JP4257586B2 - 基板処理方法 - Google Patents
基板処理方法 Download PDFInfo
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- JP4257586B2 JP4257586B2 JP2003358746A JP2003358746A JP4257586B2 JP 4257586 B2 JP4257586 B2 JP 4257586B2 JP 2003358746 A JP2003358746 A JP 2003358746A JP 2003358746 A JP2003358746 A JP 2003358746A JP 4257586 B2 JP4257586 B2 JP 4257586B2
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Description
(従来改善例1)
102,202,302 処理室壁体
103,103',203,203',303,303' Oリング
104,204,304 プレートヒーター
105,105' 加熱ロール
205 ランプヒーター
207,207' 遮熱板
Claims (2)
- 共通真空室内に、基板処理工程用の独立した処理室を複数個有し、前記基板を基板搬送手段により張力をかけながら断続的に搬送して、前記複数の処理室において順次、基板処理を行うステッピングロール方式の基板処理装置であって、前記処理室は、少なくとも基板の処理部分に接触して加熱する加熱手段を有し、さらに断続的に搬送される基板の上下に函状の下部処理室壁体と上部処理室壁体とをシール部材を介して対向配置し、処理室の封止時には、前記上下処理室壁体とシール部材とにより独立した処理空間を構成するものとした基板処理装置を用いて基板処理を行う方法において、
前記基板を処理室に搬送して処理室を封止した後、前記加熱手段により予備的接触加熱を行う工程と、予備的接触加熱を停止後、一旦処理室を開放する工程と、所定時間開放後に処理室を封止して前記加熱手段により本加熱を行う工程とを含むことを特徴とする基板処理方法。 - 請求項1に記載の基板処理方法において、前記基板処理工程は、プラズマCVDや蒸着,スパッタリングによる薄膜形成処理、プラズマエッチングやプラズマによる基板の改質処理の内の少なくともいずれか一種もしくは複数種の処理を含むことを特徴とする基板処理方法。
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JP2003358746A JP4257586B2 (ja) | 2003-10-20 | 2003-10-20 | 基板処理方法 |
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JP2003358746A JP4257586B2 (ja) | 2003-10-20 | 2003-10-20 | 基板処理方法 |
Publications (2)
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JP2005123492A JP2005123492A (ja) | 2005-05-12 |
JP4257586B2 true JP4257586B2 (ja) | 2009-04-22 |
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JP2003358746A Expired - Fee Related JP4257586B2 (ja) | 2003-10-20 | 2003-10-20 | 基板処理方法 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4672538B2 (ja) * | 2005-12-06 | 2011-04-20 | 東京エレクトロン株式会社 | 加熱処理装置 |
JP5122805B2 (ja) * | 2006-12-20 | 2013-01-16 | 株式会社アルバック | 成膜装置 |
JP5468857B2 (ja) * | 2009-09-28 | 2014-04-09 | 古河電気工業株式会社 | 超電導線材の製造方法及びcvd装置 |
KR101876454B1 (ko) | 2011-09-14 | 2018-07-11 | 삼성디스플레이 주식회사 | 진공 롤투롤 장치 및 롤 타입 기판 제조 방법 |
KR102622868B1 (ko) * | 2016-11-28 | 2024-01-08 | 엘지디스플레이 주식회사 | 열충격이 방지된 롤투롤 제조장치 |
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2003
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