 아이알 히터
JP4592787B2 (ja) * 2008-07-11 2010-12-08 東京エレクトロン株式会社 基板処理装置
JP4638931B2 (ja) * 2008-09-12 2011-02-23 東京エレクトロン株式会社 基板処理装置
JP4813583B2 (ja) * 2009-07-15 2011-11-09 東京エレクトロン株式会社 基板処理装置
JP2011222834A (ja) * 2010-04-12 2011-11-04 Hoya Corp ベーク処理装置、レジストパターン形成方法、フォトマスクの製造方法、及び、ナノインプリント用モールドの製造方法
JP5063741B2 (ja) * 2010-06-03 2012-10-31 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP5226037B2 (ja) * 2010-06-04 2013-07-03 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP5048810B2 (ja) * 2010-06-23 2012-10-17 東京エレクトロン株式会社 熱処理装置及び熱処理方法
JP5377463B2 (ja) * 2010-11-16 2013-12-25 東京エレクトロン株式会社 加熱処理装置
TWI557389B (zh) * 2014-10-24 2016-11-11 Dong-Ming Li Improvement of Heating Device of Light Resistance Pre - oven
JP7403234B2 (ja) * 2019-04-25 2023-12-22 東京エレクトロン株式会社 基板処理装置、及び基板処理方法

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5875154A (ja) * 1981-10-29 1983-05-06 Toppan Printing Co Ltd 加熱装置
JPH0193121A (ja) * 1987-10-05 1989-04-12 Kawasaki Steel Corp 半導体ウェハベーキング装置
JPS64738A (en) * 1988-05-20 1989-01-05 Hitachi Ltd Heat treatment of semiconductor wafer
JP2691907B2 (ja) * 1988-05-27 1997-12-17 東京エレクトロン株式会社 加熱方法及び処理装置及び処理方法
JP2931992B2 (ja) * 1990-06-02 1999-08-09 東京エレクトロン株式会社 熱処理装置
JPH05304085A (ja) * 1992-04-27 1993-11-16 Fujitsu Ltd 半導体ウェハベーキング装置
JPH07135154A (ja) * 1993-06-18 1995-05-23 Hitachi Ltd ホトレジスト膜のベーキング方法および装置
JP3052116B2 (ja) * 1994-10-26 2000-06-12 東京エレクトロン株式会社 熱処理装置
JPH0953881A (ja) * 1995-08-11 1997-02-25 Fuji Photo Film Co Ltd 硬基板のベーク装置
JP3811247B2 (ja) * 1997-02-17 2006-08-16 大日本スクリーン製造株式会社 基板加熱装置
JP3596312B2 (ja) * 1998-10-27 2004-12-02 松下電器産業株式会社 熱処理装置
JP4040814B2 (ja) * 1998-11-30 2008-01-30 株式会社小松製作所 円盤状ヒータ及び温度制御装置
JP4042244B2 (ja) * 1999-02-23 2008-02-06 松下電工株式会社 半導体マイクロアクチュエータ及び半導体マイクロバルブ及び半導体マイクロリレー
US20020088608A1 (en) * 1999-07-26 2002-07-11 Park Chan-Hoon Method and apparatus for heating a wafer, and method and apparatus for baking a photoresist film on a wafer
JP2001230199A (ja) * 1999-07-28 2001-08-24 Komatsu Ltd 半導体基板の温度制御装置及び熱交換プレート
US6344631B1 (en) * 2001-05-11 2002-02-05 Applied Materials, Inc. Substrate support assembly and processing apparatus
JP2003279245A (ja) * 2002-03-19 2003-10-02 Seiko Epson Corp 塗布膜の乾燥方法及びその装置、デバイスの製造方法、デバイス
WO2004010480A1 (en) * 2002-07-24 2004-01-29 Applied Materials, Inc. Apparatus and method for thermally isolating a heat chamber
JP4384538B2 (ja) * 2003-06-16 2009-12-16 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP4257586B2 (ja) * 2003-10-20 2009-04-22 富士電機システムズ株式会社 基板処理方法
JP4741307B2 (ja) * 2005-05-20 2011-08-03 富士フイルム株式会社 加熱装置及び加熱方法

Also Published As

Publication number Publication date
KR20070059990A (ko) 2007-06-12
CN100454482C (zh) 2009-01-21
CN1979764A (zh) 2007-06-13
TW200802531A (en) 2008-01-01
JP2007158088A (ja) 2007-06-21
KR101332120B1 (ko) 2013-11-21
JP4672538B2 (ja) 2011-04-20

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees