TWI358067B - Integrated circuits and discharge circuits - Google Patents
Integrated circuits and discharge circuits Download PDFInfo
- Publication number
- TWI358067B TWI358067B TW096148594A TW96148594A TWI358067B TW I358067 B TWI358067 B TW I358067B TW 096148594 A TW096148594 A TW 096148594A TW 96148594 A TW96148594 A TW 96148594A TW I358067 B TWI358067 B TW I358067B
- Authority
- TW
- Taiwan
- Prior art keywords
- voltage
- transistor
- coupled
- discharge
- circuit
- Prior art date
Links
- 208000028659 discharge Diseases 0.000 claims description 110
- 239000003990 capacitor Substances 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 17
- 230000008878 coupling Effects 0.000 claims description 12
- 238000010168 coupling process Methods 0.000 claims description 12
- 238000005859 coupling reaction Methods 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 5
- 238000007599 discharging Methods 0.000 claims description 4
- 238000003860 storage Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000007667 floating Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000824268 Kuma Species 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000269722 Thea sinensis Species 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 235000003642 hunger Nutrition 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005055 memory storage Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 210000000952 spleen Anatomy 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
- G11C16/16—Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
Landscapes
- Read Only Memory (AREA)
- Non-Volatile Memory (AREA)
- Semiconductor Memories (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096148594A TWI358067B (en) | 2007-12-19 | 2007-12-19 | Integrated circuits and discharge circuits |
| JP2008306999A JP2009151920A (ja) | 2007-12-19 | 2008-12-02 | メモリデバイスと放電回路とを備える集積回路 |
| US12/335,189 US7903470B2 (en) | 2007-12-19 | 2008-12-15 | Integrated circuits and discharge circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW096148594A TWI358067B (en) | 2007-12-19 | 2007-12-19 | Integrated circuits and discharge circuits |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200929221A TW200929221A (en) | 2009-07-01 |
| TWI358067B true TWI358067B (en) | 2012-02-11 |
Family
ID=40788427
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096148594A TWI358067B (en) | 2007-12-19 | 2007-12-19 | Integrated circuits and discharge circuits |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7903470B2 (enExample) |
| JP (1) | JP2009151920A (enExample) |
| TW (1) | TWI358067B (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107370351A (zh) * | 2016-05-13 | 2017-11-21 | 中芯国际集成电路制造(天津)有限公司 | 电荷泄放电路 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8000151B2 (en) | 2008-01-10 | 2011-08-16 | Micron Technology, Inc. | Semiconductor memory column decoder device and method |
| US8576611B2 (en) | 2010-07-08 | 2013-11-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory with regulated ground nodes |
| WO2014124324A1 (en) * | 2013-02-08 | 2014-08-14 | Sandisk Technologies Inc. | Non-volatile memory including bit line switch transistors formed in a triple-well |
| JP5883494B1 (ja) * | 2014-11-19 | 2016-03-15 | ウィンボンド エレクトロニクス コーポレーション | 不揮発性半導体記憶装置 |
| US9806608B2 (en) * | 2015-02-13 | 2017-10-31 | Apple Inc. | Charge pump having AC and DC outputs for touch panel bootstrapping and substrate biasing |
