TWI367392B - - Google Patents

Info

Publication number
TWI367392B
TWI367392B TW096148130A TW96148130A TWI367392B TW I367392 B TWI367392 B TW I367392B TW 096148130 A TW096148130 A TW 096148130A TW 96148130 A TW96148130 A TW 96148130A TW I367392 B TWI367392 B TW I367392B
Authority
TW
Taiwan
Application number
TW096148130A
Other versions
TW200848924A (en
Inventor
Katsuya Shimizu
Fumio Matsushita
Original Assignee
Asahi Kasei Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Kasei Chemicals Corp filed Critical Asahi Kasei Chemicals Corp
Publication of TW200848924A publication Critical patent/TW200848924A/zh
Application granted granted Critical
Publication of TWI367392B publication Critical patent/TWI367392B/zh

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/17—Amines; Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
    • C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L81/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing sulfur with or without nitrogen, oxygen or carbon only; Compositions of polysulfones; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/63—Additives non-macromolecular organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/65—Additives macromolecular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/106—Binder containing
    • Y10S430/111—Polymer of unsaturated acid or ester
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055—Radiation sensitive composition or product or process of making
    • Y10S430/114—Initiator containing
    • Y10S430/12—Nitrogen compound containing

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Nitrogen Condensed Heterocyclic Rings (AREA)
TW096148130A 2006-12-14 2007-12-14 Photobase generator and photocurable resin composition TW200848924A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006336901 2006-12-14

Publications (2)

Publication Number Publication Date
TW200848924A TW200848924A (en) 2008-12-16
TWI367392B true TWI367392B (zh) 2012-07-01

Family

ID=39511668

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096148130A TW200848924A (en) 2006-12-14 2007-12-14 Photobase generator and photocurable resin composition

Country Status (7)

Country Link
US (1) US8137892B2 (zh)
EP (1) EP2093269A4 (zh)
JP (1) JP5356828B2 (zh)
KR (1) KR101114694B1 (zh)
CN (1) CN101553549B (zh)
TW (1) TW200848924A (zh)
WO (1) WO2008072651A1 (zh)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5707622B2 (ja) * 2007-08-09 2015-04-30 積水化学工業株式会社 光硬化性組成物
JP5086965B2 (ja) * 2008-10-20 2012-11-28 旭化成イーマテリアルズ株式会社 光塩基発生剤及び光硬化性樹脂組成物
JP5208673B2 (ja) * 2008-10-28 2013-06-12 旭化成イーマテリアルズ株式会社 光塩基発生剤及び光硬化型樹脂組成物
JP5274206B2 (ja) * 2008-11-06 2013-08-28 旭化成イーマテリアルズ株式会社 光硬化型樹脂組成物、その硬化物及び硬化物の製造方法
JP2010126662A (ja) * 2008-11-28 2010-06-10 Asahi Kasei E-Materials Corp 光塩基発生剤、それを用いた光硬化性樹脂組成物及び硬化物
JP5516417B2 (ja) * 2008-12-02 2014-06-11 和光純薬工業株式会社 光塩基発生剤
JP2010174210A (ja) * 2009-02-02 2010-08-12 Asahi Kasei E-Materials Corp 光硬化型樹脂組成物及びその硬化物
KR20110019636A (ko) * 2009-08-20 2011-02-28 삼성모바일디스플레이주식회사 가요성 표시 장치용 기판 및 그 제조 방법과 상기 기판을 포함하는 유기 발광 표시 장치
US8216767B2 (en) * 2009-09-08 2012-07-10 Taiwan Semiconductor Manufacturing Company, Ltd. Patterning process and chemical amplified photoresist with a photodegradable base
US8956806B2 (en) 2009-09-18 2015-02-17 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist and patterning process
US8512939B2 (en) * 2009-09-25 2013-08-20 Taiwan Semiconductor Manufacturing Company, Ltd. Photoresist stripping technique
JP2011195616A (ja) * 2010-03-17 2011-10-06 Eiweiss Kk 光硬化性樹脂組成物
JP6011956B2 (ja) * 2010-04-14 2016-10-25 学校法人東京理科大学 感光性樹脂組成物
JP5612373B2 (ja) * 2010-06-16 2014-10-22 旭化成イーマテリアルズ株式会社 光硬化型樹脂組成物、パターン形成された基板の製造方法及び電子部品
JP2012159657A (ja) * 2011-01-31 2012-08-23 Asahi Kasei E-Materials Corp 光硬化型樹脂組成物及びそれを用いたパターン形成された基材の製造方法、並びに該基材を備える電子部品
CN102338985A (zh) * 2011-06-29 2012-02-01 山东大学 含羟基的烃基双环胍光碱产生剂的环保型光刻胶组合物
JP2017125101A (ja) * 2016-01-12 2017-07-20 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP7012424B2 (ja) * 2016-03-25 2022-02-14 東京応化工業株式会社 エネルギー感受性組成物、硬化物及び硬化物の製造方法
CN108885944B (zh) * 2016-03-30 2020-11-24 日本瑞翁株式会社 有机系太阳能电池用密封剂组合物、密封剂、电极以及有机系太阳能电池
CN109825034B (zh) * 2019-01-21 2020-10-30 江南大学 一种实现巯基-环氧深层光固化的方法及其组合物
WO2021097852A1 (zh) * 2019-11-22 2021-05-27 南昌欧菲显示科技有限公司 纳米银导电薄膜及其制备方法和电子装置
EP3848179A1 (de) * 2020-01-10 2021-07-14 Carl Zeiss Vision International GmbH Inkjet-verfahren zur herstellung eines brillenglases
CN111546805B (zh) * 2020-04-28 2021-05-25 中山大学 一种可制备全息彩色图案的材料及其制备方法和应用
CN114163322B (zh) * 2021-11-23 2023-09-12 中国农业科学院农业环境与可持续发展研究所 紫外线吸收剂、制备方法和用途
CN114517043B (zh) * 2022-01-27 2022-12-16 福建泓光半导体材料有限公司 含有有机刚性笼状化合物的底部抗反射涂料组合物及其制备方法和微电子结构的形成方法

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EP1564255B1 (en) * 2004-02-16 2007-09-26 Mitsubishi Gas Chemical Company, Inc. Photobase generator and curable composition
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Also Published As

Publication number Publication date
KR20090057319A (ko) 2009-06-04
JP5356828B2 (ja) 2013-12-04
US8137892B2 (en) 2012-03-20
CN101553549B (zh) 2013-02-20
CN101553549A (zh) 2009-10-07
EP2093269A4 (en) 2011-03-30
US20100151386A1 (en) 2010-06-17
JPWO2008072651A1 (ja) 2010-04-02
EP2093269A1 (en) 2009-08-26
TW200848924A (en) 2008-12-16
KR101114694B1 (ko) 2012-03-13
WO2008072651A1 (ja) 2008-06-19

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