TWI365907B - Composition for polishing semiconductor layers - Google Patents

Composition for polishing semiconductor layers

Info

Publication number
TWI365907B
TWI365907B TW093121014A TW93121014A TWI365907B TW I365907 B TWI365907 B TW I365907B TW 093121014 A TW093121014 A TW 093121014A TW 93121014 A TW93121014 A TW 93121014A TW I365907 B TWI365907 B TW I365907B
Authority
TW
Taiwan
Prior art keywords
composition
semiconductor layers
polishing semiconductor
polishing
layers
Prior art date
Application number
TW093121014A
Other languages
English (en)
Chinese (zh)
Other versions
TW200513523A (en
Inventor
Zhendong Liu
John Quanci
Original Assignee
Rohm & Haas Elect Mat
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm & Haas Elect Mat filed Critical Rohm & Haas Elect Mat
Publication of TW200513523A publication Critical patent/TW200513523A/zh
Application granted granted Critical
Publication of TWI365907B publication Critical patent/TWI365907B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/02—Silicon
    • C01B33/021—Preparation
    • C01B33/023—Preparation by reduction of silica or free silica-containing material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials
    • H10P95/062—Planarisation of inorganic insulating materials involving a dielectric removal step

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
TW093121014A 2003-08-05 2004-07-14 Composition for polishing semiconductor layers TWI365907B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/634,437 US7018560B2 (en) 2003-08-05 2003-08-05 Composition for polishing semiconductor layers

Publications (2)

Publication Number Publication Date
TW200513523A TW200513523A (en) 2005-04-16
TWI365907B true TWI365907B (en) 2012-06-11

Family

ID=33552908

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093121014A TWI365907B (en) 2003-08-05 2004-07-14 Composition for polishing semiconductor layers

Country Status (7)

Country Link
US (1) US7018560B2 (https=)
EP (1) EP1505133B1 (https=)
JP (1) JP4681261B2 (https=)
KR (1) KR101092939B1 (https=)
CN (1) CN1609156B (https=)
DE (1) DE602004012674T2 (https=)
TW (1) TWI365907B (https=)

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JP2005101545A (ja) 2005-04-14
KR101092939B1 (ko) 2011-12-12
US7018560B2 (en) 2006-03-28
JP4681261B2 (ja) 2011-05-11
TW200513523A (en) 2005-04-16
US20050031789A1 (en) 2005-02-10
KR20050016128A (ko) 2005-02-21
DE602004012674T2 (de) 2009-04-09
DE602004012674D1 (de) 2008-05-08
EP1505133A1 (en) 2005-02-09
EP1505133B1 (en) 2008-03-26
CN1609156B (zh) 2012-03-28
CN1609156A (zh) 2005-04-27

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