| CN119943114A (zh) * | 2023-11-02 | 2025-05-06 | 长江存储科技有限责任公司 | 存储器装置及其操作方法、存储器系统 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5740109A (en) * | 1996-08-23 | 1998-04-14 | Motorola, Inc. | Non-linear charge pump |
| KR100481841B1 (ko) * | 1997-11-25 | 2005-08-25 | 삼성전자주식회사 | 음의고전압을방전시키기위한회로를구비한플래시메모리장치 |
| JP2000021186A (ja) * | 1998-07-02 | 2000-01-21 | Toshiba Corp | 不揮発性半導体記憶装置 |
| JP3883391B2 (ja) * | 2001-02-28 | 2007-02-21 | シャープ株式会社 | 不揮発性半導体メモリのウェル電圧設定回路およびそれを備えた半導体メモリ装置 |
| US6667910B2 (en) * | 2002-05-10 | 2003-12-23 | Micron Technology, Inc. | Method and apparatus for discharging an array well in a flash memory device |
| JP4357351B2 (ja) * | 2004-04-23 | 2009-11-04 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| DE102004028934B3 (de) * | 2004-06-15 | 2006-01-05 | Infineon Technologies Ag | Entladeschaltung für eine kapazitive Last |
| JP4881552B2 (ja) * | 2004-09-09 | 2012-02-22 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US7272053B2 (en) * | 2004-11-18 | 2007-09-18 | Freescale Semiconductor, Inc. | Integrated circuit having a non-volatile memory with discharge rate control and method therefor |
| KR100688545B1 (ko) * | 2005-05-04 | 2007-03-02 | 삼성전자주식회사 | 메모리 장치의 소거 전압 디스차지 방법 |
| JP4903432B2 (ja) * | 2005-12-27 | 2012-03-28 | 株式会社東芝 | 不揮発性半導体記憶装置 |
| JP2008004336A (ja) * | 2006-06-21 | 2008-01-10 | Yazaki Corp | コネクタ |
| JP2008004236A (ja) * | 2006-06-26 | 2008-01-10 | Samsung Electronics Co Ltd | 不揮発性半導体記憶装置の消去放電制御方法 |
-
2007
- 2007-12-19 TW TW096148594A patent/TWI358067B/zh active
-
2008
- 2008-12-02 JP JP2008306999A patent/JP2009151920A/ja active Pending
- 2008-12-15 US US12/335,189 patent/US7903470B2/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107370351A (zh) * | 2016-05-13 | 2017-11-21 | 中芯国际集成电路制造(天津)有限公司 | 电荷泄放电路 |
| CN107370351B (zh) * | 2016-05-13 | 2019-12-27 | 中芯国际集成电路制造(天津)有限公司 | 电荷泄放电路 |
Also Published As
| Publication number | Publication date |
|---|---|
| US7903470B2 (en) | 2011-03-08 |
| TW200929221A (en) | 2009-07-01 |
| JP2009151920A (ja) | 2009-07-09 |
| US20090161440A1 (en) | 2009-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106158018B (zh) | 非易失性记忆胞结构及其装置 | |
| TWI358067B (en) | Integrated circuits and discharge circuits | |
| KR100420574B1 (ko) | 반도체집적회로장치 | |
| CN107527654B (zh) | 非易失性半导体存储装置及其字线的驱动方法 | |
| EP4243081A2 (en) | Improved flash memory cell associated decoders | |
| TW200535846A (en) | NAND flash memory device and method of programming the same | |
| JP2015070264A (ja) | 再書き込み動作のための不揮発性メモリセル、不揮発性メモリセル、及び不揮発性メモリセルの動作方法 | |
| CN102314946A (zh) | 电压开关电路和使用其的非易失性存储器件 | |
| JP2000298991A (ja) | 半導体装置 | |
| CN109754838A (zh) | 非易失性存储器设备 | |
| CN110299170A (zh) | 包含电压自举控件的存储器块选择电路系统 | |
| CN106463159B (zh) | 用于嵌入式闪存装置的改进的通电次序 | |
| TW201711041A (zh) | 電壓產生電路及半導體記憶裝置 | |
| TW432704B (en) | Row decoder having global and local decoders in flash memory devices | |
| CN115968200A (zh) | 浮动节点存储器元件及其浮动节点存储器单元的形成方法 | |
| JP2009151920A5 (enExample) | ||
| Tanzawa et al. | High-voltage transistor scaling circuit techniques for high-density negative-gate channel-erasing NOR flash memories | |
| US8559230B2 (en) | Row decoder and non-volatile memory device | |
| US9564231B2 (en) | Non-volatile memory device and corresponding operating method with stress reduction | |
| TWI243382B (en) | Program voltage generation circuit for stably programming flash memory cell and method of programming flash memory cell | |
| US8520465B2 (en) | Semiconductor device | |
| JP2003272396A (ja) | 半導体装置 | |
| US20200119723A1 (en) | Latch circuit | |
| JP2008299917A (ja) | 半導体装置及びその制御方法 | |
| CN101504866B (zh) | 集成电路与放电电路 |