TWI370147B - Modified polyimide resin and curable resin composition - Google Patents

Modified polyimide resin and curable resin composition

Info

Publication number
TWI370147B
TWI370147B TW094131178A TW94131178A TWI370147B TW I370147 B TWI370147 B TW I370147B TW 094131178 A TW094131178 A TW 094131178A TW 94131178 A TW94131178 A TW 94131178A TW I370147 B TWI370147 B TW I370147B
Authority
TW
Taiwan
Prior art keywords
modified polyimide
resin composition
curable resin
polyimide resin
curable
Prior art date
Application number
TW094131178A
Other languages
English (en)
Other versions
TW200619269A (en
Inventor
Masahiro Naiki
Ryoichi Takasawa
Shuichi Maeda
Tetsuji Hirano
Masayuki Kinouchi
Original Assignee
Ube Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries filed Critical Ube Industries
Publication of TW200619269A publication Critical patent/TW200619269A/zh
Application granted granted Critical
Publication of TWI370147B publication Critical patent/TWI370147B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/67—Unsaturated compounds having active hydrogen
    • C08G18/69—Polymers of conjugated dienes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • C08G18/0804—Manufacture of polymers containing ionic or ionogenic groups
    • C08G18/0819—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups
    • C08G18/0823—Manufacture of polymers containing ionic or ionogenic groups containing anionic or anionogenic groups containing carboxylate salt groups or groups forming them
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/32—Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30—Low-molecular-weight compounds
    • C08G18/38—Low-molecular-weight compounds having heteroatoms other than oxygen
    • C08G18/3819—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen
    • C08G18/3842—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring
    • C08G18/3844—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring
    • C08G18/3846—Low-molecular-weight compounds having heteroatoms other than oxygen having nitrogen containing heterocyclic rings having at least one nitrogen atom in the ring containing one nitrogen atom in the ring containing imide groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
    • C08G18/44—Polycarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/80—Masked polyisocyanates
    • C08G18/8061—Masked polyisocyanates masked with compounds having only one group containing active hydrogen
    • C08G18/807—Masked polyisocyanates masked with compounds having only one group containing active hydrogen with nitrogen containing compounds
    • C08G18/8077—Oximes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04—Polyurethanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Paints Or Removers (AREA)
TW094131178A 2004-09-10 2005-09-09 Modified polyimide resin and curable resin composition TWI370147B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004263343 2004-09-10

Publications (2)

Publication Number Publication Date
TW200619269A TW200619269A (en) 2006-06-16
TWI370147B true TWI370147B (en) 2012-08-11

Family

ID=36036556

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131178A TWI370147B (en) 2004-09-10 2005-09-09 Modified polyimide resin and curable resin composition

Country Status (6)

Country Link
US (1) US7687113B2 (zh)
JP (1) JP5321560B2 (zh)
KR (1) KR101165653B1 (zh)
CN (1) CN1980970B (zh)
TW (1) TWI370147B (zh)
WO (1) WO2006028289A1 (zh)

