TWI370509B - Bipolar electrostatic chuck - Google Patents

Bipolar electrostatic chuck

Info

Publication number
TWI370509B
TWI370509B TW094108071A TW94108071A TWI370509B TW I370509 B TWI370509 B TW I370509B TW 094108071 A TW094108071 A TW 094108071A TW 94108071 A TW94108071 A TW 94108071A TW I370509 B TWI370509 B TW I370509B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
bipolar electrostatic
bipolar
chuck
electrostatic
Prior art date
Application number
TW094108071A
Other languages
English (en)
Other versions
TW200605260A (en
Inventor
Hiroshi Fujisawa
Kinya Miyashita
Original Assignee
Creative Tech Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Creative Tech Corp filed Critical Creative Tech Corp
Publication of TW200605260A publication Critical patent/TW200605260A/zh
Application granted granted Critical
Publication of TWI370509B publication Critical patent/TWI370509B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
TW094108071A 2004-03-19 2005-03-16 Bipolar electrostatic chuck TWI370509B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004081432 2004-03-19
JP2004191280 2004-06-29

Publications (2)

Publication Number Publication Date
TW200605260A TW200605260A (en) 2006-02-01
TWI370509B true TWI370509B (en) 2012-08-11

Family

ID=34993968

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094108071A TWI370509B (en) 2004-03-19 2005-03-16 Bipolar electrostatic chuck

Country Status (8)

Country Link
US (2) US20070223173A1 (zh)
JP (1) JP4684222B2 (zh)
KR (1) KR101212246B1 (zh)
DE (1) DE112005000621B4 (zh)
HK (1) HK1101451A1 (zh)
MY (1) MY138415A (zh)
TW (1) TWI370509B (zh)
WO (1) WO2005091356A1 (zh)

