TWI331489B - - Google Patents

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Publication number
TWI331489B
TWI331489B TW095128862A TW95128862A TWI331489B TW I331489 B TWI331489 B TW I331489B TW 095128862 A TW095128862 A TW 095128862A TW 95128862 A TW95128862 A TW 95128862A TW I331489 B TWI331489 B TW I331489B
Authority
TW
Taiwan
Prior art keywords
resin composition
printed circuit
circuit board
insulating
curable resin
Prior art date
Application number
TW095128862A
Other languages
English (en)
Chinese (zh)
Other versions
TW200738075A (en
Inventor
Yoshikazu Daigo
Shigeru Ushiki
Original Assignee
Taiyo Ink Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd filed Critical Taiyo Ink Mfg Co Ltd
Publication of TW200738075A publication Critical patent/TW200738075A/zh
Application granted granted Critical
Publication of TWI331489B publication Critical patent/TWI331489B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW095128862A 2005-08-12 2006-08-07 Insulating hardenable composite and its curing object, and printed wiring board using it TW200738075A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005234154A JP4920929B2 (ja) 2005-08-12 2005-08-12 ソルダーレジスト組成物、及びその硬化物並びにそれを用いたプリント配線板

Publications (2)

Publication Number Publication Date
TW200738075A TW200738075A (en) 2007-10-01
TWI331489B true TWI331489B (fr) 2010-10-01

Family

ID=37757458

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095128862A TW200738075A (en) 2005-08-12 2006-08-07 Insulating hardenable composite and its curing object, and printed wiring board using it

Country Status (5)

Country Link
JP (1) JP4920929B2 (fr)
KR (1) KR20080035619A (fr)
CN (1) CN101238760A (fr)
TW (1) TW200738075A (fr)
WO (1) WO2007020793A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011037986A (ja) * 2009-08-11 2011-02-24 Taiyo Holdings Co Ltd 光硬化性ペースト及びその硬化物
CN102006722A (zh) * 2010-11-15 2011-04-06 中山市格普斯纳米电热科技有限公司 快速散热线路板
CN102958269A (zh) * 2011-08-31 2013-03-06 冠品化学股份有限公司 导热软质印刷电路板结构
JP5458215B1 (ja) * 2013-03-11 2014-04-02 太陽インキ製造株式会社 光硬化性樹脂組成物、そのドライフィルムおよび硬化物、並びにそれらを用いて形成された硬化皮膜を有するプリント配線板
KR101792755B1 (ko) 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
CN112823188B (zh) * 2018-11-20 2023-08-11 太阳控股株式会社 高耐电压散热绝缘性树脂组合物和使用其的电子部件
CN115141460B (zh) * 2021-03-30 2023-09-01 太阳油墨（苏州）有限公司 热固性树脂组合物、固化物以及电子部件

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0940751A (ja) * 1995-07-27 1997-02-10 Taiyo Ink Mfg Ltd 耐衝撃性絶縁樹脂組成物
JPH09207270A (ja) * 1996-01-31 1997-08-12 Matsushita Electric Works Ltd 金属箔、プリプレグ及び紙基材積層板
JP3614844B2 (ja) * 1996-10-09 2005-01-26 松下電器産業株式会社 熱伝導基板
JP3505170B2 (ja) * 1996-10-09 2004-03-08 松下電器産業株式会社 熱伝導基板及びその製造方法
JP2002171050A (ja) * 1997-04-11 2002-06-14 Ibiden Co Ltd プリント配線板
JP3346263B2 (ja) * 1997-04-11 2002-11-18 イビデン株式会社 プリント配線板及びその製造方法
JPH1146049A (ja) * 1997-07-25 1999-02-16 Matsushita Electric Ind Co Ltd 放熱性樹脂基板およびその製造方法
JP3581268B2 (ja) * 1999-03-05 2004-10-27 株式会社東芝 ヒートシンク付半導体装置およびその製造方法
JP3921630B2 (ja) * 2000-04-05 2007-05-30 株式会社日立製作所 エポキシ樹脂複合材料及びそれを用いた装置
JP2001348488A (ja) * 2000-06-06 2001-12-18 Matsushita Electric Works Ltd 熱伝導性樹脂組成物、プリプレグ、放熱性回路基板及び放熱性発熱部品
JP2002179886A (ja) * 2000-12-15 2002-06-26 Nagase Chemtex Corp 高熱伝導性エポキシ樹脂組成物、該組成物からなるシート状物および該シート状物からなる高熱伝導性基板
JP2003213089A (ja) * 2002-01-28 2003-07-30 Matsushita Electric Works Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP3985554B2 (ja) * 2002-03-18 2007-10-03 凸版印刷株式会社 感光性樹脂組成物およびそれを用いたプリント配線板
JP4280200B2 (ja) * 2003-05-19 2009-06-17 株式会社日本触媒 放熱材用樹脂組成物
JP3908198B2 (ja) * 2003-05-29 2007-04-25 ナミックス株式会社 層間絶縁膜用樹脂組成物
JP4231748B2 (ja) * 2003-07-10 2009-03-04 太陽インキ製造株式会社 プリント配線基板用プリプレグ及びそれを用いて作製された多層プリント配線板
JP2005146229A (ja) * 2003-11-20 2005-06-09 Matsushita Electric Works Ltd 封止用エポキシ樹脂組成物及びそれを用いた半導体装置

Also Published As

Publication number Publication date
JP4920929B2 (ja) 2012-04-18
WO2007020793A1 (fr) 2007-02-22
CN101238760A (zh) 2008-08-06
TW200738075A (en) 2007-10-01
KR20080035619A (ko) 2008-04-23
JP2007049064A (ja) 2007-02-22

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