Families Citing this family (47)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090082518A1 (en) * 2005-05-16 2009-03-26 Showa Denko K.K. Carboxyl group-containing polyurethane, heat-curable resin composition and uses thereof
US7781147B2 (en) * 2005-10-07 2010-08-24 Nippon Kayaku Kabushiki Kaisha Imide-urethane resin, photosensitive resin composition including the same and cured product
JP4485504B2 (ja) * 2006-09-19 2010-06-23 ニッタ株式会社 画像形成装置用ベルト
JP5208399B2 (ja) * 2006-10-24 2013-06-12 ニッタ株式会社 ポリイミド樹脂
KR101472941B1 (ko) * 2007-04-19 2014-12-16 가부시키가이샤 가네카 신규한 폴리이미드 전구체 조성물 및 그 이용
US20120135156A1 (en) * 2009-07-14 2012-05-31 Mukerrem Cakmak Electromagnetic processing line
US11203192B2 (en) 2009-08-03 2021-12-21 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US9631054B2 (en) 2010-07-23 2017-04-25 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8574720B2 (en) * 2009-08-03 2013-11-05 E.I. Du Pont De Nemours & Company Matte finish polyimide films and methods relating thereto
US9926415B2 (en) 2010-08-05 2018-03-27 E I Du Pont De Nemours And Company Matte finish polyimide films and methods relating thereto
US8541108B2 (en) * 2010-09-27 2013-09-24 Xerox Corporation Fuser member
KR101775570B1 (ko) 2010-12-20 2017-09-07 삼성전자주식회사 폴리이미드 전구체 조성물, 폴리이미드의 제조 방법, 상기 제조 방법에 따라 제조한 폴리이미드 및 상기 폴리이미드를 포함하는 필름
WO2012088266A2 (en) 2010-12-22 2012-06-28 Incyte Corporation Substituted imidazopyridazines and benzimidazoles as inhibitors of fgfr3
TWI534177B (zh) * 2011-03-11 2016-05-21 Ube Industries 聚醯亞胺前驅體及聚醯亞胺
US8791227B1 (en) 2012-04-20 2014-07-29 The United States Of America As Represented By The Secretary Of The Air Force Crosslinked aromatic polyimides and methods of making the same
US8962890B1 (en) 2012-04-20 2015-02-24 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinkers for shape-memory polyimides, polyamides and poly(amide-imides) and methods of making the same
CN104334643B (zh) * 2012-06-07 2016-03-16 三井化学株式会社 聚酰亚胺树脂组合物、膜、粘接剂及部件
CN107652289B (zh) 2012-06-13 2020-07-21 因塞特控股公司 作为fgfr抑制剂的取代的三环化合物
WO2014026125A1 (en) 2012-08-10 2014-02-13 Incyte Corporation Pyrazine derivatives as fgfr inhibitors
US9085661B1 (en) 2012-10-26 2015-07-21 The United States Of America As Represented By The Secretary Of The Air Force Photomechanically active copolyimides derived from an azobenzenediamine, a rigid dianhydride, and a flexible dianhydride
US9266892B2 (en) 2012-12-19 2016-02-23 Incyte Holdings Corporation Fused pyrazoles as FGFR inhibitors
CN103030763B (zh) * 2012-12-28 2014-12-10 青岛海洋新材料科技有限公司 一种聚酰亚胺改性聚异氰脲酸酯泡沫体及其制备方法
JP6449244B2 (ja) 2013-04-19 2019-01-09 インサイト・ホールディングス・コーポレイションＩｎｃｙｔｅ Ｈｏｌｄｉｎｇｓ Ｃｏｒｐｏｒａｔｉｏｎ Ｆｇｆｒ抑制剤としての二環式複素環
US9139696B1 (en) 2014-03-28 2015-09-22 The United States Of America, As Represented By The Secretary Of The Air Force Aromatic diamines containing three ether-linked-benzonitrile moieties, polymers thereof, and methods of making the same
CN103929874B (zh) * 2014-04-09 2017-04-19 中国科学院微电子研究所 一种pcb线路板铜线路加工方法
US9644071B1 (en) 2014-09-05 2017-05-09 The United States Of America As Represented By The Secretary Of The Air Force Bis(azobenzene) diamines and photomechanical polymers made therefrom
US10851105B2 (en) 2014-10-22 2020-12-01 Incyte Corporation Bicyclic heterocycles as FGFR4 inhibitors
MA41551A (fr) 2015-02-20 2017-12-26 Incyte Corp Hétérocycles bicycliques utilisés en tant qu'inhibiteurs de fgfr4
US9580423B2 (en) 2015-02-20 2017-02-28 Incyte Corporation Bicyclic heterocycles as FGFR4 inhibitors