Families Citing this family (72)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3992018B2 (ja) * 2003-07-23 2007-10-17 松下電器産業株式会社 プラズマ処理装置
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
CN101218668B (zh) * 2005-07-08 2010-11-03 创意科技股份有限公司 静电吸盘以及静电吸盘用的电极片
US7802917B2 (en) * 2005-08-05 2010-09-28 Lam Research Corporation Method and apparatus for chuck thermal calibration
KR100994299B1 (ko) * 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척
JP4808149B2 (ja) * 2006-03-29 2011-11-02 新光電気工業株式会社 静電チャック
JP2008153543A (ja) * 2006-12-19 2008-07-03 Shinko Electric Ind Co Ltd 静電チャック
JP2008160009A (ja) * 2006-12-26 2008-07-10 Tomoegawa Paper Co Ltd 双極型静電チャック装置
KR20090107514A (ko) * 2006-12-26 2009-10-13 후지필름 디마틱스, 인크. 전도성 요소를 구비한 인쇄 시스템
JP5349805B2 (ja) * 2008-01-22 2013-11-20 株式会社日立ハイテクノロジーズ 半導体デバイス製造装置の製造方法及び半導体デバイス製造装置の洗浄方法
JP5317509B2 (ja) * 2008-03-27 2013-10-16 東京エレクトロン株式会社 プラズマ処理装置および方法
JP2009246325A (ja) * 2008-03-28 2009-10-22 Creative Technology:Kk 静電チャック
TWI475594B (zh) 2008-05-19 2015-03-01 Entegris Inc 靜電夾頭
WO2010004915A1 (ja) * 2008-07-08 2010-01-14 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR101001454B1 (ko) * 2009-01-23 2010-12-14 삼성모바일디스플레이주식회사 정전척 및 이를 구비한 유기전계발광 소자의 제조장치
JP5731485B2 (ja) 2009-05-15 2015-06-10 インテグリス・インコーポレーテッド ポリマー突起を有する静電チャック
US8861170B2 (en) 2009-05-15 2014-10-14 Entegris, Inc. Electrostatic chuck with photo-patternable soft protrusion contact surface
WO2011000689A1 (en) * 2009-06-30 2011-01-06 Asml Holding N.V. Image-compensating addressable electrostatic chuck system
KR101806926B1 (ko) 2009-07-02 2017-12-08 가부시키가이샤 크리에이티브 테크놀러지 양면 흡착 구조체, 양면 흡착 구조체의 제조방법, 및 양면 흡착 구조체를 이용한 피흡착물의 흡착방법
CN102986017B (zh) 2010-05-28 2015-09-16 恩特格林斯公司 高表面电阻率静电吸盘
NL2009487A (en) * 2011-10-14 2013-04-16 Asml Netherlands Bv Substrate holder, lithographic apparatus, device manufacturing method, and method of manufacturing a substrate holder.
US9455172B2 (en) 2012-02-29 2016-09-27 Asml Netherlands B.V. Electrostatic clamp
US9105492B2 (en) 2012-05-08 2015-08-11 LuxVue Technology Corporation Compliant micro device transfer head
US9034754B2 (en) 2012-05-25 2015-05-19 LuxVue Technology Corporation Method of forming a micro device transfer head with silicon electrode
US8415771B1 (en) * 2012-05-25 2013-04-09 LuxVue Technology Corporation Micro device transfer head with silicon electrode
US8415767B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant bipolar micro device transfer head with silicon electrodes
US8569115B1 (en) 2012-07-06 2013-10-29 LuxVue Technology Corporation Method of forming a compliant bipolar micro device transfer head with silicon electrodes
US8415768B1 (en) 2012-07-06 2013-04-09 LuxVue Technology Corporation Compliant monopolar micro device transfer head with silicon electrode
US8791530B2 (en) 2012-09-06 2014-07-29 LuxVue Technology Corporation Compliant micro device transfer head with integrated electrode leads
KR102047001B1 (ko) * 2012-10-16 2019-12-03 삼성디스플레이 주식회사 정전 척
US20140116622A1 (en) * 2012-10-31 2014-05-01 Semes Co. Ltd. Electrostatic chuck and substrate processing apparatus
KR101413898B1 (ko) * 2012-11-06 2014-06-30 엔지케이 인슐레이터 엘티디 서셉터
US9255001B2 (en) 2012-12-10 2016-02-09 LuxVue Technology Corporation Micro device transfer head array with metal electrodes
US9236815B2 (en) 2012-12-10 2016-01-12 LuxVue Technology Corporation Compliant micro device transfer head array with metal electrodes
US20160329173A1 (en) 2013-06-12 2016-11-10 Rohinni, LLC Keyboard backlighting with deposited light-generating sources
WO2015013142A1 (en) 2013-07-22 2015-01-29 Applied Materials, Inc. An electrostatic chuck for high temperature process applications
JP6518666B2 (ja) 2013-08-05 2019-05-22 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 薄い基板をハンドリングするための静電キャリア
CN105359265B (zh) 2013-08-05 2018-12-14 应用材料公司 原位可移除式静电夹盘
JP6441927B2 (ja) 2013-08-06 2018-12-19 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 局部的に加熱されるマルチゾーン式の基板支持体
WO2015042302A1 (en) 2013-09-20 2015-03-26 Applied Materials, Inc. Substrate carrier with integrated electrostatic chuck
US9460950B2 (en) 2013-12-06 2016-10-04 Applied Materials, Inc. Wafer carrier for smaller wafers and wafer pieces
WO2015171226A1 (en) 2014-05-09 2015-11-12 Applied Materials, Inc. Substrate carrier system with protective covering
US10153191B2 (en) 2014-05-09 2018-12-11 Applied Materials, Inc. Substrate carrier system and method for using the same
US9959961B2 (en) 2014-06-02 2018-05-01 Applied Materials, Inc. Permanent magnetic chuck for OLED mask chucking
JP6334338B2 (ja) * 2014-09-09 2018-05-30 京セラ株式会社 試料保持具
EP3207565A1 (en) * 2014-10-14 2017-08-23 Evatec AG Film stress uniformity control by rf coupling and wafer mount with adapted rf coupling
KR102398067B1 (ko) * 2014-11-05 2022-05-13 삼성디스플레이 주식회사 정전 척
KR102288349B1 (ko) * 2014-12-09 2021-08-11 삼성디스플레이 주식회사 정전 척 시스템과, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
JP2018518055A (ja) 2015-06-04 2018-07-05 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 透明な静電キャリア
JP6959697B2 (ja) 2016-01-15 2021-11-05 ロヒンニ リミテッド ライアビリティ カンパニー 装置上のカバーを介してバックライトで照らす装置及び方法
US10648080B2 (en) 2016-05-06 2020-05-12 Applied Materials, Inc. Full-area counter-flow heat exchange substrate support
US10460969B2 (en) 2016-08-22 2019-10-29 Applied Materials, Inc. Bipolar electrostatic chuck and method for using the same
US10923379B2 (en) * 2017-02-15 2021-02-16 Lam Research Corporation Methods for controlling clamping of insulator-type substrate on electrostatic-type substrate support structure
JP7190802B2 (ja) * 2017-02-16 2022-12-16 日本特殊陶業株式会社 静電チャックおよび基板保持方法
US11289355B2 (en) * 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
JP7374103B2 (ja) 2018-01-31 2023-11-06 ラム リサーチ コーポレーション 静電チャック（ｅｓｃ）ペデスタル電圧分離
KR20190106119A (ko) * 2018-03-07 2019-09-18 어플라이드 머티어리얼스, 인코포레이티드 부분적으로 전극이 형성된 바이폴라 정전척
US11086233B2 (en) 2018-03-20 2021-08-10 Lam Research Corporation Protective coating for electrostatic chucks
JP7059064B2 (ja) * 2018-03-26 2022-04-25 株式会社日立ハイテク プラズマ処理装置
KR102614668B1 (ko) * 2018-03-29 2023-12-19 가부시키가이샤 크리에이티브 테크놀러지 흡착 패드
US11024529B2 (en) * 2018-04-04 2021-06-01 Applied Materials, Inc. System and method for residual voltage control of electrostatic chucking assemblies
JP7020284B2 (ja) * 2018-05-14 2022-02-16 トヨタ自動車株式会社 接合用冶具
TWI819046B (zh) * 2018-08-02 2023-10-21 日商創意科技股份有限公司 靜電吸附體
US20200099760A1 (en) * 2018-09-24 2020-03-26 Salesforce.Com, Inc. Interactive customized push notifications with customized actions
KR102318925B1 (ko) * 2019-07-22 2021-10-27 김종명 기판 흡착용 정전척
US11270903B2 (en) * 2019-12-17 2022-03-08 Applied Materials, Inc. Multi zone electrostatic chuck
EP4414083A1 (en) 2021-10-06 2024-08-14 Creative Technology Corporation Electric dust collector and dust collection method using same
JP2023055411A (ja) 2021-10-06 2023-04-18 株式会社クリエイティブテクノロジー プレス金型用電気集塵機及びそれを用いたプレス金型
KR102671376B1 (ko) * 2021-11-17 2024-05-31 주식회사 에이치앤이루자 정전척 및 이를 이용한 평판 기판 척킹 방법
KR102648622B1 (ko) * 2021-12-13 2024-03-18 (주) 아이엠텍 기판 합착 장치 및 기판 합착 방법
CN114347457A (zh) * 2021-12-28 2022-04-15 广州国显科技有限公司 贴附系统及贴附方法
KR102615529B1 (ko) * 2023-09-19 2023-12-19 주식회사 제스코 이층 히터 패턴이 구비된 정전척

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5944797A (ja) * 1982-09-07 1984-03-13 増田　閃一 物体の静電的処理装置
US5103367A (en) * 1987-05-06 1992-04-07 Unisearch Limited Electrostatic chuck using A.C. field excitation
JP2838810B2 (ja) 1990-07-16 1998-12-16 東陶機器株式会社 静電チャック
JP3311812B2 (ja) * 1993-04-09 2002-08-05 東京エレクトロン株式会社 静電チャック
US5646814A (en) * 1994-07-15 1997-07-08 Applied Materials, Inc. Multi-electrode electrostatic chuck
JPH0864663A (ja) * 1994-08-18 1996-03-08 Sumitomo Metal Ind Ltd 静電チャック
US5838529A (en) 1995-12-22 1998-11-17 Lam Research Corporation Low voltage electrostatic clamp for substrates such as dielectric substrates
JPH09293775A (ja) 1996-04-26 1997-11-11 Sony Corp 静電チャック
JP3527823B2 (ja) 1997-01-31 2004-05-17 京セラ株式会社 静電チャック
US6529362B2 (en) * 1997-03-06 2003-03-04 Applied Materials Inc. Monocrystalline ceramic electrostatic chuck
JP3853960B2 (ja) * 1998-02-27 2006-12-06 京セラ株式会社 静電チャック
US6104596A (en) * 1998-04-21 2000-08-15 Applied Materials, Inc. Apparatus for retaining a subtrate in a semiconductor wafer processing system and a method of fabricating same
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
US6273958B2 (en) * 1999-06-09 2001-08-14 Applied Materials, Inc. Substrate support for plasma processing
US6431112B1 (en) * 1999-06-15 2002-08-13 Tokyo Electron Limited Apparatus and method for plasma processing of a substrate utilizing an electrostatic chuck
US6509542B1 (en) * 1999-09-30 2003-01-21 Lam Research Corp. Voltage control sensor and control interface for radio frequency power regulation in a plasma reactor
EP1124404B1 (en) * 1999-11-19 2005-08-10 Ibiden Co., Ltd. Ceramic heater
JP2002124446A (ja) * 1999-11-19 2002-04-26 Ibiden Co Ltd 半導体製造・検査装置用セラミックヒータ
JP2001164202A (ja) * 1999-12-06 2001-06-19 Nitto Denko Corp 粘着テープ巻回体及び粘着テープの製造方法
JP2002026113A (ja) * 2000-07-10 2002-01-25 Toshiba Corp ホットプレート及び半導体装置の製造方法
KR20020046214A (ko) * 2000-12-11 2002-06-20 어드밴스드 세라믹스 인터내셔날 코포레이션 정전척 및 그 제조방법
JP2002038291A (ja) * 2001-09-03 2002-02-06 Daiso Co Ltd 金属箔製造用陽極
JP2003179128A (ja) * 2001-12-11 2003-06-27 Ngk Spark Plug Co Ltd 静電チャック
JP3978714B2 (ja) * 2002-02-26 2007-09-19 ジーイー・スペシャルティ・マテリアルズ・ジャパン株式会社 静電チャックの製造方法
JP4028753B2 (ja) * 2002-04-25 2007-12-26 京セラ株式会社 静電チャック
JP2004031594A (ja) * 2002-06-25 2004-01-29 Kyocera Corp 静電チャックおよびその製造方法
JP2004031599A (ja) * 2002-06-25 2004-01-29 Kyocera Corp 静電チャック
JP4684222B2 (ja) * 2004-03-19 2011-05-18 株式会社クリエイティブ テクノロジー 双極型静電チャック
KR100994299B1 (ko) * 2005-12-06 2010-11-12 가부시키가이샤 크리에이티브 테크놀러지 정전척용 전극 시트 및 정전척

Also Published As

Publication number Publication date
KR101212246B1 (ko) 2012-12-12
MY138415A (en) 2009-06-30
DE112005000621T5 (de) 2007-02-08
KR20070008640A (ko) 2007-01-17
US20100149720A1 (en) 2010-06-17
WO2005091356A1 (ja) 2005-09-29
JP4684222B2 (ja) 2011-05-18
TW200605260A (en) 2006-02-01
US20070223173A1 (en) 2007-09-27
HK1101451A1 (en) 2007-10-18
US8238072B2 (en) 2012-08-07
JPWO2005091356A1 (ja) 2008-02-07
DE112005000621B4 (de) 2019-01-31

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