WO2016134320A1 (en) 2015-02-20 2016-08-25 Incyte Corporation Bicyclic heterocycles as fgfr inhibitors
US10294255B1 (en) 2015-08-07 2019-05-21 The United States Of America As Represented By The Secretary Of The Air Force Multifunctional crosslinking agent, crosslinked polymer, and method of making same
US10239254B1 (en) 2015-08-07 2019-03-26 The United States Of America As Represented By The Secretary Of The Air Force Method of fabricating shape memory films
KR101966736B1 (ko) * 2015-09-15 2019-04-09 주식회사 엘지화학 변성 폴리이미드 및 이를 포함하는 경화성 수지 조성물
TWI567110B (zh) * 2015-12-04 2017-01-21 張綺蘭 樹脂組合物、以及包含此樹脂組合物之絕緣基材及電路板
AR111960A1 (es) 2017-05-26 2019-09-04 Incyte Corp Formas cristalinas de un inhibidor de fgfr y procesos para su preparación
DK3788047T3 (da) 2018-05-04 2024-09-16 Incyte Corp Faste former af en FGFR-inhibitor og fremgangsmåder til fremstilling deraf
SG11202010882XA (en) 2018-05-04 2020-11-27 Incyte Corp Salts of an fgfr inhibitor
US11628162B2 (en) 2019-03-08 2023-04-18 Incyte Corporation Methods of treating cancer with an FGFR inhibitor
KR102054611B1 (ko) * 2019-03-13 2019-12-10 주식회사 엘지화학 변성 폴리이미드 및 이를 포함하는 경화성 수지 조성물
WO2021007269A1 (en) 2019-07-09 2021-01-14 Incyte Corporation Bicyclic heterocycles as fgfr inhibitors
MX2022004513A (es) 2019-10-14 2022-07-19 Incyte Corp Heterociclos biciclicos como inhibidores de los receptores del factor de crecimiento de fibroblastos (fgfr).
WO2021076728A1 (en) 2019-10-16 2021-04-22 Incyte Corporation Bicyclic heterocycles as fgfr inhibitors
JP2023505258A (ja) 2019-12-04 2023-02-08 インサイト・コーポレイション Ｆｇｆｒ阻害剤としての三環式複素環
BR112022010664A2 (pt) 2019-12-04 2022-08-16 Incyte Corp Derivados de um inibidor de fgfr
US12012409B2 (en) 2020-01-15 2024-06-18 Incyte Corporation Bicyclic heterocycles as FGFR inhibitors
EP4323405A1 (en) 2021-04-12 2024-02-21 Incyte Corporation Combination therapy comprising an fgfr inhibitor and a nectin-4 targeting agent
CA3220274A1 (en) 2021-06-09 2022-12-15 Incyte Corporation Tricyclic heterocycles as fgfr inhibitors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121460B2 (zh) * 1971-12-23 1976-07-02
FR2514772B1 (fr) * 1981-10-19 1985-09-06 Inst Francais Du Petrole Compositions reactives de polyimides thermostables presentant une solubilite elevee et leurs utilisations
US4996268A (en) * 1986-07-01 1991-02-26 National Starch And Chemical Investment Holding Corporation Carbinol-containing polyimide oligomers terminated with epoxide-reactive groups
JP2678934B2 (ja) * 1989-01-20 1997-11-19 宇部興産株式会社 熱硬化性樹脂組成物およびその硬化物
US5254659A (en) * 1990-03-27 1993-10-19 Hitachi, Ltd. Insulating coating composition, solderable insulated wires, production process of the insulated wires and flyback transformers using the insulated wires
JPH04212206A (ja) * 1990-03-27 1992-08-03 Hitachi Ltd 絶縁塗料、ハンダ付け可能な絶縁電線、該絶縁電線の製造方法および該絶縁電線を用いたフライバックトランス
JPH07330856A (ja) * 1994-06-10 1995-12-19 Sekisui Chem Co Ltd 熱可塑性ポリウレタン及びその製造方法
JP3603472B2 (ja) * 1996-05-14 2004-12-22 Ｊｓｒ株式会社 液晶配向剤および液晶表示素子
JP4016226B2 (ja) * 1998-01-14 2007-12-05 味の素株式会社 変成ポリイミド樹脂及びこれを含有する熱硬化性樹脂組成物
JP3299197B2 (ja) * 1998-09-30 2002-07-08 第一工業製薬株式会社 熱硬化性水系金属用防錆塗料
JP4137323B2 (ja) * 1999-11-18 2008-08-20 日本化薬株式会社 樹脂組成物、ソルダ−レジスト樹脂組成物及びこれらの硬化物
JP4794719B2 (ja) * 2000-06-23 2011-10-19 古河電気工業株式会社 自己融着性絶縁電線
JP2002194081A (ja) * 2000-12-25 2002-07-10 Mitsubishi Rayon Co Ltd 熱可塑性弾性体
JP3846856B2 (ja) * 2001-11-14 2006-11-15 日本化薬株式会社 アルカリ水溶液可溶性ウレタン化エポキシカルボキシレート化合物及びそれを用いた感光性樹脂組成物並びにその硬化物
JP4650176B2 (ja) * 2004-09-10 2011-03-16 宇部興産株式会社 ポリブタジエンを含んだ変性ポリイミド樹脂、その組成物及び硬化絶縁膜

Also Published As

Publication number Publication date
TW200619269A (en) 2006-06-16
US7687113B2 (en) 2010-03-30
CN1980970A (zh) 2007-06-13
JP2011052220A (ja) 2011-03-17
CN1980970B (zh) 2010-05-26
WO2006028289A1 (en) 2006-03-16
US20080311303A1 (en) 2008-12-18
KR101165653B1 (ko) 2012-07-17
KR20070050006A (ko) 2007-05-14
JP5321560B2 (ja) 2013-10-23

Similar Documents

Publication Publication Date Title
TWI370147B (en) Modified polyimide resin and curable resin composition
HK1126235A1 (en) Two-part curable composition and polyurethane-polysiloxane resin mixture obtained therefrom
HK1086851A1 (en) Curable resin composition, curable film and cured film
TWI360557B (en) Resin composition and its use
EP1746134A4 (en) HARDENING COMPOSITION WITH IMPROVED HARDENABILITY AND IMPROVED LIABILITY
EP1731545A4 (en) HARDENER FOR EPOXY RESIN AND COMPOSITION OF THE EPOXY RESIN
TWI367899B (en) Epoxy resin curing agent and epoxy resin composition
EP1852469A4 (en) CURABLE COMPOSITION CONTAINING SILICONE AND HARDENED PRODUCT
HK1100370A1 (en) Flame-retardant and flame-retardant resin composition
EP2009030A4 (en) RESIN COMPOSITION AND HEAT-RESISTANT ADHESIVE
EP1818368A4 (en) HARDENING COMPOSITION
EP1816168A4 (en) CURABLE COMPOSITION
EP1652891A4 (en) HARDENABLE RESIN AND COMPOSITE ADHESIVE AND ADHESIVE ADHESIVE
EP2017307A4 (en) HEAT-RESISTANT RESIN COMPOSITION AND ITS USE
EP1832626A4 (en) HARDENING COMPOSITION
EP1775317A4 (en) POLYORGANOSILOXAN AND HARDENABLE COMPOSITION THEREFOR
EP1795558A4 (en) MODULATION OF MODIFIED EPOXY RESIN
EP1897914A4 (en) RESIN ADDITIVE COMPOSITION AND RESIN COMPOSITION
EP1754754A4 (en) CURABLE COMPOSITION
HK1069407A1 (en) Curable resin composition and cured product thereof
EP1731549A4 (en) VULCANIZABLE COMPOSITION
EP1900774A4 (en) CURABLE RESIN COMPOSITION
EP1715002A4 (en) CURABLE COMPOSITION
EP2025695A4 (en) EPOXY RESIN COMPOSITION AND CURED EPOXY RESIN
EP1731573A4 (en) VULCANIZABLE COMPOSITION

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees